CN102514277A - Heat dissipation material with graphite film and graphene composite structure and implementation method thereof - Google Patents
Heat dissipation material with graphite film and graphene composite structure and implementation method thereof Download PDFInfo
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- CN102514277A CN102514277A CN2011103637130A CN201110363713A CN102514277A CN 102514277 A CN102514277 A CN 102514277A CN 2011103637130 A CN2011103637130 A CN 2011103637130A CN 201110363713 A CN201110363713 A CN 201110363713A CN 102514277 A CN102514277 A CN 102514277A
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Abstract
The invention provides a heat dissipation material with a graphite film and graphene composite structure and an implementation method thereof and belongs to the technical field of heat dissipation materials. The material comprises a first graphene layer and a graphite film layer, wherein the first graphene layer is arranged on one end face of the heat dissipation material and is a physical layer consisting of graphene; and the graphite film layer is arranged on the other side of the first graphene layer and is a physical layer consisting of graphite films. The heat dissipation material has high heat dissipation performance, and the advantages of the graphite films and the graphene serving as the heat dissipation materials are mutually combined.
Description
Technical field
The invention belongs to the heat sink material technical field.
Background technology
Numerous areas such as electronic product, machinery, electric power, communication, chemical industry in the process of product processing, production, and in the use, all can produce the different heat of quantity.And, if the heat that is produced can not effectively be distributed, then can all might impact the processing and the use of product.
At present, various heat sink materials are widely used.Dissimilar heat sink materials can have different performances, such as the heat conductivility of metal material is good, wherein a part of metal material particularly, and like copper, aluminium, silver etc., its thermal conductivity is especially good.Utilize these metal radiators, the radiator such as copper radiator, aluminium matter obtains widespread usage.
Enumerate the thermal conductivity performance of some heat sink materials commonly used below:
Aluminium: 237W/mK;
Copper: 401W/mK;
Silver: 420W/mK;
Gold: 318W/mK.
Along with the appearance of the Delanium membrane material of high heat dispersion, its heat-sinking capability has increased significantly, and can reach at present: 1500～2200W/mK.And, then having more powerful heat-sinking capability at present as the grapheme material of research focus, its thermal conductivity reaches as high as 5000W/mK.The membrane material of high rate of heat dissipation like this is the radiating equipment in the various products, and new selection is provided.
In the flaky material that can make at present, the thickness of Graphene is the thinnest, also has high intensity and thermal conductivity.
And existing high conductive graphite film also has weak point, though be high conductive graphite film certain folding resistance is arranged, and the weak strength between the material can be torn easily, perhaps because of the displacement of institute's adhesive attachment means disrepair phenomenon takes place, or entry material comes off etc.
The high-cooling property that how to keep graphite film effectively makes it can resist bigger external force effect simultaneously, is the problem that needs solution at present.
Summary of the invention
The purpose of this invention is to provide a kind of heat sink material and its implementation,, be applied to the heat radiation field but be not limited to the application of heat radiation aspect with the heat sink material that provides a kind of graphite film and Graphene to combine with graphite film and Graphene composite construction.
A kind of heat sink material provided by the present invention with graphite film and Graphene composite construction, it comprises:
First graphene layer, it is arranged on one of them end face of this heat sink material, the Physical layer of being made up of Graphene;
The graphite rete, it is arranged on the opposite side of above-mentioned first graphene layer, the Physical layer of being made up of graphite film.
Further, described first graphene layer, include four individual layers and more than.
Further, described first graphene layer, its thickness is within 1000 nanometers.
Further, described graphite rete, thickness is more than 1 micron.
Further, described graphite rete, its thickness is between 5 microns to 5 millimeters.
Further, described graphite rete, its thickness is preferably between 10 microns to 100 microns.
Further, the version of described heat sink material does, graphene layer-graphite rete-[(graphene layer-graphite rete) * N], and N is the integer more than or equal to 1.
Further, the version of described heat sink material does, graphene layer-graphite rete-[(metal level-graphite rete) * N], and wherein N is the integer more than or equal to 1.
Further, the version of described heat sink material does, graphene layer-[(graphite rete-metal level) * N], and wherein N is the integer more than or equal to 1.
Further, between graphene layer and adjacent graphite rete, be provided with the adhesive that the two is linked together.
Further, described adhesive is provided with the face structure that structure is a thin layer form, lattice array structure, line array structure three one of which on graphene layer and/or graphite rete.
Further, described adhesive is an organic adhesion agent.
Further, described adhesive is a metal material.
Further, the face structure of the metal material of the thin layer form that is adopted, thickness is within 10 microns.
Further, described metal material be aluminium, copper, tin, silver, gold one of them.
The present invention also provides a kind of implementation method with heat sink material of graphite film and Graphene composite construction, is adopting metal material to carry out having following steps when bonding:
Step S110 between the interlayer of the graphite rete and adjacent first graphene layer, is provided with the solid-state metallic material layer;
Step S120, near attaching, aforesaid solid-state metallic material is set to the material in the interlayer with graphite rete and adjacent first graphene layer;
Step S130 is directed to the graphite rete of attaching or adjacent graphene layer and heats, and aforesaid solid-state metallic material is carried out melt processed;
Step S140, in metal material part when being in molten state at least, both compress the back condensation with aforesaid graphite rete and adjacent graphene layer, form the structure that the outermost end face is respectively first graphene layer and graphite rete.
The present invention also provides a kind of implementation method with heat sink material of graphite film and Graphene composite construction, is adopting organic adhesion agent to carry out having following steps when bonding:
Step S210, graphite rete and adjacent first graphene layer both at least on the one of which, the coated structure of adhesive is set;
Step S220 carries out graphite rete and the first adjacent graphene layer near attaching, and aforesaid adhesive is the material of layout in the interlayer;
Step S230, with aforesaid graphite rete and adjacent first graphene layer both to compress the back fixing, form the structure that the outermost end face is respectively first graphene layer and graphite rete.
The present invention also provides a kind of implementation method with heat sink material of graphite film and Graphene composite construction, and this method comprises the steps:
Step S310 gets the graphite film material as the graphite rete respectively, and as the grapheme material of first graphene layer;
Step S320 with the two overlapping placement, and exerts pressure to it, and the two is pressed close to each other, forms the structure that the outermost end face is respectively first graphene layer and graphite rete.
Description of drawings
Fig. 1 is the structural representation with heat sink material of graphite film and Graphene composite construction of the present invention, is first kind of embodiment.
Fig. 2 is the structural representation with heat sink material of graphite film and Graphene composite construction of the present invention, is second kind of embodiment.
Fig. 3 is the structural representation with heat sink material of graphite film and Graphene composite construction of the present invention, is the third embodiment.
Fig. 4 is the structural representation with heat sink material of graphite film and Graphene composite construction of the present invention, is the 4th kind of embodiment.
Fig. 5 is the implementation method flow chart with heat sink material of graphite film and Graphene composite construction, carries out bonding realization flow for adopting metal material, is the 5th kind of embodiment.
Fig. 6-the 1st has in the process of heat sink material of graphite film and Graphene composite construction in preparation, and the structural representation that adhesive is provided with is the lattice array structural representation.
Fig. 6-the 2nd has in the process of heat sink material of graphite film and Graphene composite construction in preparation, and the structural representation that adhesive is provided with is parallel lines array structure sketch map.
Fig. 6-the 3rd has in the process of heat sink material of graphite film and Graphene composite construction in preparation, and the structural representation that adhesive is provided with is grid lines strip array structural representation.
Fig. 7 is the implementation method flow chart with heat sink material of graphite film and Graphene composite construction, is to adopt organic adhesion agent to carry out bonding realization flow, and be the 6th kind of embodiment.
Fig. 8 is the implementation method flow chart with heat sink material of graphite film and Graphene composite construction, is to adopt directly extrusion bonded realization flow, and be the 7th kind of embodiment.
The specific embodiment
Below in conjunction with specific embodiment, and accompanying drawing is done further introduction in detail to the present invention.
In the present invention; Utilize graphite rete and graphene layer compound action between the two, learn from other's strong points to offset one's weaknesses, both can maintain the high heat dispersion of graphite rete; Can eliminate graphite rete original defects again, comprise that surface strength is low, fall weak points such as fragment easily.Below in conjunction with accompanying drawing the present invention is done further description.On the other hand, the reason that is provided with like this is that the graphite rete of macroscopic thickness is mature technology at present; And the graphene layer of macroscopic thickness also is difficult to realize at present, but the graphene layer of single or multiple lift; Comprise the single-layer graphene layer of large scale, also can realize at present.
The explanation of Fig. 1:
Join shown in Figure 1ly, showed the structural representation with heat sink material 100 of graphite film and Graphene composite construction of the present invention here, be first embodiment among the present invention.
This heat sink material comprises:
First graphene layer 110, it is arranged on one of them end face of this heat sink material 100, the Physical layer of being made up of Graphene;
And graphite rete 120, it is arranged on the other side end face of above-mentioned first graphene layer 110, the Physical layer of being made up of graphite film.
That is to say that in the present embodiment, described heat sink material 100 includes two altogether layer by layer, is respectively graphene layer and graphite rete.
The advantage that is provided with like this is that graphene layer has very high intensity and heat transfer efficiency, but makes the Graphene of macroscopic thickness, such as micron-sized Graphene, still is at present very difficult thing.Therefore, just can select thin Graphene, be used as the protective layer of graphite rete one side.
Described first graphene layer 110, their thickness is not done to limit.But preferred embodiment, the thickness of first graphene layer 110 should be more than the stack thickness of four monoatomic layer Graphenes.In this case, the described material that includes monoatomic layer Graphene more than four layers and four layers just has certain guarantee aspect intensity.
Further, described first graphene layer and second graphene layer, its thickness is within 1000 nanometers.
Described graphite rete; The product of making macroscopic thickness technology relatively is comparatively ripe; The form that therefore just can combine through both both can prevent under the situation that graphite film laminar surface intensity goes wrong the phenomenon generation of the granule fragment that comes off; In addition, also can improve the intensity of manufactured goods.
In the present invention, described graphite rete, thickness is more than 1 micron.
Further, described graphite rete, its thickness is between 5 microns to 5 millimeters.
Further, described graphite rete, its thickness is preferably between 10 microns to 100 microns.
Fixed form between described first graphene layer 110, they and adjoining graphite rete 120 has diversified selection.
Such as, can carry out between the two bonding through the form of adhesive, such as, fix through pressure-sensitive adhesive.Perhaps utilize other any material that can realize adhesive function; Also can adopt other principle, specifically not limit.
In the embodiment shown in this figure, described first graphene layer 110, and middle graphite rete 120 threes' planar dimension are identical.
The explanation of Fig. 2:
Joining shown in Figure 2ly, showed the composition structural representation with heat sink material 200 of graphite film and Graphene composite construction of the present invention here, is second kind of embodiment.
In the structure of the described heat sink material 200 of this embodiment, the topmost end face is first graphene layer 210, and the foot end face is the first graphite rete 220.
Further,, be provided with two-layer and two-layer above graphite rete at first graphene layer 210 and second graphene layer 220 between the two, and the graphene layer that between the graphite rete, also is provided with other.
The structure of the heat sink material 200 in the present embodiment describes according to successively mode, for:
Graphene layer-graphite rete-[(graphene layer-graphite rete) * N], wherein N is the integer more than or equal to 1.
Shown in the ginseng figure, in the present embodiment, the top is first graphene layer 210, is the second graphite rete 230 below and then, is second graphene layer 240 below being right after, and is the first graphite rete 220 below and then.Between aforesaid each layer, fix through the form of adhesive, perhaps utilize the mode that compresses each other to fix, perhaps other mode is fixed.
Adopt aforementioned schemes under the situation that the numerical value of N increases, can increase the graphene layer of intermediate course part and the quantity of graphite rete expediently, and, can also guarantee the strength and toughness of entire heat dissipation material 200.The heat sink material of this embodiment is mainly used in needs big thickness, and heat radiation is required to compare condition with higher.
The explanation of Fig. 3:
Join shown in Figure 3ly, showed the composition structural representation with heat sink material 300 of graphite film and Graphene composite construction of the present invention here, be the third embodiment.
In this embodiment, described heat sink material 300, structure from top to bottom is followed successively by:
Top end is first graphene layer 310;
And then below the second graphite rete 330;
It below being right after metal level 340;
And then below the first graphite rete 320;
This version is the implementation of setting up metal level and graphite rete.
Between aforesaid each layer, can fix through the form of adhesive; Perhaps utilize the mode that compresses each other to fix; Perhaps other mode is fixed, such as, utilize metal level 340 to carry out heat fused, and then condensation, can play fixation between the two to the first adjacent graphite rete 320 and the second graphite rete 330.
Further, and non-limiting, the structure among this figure can also be expressed as as preferred embodiment:
Graphene layer-graphite rete-[(metal level-graphite rete) * N], wherein N is the integer more than or equal to 1.
The scheme that present embodiment provided can also be used the characteristic of metal, comprises the intensity that has than higher, good heat-conducting.And have the strong metal level of the multiple capacity of heat transmission available, such as the copper material bed of material and the aluminium bed of material etc., its cost is also lower.
The explanation of Fig. 4:
Joining shown in Figure 4ly, showed the composition structural representation with heat sink material 400 of graphite film and Graphene composite construction of the present invention here, is the 4th kind of embodiment.
In this embodiment, described heat sink material 400, structure from top to bottom is followed successively by:
Top end is first graphene layer 410;
And then below graphite rete 420;
It below being right after metal level 430.
Between aforesaid each layer, can fix through the form of adhesive; Perhaps utilize the mode that compresses each other to fix.
Structure among this figure can be expressed as:
Graphene layer-[(graphite rete-metal level) * N], wherein N is the integer more than or equal to 1.
The typical feature of this scheme is, makes between graphene layer and the metal level of an end directly to fix.Under this scheme, can single metal level be made significantly thicker, have thickness adjusted flexibility eaily.
The scheme that present embodiment provided can also be used the characteristic of metal, comprises the intensity that has than higher, good heat-conducting, and the strong metal material of the multiple capacity of heat transmission is arranged, and comprising the copper material bed of material and the aluminium bed of material etc., cost is all lower.
The preparation method that will have the heat sink material of graphite film and Graphene composite construction below is further described in conjunction with the embodiment shown in Fig. 5, Fig. 6-1, Fig. 6-2, Fig. 6-3.
Join shown in Figure 5ly, showed the flow chart of the preparation method of the heat sink material with graphite film and Graphene composite construction of the present invention here, be the 5th embodiment among the present invention.
Jointing material wherein is that the mode that adopts metallic material to cool off again realizes.And non-limiting, its step is described below as for example:
Step S110 between the interlayer of the graphite rete and adjacent first graphene layer, is provided with the solid-state metallic material layer.
This metal material layer is fit to do very thinly.As preferred embodiment and non-limiting, be fit to adopt metal powder, perhaps sheet metal, perhaps wire, perhaps structure such as thin bonding jumper realizes.Its thickness should further be preferably within 10 microns within 0.5 millimeter.
Aforesaid metal material layer can be used as independently that thin layer appears, and also can be provided with on the one of which at least at adjoining graphite rete and graphene layer.
As for example and non-limiting, the aforesaid scheme that is provided with on the one of which at least at adjoining graphite rete and graphene layer is preferably 4 kinds: be respectively thin metal layer structure, metal bisque structure, lattice array structure and line array structure.In use, with metal material with above-mentioned form at least the mode of one of which be coated on corresponding graphene layer or the graphite rete and get final product.
Shown in ginseng Fig. 6-1, Fig. 6-2, Fig. 6-3, be the structure that is provided with of above-mentioned solid-state metallic material, wherein Fig. 6-1 is the lattice array structure, and Fig. 6-2 is a parallel lines array junctions composition, and Fig. 6-3 is a grid lines strip array structure.
(1) the face structure of thin metal layer
As previously mentioned, under the situation that adopts thin metal layer, its thickness may be selected within 0.5 millimeter, further is preferably within 10 microns.Described thin metal layer, the material that is adopted as for example and non-limiting, can adopt the aluminium foil that meets thickness requirement, perhaps Copper Foil, perhaps tinfoil paper etc.; Or even silver foil, perhaps goldleaf.
(2) the face structure of metal bisque
Accordingly, when adopting the metal bisque, require after the molten condition fusion and solidifying, its metal layer thickness can meet the front requirement equally.The type of metal powder does not limit, but is fit to select the metal material that heat conductivility is strong, be easy to process for use, such as copper powder, aluminium powder, or the like.
(3) lattice array structure
Shown in ginseng Fig. 6-1, through have at interval, the array format metal lattice, solidify again after melting, thereby realize the adhesive effect between the material.As preferred embodiment and non-limiting, the size of each metal dots, within 5mm * 5mm, and each metal dots is to the minimum range of contiguous metal dots, also within 5mm.
(4) line array structure
Shown in ginseng Fig. 6-2, realize through parallel lines or interlaced metal wire.Such as, can adopt horizontal metal wire to implement, the width of each metal wire is 3mm, and each metal wire is parallel to each other, and the minimum distance between the adjacent metal lines is 3mm.
Shown in ginseng Fig. 6-3, in ability embodiment, just make staggered network through lines, it also is equally passable.
To be arranged to above-mentioned lattice structure or line array structure as the metal material of adhesive; Although mainly be because metal has certain thermal diffusivity; But its radiating efficiency is compared with Graphene and graphite film material or gap is arranged; Be arranged to array so metal is provided with structure, rather than whole surface all is provided with metal, can improves radiating efficiency like this.
Step S120, near attaching, aforesaid solid-state metallic material is set to the material in the interlayer with graphite rete and adjacent first graphene layer.
In the solid-state metallic material described in this step and the above-mentioned steps 1, non-limiting as giving an example, be one of which such as aluminium or copper or tin or silver or gold, mainly be the high-termal conductivity of utilizing metal, fusible voltinism and high ductibility here.
Step S130 is directed to the graphite rete of attaching or adjacent graphene layer and heats, and aforesaid solid-state metallic material is carried out melt processed.
The temperature that in this step, heats requires the melting temperature above corresponding solid-state metallic material, is heated to the solid metallic fusing.Further, can also carry out Fast Heating, so that the metal section and part fusing equally also can reach fixing purpose after it solidifies.
Step S140, in metal material part when being in molten state at least, both compress the back condensation with aforesaid graphite rete and adjacent graphene layer, form the structure that the outermost end face is respectively first graphene layer and graphite rete.
Treat that all aspects that need fix all fixedly finish, and be cooled to room temperature, just make the heat sink material with graphite film and Graphene composite construction of the present invention.
The explanation of Fig. 7:
Join shown in Figure 7ly, showed the implementation method flow chart with heat sink material of graphite film and Graphene composite construction of the present invention, carry out bonding realization flow for adopting organic adhesion agent, it is the 6th kind of embodiment of the present invention.
Step S210, graphite rete and adjacent first graphene layer both at least on the one of which, the coated structure of adhesive is set.Non-limiting as giving an example; The coated structure of adhesive in this step; Can be similar as the embodiment of jointing material with aforesaid metal, comprise lattice array structure, parallel lines array structure, grid lines strip array structure and face structure etc., repeat no more at this.
Step S220 carries out graphite rete and the first adjacent graphene layer near attaching, and aforesaid adhesive is the material of layout in the interlayer.In this step and above-mentioned steps 1, described adhesive is an organic adhesion agent, for example heat-conducting type silica gel, perhaps pressure sensitive adhesive etc.
Further, in this step, if adhesive is PUR, also will to be arranged among the step S210 graphite rete and adjacent graphene layer both at least the adhesive on the one of which carry out heat fused and handle so that in step S230, be fixed.
Step S230, with aforesaid graphite rete and adjacent first graphene layer both to compress the back fixing, form the structure that the outermost end face is respectively first graphene layer and graphite rete.
Treat that all aspects that need fix all fixedly finish, just make the heat sink material with graphite film and Graphene composite construction of the present invention.
The explanation of Fig. 8:
Join shown in Figure 8ly, showed the implementation method flow chart with heat sink material of graphite film and Graphene composite construction of the present invention, for adopting directly extrusion bonded concrete realization flow, it is the 7th kind of embodiment of the present invention.
Step S310 gets the graphite film material as the graphite rete respectively, and as the grapheme material of first graphene layer.
Step S320 with the two overlapping placement, and exerts pressure to it, and the two is pressed close to each other, forms the structure that the outermost end face is respectively first graphene layer and graphite rete.
Such as, apply the power of size between 10-100 ox/square centimeter, utilize the active force between the molecule to make it compress each other, attach.Thereby graphite film and the compound heat sink material of Graphene that acquisition needs.
More than be the description of this invention and non-limiting, based on other embodiment of inventive concept, also all among protection scope of the present invention.
Claims (18)
1. heat sink material with graphite film and Graphene composite construction is characterized in that this material comprises:
First graphene layer, it is arranged on one of them end face of this heat sink material, the Physical layer of being made up of Graphene;
The graphite rete, it is arranged on the opposite side of above-mentioned first graphene layer, the Physical layer of being made up of graphite film.
2. a kind of heat sink material with graphite film and Graphene composite construction according to claim 1 is characterized in that: described first graphene layer, include four individual layers and more than.
3. a kind of heat sink material with graphite film and Graphene composite construction according to claim 2, it is characterized in that: described first graphene layer, its thickness is within 1000 nanometers.
4. a kind of heat sink material with graphite film and Graphene composite construction according to claim 1 is characterized in that: described graphite rete, thickness is more than 1 micron.
5. a kind of heat sink material with graphite film and Graphene composite construction according to claim 4 is characterized in that: described graphite rete, its thickness is between 5 microns to 5 millimeters.
6. a kind of heat sink material with graphite film and Graphene composite construction according to claim 5, it is characterized in that: described graphite rete, its thickness is preferably between 10 microns to 100 microns.
7. a kind of heat sink material according to claim 1 with graphite film and Graphene composite construction; It is characterized in that: the version of described heat sink material does; Graphene layer-graphite rete-[(graphene layer-graphite rete) * N], N is the integer more than or equal to 1.
8. a kind of heat sink material according to claim 1 with graphite film and Graphene composite construction; It is characterized in that: the version of described heat sink material does; Graphene layer-graphite rete-[(metal level-graphite rete) * N], wherein N is the integer more than or equal to 1.
9. a kind of heat sink material with graphite film and Graphene composite construction according to claim 1 is characterized in that: the version of described heat sink material does, graphene layer-[(graphite rete-metal level) * N], and wherein N is the integer more than or equal to 1.
10. a kind of heat sink material with graphite film and Graphene composite construction according to claim 1 is characterized in that: between graphene layer and adjacent graphite rete, be provided with the adhesive that the two is linked together.
11. a kind of heat sink material according to claim 10 with graphite film and Graphene composite construction; It is characterized in that: described adhesive is provided with the face structure that structure is a thin layer form, lattice array structure, line array structure three one of which on graphene layer and/or graphite rete.
12. a kind of heat sink material with graphite film and Graphene composite construction according to claim 10, it is characterized in that: described adhesive is an organic adhesion agent.
13. a kind of heat sink material with graphite film and Graphene composite construction according to claim 10, it is characterized in that: described adhesive is a metal material.
14. a kind of heat sink material with graphite film and Graphene composite construction according to claim 13, it is characterized in that: the face structure of the metal material of the thin layer form that is adopted, thickness is within 10 microns.
15. a kind of heat sink material with graphite film and Graphene composite construction according to claim 13 is characterized in that: described metal material be aluminium, copper, tin, silver, gold one of them.
16. the implementation method with heat sink material of graphite film and Graphene composite construction is characterized in that, is adopting metal material to carry out having following steps when bonding:
Step S110 between the interlayer of the graphite rete and adjacent first graphene layer, is provided with the solid-state metallic material layer;
Step S120, near attaching, aforesaid solid-state metallic material is set to the material in the interlayer with graphite rete and adjacent first graphene layer;
Step S130 is directed to the graphite rete of attaching or adjacent graphene layer and heats, and aforesaid solid-state metallic material is carried out melt processed;
Step S140, in metal material part when being in molten state at least, both compress the back condensation with aforesaid graphite rete and adjacent graphene layer, form the structure that the outermost end face is respectively first graphene layer and graphite rete.
17. the implementation method with heat sink material of graphite film and Graphene composite construction is characterized in that, is adopting organic adhesion agent to carry out having following steps when bonding:
Step S210, graphite rete and adjacent first graphene layer both at least on the one of which, the coated structure of adhesive is set;
Step S220 carries out graphite rete and the first adjacent graphene layer near attaching, and aforesaid adhesive is the material of layout in the interlayer;
Step S230, with aforesaid graphite rete and adjacent first graphene layer both to compress the back fixing, form the structure that the outermost end face is respectively first graphene layer and graphite rete.
18. the implementation method with heat sink material of graphite film and Graphene composite construction is characterized in that this method comprises the steps:
Step S310 gets the graphite film material as the graphite rete respectively, and as the grapheme material of first graphene layer;
Step S320 with the two overlapping placement, and exerts pressure to it, and the two is pressed close to each other, forms the structure that the outermost end face is respectively first graphene layer and graphite rete.
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| CN106273883A (en) * | 2016-08-12 | 2017-01-04 | 碳元科技股份有限公司 | A kind of graphite linings laminated structure and preparation method thereof |
| CN106273883B (en) * | 2016-08-12 | 2018-10-02 | 碳元科技股份有限公司 | A kind of graphite laminar structure and preparation method thereof |
| CN107311659A (en) * | 2017-06-22 | 2017-11-03 | 李若明 | A kind of preparation method of graphite film/graphene composite film |
| CN111497367A (en) * | 2020-04-26 | 2020-08-07 | 哈尔滨工业大学（威海） | High-heat-conductivity body and preparation method thereof |
| CN112980400A (en) * | 2021-03-04 | 2021-06-18 | 浙江大学 | High-efficient light flexible heat conduction chain based on graphite alkene macroscopic view equipment membrane |
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