CN102426121A - Method for unsealing component at fixed point - Google Patents
Method for unsealing component at fixed point Download PDFInfo
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- CN102426121A CN102426121A CN2011102519832A CN201110251983A CN102426121A CN 102426121 A CN102426121 A CN 102426121A CN 2011102519832 A CN2011102519832 A CN 2011102519832A CN 201110251983 A CN201110251983 A CN 201110251983A CN 102426121 A CN102426121 A CN 102426121A
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Abstract
The invention provides a method for unsealing a component at a fixed point. The method comprises the following steps of: A. confirming a component needing an unsealing test and the position of a chip corresponding to the component; B. wrapping the component tightly with a piece of aluminized paper with one surface equipped with glue, cutting the aluminized paper at a position needing unsealing with a knife and taking the aluminized paper out; C. dropping a prepared hot mixed acid on a plastic packaging material where the aluminized paper is cut off until the chip is exposed; D. placing the component into an acetone solution and placing a containing holding the acetone solution into an ultrasonic cleaning machine so as to clean and eliminate the corroded plastic packaging material; E. unveiling the aluminized paper on the surface of the component and drying the component. According to the invention, the method has advantages of simple steps, convenient operation, few using consumable materials, and reduced component unsealing costs. Besides, windowing is carried out on a required position of the component, so that it can be ensured that a pin on the component will not be corroded and it is convenient to carry out subsequent electric measurement processes.
Description
Technical field
The present invention relates to a kind of failure of elements analytical approach, particularly a kind of method of using fixed point Kaifeng that components and parts are carried out failure analysis to components and parts.
Background technology
The Kaifeng test is a kind of destructive test, is primarily aimed at packaging.Components and parts general using nitration mixture for the EMC encapsulation erodes exposed chip to the packaging body of components and parts outside, for follow-up experiment is prepared.The general in the industry machine that breaks a seal automatically that uses breaks a seal, or is welded on components and parts on the copper framework, generally is stained with scaling powder to the copper framework during welding; Insert the tin stove then, be stained with tin after, framework tin sticky is partly lain in the tin liquor surface; Clamp components and parts with tweezers and be stained with scaling powder; Be put on the framework, wait after the whole welding well of components and parts, put into ready nitration mixture to components and parts and break a seal.Automatically the advantage in Kaifeng machine Kaifeng is that comparison safety is also more convenient, and shortcoming is can not the better controlled etching time, can only come setting-up time according to the personal experience; If the time is too short; Can not eliminate the plastic-sealed body of chip surface, if the time is oversize, the copper cash on the copper cash device might be corroded; And the size of Kaifeng, components and parts surface window depends on the tool that machine is supporting fully in the experiment, can not set the position in Kaifeng as required arbitrarily.Speed was fast when the advantage of second method was in batches experiment, follow-uply took pictures more conveniently, and shortcoming is to use consumables cost such as copper framework high, and the Kaifeng of can not fixing a point.Therefore, how components and parts are fixed a point to break a seal and reduce the cost that breaks a seal, become this technical field problem demanding prompt solution.
Summary of the invention
Can not be in order to solve existing Kaifeng method to the position that needs to analyze break a seal test and the high problem of Kaifeng cost, the present invention proposes following technical scheme:
The method in a kind of components and parts fixed point Kaifeng may further comprise the steps:
The components and parts that A, affirmation need break a seal and test, the photo in kind and the X-ray photo of shooting components and parts are confirmed components and parts relevant chip position according to photo;
B, use the aluminium-foil paper of one-side band glue that components and parts are closely wrapped up, cut taking-up with the pocket knife locational aluminium-foil paper that needs break a seal;
C, the hot nitration mixture that will mix up with suction pipe drop on the plastic packaging material that has excised aluminium-foil paper on the components and parts and expose until chip;
D, components and parts are put into acetone soln, the container of splendid attire acetone soln is put in the supersonic wave cleaning machine components and parts are cleaned, the plastic packaging material that is corroded until the components and parts surface eliminates; E, throw off the aluminium-foil paper on components and parts surfaces, and components and parts are dry.
As a kind of preferred version of the present invention, the hot nitration mixture temperature among the said step C is 90 ℃.
As another kind of preferred version of the present invention, the drying means of components and parts is a hot blast drying in the said step e.
The beneficial effect that the present invention brings is:
1, the inventive method step is simple, and is easy to operate, uses consumptive material few, reduced the cost in components and parts Kaifeng;
2, the inventive method can position Kaifeng according to the ad-hoc location that components and parts needs Kaifeng is observed;
3, the inventive method is windowed through the position that need analyze components and parts, can guarantee that pin is not corroded on the components and parts, is convenient to follow-up electrical measurement operation;
4, the inventive method can be observed the extent of corrosion of components and parts surface plastic packaging material at any time, guarantees can not damage routing.
Embodiment
Set forth in detail in the face of preferred embodiment of the present invention down, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
Present embodiment is to the C-MOS device detection that breaks a seal, and its concrete operations step is following:
A, the photo in kind of taking this C-MOS device and X-ray photo are confirmed this C-MOS device relevant chip position according to photo in kind and X-ray photo;
B, use the aluminium-foil paper of one-side band glue that this C-MOS device is closely wrapped up, guarantee that aluminium-foil paper and this C-MOS device fit tightly, cut taking-up with the pocket knife locational aluminium-foil paper that needs break a seal then;
C, the nitration mixture that mixes up is heated to 90 ℃, the hot nitration mixture that will mix up with suction pipe drops on this C-MOS device and has excised on the plastic packaging material of aluminium-foil paper, exposes until chip;
D, components and parts are put into acetone soln, the container of splendid attire acetone soln is put in the supersonic wave cleaning machine components and parts are cleaned, the plastic packaging material that is corroded until the components and parts surface eliminates;
E, throw off the aluminium-foil paper on components and parts surfaces, and use the method for hot blast drying that components and parts are dry, the components and parts that Kaifeng is good carry out follow-up observation analysis, and the chip of finding this C-MOS device has the vestige of burn.
The above; Be merely embodiment of the present invention; But protection scope of the present invention is not limited thereto; Any those of ordinary skill in the art are in the technical scope that the present invention disclosed, and variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (3)
1. the method in components and parts fixed point Kaifeng, it is characterized in that: this method may further comprise the steps:
The components and parts that A, affirmation need break a seal and test, the photo in kind and the X-ray photo of shooting components and parts are confirmed components and parts relevant chip position according to photo;
B, use the aluminium-foil paper of one-side band glue that components and parts are closely wrapped up, cut taking-up with the pocket knife locational aluminium-foil paper that needs break a seal;
C, the hot nitration mixture that will mix up with suction pipe drop on the plastic packaging material that has excised aluminium-foil paper on the components and parts, expose until chip;
D, components and parts are put into acetone soln, the container of splendid attire acetone soln is put in the supersonic wave cleaning machine cleaned, the plastic packaging material that is corroded until the components and parts surface eliminates;
E, throw off the aluminium-foil paper on components and parts surfaces, and components and parts are dry.
2. the method in a kind of components and parts fixed point according to claim 1 Kaifeng, it is characterized in that: the hot nitration mixture temperature among the said step C is 90 ℃.
3. the method in a kind of components and parts fixed point according to claim 1 Kaifeng, it is characterized in that: the drying means of components and parts is a hot blast drying in the said step e.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102519832A CN102426121A (en) | 2011-08-30 | 2011-08-30 | Method for unsealing component at fixed point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102519832A CN102426121A (en) | 2011-08-30 | 2011-08-30 | Method for unsealing component at fixed point |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102426121A true CN102426121A (en) | 2012-04-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102519832A Pending CN102426121A (en) | 2011-08-30 | 2011-08-30 | Method for unsealing component at fixed point |
Country Status (1)
| Country | Link |
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| CN (1) | CN102426121A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104599981A (en) * | 2015-01-07 | 2015-05-06 | 航天科工防御技术研究试验中心 | Plastic package device opening method |
| CN104599997A (en) * | 2015-01-30 | 2015-05-06 | 工业和信息化部电子第五研究所 | Unpacking method of plastic-packed metal wire bonding device |
| CN104658881A (en) * | 2013-11-21 | 2015-05-27 | 上海华虹宏力半导体制造有限公司 | Fast nondestructive full de-encapsulation method of contact-type IC card |
| CN106098571A (en) * | 2016-08-08 | 2016-11-09 | 湖北三江航天红峰控制有限公司 | A kind of pre-opening method of plastic-packaged electronic component |
| CN106531668A (en) * | 2016-12-16 | 2017-03-22 | 贵州航天计量测试技术研究所 | Unpackaging device and method for unpackaging plastic packaging device by employing acid dropping method |
| CN106683977A (en) * | 2016-12-16 | 2017-05-17 | 贵州航天计量测试技术研究所 | Unsealing device and unsealing method of molded package device |
| CN108275330A (en) * | 2017-01-05 | 2018-07-13 | 富士康(昆山)电脑接插件有限公司 | A kind of method of ceramic package component rapid open |
| CN111693852A (en) * | 2020-06-23 | 2020-09-22 | 紫光宏茂微电子(上海)有限公司 | Plastic packaged component unsealing method and unsealing device |
| CN113252427A (en) * | 2021-04-30 | 2021-08-13 | 苏试宜特(深圳)检测技术有限公司 | Method for removing heat dissipation cover without introducing external hard force |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104658881A (en) * | 2013-11-21 | 2015-05-27 | 上海华虹宏力半导体制造有限公司 | Fast nondestructive full de-encapsulation method of contact-type IC card |
| CN104658881B (en) * | 2013-11-21 | 2017-12-05 | 上海华虹宏力半导体制造有限公司 | A kind of quick nondestructive standard-sized sheet encapsulation method of Contact Type Ic Card |
| CN104599981B (en) * | 2015-01-07 | 2017-06-30 | 航天科工防御技术研究试验中心 | The opening method of plastic device |
| CN104599981A (en) * | 2015-01-07 | 2015-05-06 | 航天科工防御技术研究试验中心 | Plastic package device opening method |
| CN104599997A (en) * | 2015-01-30 | 2015-05-06 | 工业和信息化部电子第五研究所 | Unpacking method of plastic-packed metal wire bonding device |
| CN106098571A (en) * | 2016-08-08 | 2016-11-09 | 湖北三江航天红峰控制有限公司 | A kind of pre-opening method of plastic-packaged electronic component |
| CN106098571B (en) * | 2016-08-08 | 2018-12-28 | 湖北三江航天红峰控制有限公司 | A kind of pre- opening method of plastic-packaged electronic component |
| CN106683977A (en) * | 2016-12-16 | 2017-05-17 | 贵州航天计量测试技术研究所 | Unsealing device and unsealing method of molded package device |
| CN106531668A (en) * | 2016-12-16 | 2017-03-22 | 贵州航天计量测试技术研究所 | Unpackaging device and method for unpackaging plastic packaging device by employing acid dropping method |
| CN108275330A (en) * | 2017-01-05 | 2018-07-13 | 富士康(昆山)电脑接插件有限公司 | A kind of method of ceramic package component rapid open |
| CN111693852A (en) * | 2020-06-23 | 2020-09-22 | 紫光宏茂微电子(上海)有限公司 | Plastic packaged component unsealing method and unsealing device |
| CN111693852B (en) * | 2020-06-23 | 2023-12-22 | 宏茂微电子(上海)有限公司 | Plastic packaging component unsealing method and unsealing device |
| CN113252427A (en) * | 2021-04-30 | 2021-08-13 | 苏试宜特(深圳)检测技术有限公司 | Method for removing heat dissipation cover without introducing external hard force |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120425 |