CN102369792A - 具有增强封装的无线过程通信适配器 - Google Patents

具有增强封装的无线过程通信适配器 Download PDF

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CN102369792A
CN102369792A CN2010800128503A CN201080012850A CN102369792A CN 102369792 A CN102369792 A CN 102369792A CN 2010800128503 A CN2010800128503 A CN 2010800128503A CN 201080012850 A CN201080012850 A CN 201080012850A CN 102369792 A CN102369792 A CN 102369792A
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circuit board
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field apparatus
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CN102369792B (zh
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大卫·M·斯特雷
乔尔·D·万德拉
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Rosemount Inc
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    • H—ELECTRICITY
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Abstract

本发明提供一种针对现场设备(12)的无线过程通信适配器(14、30)。所述适配器(14、30)包括：金属外壳(120)，具有第一端和第二端。在所述第一端和所述第二端之间限定腔(130)。将射频透过性天线罩(124)耦合到所述第一端。所述第二端具有被配置为连接到现场设备(12)的现场设备连接器(123)。将至少一个电路板(132、134)置于所述腔(130)中。所述电路板(132、134)至少承载无线过程通信电路(154)。将多根线(158、160)耦合到所述至少一个电路板(132、134)，并延伸通过所述现场设备连接器(123)。硅树脂灌封(136)实质上填充了所述腔(130)中未由所述至少一个电路板(132、134)和所述无线过程通信电路(154)所占有的全部容积。

Description

具有增强封装的无线过程通信适配器
背景技术
在工业设置中，控制系统用于监视和控制工业库存和化学过程等等。控制系统一般使用分布在工业过程中关键位置处的并通过过程控制环路耦合到控制室的控制电路的现场设备，来执行这些功能。术语“现场设备”指代在分布式控制或过程监视系统中执行功能的任何设备，包括在工业过程的测量、控制和监视中使用的任何当前已知的或尚未已知的所有设备。
一些现场设备包括换能器(transducer)。将换能器理解为意味着或者是基于物理输入产生输出信号的设备，或者是基于输入信号产生物理输出的设备。换能器一般将输入变换为具有不同形式的输出。换能器的类型包括各种分析传感器、压力传感器、热敏电阻器、热电偶、应变仪、水平传感器、数字阀门控制器、流量计、流量计算机、定位器、致动器、螺线管、指示灯等等。
每个现场设备一般还包括用于通过过程控制环路与过程控制室或其他电路通信的通信电路。在一些设施中，过程控制环路还用于向现场设备传输已调整的电流和/或电压，以向现场设备供电。过程控制环路还传输具有模拟或数字格式的数据。
传统上，已将模拟现场设备通过双线过程控制电流环路连接到控制室，同时每个设备通过单一的双线控制环路连接到控制室。针对模拟模式，将双线之间的压差维持在从12到45伏特的电压范围中，针对数字模式，维持在9-50伏特的电压范围中。一些模拟现场设备通过将与检测到的过程变量成正比的电流调制到在电流环路中运行的电流中向控制室发送信号。通过控制环路中的电流的大小，其他模拟现场设备可以在控制室的控制下执行动作。除此之外，或作为备选，过程控制环路还可以传输用于与现场设备通信的数字信号。
在一些实施中，已开始使用无线技术与现场设备进行通信。无线操作简化了现场设备的布线和设置。然而，大多数现场设备是硬连线到过程控制室的，且不使用无线通信技术的。
工业过程工程通常包含上百或甚至上千的现场设备。很多这些现场设备包含复杂的电子装置并能够提供比传统的模拟4-20mA测量更多的数据。出于很多原因(成本是其中之一)，很多工厂并未利用这种现场设备所提供的额外数据的优势。这就产生了对针对这种现场设备的无线适配器的需要，该无线适配器可以连接到现场设备上，且经由无线网络向控制系统或其他监视或诊断系统或应用发送回数据。
为了操作工业过程工程，现场设备必须经常进行危险位置许可评级(hazardous location approval ratings)。存在不同类型的评级，且为了被广泛地采用，无线现场设备适配器应当能够连接到每个这种现场设备上，同时不破坏该现场设备的危险位置许可评级。
这些许可评级之一被称作免爆或防爆评级。免爆外壳的目的是万一可燃性气体进入外壳并点燃，则外壳将爆炸控制住。如果外壳不能控制该爆炸，则其可能点燃周围的气体，并造成灾难性的后果。
另一种类型的许可评级被称作本质安全(IS)。本质安全设备通过限制在电子装置中出现的能量数量且通过确保将电子装置组件间隔地足够远来避免在电子故障事件中电弧放电，从而避免了可燃性气体的点燃。电子装置组件产生的热也受到控制。让设备的电子装置本质安全易于使组件的数目上升且增加了电路板的尺寸。在必须将设备的物理尺寸最小化时，这也提出了新的挑战。
为了让无线通信适配器能在免爆设施中使用，其自身必须是防爆的，且其必须在两个设备之间的连接处提供免爆屏障。对于本质安全的设施，无线通信电路必须也是本质安全的。将这种适配器连接到任一设备的能力也使得物理尺寸上升。可以在很多配置中安装工业设备，比如现场设备，且该工业设备一般被置于紧密的空间中。这就要求小型且不显眼的设计。
提供针对现场设备的相对小型且不显眼的但是依然能够方便符合免爆认证和本质安全的无线通信适配器将推动无线过程通信领域的发展。
发明内容
本发明提供一种针对现场设备的无线过程通信适配器。所述适配器包括：金属外壳，具有第一端和第二端。在所述第一端和所述第二端之间限定腔。将射频透过性天线罩耦合到所述第一端。所述第二端具有被配置为连接到现场设备的现场设备连接器。将至少一个电路板置于所述腔中。所述电路板至少承载无线过程通信电路。将多根线耦合到所述至少一个电路板，并通过所述现场设备连接器延伸。硅树脂灌封实质上填充了所述腔中未由所述至少一个电路板和所述无线过程通信电路所占据的全部容积。
附图说明
图1是可操作地耦合到根据本发明的实施例的无线通信适配器的有线过程现场设备的概略图。
图2示出了现场设备以及根据本发明的实施例的无线过程通信适配器的简化横截面图。
图3根据本发明的实施例的无线过程通信适配器的横截面概略图。
图4是硅树脂灌封对各种表面的粘性测试结果的图。
图5是硅树脂灌封固化温度对灌封粘性和所需泡沫的量的图。
具体实施方式
本发明的实施例一般提供了可以连接到或者是免爆的或者是本质安全的有线过程过程现场设备上的无线发射机，且同时不破坏这种现场设备的许可评级。该无线通信适配器被配置为提供防爆，且还优选地包含本质安全电子装置。该适配器优选地包括位于与有线过程设备的连接点处的免爆屏障，并包括完全封装的电子装置。
图1是可操作地耦合到根据本发明的实施例的无线通信适配器14的有线过程现场设备12的概略图。尽管图1将现场设备12示出为过程流体压力变送器(比如Chanhassen，Minnesota的Emerson ProcessManagement出售的具有商业名称Model 3051S的过程流体压力变送器)，可以使用任何合适的现场设备。现场设备一般包括传感器模块(比如传感器模块16)、电子装置模块(比如电子装置模块18)。一般将现场设备12设计为符合免爆规则。此外，现场设备12中的电子装置的设计可以依照于本质安全要求，比如由Factory Mutual Research在1998年10月发布的名为APPROVAL STANDARD INTRINSICALLYSAFE APPARATUS AND ASSOCIATED APPARATUS FOR USE INCLASS I，II，AND III，DIVISION 1HAZARDOUS(CLASSIFIED)LOCATIONS，CLASS NUMBER 3610的标准的一个或多个部分。现场设备12一般包括传感器模块16中的传感器(比如压力传感器)，该传感器将过程流体特性(比如压力)进行转换，并向电子装置模块18提供该过程流体变量的电子指示。然后电子装置模块18通过一般经由输入20耦合的过程通信环路，来传输过程变量信息。
如上所述，向有线过程现场设备提供附加的通信能力(比如无线通信能力)变得是有利的。通过提供无线过程通信适配器，比如过程通信适配器14，可以传递除了通过有线过程连接发送之外的附加的数字信息。可以将这种信息传输到分离的监视或诊断系统或应用，用于分析。此外，对附加通信资源的简单的提供，比如适配器14，还允许冗余通信。让过程通信适配器14能够与现场设备耦合，同时不负面的影响装置继续满足免爆和/或本质安全要求的能力是重要的。
图2示出了现场设备12和根据本发明的实施例的无线过程通信适配器30的简化横截面图。将现场设备12通过输入20和导管11耦合到过程通信环路22。过程通信环路的示例包括高速可寻址远程传感器
Figure BDA0000092908750000041
协议以及FOUNDATIONTM Fieldbus协议。然而，其他有线过程通信协议是众所周知的。在过程变量变送器的示例中，现场设备12包括连接到测量电路52以测量过程变量的过程变量传感器50。变送器电路54被配置为使用已知技术来接收过程变量并将过程变量传输到双线过程控制环路22上。现场设备12通过连接块102耦合到双线过程控制环路22上。无线通信适配器30通过连接块106耦合到双线过程控制环路22上，并将无线通信适配器30通过例如螺纹连接123和109安装在现场设备12的外壳上。无线过程通信适配器30的底架通过线108耦合到现场设备12的电接地连接器110。现场设备12包括耦合到来自无线过程通信适配器30的连接112的双线过程连接块102。无线过程通信适配器30的外壳120承载耦合到无线过程通信适配器30的无线通信电路的天线126。可以使用射频(RF)透过性端盖124来可密封的耦合到外壳120上，以允许通过其传输RF信号。在图2所示的布置中，向射频适配器提供5个电子连接，其包括4个环路连接以及1个电接地连接。
图3是根据本发明的实施例的无线过程通信适配器的横截面概略图。如图3所示，无线过程通信适配器30优选地包括圆柱形金属外壳120，其在一端具有用于容纳射频透过性天线罩(radome)或端盖124的大开口150，以及在另一端具有用于容纳现场设备连接器122的相对小的开口152。电子装置154驻留在空腔130中，优选地在一对印刷电路板132、134上。电子装置优选地包括无线通信电路，以允许无线过程通信适配器根据一种或多种无线通信协议进行通信。合适的无线过程通信协议的示例包括例如：无线网络技术(比如由Irvine，California的Linksys构建的IEEE 802.11b无线接入点和无线网络设备)；超宽带、自由空间光学、全球移动通信系统(GSM)、通用分组无线服务(GPRS)；码分多址(CDMA)；扩频技术、红外通信技术；SMS(短消息服务/文本消息)；来自Bluetooth SIG(www.bluetooth.com)的已知的Bluetooth规范，比如Bluetooth核心规范版本1.1(2001年2月22日)；以及由Hart通信基金公布的WirelessHART规范。Wireless
Figure BDA0000092908750000051
规范的相关部分包括：HCF_Spec 13，修订7.0；HART规范65-无线物理层规范；HART规范75-TDMA数据链路层规范(TDMA指代时分多址接入)；HART规范85-网络管理规范；HART规范155-无线命令规范；以及HART规范290-无线设备规范。
将每个电路板132、134上的电子装置优选地安装为在它们周围具有间隔，且安装在电路板之间，以利于灌封成分的流动。在密封该外壳的情况下，将灌封136通过通道156注入腔130中，直到外壳满为止。尽管可以使用任何合适的灌封成分，但是重要的是让灌封材料本身满足许可机构(approval agency)的要求，其包括合适的耐化学性、在热和冷的操作温度下的热稳定性、以及其他相关参数。本发明的一些实施例提供了特定的使用封装的硅树脂和特定调节，以容纳在适配器中产生的在适配器的整个热操作范围上的各种热应力。天线罩124、外壳120、以及现场设备连接器122为灌封136提供了防风雨的外壳。
现场设备连接器122提供了直接连接到现场设备12的方法。馈穿(feedthrough)装置140优选地还作为在连接点处的免爆屏障。如果可燃气体进入现场设备的外壳并点燃，则馈穿装置140将控制该爆炸。引线158、160穿过馈穿装置140。用能够经受爆炸压力的灌封来填充连接器的内部。连接器的内部包括肩部166，肩部166帮助保持连接器中的灌封。现场设备连接器122还可以包括活接头(union)和/或弯头(elbow)以按照需要提供可调整性。在一个实施例中，通过让线158、160穿过馈穿装置140中的胶合接头(cemented joint)来提供免爆屏障。通过用能够经受爆炸压力的灌封来填充馈穿装置140，以创建该胶合接头164。
从而无线过程通信适配器30优选地使用馈穿装置的封装和调节，来提供防爆和环境保护，并减少在电子装置组件中为了本质安全保护所需的间隔。在用灌封来填充组件之间的空间时，本质安全间隔要求就不那么严格了。这允许更有效率地将整个设备小型化。封装通过将可燃气体完全排除在外而实现了防爆。无线过程通信适配器30的电子装置完全地由灌封所环绕，且因此避免受到环境的影响。
本发明的一些实施例源自于对用灌封材料(比如塑料或环氧树脂)来填充金属外壳120的困难的判断。在不增加最终产品的尺寸的情况下，设计足够的自由空间来允许灌封在适配器的操作温度上的额外膨胀/收缩将是极度困难的(如果不是不可能的话)。然而，增加最终产品的尺寸在市场接受角度来讲被视为是不受欢迎的。取而代之地，在本发明的一些实施例中使用硅树脂灌封来封装电子装置，且确定在环境温度低于灌封的固化温度时，硅树脂灌封将粘附于铝外壳120，而不是电路板132、134。将硅树脂底层漆(silicone primer)涂到电路板偶尔引起灌封将组件从电路板上拉下来，从而可能降低制造产量。此外，还确定，灌封可能通过在环境温度高于灌封的固化温度时挤压大型电子装置组件(比如电解电容器)，施加足以摧毁这些组件的足够压力。
本发明的实施例一般提供完全封装的无线过程通信适配器，该无线过程通信适配器使用脱模剂、泡沫以及特别的固化的硅树脂灌封的组合，来补偿在灌封与适配器中的其他组件之间的相对大的热膨胀差异。
存在相互关联来为无线过程通信适配器提供优异的灌封解决方案的4种要素。这些要素包括：硅树脂灌封的类型、脱模剂的类型、泡沫垫的提供、以及固化过程。
将硅树脂灌封材料确定为灌封设计的优异候选。具体地，针对在电路板132、134上提供的高密度表面安装的装置选择两部分(two-part)硅树脂材料，因为这些材料是相容的，且弹性体材料一般不对装置施加高应力。此外，硅树脂灌封材料提供了良好的电属性和广泛有用的温度范围。硅树脂灌封材料的选择如下帮助驱动了对脱模剂、泡沫和固化过程的选择。
为了满足上述本质安全许可规范，以及长期可靠性要求，硅树脂灌封材料需要粘附于产品中的电路板132、134上，而不是外壳120上。很多因素使得这种设计要求是困难的。具体地，相对于电路板132、134，硅树脂更好地粘附于铝外壳120。此外，硅树脂灌封材料的大的热膨胀系数使得其在相对低的环境温度下就从电路板132、134上脱离，从而在灌封材料和电路板之间创建了空隙。此外，硅树脂底层漆可能如此多地增加对电路板的粘性，以至于其导致将电子装置组件固定在电路板132、134上的焊接结合处的偶尔失效。为了创建在重复的热循环期间硅树脂灌封将会粘附于电路板上的情况，在外壳120的内侧喷涂脱模剂。脱模剂一般将硅树脂灌封材料对铝外壳120的粘性降低到硅树脂灌封材料对电路板132、134的粘性之下，从而导致甚至在低温下的硅树脂灌封材料对电路板132、134的粘附。在这种低温下，在硅树脂灌封材料和铝外壳120之间创建空隙。一般的，硅树脂灌封材料不粘附于很多事物上，使得难以找到进一步降低粘性的脱模剂。作为示例，DuPont销售的
Figure BDA0000092908750000081
是针对硅树脂的常用脱模剂，且其在阻止硅树脂粘附于铝的方面工作良好。不幸的是，相对于电路板132、134，硅树脂灌封更好地粘附于
Figure BDA0000092908750000082
类似地，硅树脂油是另一种常用脱模剂，但是由于与硅树脂灌封相似的原因，硅树脂脱模剂实际上增加了对铝外壳120的粘性。取而代之地，使用基于卵磷脂的脱模剂，将硅树脂对铝外壳120的粘性降到低于硅树脂对电路板132、134的粘性。在图3中以引用标号180概略性地示出了该层卵磷脂脱模剂。
图4是示出了针对硅树脂灌封对各种表面的粘性测试的结果的图。该测试在得到本发明的实施例的材料和过程的协同选择中是有用的。硅树脂灌封对电路板的粘性随着灌封的固化温度而改变。较高的灌封固化温度被发现导致灌封对电路板的较低粘性，同时较低的灌封固化温度导致硅树脂灌封对电路板的较高粘性。硅树脂灌封对铝外壳的粘性呈现为不受灌封的固化温度的影响。
由于需要低硅树脂灌封固化温度来最大化对电路板的粘性，因此在灌封固化温度和适配器的操作温度的上限之间，灌封在过程适配器的操作温度上的高热膨胀可能在外壳120中导致高的内部压力。对于一些实施例，初始使用22摄氏度的灌封固化温度。作为参考，无线过程通信适配器的操作温度的上限是大约85摄氏度。在22摄氏度下和在操作温度上限下的硅树脂灌封材料之间的热膨胀的差异导致在外壳120中产生大约9000psi的压强。该压强足够大到挤压无线过程适配器中的电子装置组件，比如电解电容器。尽管还确定可以通过简单地增加灌封固化温度来降低压强，然而这对于硅树脂灌封材料对电路板的粘性产生负面影响。
如图4所示，使用硅树脂底层漆，观察到在硅树脂灌封和电路板之间的大约40psi的粘性评级。在不使用任何底层漆的情况下，在电路板和硅树脂灌封之间的粘性是大约7.5psi。在喷涂了脱模剂时，在硅树脂灌封材料和铝外壳之间的粘性被确定为大约17.5psi。在不使用脱模剂的情况下，在铝外壳和硅树脂灌封材料之间的粘性大约是8psi。此外，在喷涂了PTFE脱模剂时，在硅树脂制模材料和铝外壳之间的粘性是大约7.5psi。最后，在喷涂了卵磷脂脱模剂时，在铝外壳和硅树脂脱模剂之间的粘性是大约2.5psi。当然，向电路板喷涂或以其他方式提供硅树脂底层漆将确保硅树脂灌封材料和板之间的粘性远高于铝和硅树脂灌封材料之间的粘性。然而，如图4所示，硅树脂底层漆过多的增加了对电路板的粘性，其导致将电子装置组件固定到电路板的焊接结合处的偶尔失效。然而，在铝外壳上使用卵磷脂脱模剂时，与硅树脂灌封的粘性小于与未涂底层漆的电路板的粘性。
为了平衡对增强硅树脂对电路板的粘性的低温固化的需要，同时依然避免挤压较大的电子装置组件，比如电解电容器，添加聚乙烯泡沫层以在环境温度高于灌封的固化温度时保护这种组件。图3概略性地示出了在电路板132上支撑的电解电容器154。置于电解电容器154和硅树脂灌封材料130之间的是聚乙烯泡沫垫184。尽管根据本发明的实施例可以使用其他材料，选择聚乙烯是基于其可压缩性和与两部分硅树脂灌封材料的兼容性。难以压缩的泡沫将必须更厚，以吸收压力，且与硅树脂灌封材料不兼容的泡沫将导致硅树脂的不能固化(不能固化导致硅树脂保持液态而不是固态化)。附加地，如引用标号186所概略性示出的，还可以由泡沫垫来保护组件的侧向侧壁。可选的侧壁泡沫可以具有套筒的形式，或具有其他合适的形状，其大小遵循电子装置组件的外周界。
图5是各种实验所需的硅树脂灌封固化温度对灌封粘性和泡沫量的图，其给出了本发明的实施例的来源。如图5所示，灌封粘性强度在从大约22.5摄氏度的具有大约8.4psi的粘性到大约85摄氏度固化的硅树脂灌封材料的大约1.2psi的灌封粘性强度之间变化。这在图5的线190处示出。附加地，区域192示出了灌封对电路板的粘性不够高的结果，不足以作为可接受的结果。附加地，保护无线过程适配器中的电子装置组件免受热压缩力所需的最小泡沫厚度从大约22摄氏度的固化温度下的5/16英寸到60摄氏度固化的硅树脂灌封材料所需的1/16英寸的泡沫绝缘。作为该实验的结果，选择50摄氏度的硅树脂固化温度且选择1/8英寸的聚乙烯泡沫垫厚度，以保护无线过程通信适配器中的较大电子装置组件。然而如图5所示，可以根据本发明的实施例来实现泡沫垫厚度和硅树脂灌封材料固化温度的其他组合。更具体地，图5示出了从在大约45摄氏度的灌封温度与泡沫厚度在大约7/32英寸的泡沫厚度的级别的可接受结果，到在大约55摄氏度的硅树脂灌封材料以及1/16英寸的聚乙烯泡沫垫厚度处提供的可接受结果。
尽管已通过优选实施例描述了本发明，本领域技术人员将认识到在不脱离本发明的精神和范围的情况下可以作出形式和细节方面的改变。

Claims (15)

1.一种用于现场设备的无线过程通信适配器，所述适配器包括：
金属外壳，具有第一端和第二端，且在所述第一端和所述第二端之间限定腔，所述第一端具有耦合到所述第一端的RF透过性天线罩，所述第二端具有被配置为连接到现场设备的现场设备连接器；
至少一个电路板，置于所述腔中，所述电路板至少承载无线过程通信电路；
多根线，耦合到所述至少一个电路板，并延伸通过所述现场设备连接器；以及
硅树脂灌封，实质上填充了所述腔中未由所述至少一个电路板和所述无线过程通信电路所占据的全部容积。
2.根据权利要求1所述的适配器，其中，所述硅树脂灌封是两部分硅树脂灌封。
3.根据权利要求1所述的适配器，还包括涂在所述金属外壳内表面上的脱模剂。
4.根据权利要求3所述的适配器，其中，所述脱模剂是卵磷脂脱模剂。
5.根据权利要求4所述的适配器，还包括在所述至少一个电路板上的至少一个电子组件与所述金属外壳之间放置的泡沫垫。
6.根据权利要求5所述的适配器，其中，所述泡沫垫是用聚乙烯构建的。
7.根据权利要求6所述的适配器，还包括环绕所述至少一个电子组件的泡沫外罩。
8.根据权利要求1所述的适配器，还包括在所述至少一个电路板上的至少一个电子组件与所述金属外壳之间放置的泡沫垫。
9.根据权利要求8所述的适配器，其中，所述泡沫垫是用聚乙烯构建的。
10.根据权利要求9所述的适配器，还包括环绕所述至少一个电子组件的泡沫外罩。
11.根据权利要求9所述的适配器，其中，所述硅树脂灌封在大约50摄氏度处固化。
12.根据权利要求1所述的适配器，其中，所述硅树脂灌封在大约50摄氏度处固化。
13.一种制造无线过程通信适配器的方法，所述方法包括：
提供金属外壳、天线罩、以及现场设备连接器；
提供具有无线通信电路的至少一个电路板；
向所述外壳的内表面涂脱模剂；
将所述至少一个电路板置于所述外壳中；
将所述现场设备连接器附加在所述金属外壳上；
将所述天线罩耦合到所述金属外壳上；
准备两部分硅树脂灌封材料；
用所述两部分硅树脂灌封材料填充所述外壳；以及
固化所述两部分硅树脂。
14.根据权利要求13所述的方法，其中，在大约50摄氏度处执行对所述两部分硅树脂的固化。
15.一种根据权利要求13所述的方法制造的无线过程通信适配器。
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