CN102368497A - LED (light-emitting diode) light source - Google Patents
LED (light-emitting diode) light source Download PDFInfo
- Publication number
- CN102368497A CN102368497A CN2011102841510A CN201110284151A CN102368497A CN 102368497 A CN102368497 A CN 102368497A CN 2011102841510 A CN2011102841510 A CN 2011102841510A CN 201110284151 A CN201110284151 A CN 201110284151A CN 102368497 A CN102368497 A CN 102368497A
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- China
- Prior art keywords
- pad
- welding disk
- light source
- conductive welding
- luminescence chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The invention relates to an LED (light-emitting diode) light source and solves the problems that the existing LED light source pad is only suitable for an enlarged medium power chip, so that the cost is high and the lighting effect is low; and due to the adoption of a low power chip, a bank is excessively elongated and is difficult to manufacture, and the break risk exists in the process of welding a wire. The LED light source comprises a base and a pad, wherein the pad is arranged on the upper surface of the base; the pad is provided with light emitting chips; the base is also provided with a bowl cup; the pad comprises a heat conducting pad and a first conducting pad and a second conducting pad which are arranged at both sides of the heat conducting pad; the light emitting chips are arranged on the heat conducting pad; and the light emitting chips are respectively connected with the first conducting pad and the second conducting pad through gold wires. Due to the adoption of heat and electricity separation, the design service life of an LED is prolonged, and the long-term stability of the LED is improved; due to the layout of the LED light source, in the process of welding the wire, the bank does not need to be excessively elongated and is simpler to manufacture and the break risk is reduced; and a plurality of light emitting chips are arranged in a centralized mode, so that the packaging density and the lighting effect are improved and the packaging cost is also reduced.
Description
Technical field
The present invention relates to a kind of illuminating source, especially relate to a kind of high performance-price ratio, high density, led light source that light efficiency is good.
Background technology
Power LED light source pad structure and size only are applicable to larger-size middle power chip in existing, power chip encapsulated LED light source in this employing, and chip cost is high; Light efficiency is low, generally can only use a chip, and packaging density is low; Heat was concentrated when single chips was lighted; Temperature distributing disproportionation is even, and forms point-source of light, and photochromic spatial distribution is inhomogeneous.If adopt the small-power chip, chip number that can be integrated is restricted again, and because the small-power chip size is little, during bonding wire, bank is too long for gap, manufactures difficulty, and has the broken string risk.Like publication number is CN101713506A, and name is called China's invention application of a kind of high-sealed SMD LED, and it comprises support, and first bowl of cup is set on the support, and the cup end of first bowl of cup is provided with second bowl of cup, is fixed with a led chip in the bottom of second bowl of cup.Just there is above-mentioned shortcoming in this invention application: the power chip encapsulated LED light source generally can only use a chip in the employing, and packaging density is low, and heat was concentrated when single chips was lighted, and temperature distributing disproportionation is even, and forms point-source of light, and photochromic spatial distribution is inhomogeneous.
Summary of the invention
The present invention solves in the prior art led light source pad only to be suitable for and to add big-and-middle power chip, and the problem that the cost of existence is high, light efficiency is low provides a kind of high performance-price ratio, high density, led light source that light efficiency is good.
The present invention has also solved in the prior art LED and has adopted the small-power chip about pad, limited amount system, and bank draws longly during bonding wire; Make difficulty, and have the problem of broken string risk, a kind of high density is provided; Bank need not draw very longly during bonding wire, has reduced the led light source of broken string risk.
Above-mentioned technical problem of the present invention mainly is able to solve through following technical proposals: a kind of led light source; Comprise pedestal, be arranged on the pad of pedestal upper surface, pad is provided with luminescence chip; Also be provided with the bowl cup on the pedestal; Pad is interposed between pedestal and the bowl cup, and said pad comprises the thermal land in the middle of being positioned at, and first conductive welding disk and second conductive welding disk that are arranged on the thermal land both sides; Said luminescence chip is arranged on the thermal land, and luminescence chip is connected with first conductive welding disk, second conductive welding disk respectively through gold thread.The present invention is a kind of thermoelectric isolating construction; On the thermal land in the middle of luminescence chip concentrates on; This thermal land does not have electric current to flow through, and only play the heat transfer conductive force, and first conductive welding disk of the thermal land left and right sides is connected respectively at the luminescence chip pin with second conductive welding disk; Play electric action, thermoelectric separated structures has improved LED designed life and long-time stability.This centre of the present invention is provided with thermal land, and both sides are provided with the layout of conductive welding disk, makes to concentrate to use a plurality of small-power chips; And when welding; The luminescence chip both sides are conductive welding disks, and the luminescence chip pin has thought that with conductive welding disk bank need not be too long for gap through gold thread is convenient; Manufacture simplyr, reduced the risk of broken string.Luminescence chip is arranged on the intermediate thermal conductivity pad in addition, can concentrate many luminescence chips are set, and has improved packaging density and light efficiency, has also reduced packaging cost simultaneously.
As a kind of preferred version; Said thermal land two ends extend on the base bottom surface and are connected together in two sides up and down through the pedestal pedestal respectively; On base bottom surface, form a radiating part; First conductive welding disk and second conductive welding disk extend to base bottom surface through the pedestal left and right side respectively, form conductive part in the radiating part both sides.Heat is transmitted to base bottom along thermal land, through conducting with the base bottom connector, has played good thermolysis then.
As a kind of preferred version, said luminescence chip is in series, and this luminescence chip series circuit one end is connected on first conductive welding disk, and the other end is connected on second conductive welding disk.As required, can connect flexibly between the chip and between chip and the pad or parallel connection or string and combine to be connected, here the employing mode that is connected in series between the chip.
As a kind of preferred version, said luminescence chip is in parallel, and an end pin of each luminescence chip is connected on first conductive welding disk, and other end pin is connected on second conductive welding disk.As required, can connect flexibly between the chip and between chip and the pad or parallel connection or string and combine to be connected, here the employing mode that is connected in parallel between the chip.
As a kind of preferred version, said luminescence chip is divided into some groups, and every group of interior luminescence chip is in series, and luminescence chip series circuit one end of formation is connected on first conductive welding disk, and the other end is connected on second conductive welding disk.As required, can connect flexibly between the chip and between chip and the pad or parallel connection or string and combine to be connected the connected mode that this luminescence chip employing connection in series-parallel combines.
As a kind of preferred version, said bowl cup be a square structure, be provided with in the middle of the bowl cup circle in the through hole that contracts, said luminescence chip is arranged in through hole.The mode that bowl cup adopts circumference to combine, not only more attractive in appearance in appearance, and in that to go out on the light effect performance better.
As a kind of preferred version, said luminescence chip becomes two row to interlace to arrange to be arranged on the thermal land.Carry out the connection in series-parallel wiring in the middle of making things convenient for luminescence chip.
Therefore, advantage of the present invention is: 1. adopt thermoelectric isolating construction, improved LED designed life and long-time stability; 2. layout of the present invention make to concentrate is used a plurality of small-power chips, and bank need not be too long for gap when welding, manufactures simplyr, has reduced the risk of broken string; 3. concentrate many luminescence chips are set, improved packaging density and light efficiency, also reduced packaging cost simultaneously.
Description of drawings
Accompanying drawing 1 is a kind of Facad structure sketch map of the present invention;
Accompanying drawing 2 is a kind of reverse side structural representations of the present invention;
Accompanying drawing 3 is another kind of structural representations of the present invention;
Accompanying drawing 4 is the third structural representations of the present invention.
The 1-pedestal 2-bowl cup 3-thermal land 4-first conductive welding disk 5-second conductive welding disk 6-luminescence chip 7-through hole.
Embodiment
Pass through embodiment below, and combine accompanying drawing, do further bright specifically technical scheme of the present invention.
Embodiment:
A kind of led light source of present embodiment, as shown in Figure 1, comprise pedestal 1, the upper surface of pedestal is provided with pad, and this pad comprises thermal land 3, first conductive welding disk 4 that is arranged on the thermal land left and right sides and second conductive welding disk 5 in the middle of being arranged on.As depicted in figs. 1 and 2; This thermal land is at the positive upper strip of pedestal; From top to bottom lie across on base-plates surface, this thermal land two ends up and down extends on the base bottom surface and is connected together in two sides up and down through pedestal 1 pedestal respectively, on base bottom surface, forms a radiating part; First conductive welding disk 4 and second conductive welding disk 5 extend to base bottom surface through the pedestal left and right side respectively, form conductive part in the radiating part both sides.Thermal land 3 is provided with a plurality of luminescence chips 6, and luminescence chip becomes two row interlaced arrangement, and the luminescence chip two pins is connected respectively on first conductive welding disk, second conductive welding disk through gold thread.On pedestal, also be provided with bowl cup 2, this bowl cup is square, in the middle of the bowl cup, is provided with the through hole 7 that contracts in the circle, and luminescence chip is arranged in through hole.
As required; Can connect flexibly between the chip and between chip and the pad or parallel connection or string and combine to be connected; As shown in Figure 1, adopt series system between the chip, all luminescence chip is in series; One end of this luminescence chip series circuit is connected on first conductive welding disk 4, and the other end is connected on second conductive welding disk 5.
As shown in Figure 3, provided a kind of luminescence chip connected mode mutually arranged side by side, an end pin of each luminescence chip is connected on first conductive welding disk 4, and other end pin is connected on second conductive welding disk 5.
As shown in Figure 4; Provided the connected mode that a kind of luminescence chip connection in series-parallel combines, luminescence chip is divided into two groups, and every group of interior luminescence chip is in series; Luminescence chip series circuit one end that forms is connected on first conductive welding disk 4, and the other end is connected on second conductive welding disk 5.
Specific embodiment described herein only is that the present invention's spirit is illustrated.Person of ordinary skill in the field of the present invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Although this paper has used terms such as pedestal, thermal land, first conductive welding disk, second conductive welding disk, luminescence chip morely, do not get rid of the possibility of using other term.Using these terms only is in order to describe and explain essence of the present invention more easily; It all is contrary with spirit of the present invention being construed to any additional restriction to them.
Claims (7)
1. led light source; Comprise pedestal, be arranged on the pad of pedestal upper surface, pad is provided with luminescence chip; Also be provided with the bowl cup on the pedestal; Pad is interposed between pedestal and the bowl cup, and it is characterized in that: said pad comprises the thermal land (3) in the middle of being positioned at, and first conductive welding disk (4) and second conductive welding disk (5) that are arranged on the thermal land both sides; Said luminescence chip (6) is arranged on the thermal land (3), and luminescence chip is connected with first conductive welding disk (4), second conductive welding disk (5) respectively through gold thread.
2. a kind of led light source according to claim 1; It is characterized in that said thermal land (3) two ends extend on the base bottom surface and are connected together in two sides up and down through pedestal (1) pedestal respectively; On base bottom surface, form a radiating part; First conductive welding disk (4) and second conductive welding disk (5) extend to base bottom surface through the pedestal left and right side respectively, form conductive part in the radiating part both sides.
3. a kind of led light source according to claim 1 and 2 is characterized in that said luminescence chip (6) is in series, and this luminescence chip series circuit one end is connected on first conductive welding disk (4), and the other end is connected on second conductive welding disk (5).
4. a kind of led light source according to claim 1 and 2 is characterized in that said luminescence chip (6) is in parallel, and an end pin of each luminescence chip is connected on first conductive welding disk (4), and other end pin is connected on second conductive welding disk (5).
5. a kind of led light source according to claim 1 and 2; It is characterized in that said luminescence chip (6) is divided into some groups; Luminescence chip is in series in every group, and luminescence chip series circuit one end of formation is connected on first conductive welding disk (4), and the other end is connected on second conductive welding disk (5).
6. a kind of led light source according to claim 1 and 2 is characterized in that said bowl cup (2) is square structure, is provided with the through hole () that contracts in circular in the middle of the bowl cup, and said luminescence chip is arranged in through hole.
7. a kind of led light source according to claim 1 and 2 is characterized in that said luminescence chip (6) becomes two row to interlace to arrange and is arranged on the thermal land (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102841510A CN102368497A (en) | 2011-09-23 | 2011-09-23 | LED (light-emitting diode) light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102841510A CN102368497A (en) | 2011-09-23 | 2011-09-23 | LED (light-emitting diode) light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102368497A true CN102368497A (en) | 2012-03-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102841510A Pending CN102368497A (en) | 2011-09-23 | 2011-09-23 | LED (light-emitting diode) light source |
Country Status (1)
| Country | Link |
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| CN (1) | CN102368497A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105762254A (en) * | 2016-04-01 | 2016-07-13 | 宁波赛福特电子有限公司 | Vertical surface mount infrared tube packaging structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040264195A1 (en) * | 2003-06-25 | 2004-12-30 | Chia-Fu Chang | Led light source having a heat sink |
| CN201294227Y (en) * | 2008-10-30 | 2009-08-19 | 一诠精密工业股份有限公司 | Conductor frame structure of LED |
| CN201885017U (en) * | 2010-12-06 | 2011-06-29 | 何超 | LED (light emitting diode) fluorescent lamp |
| CN201956388U (en) * | 2010-08-20 | 2011-08-31 | 符建 | Softly connected LED (light-emitting diode) device based on liquid metal substrate |
-
2011
- 2011-09-23 CN CN2011102841510A patent/CN102368497A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040264195A1 (en) * | 2003-06-25 | 2004-12-30 | Chia-Fu Chang | Led light source having a heat sink |
| CN201294227Y (en) * | 2008-10-30 | 2009-08-19 | 一诠精密工业股份有限公司 | Conductor frame structure of LED |
| CN201956388U (en) * | 2010-08-20 | 2011-08-31 | 符建 | Softly connected LED (light-emitting diode) device based on liquid metal substrate |
| CN201885017U (en) * | 2010-12-06 | 2011-06-29 | 何超 | LED (light emitting diode) fluorescent lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105762254A (en) * | 2016-04-01 | 2016-07-13 | 宁波赛福特电子有限公司 | Vertical surface mount infrared tube packaging structure |
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Application publication date: 20120307 |