CN102074647B - Packaging device for piezoelectric component - Google Patents
Packaging device for piezoelectric component Download PDFInfo
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- CN102074647B CN102074647B CN 200910223794 CN200910223794A CN102074647B CN 102074647 B CN102074647 B CN 102074647B CN 200910223794 CN200910223794 CN 200910223794 CN 200910223794 A CN200910223794 A CN 200910223794A CN 102074647 B CN102074647 B CN 102074647B
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- elastomer
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Abstract
The invention discloses a packaging device for a piezoelectric component. An upper cover and a lower cover correspondingly rotate to be clamped and fixed so as to form an accommodating space; a hole is formed in the middle of the upper cover and in the middle of the lower cover respectively; the inner edge of the upper cover and the inner edge of the lower cover are provided with a groove at the periphery of the hole respectively, and an annular elastomer is correspondingly embedded into the groove; the piezoelectric component is arranged in the accommodating space and between the elastomer of the upper cover and the elastomer of the lower cover; a conducting strip is arranged on the external surface of the upper cover and the external surface of the lower cover respectively; and a bent extending part of the conducting strip, such as a cylindrical conducting body passes through the hole in the middle of the upper cover, the hole in the middle of the lower cover, and the elastomers embedded into the grooves respectively, and is connected to nodes on the upper surface and lower surface of the piezoelectric component by welding, and reacting force which is applied to the grooves and the cylindrical conducting bodies by the elastomers is used to buffer upper, lower, left and right parts, so that a 360-degree anti-vibration effect is achieved.
Description
[technical field]
The present invention is relevant a kind of packaging device for piezoelectric component, particularly about a kind of vibrations of avoiding piezoelectric element to be connected in and to produce because of running on the circuit get loose, the packaging device for piezoelectric component of crack conditions.
[background technology]
Press, the running of piezoelectric ceramic piece (being called for short " piezoelectric patches ") is to be to be subjected to exciting of high pressure pulse wave, and mechanical energy is converted to electric energy, to be applied on the power supply module, perhaps can convert electric energy to acoustic energy, it also can be applicable to the ultrasonic waves technology except the acoustic assembly (microphone) that can be applicable to handfree receiver for telephone, and the detection of water-bed image; Also because, piezoelectric patches can produce concussion because being subjected to the effect of current lead-through in when running, so must have very firm circuit between piezoelectric patches and the circuit board and link and construct, and causes getting loose, rupturing of circuit with the concussion of avoiding piezoelectric patches.
Yet voltage input, output that the circuit link structure that piezoelectric patches used mainly ties up to piezoelectric patches are provided with pin (node), recycle a conductor wire one end and each pin and are welded to each other, and the other end is linked to assembly or the circuit on the circuit board.When the input of high pressure pulse wave, when making electric current be sent to piezoelectric patches via conductor wire, can allow piezoelectric patches produce the fierceness concussion of upper and lower, left and right, again because the very thin cause of conductor wire, therefore be subject to the fierceness concussion of piezoelectric patches, easily make conductor wire impaired or fracture, and then cause the operational function of piezoelectric patches not good or ineffective.
In view of this, the present invention proposes a kind of packaging device for piezoelectric component then, is present in those disappearances in the prior art with improvement.
[summary of the invention]
Main purpose of the present invention is to provide a kind of packaging device for piezoelectric component, is to utilize elastomer in the packaging system as buffering, with the piezoelectric element of effective protection in it, therefore the jerk problem that causes in the time of can preventing the piezoelectric element running.
Another object of the present invention system provides a kind of packaging device for piezoelectric component, it more is provided with fixture, is fastened in order to correspondence on the draw-in groove of a circuit board, can dwindle whole circuit board thickness, and allow the final products size reach the advantage of slimming, have market competition advantage.
The present invention's another purpose is that a kind of packaging device for piezoelectric component is provided, and the thickness of the visual piezoelectric element of packaging system is adjusted the encapsulation whole height.
For achieving the above object, the invention provides a kind of packaging device for piezoelectric component, comprise being provided with one first hole in the middle of the loam cake, loam cake inner edge and be provided with one first groove in the first hole periphery is in order to be embedded the first elastomer of an annular shape.Be provided with one second hole in the middle of the lower cover, lower cover inner edge and be provided with one second groove in the second hole periphery in order to being embedded the second elastomer of an annular shape, the loam cake correspondence is fixed in lower cover forming an accommodation space, and piezoelectric element system is arranged in the accommodation space.On the piezoelectric element, lower surface is respectively equipped with a node, one first conducting strip and the second conducting strip are set respectively on surface outside loam cake and the lower cover, the bending extension of the first conducting strip and the second conducting strip, penetrate respectively the first hole, second hole of loam cake, lower cover such as the first cylinder electric conductor the second cylinder electric conductor, and first groove, embedded the first elastomer and the second elastomer of the first groove, and extend and utilize that welding manner is connected on the piezoelectric element, on the node of lower surface, make piezoelectric element between the first elastomer and the second elastomer.Therefore, during the piezoelectric element running, can utilize the first elastomer to the backwash elasticity of the first groove and the first cylinder electric conductor and the second elastomer to the backwash elasticity of the second groove and the second cylinder electric conductor cushioning effect as upper and lower, left and right, with the situation of solution jerk, and then reach the shockproof effect of 360 degree.
Good effect of the present invention is as follows: the jerk problem that the present invention causes in the time of can preventing the piezoelectric element running, can solve the vibrations that prior art produces because of running, get loose thereby avoid piezoelectric element to be connected in the vibrations that produce because of running on the circuit.
Under cooperate appended graphic in detail explanation by specific embodiment, when the purpose that is easier to understand the present invention, technology contents, characteristics and the effect reached thereof.
[description of drawings]
Fig. 1 is the present invention's stereogram.
Fig. 2 is the present invention's three-dimensional exploded view.
The cutaway view that Fig. 3 is got along A-A ' hatching by Fig. 1.
Fig. 4 (A) is the schematic diagram of the piezoelectric element vertical tremor state of Fig. 3.
Fig. 4 (B) is the schematic diagram of the piezoelectric element left and right sides vibrating state of Fig. 3.
Fig. 5 (A) is embedded at the first front embodiment schematic diagram of circuit board for the present invention.
Fig. 5 (B) is embedded at the first embodiment schematic diagram behind the circuit board for the present invention.
Fig. 6 (A) is embedded at the second front embodiment schematic diagram of circuit board for the present invention.
Fig. 6 (B) is embedded at the second embodiment schematic diagram behind the circuit board for the present invention.
Fig. 7 is that the present invention is embedded at the 3rd embodiment schematic diagram on the circuit board.
Among the figure:
1 packaging device for piezoelectric component
11 loam cakes
111 first holes
112 first storage tanks
113 first grooves
114 projections
115 protuberances
12 lower covers
121 second holes
122 second storage tanks
123 second grooves
124 grooves
125 protuberances
13 first elastomers
14 second elastomers
15 first conducting strips
151 first cylinder electric conductors
16 second conducting strips
161 second cylinder electric conductors
17 piezoelectric elements
171 first nodes
172 Section Points
30 circuit boards
301 draw-in grooves
302 recesses
[embodiment]
See also Fig. 1 and Fig. 2, be respectively the present invention's stereogram and three-dimensional exploded view.In Fig. 2, packaging device for piezoelectric component comprises loam cake 11 and lower cover 12, the centre is respectively equipped with one first hole 111 and the second hole 121, loam cake 11 and lower cover 12 outer surfaces are respectively equipped with one first storage tank 112 and one second storage tank 122, respectively in order to accommodating the first conducting strip 15 and the second conducting strip 16.The first conducting strip 15 and the second conducting strip 16 are a conductive foil, and the bending extension of the first conducting strip 15 and the second conducting strip 16 is respectively one first cylinder electric conductor 151 and one second cylinder electric conductor 161.Loam cake 11 inner edges and be provided with one first groove 113 in the first hole 111 peripheries are in order to be embedded the first elastomer 13 of an annular shape.Lower cover 12 inner edges and be provided with one second groove 123 in the second hole 121 peripheries are in order to be embedded the second elastomer 14 of an annular shape.One piezoelectric element 17 is arranged between the first elastomer 13 and the second elastomer 14, wherein on the piezoelectric element 17, lower surface is respectively equipped with first node 171 and the Section Point 172 of corresponding the first elastomer 13 and the second elastomer 14.The first cylinder electric conductor 151 of the first conducting strip 15 is to penetrate the first hole 111 and the first elastomer 13 and extend and be connected on the first node 171, the second cylinder electric conductor 161 of the second conducting strip 16 is to penetrate the second hole 121 and the second elastomer 14 and extend and be connected on the Section Point 172, and wherein connected mode is welding manner.Be provided with one first engaging group in one of loam cake 11 horizontal line inner edge circumferential edge, namely plurality of bump 114, are provided with one second engaging group in the horizontal line outer marginal circumference limit of lower cover 12, and namely plurality of grooves 124.As shown in Figure 1, be fastened on these a little grooves 124 of lower cover 12 when these a little projection 114 correspondences of loam cake 11, can form an accommodation space, and piezoelectric element 17 be arranged in the accommodation space.In addition, these a little grooves 124 more comprise a plurality of first engaging assemblies of differentiated levels, i.e. plurality of grooves, and groove 124 can be according to the thickness of piezoelectric element 17, be fixed for projection 114 correspondences, the thickness of visual piezoelectric element 17 is adjusted the advantage of encapsulation whole height by this.Learnt by above-mentioned, when piezoelectric element 17 running, can utilize the backwash elasticity of the backwash elasticity of 13 pairs of the first grooves 113 of the first elastomer and the first cylinder electric conductor 151 and 14 pairs of the second grooves 123 of the second elastomer and the second cylinder electric conductor 161 as the cushioning effect of upper and lower, left and right, with the situation of solution jerk, and then reach the shockproof effect of 360 degree.Wherein the material of the first elastomer 13 and the second elastomer 14 is silica gel, rubber or plastics, therefore have the advantages such as elastic restoring force, compression resistant permanent deformation, stress relaxation, thermal endurance and fatigue resistance.
When operating for further understanding piezoelectric element 17, can utilize the backwash elasticity of the first elastomer 13 and the second elastomer 14 to reach the cushioning effect of 306 degree, see also Fig. 3, Fig. 4 (A) and Fig. 4 (B), the cutaway view that Fig. 3 is got along A-A ' hatching by Fig. 1, Fig. 4 (A) are the schematic diagram of the piezoelectric element vertical tremor state of Fig. 3.Shown in Fig. 4 (A), piezoelectric element 17 running and producing when vibrating up and down if piezoelectric element 17 up shakes, can allow 13 extrusions of the first elastomer, and utilize the backwash elastic characteristic of the first elastomer 13 that piezoelectric element 17 is resetted.Otherwise, if piezoelectric element 17 down shakes, can allow the second elastomer 14 extrusion (not shown), and utilize the backwash elastic characteristic of the second elastomer 14 that piezoelectric element 17 is resetted.By this, when piezoelectric element 17 when vibrating up and down with covering, the backwash elasticity on surface under backwash elasticity and 14 pairs of the second grooves 123 of the second elastomer and the piezoelectric element 17 is done on the surface on 13 pairs of the first grooves 113 of the first elastomer and the piezoelectric element 17, to reach buffer effect.
Shown in Fig. 4 (B), be the schematic diagram of the piezoelectric element left and right sides vibrating state of Fig. 3.Piezoelectric element 17 running and when producing left and right vibrations, the vibrations if piezoelectric element 17 is turned left can allow 13 extrusions of the first elastomer, and utilize the backwash elastic characteristic of the first elastomer 13 that piezoelectric element 17 is resetted.Otherwise the vibrations if piezoelectric element 17 is turned right can allow the second elastomer 14 extrusion (not shown), and utilize the backwash elastic characteristic of the second elastomer 14 that piezoelectric element 17 is resetted.By this, when piezoelectric element 17 when doing left and right vibrations with covering, 13 pairs of the first grooves 113 of the first elastomer and the first cylinder electric conductor 151 are done the backwash elasticity of backwash elasticity and 14 pairs of the second grooves 123 of the second elastomer and the second cylinder electric conductor 16, to reach buffer effect.Learnt by above-mentioned, the present invention can solve the situation of jerk, and then reaches the shockproof effect of 360 degree of upper and lower, left and right.
Continue, shown in Fig. 5 (A), the present invention can be embedded on the circuit board 30, the present embodiment be loam cake 11 peripheries different from Fig. 1 are provided with at least one the second engaging assembly, respectively be extended with a protuberance 115 such as the position in 120 degree, 240 degree and 360 degree, the base diameter system of lower cover 12 is more than or equal to the protuberance 115 of loam cake 11 peripheries.Be fastened on the groove 124 of lower cover 12 when projection 114 correspondences of loam cake 11, can form an accommodation space, and piezoelectric element 17 is arranged in the accommodation space, can be assembled into by this packaging device for piezoelectric component 1 of one " worker " font.Circuit board 30 has a draw-in groove 301, is to be embedded packaging device for piezoelectric component 1 in order to correspondence, and draw-in groove 301 peripheries are provided with recess 302, in order to the protuberance 115 of corresponding loam cake 11.When protuberance 115 correspondences of packaging device for piezoelectric component 1 and loam cake 11 thereof be embedded in the draw-in groove 301 of circuit board 30 and recess 302 interior after, can make the bottom of lower cover 12 be fixed in surface on the circuit board 30, and the protuberance 115 of loam cake 11 penetrates into surface under the circuit board 30, rotary piezoelectric component package device 1 again, make the recess 302 of the protuberance 115 breaking circuit plates 30 of loam cake 11, the protuberance 115 of loam cake 11 can be fixed in surface under the circuit board 30.Shown in Fig. 5 (B), by the mode of operation of Fig. 5 (A), can be with packaging device for piezoelectric component 1 firm being fastened on the circuit board 30.Certainly, if rotary piezoelectric component package device 1 again makes the recess 302 of the protuberance 115 corresponding circuits plates 30 of loam cake 11, can be with packaging device for piezoelectric component 1 removal on circuit board 30.
Except the execution mode of above-mentioned the 5th (A) and Fig. 5 (B), the present invention is in order to be embedded on the circuit board 30, shown in Fig. 6 (A), more can be provided with at least one the 3rd engaging assembly in lower cover 12 peripheries, respectively be extended with a protuberance 125 such as the position in 120 degree, 240 degree and 360 degree, the base diameter system of loam cake 11 is more than or equal to the protuberance 125 of lower cover 12 peripheries.Be fastened on the groove 124 of lower cover 12 when projection 114 correspondences of loam cake 11, can form an accommodation space, and piezoelectric element 17 is arranged in the accommodation space, can be assembled into by this a packaging device for piezoelectric component 1 that falls " worker " font.When protuberance 125 correspondences of packaging device for piezoelectric component 1 and lower cover 12 thereof be embedded in the draw-in groove 301 of circuit board 30 and recess 302 interior after, can make the bottom of loam cake 11 be fixed in surface on the circuit board 30, and the protuberance 125 of lower cover 12 penetrates into surface under the circuit board 30, rotary piezoelectric component package device 1 again, make the recess 302 of the protuberance 125 breaking circuit plates 30 of lower cover 12, the protuberance 125 of lower cover 12 can be fixed in surface under the circuit board 30.Shown in Fig. 6 (B), by the mode of operation of Fig. 6 (A), can be with packaging device for piezoelectric component 1 firm being fastened on the circuit board 30.
In addition, as shown in Figure 7, on the packaging device for piezoelectric component 1 lid 11 and lower cover 12 more respectively periphery be provided with at least one protuberance 115 and protuberance 125, be embedded in order to correspondence in the draw-in groove 301 and periphery recess 302 thereof of circuit board 30.Rotary piezoelectric component package device 1 makes the protuberance 115 of loam cake 11 and lower cover 12 and the recess 302 of protuberance 125 breaking circuit plates 30, can be individually fixed in protuberance 115 and the protuberance 125 of loam cake 11 and lower cover 12 on the circuit board 30, on the lower surface.
In sum, after the present invention's packaging device for piezoelectric component 1 is embedded on the circuit board 30, the first storage tank 112 of loam cake 11 and lower cover 12 outer surfaces and the second storage tank 122 interior the first conducting strip 15 and the second conducting strips 16 of being equipped with respectively, system is connected to assembly or the circuit of lower surface on the circuit board 30, can dwindle whole circuit board thickness, and allow the final products size reach the advantage of slimming, have market competition advantage.Further; the backwash elasticity of utilizing the backwash elasticity of 13 pairs of the first grooves 113 of the first elastomer and the first cylinder electric conductor 151 and 14 pairs of the second grooves 123 of the second elastomer and the second cylinder electric conductor 161 reaches the shockproof purpose of 360 degree as the buffering of upper and lower, left and right; can effectively protect its interior piezoelectric element 17; therefore the jerk problem that causes in the time of can preventing piezoelectric element 17 running; can solve prior art because of the vibrations that produce of running, and make piezoelectric element be embedded at the assembly on the circuit board or circuit gets loose or crack conditions.
The embodiment of the above only is explanation the present invention's technological thought and characteristics, its purpose makes the person skilled in the art can understand appearance and according to this enforcement within the present invention, when can not with restriction the present invention's claim, the equalization of namely generally doing according to disclosed spirit changes or modifies, and must be encompassed in the present invention's the claim.
Claims (9)
1. packaging device for piezoelectric component is characterized in that: comprising:
One loam cake is provided with one first hole in the middle of it, this loam cake inner edge and be provided with one first groove in this first hole periphery, and this first groove system is embedded one first elastomer, and this first elastic system is an annular shape;
One lower cover, be provided with one second hole in the middle of it, this lower cover inner edge and be provided with one second groove in this second hole periphery, this second groove is in order to be embedded one second elastomer, this second elastic system is an annular shape, and this lower cover is that correspondence is fixed in this loam cake to form an accommodation space;
One piezoelectric element is to arrange in this accommodation space, and between this first elastomer and this second elastomer, on this piezoelectric element, lower surface is respectively equipped with a node; And
Two conducting strips, lay respectively at outside this upper and lower cover on the surface, the bending extension of this two conducting strip system penetrates respectively this first hole, this first elastomer and this second hole, this second elastomer, on this node with this upper and lower surface of being connected in this piezoelectric element.
2. according to 1 described packaging device for piezoelectric component of claim the, it is characterized in that: wherein the surface is respectively equipped with one first storage tank and one second storage tank outside this loam cake and this lower cover, is respectively that this two conducting strip is set.
3. according to 1 described packaging device for piezoelectric component of claim the, it is characterized in that: wherein this two conducting strip is a conductive foil, and its this bending extension is a cylinder electric conductor.
4. according to 1 described packaging device for piezoelectric component of claim the, it is characterized in that: wherein this loam cake periphery is provided with one first engaging group, is that correspondence is fastened on one of this lower cover periphery the second engaging group.
5. according to 4 described packaging device for piezoelectric components of claim the, it is characterized in that: wherein this second engaging group comprises a plurality of first engaging assemblies of differentiated levels, and those the first engaging assembly systems are fixed for this first engaging group correspondence according to the thickness of this piezoelectric element.
6. according to 1 described packaging device for piezoelectric component of claim the, it is characterized in that: wherein the material of this first elastomer and this second elastomer is silica gel, rubber or plastics.
7. according to 1 described packaging device for piezoelectric component of claim the, it is characterized in that: wherein this loam cake or lower cover periphery more are provided with at least one the second engaging assembly, are to be fastened on the circuit board.
8. according to 8 described packaging device for piezoelectric components of claim the, it is characterized in that: wherein this circuit board has a draw-in groove, is to be fixed for this second engaging assembly.
9. according to 1 described packaging device for piezoelectric component of claim the, it is characterized in that: wherein this first elastomer and this second elastic system cushion the vibrating state that this piezoelectric element is made 360 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910223794 CN102074647B (en) | 2009-11-19 | 2009-11-19 | Packaging device for piezoelectric component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910223794 CN102074647B (en) | 2009-11-19 | 2009-11-19 | Packaging device for piezoelectric component |
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| CN102074647A CN102074647A (en) | 2011-05-25 |
| CN102074647B true CN102074647B (en) | 2013-09-18 |
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| CN 200910223794 Active CN102074647B (en) | 2009-11-19 | 2009-11-19 | Packaging device for piezoelectric component |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114824072B (en) * | 2022-05-10 | 2022-09-13 | 山东科技大学 | Memristor with oxygen-enriched vacancy doped zirconium dioxide and preparation method thereof |
| CN114784178B (en) * | 2022-06-22 | 2022-09-09 | 上海隐冠半导体技术有限公司 | Piezoelectric actuator and moving device |
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| US5185550A (en) * | 1990-02-09 | 1993-02-09 | Toyo Communication Equipment Co., Ltd. | Structure for supporting a resonator using an ultrathin piezoelectric plate in a package |
| US6185107B1 (en) * | 1998-12-23 | 2001-02-06 | Raytheon Company | MEMS based tile assemblies and methods of fabrication |
| KR20080005801A (en) * | 2006-07-10 | 2008-01-15 | 주식회사 비에스이 | Packging structure of mems microphone |
| CN101562957A (en) * | 2008-04-16 | 2009-10-21 | 台达电子工业股份有限公司 | Buffering subassembly and electronic device using same |
| CN201601152U (en) * | 2009-11-19 | 2010-10-06 | 金威贸易有限公司 | Packaging device for piezoelectric element |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3097645B2 (en) * | 1998-01-26 | 2000-10-10 | 日本電気株式会社 | Piezoelectric transformer |
| US7298014B2 (en) * | 2004-12-03 | 2007-11-20 | Honeywell International Inc. | Use of visco-elastic polymer to reduce acoustic and/or vibration induced error in microelectromechanical devices and systems |
| US7372286B2 (en) * | 2006-01-03 | 2008-05-13 | Chipmos Technologies (Bermuda) Ltd. | Modular probe card |
| US7382081B2 (en) * | 2006-02-27 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Electronic component package |
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2009
- 2009-11-19 CN CN 200910223794 patent/CN102074647B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5185550A (en) * | 1990-02-09 | 1993-02-09 | Toyo Communication Equipment Co., Ltd. | Structure for supporting a resonator using an ultrathin piezoelectric plate in a package |
| US6185107B1 (en) * | 1998-12-23 | 2001-02-06 | Raytheon Company | MEMS based tile assemblies and methods of fabrication |
| KR20080005801A (en) * | 2006-07-10 | 2008-01-15 | 주식회사 비에스이 | Packging structure of mems microphone |
| CN101562957A (en) * | 2008-04-16 | 2009-10-21 | 台达电子工业股份有限公司 | Buffering subassembly and electronic device using same |
| CN201601152U (en) * | 2009-11-19 | 2010-10-06 | 金威贸易有限公司 | Packaging device for piezoelectric element |
Non-Patent Citations (1)
| Title |
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| JP特开平11-214764A 1999.08.06 |
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