CN101320148B - Display substrate, method of manufacturing the same and display device having the display substrate - Google Patents
Display substrate, method of manufacturing the same and display device having the display substrate Download PDFInfo
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- CN101320148B CN101320148B CN2008101428980A CN200810142898A CN101320148B CN 101320148 B CN101320148 B CN 101320148B CN 2008101428980 A CN2008101428980 A CN 2008101428980A CN 200810142898 A CN200810142898 A CN 200810142898A CN 101320148 B CN101320148 B CN 101320148B
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Abstract
A display substrate includes a base substrate having a display area and a peripheral area which surrounds the display area, a pixel electrode formed on the display area, a pad part formed on the peripheral area, an adhesion part formed on the peripheral area and having a plurality of holes formed in an area adjacent to the pad part on the peripheral area and a conductive adhesion member formed on the pad part and the adhesion part to make electrical contact with the pad part and a terminal of an integrated circuit.
Description
Technical field
The present invention relates to a kind of display base plate, a kind of display device of making the method for this display base plate and having this display base plate.Especially, the present invention relates to have the display base plate of strong reliability, the display device of making the method for this display base plate and having this display base plate.
Background technology
In general, display comprises display panel and the driving circuit that drives this display panel.Display panel comprises array base palte.This array base palte comprises many gate lines (gate line), many data lines and a plurality of pixel portion that is limited this gate line and data line.Driving circuit comprises to these many gate lines to be provided the gate driver circuit of signal and the source electrode drive circuit of data-signal is provided to these many data lines.
Gate driver circuit and source electrode drive circuit can be installed on the array base palte in chip piece.In the common practice, gate driver circuit is formed directly on the array base palte at present, has the display of demand characteristics such as for example approaching with manufacturing.Further, in order to prevent the gate driver circuit corrosion, quite thick organic layer is formed on the gate driver circuit of array base palte.
For source electrode drive circuit is installed on array base palte, a plurality of liners are formed on the array base palte.Independent liner in a plurality of liners is electrically connected to lower metal layer through the contact hole that is formed in the organic layer.
In the panel drop shutter test operation of the display panel that comprises array base palte and since the bounding force between the protective seam on organic layer and the lower metal layer a little less than, protective seam is come off by array base palte.In addition, source electrode drive circuit is along sag of protecting coating.As a result, contact deficiency is formed between source electrode drive circuit and the liner, thereby has reduced the driving reliability of source electrode drive circuit.
Summary of the invention
The present invention provides the display base plate with strong reliability, the display of making the method for this display base plate and having this display base plate.
In an exemplary embodiments of the present invention, display base plate comprises base substrate, the outer peripheral areas that it has the viewing area and centers on the viewing area; Be formed on the pixel electrode on the viewing area; Be formed on the liner part of outer peripheral areas; Be formed on the adhesive segment of outer peripheral areas, and have a plurality of interior holes, zone that are formed on the contiguous liner part on the outer peripheral areas, and be formed on the conduction bonding piece on liner part and the adhesive segment, in order to electrically contact liner part and ic terminal.
Display base plate further comprises the organic layer that is formed under the pixel electrode, is formed on first insulation course on the base substrate and is formed on the organic layer on first insulation course.
Each hole in said a plurality of hole forms through the part organic layer in the outer peripheral areas, and the conduction bonding piece is bonded to first insulation course that exposes to the open air through each hole.
Second insulation course is formed on the base substrate.
In addition, each hole in said a plurality of holes can form through the part that is formed on first insulation course and organic layer in the outer peripheral areas, and the conduction bonding piece can be bonded to second insulation course that exposes to the open air through each hole.
Interchangeable, each hole in said a plurality of holes can form through the synchronous composition that is formed on first insulation course and organic layer in the outer peripheral areas, and display base plate further comprises the virtual composition (dummy pattern) that exposes to the open air through each hole.
Display base plate further comprises on-off element, comprises the channel layer that is electrically connected to the pixel electrode that is formed by the first metal layer, and the source electrode and the drain electrode that are formed by second metal level.
Virtual composition is formed by the composition of channel layer, perhaps in replaceable exemplary embodiments, forms through the second metal level composition.
Further, virtual composition can be sandwich construction, forms through the channel layer composition and the second metal level composition.
Display base plate further comprises the ladder compensation composition that is formed on the base substrate, and wherein ladder compensation composition is formed by the composition of the first metal layer.
Part organic layer, first insulation course and the second insulation course simultaneously composition formation of each hole in said a plurality of hole through being formed on outer peripheral areas, and the conduction bonding piece is bonded to second insulation course that exposes to the open air through each hole.
Pixel electrode comprises transparency electrode and reflecting electrode, and organic layer can be formed on the reflecting electrode.
In alternative embodiment, organic layer has formation recessed composition and protruding composition above that.
Further; First's organic layer with first thickness can be formed in the outer peripheral areas with liner part; Second portion with organic layer of second thickness can form in the viewing area that is formed with pixel electrode above that, and second thickness of the second portion of organic layer can be greater than first thickness of first's organic layer.
Display base plate further comprises the grid circuit part that is formed on the outer peripheral areas, and the part organic layer that is formed on outer peripheral areas can cover this grid circuit part.
In another exemplary embodiments of the present invention; Display base plate comprises base substrate; The outer peripheral areas that it has the viewing area and centers on the viewing area; Be formed on the pixel electrode of viewing area, the liner part that is formed on outer peripheral areas be formed on outer peripheral areas and have the circuit part in a plurality of holes of formation in the zone of a plurality of contiguous liner part in outer peripheral areas.This circuit part has the integrated circuit (" IC ") that is installed in circuit part.
Display base plate further comprises first insulation course that is formed on the base substrate, be formed on the organic layer on first insulation course and be formed on organic layer and base substrate between first insulation course.
Each hole in a plurality of holes forms through the part organic layer in the outer peripheral areas.
Second insulation course is formed on the base substrate.
Each hole in said a plurality of hole forms through the part that is formed on first insulation course and organic layer in the outer peripheral areas.
Virtual composition can expose to the open air through each hole.
Display base plate further comprises on-off element, and this on-off element comprises the channel layer of the pixel electrode that is electrically connected to the first metal layer formation, and the source electrode and the drain electrode of the formation of second metal level.
Virtual composition forms through the channel layer composition or the second metal level composition.
Virtual composition can be sandwich construction, and can form through the channel layer composition and the second metal level composition.
Display base plate further comprises ladder compensation composition, is formed on the base substrate, is formed by the first metal layer composition.
Each hole in said a plurality of hole forms through the synchronous composition of the organic layer, first insulation course and second insulation course that are formed on outer peripheral areas.
Pixel electrode comprises transparency electrode and reflecting electrode, and organic layer is formed on the reflecting electrode.
Organic layer has formation recessed composition and protruding composition above that.
First with organic layer of first thickness is formed in the outer peripheral areas with liner part; Second portion with organic layer of second thickness forms and is formed with above that in the viewing area of pixel electrode, and second thickness of the second portion of organic layer is greater than first thickness of first's organic layer.
The grid circuit part can be formed on outer peripheral areas.Be formed on the part organic layer cover gate circuit part of outer peripheral areas.
In another exemplary embodiments of the present invention, in making the method for display base plate, form base substrate, on-off element is formed in the viewing area of base substrate and pattern of pads is formed in the outer peripheral areas of viewing area.Then, organic layer be formed on the base substrate and the organic layer composition with formation adhesive segment in the zone of contiguous pattern of pads.Adhesive segment has a plurality of holes that are formed on wherein.Then, pixel electrode forms and is electrically connected to on-off element and pad electrode is electrically connected to pattern of pads.Then, the conduction bonding piece is formed on pad electrode and the adhesive segment.The conduction bonding piece electrically contacts pad electrode and IC terminal.
First insulation course can be formed on the base substrate.
The conduction bonding piece is bonded to first insulation course of revealing through each hole in a plurality of holes.
Second insulation course is formed on the base substrate.
The formation of adhesive segment comprises synchronous composition first insulation course and organic layer.
The conduction bonding piece is bonded to second insulation course that exposes to the open air through the hole.
The grid circuit part can be formed on outer peripheral areas.
Organic layer forms step and has formed the part organic layer with the cover gate circuit part.
In another one exemplary embodiments of the present invention, display comprises display panel.This display panel comprises: base substrate; Be formed on the base substrate and have the viewing area and the display base plate of outer peripheral areas; Relative substrate in the face of display base plate; Be formed on the pixel electrode of viewing area; Be formed on the liner part of outer peripheral areas; Adhesive segment is formed on outer peripheral areas and has a plurality of holes that form in the zone of the contiguous liner part of outer peripheral areas.
Display further comprises the conducting element that is formed on liner part and adhesive segment and is electrically connected to the integrated circuit of liner part through conducting element.
Display base plate further comprises first insulation course that is formed on the base substrate and the first that is formed on the organic layer under the pixel electrode on first insulation course.
Each hole in said a plurality of hole is formed on outer peripheral areas through the first of part organic layer, and the conduction bonding piece is bonded to first insulation course that exposes to the open air through each hole.
Second insulation course is formed on the base substrate.
Each hole in said a plurality of hole forms through the first and part first insulation course of the part organic layer in the outer peripheral areas, and the conduction bonding piece is bonded to second insulation course that exposes to the open air through each hole.
The hole can form through first insulation course and the synchronous composition of organic layer that is formed in the outer peripheral areas, and display base plate can further comprise each the virtual composition that exposes to the open air by each hole.
Display can further comprise on-off element, and this on-off element comprises the channel layer that is electrically connected to the pixel electrode that the first metal layer forms, and the source electrode and the drain electrode that are formed by second metal level.
Virtual composition is formed by the channel layer composition or is formed by the second metal level composition.
Virtual composition can be sandwich construction, forms through the channel layer and the second metal level composition.
Ladder compensation composition can be formed on the base substrate.
Ladder compensation composition can be formed by the first metal layer composition.
In each hole each formed by the organic layer that is formed on outer peripheral areas, first insulation course and the synchronous composition of second insulation course, and the conduction bonding piece is bonded to second insulation course that exposes to the open air through each hole.
Pixel electrode comprises transparency electrode and reflecting electrode.The first of organic layer can be formed on the reflecting electrode.
Can be formed with protruding composition and recessed composition in the first of organic layer.
Can be formed with light hole in the colour filter, wherein light hole is formed on the reflecting electrode.
Comparative electrode further comprises second organic layer, and it is formed on the reflecting electrode of the pixel electrode on the viewing area that is positioned at display base plate.
First with first's organic layer of first thickness is formed in the outer peripheral areas with liner part; Second portion with organic layer of second thickness forms and is formed with above that in the viewing area of pixel electrode, and second thickness of the first of the second portion of organic layer is greater than first thickness of the first of first's organic layer.
At display base plate, the method for making display base plate with have in the display of the display base plate of exemplary embodiments according to the present invention, the contiguous liner part of adhesive segment forms, thereby can strengthen liner part and be installed in the cohesive force between the IC terminal on the liner part.
Description of drawings
Through further describing exemplary embodiments of the present invention according to respective drawings, of the present invention above-mentioned with other aspects, feature and advantage will be clearer, wherein:
Fig. 1 is the planimetric map of the display base plate of first exemplary embodiments according to the present invention;
Fig. 2 be according to the present invention first exemplary embodiments Fig. 1 in the partial cross section figure of display base plate;
Fig. 3 A, 3B and 3C be explanation according to the present invention the partial cross section figure of the manufacturing approach of display base plate among Fig. 2 of first exemplary embodiments;
Fig. 4 is the partial cross section figure of the display base plate of second exemplary embodiments according to the present invention;
Fig. 5 A and 5B are the partial cross section figure of explanation display substrate manufacturing method among Fig. 4 of second exemplary embodiments according to the present invention;
Fig. 6 is the partial cross section figure of the display of the 3rd exemplary embodiments according to the present invention;
Fig. 7 is the partial cross section figure of the display of the 4th exemplary embodiments according to the present invention;
Fig. 8 is the partial cross section figure of the display of the 5th exemplary embodiments according to the present invention;
Fig. 9 is the partial cross section figure of the display of the 6th exemplary embodiments according to the present invention;
Figure 10 is the partial cross section figure of the display base plate of the 7th exemplary embodiments according to the present invention;
Figure 11 is the partial cross section figure of the display base plate of the 8th exemplary embodiments according to the present invention;
Figure 12 is the partial cross section figure of the display base plate of the 9th exemplary embodiments according to the present invention;
Figure 13 is the partial cross section figure of the display base plate of the tenth exemplary embodiments according to the present invention; With
Figure 14 is the partial cross section figure of the display base plate of the 11 exemplary embodiments according to the present invention.
Embodiment
To the present invention be described more fully according to the respective drawings that shows exemplary embodiments of the present invention now.Yet the present invention can comprise multiple multi-form and should not be construed as and be limited to the embodiment that illustrates here.On the contrary, it is for this open fully with complete that these embodiment are provided, and fully passes on scope of the present invention to those skilled in the art.Same reference number is indicated same element all the time.
Will be understood that when saying that an element is on another element, it is the perhaps middle insertion element that exists on other elements directly.Accordingly, when saying that an element is directly on another element, there is not the insertion element.As as used herein, term " and/or " comprise one or more arbitrary and all combinations of lising.
It is understandable that although can use a technical term " first ", " second ", " the 3rd " wait and describe various elements, assembly, zone, layer and/or part, these elements, assembly, zone, layer and/or part should not be limited to these terms here.These terms only are used for distinguishing an element, assembly, zone, layer or part and another element, assembly, zone, layer or part.Therefore, under the situation that does not break away from the present invention's instruction, first element of discussing below, assembly, zone, layer or part may be defined as second element, assembly, zone, layer or part.
The term that here uses only is used to describe specific embodiments rather than this invention of restriction.As used herein, singulative " ", " one " and " being somebody's turn to do " also comprise plural form, only if the indication contrary of clear from context.It is understandable that; Term " comprises " and/or " comprising " when in explanation, using; The characteristic, zone, assembly, integer, step, operation, element and/or the assembly that have regulation are described, but are not got rid of the existence or the increase of one or more other characteristics, zone, integer, step, operation, element, assembly and/or their combination.
In addition, can use relational language here, for example " bottom " or " bottom " and " top " or " top " are to describe the relation of an element and other elements shown in figure.It is understandable that, also comprise other orientation of device except the orientation relational language shown in the figure.For example, if the device in the accompanying drawing overturns, be described as to be positioned at " top " of this element at the element of other elements " bottom ".Therefore according to particular orientation among the figure, exemplary term " bottom " comprises " bottom " and " top " two orientation.Similarly, if the device among width of cloth figure upset, be described as another element " below " or the element of " bottom " can be positioned at another element " above ".Therefore, above therefore exemplary term " following " or " bottom " can comprise and following two kinds of orientation.
Only if in addition definition, all terms that adopt here (comprise technology with term science) have the implication of the those of ordinary skill common sense of technical field under the present invention.It is understandable that further these terms for example define in the universaling dictionary, should be interpreted as and correlation technique and the consistent implication of context of the present disclosure, and should not be construed as Utopian or too formal implication, only if clear and definite here definition is like this.
Combine sectional view to describe exemplary embodiments of the present invention here, it is the illustrative of desirable embodiment of the present invention.Same, can expect the various deviations of shape of figure, for example since manufacturing technology and/or tolerance cause.Therefore, embodiments of the invention can not be interpreted as and be limited to the special shape in the zone of explanation here, and should comprise departing from of shape, are for example caused by manufacturing.For example, explain or be described as the zone on plane, have coarse usually and/or nonlinear characteristic.In addition, the sharp keen angle of description can sphering.Therefore, the zone of describing in the accompanying drawing is schematically in essence, and their shape is not the accurate shape of declare area and is not restriction scope of the present invention.
Hereinafter, exemplary embodiments of the present invention can combine the respective drawings further detailed description.
Fig. 1 is the planimetric map of the display base plate of first exemplary embodiments according to the present invention.
According to Fig. 1, display base plate comprises viewing area DA and centers on the outer peripheral areas PA of viewing area DA.Many gate lines G L and many data line DL are formed in the DA of viewing area.Gate lines G L crossing data line DL is to limit the pattern of substantial rectangular.In an exemplary embodiments, gate lines G L and data line DL limit a plurality of pixel portion P on display base plate; Yet a plurality of pixel portion P can limit in the replacement exemplary embodiments by different way.
Each pixel P of a plurality of pixel portion P comprises the on-off element TFT of each data line among each gate lines G L of being electrically connected among many gate lines G L and many data line DL and is electrically connected to the pixel electrode PE of on-off element TFT.
Outer peripheral areas PA comprises first circuit region CA1 that is arranged on data line DL end and the second circuit zone C A2 that is arranged on gate lines G L end.
Fig. 2 is the partial cross section figure of display base plate among Fig. 1 of first exemplary embodiments according to the present invention.
According to Fig. 1 and 2, the display base plate 100a of first exemplary embodiments comprises base substrate 101 according to the present invention.Display base plate 100a further comprises viewing area DA and outer peripheral areas PA, and it is around viewing area DA, as stated.Same, outer peripheral areas PA comprises the first circuit region CA1 and second circuit zone C A2.
The first metal composition (not illustrating fully) is formed on the base substrate 100a.The first metal composition comprises many gate lines G L that are formed in the DA of viewing area, the gate electrode GE of on-off element TFT and the gate metal composition 231 that is formed on the grid circuit part 230 of second circuit zone C A2.
The second metal composition (not illustrating fully) forms and is formed with above that on the base substrate 101 of channel part CH.The second metal composition (not illustrating fully) comprises many data line DL that are formed in the DA of viewing area; The source electrode SE of on-off element TFT; The drain electrode DE of on-off element TFT; Be formed on the liner composition 211a in the first circuit region CA1 and be formed on the source metal composition 232 of second circuit zone C A2 inner grid circuit part 230.Source metal composition 232 electrically contacts gate metal composition 231 through the first hole H1.
The second hole H2 of exposed portion drain electrode DE is formed on protection insulation course 120 and the organic layer 130, and the 3rd hole H3 that forms adhesive segment 220 is formed on the first circuit region CA1 with the 4th hole H4 that exposes liner composition 211a to the open air.The 3rd hole H3 of adhesive segment 220 can expose gate insulator 110 to the open air through the composition of organic layer 130 and protection insulation course 120.In alternative embodiment, the 3rd hole H3 can expose protection insulation course 120 to the open air through composition organic layer 130 only.Further, can have first thickness, be thinner than second thickness, to minimize the stepped portion of the 3rd hole H3 and the 4th hole H4 corresponding to the second portion 130 of the organic layer of viewing area DA corresponding to first's organic layer 130 of the first circuit region CA1.
The pixel electrode PE that is electrically connected to drain electrode DE through the second hole H2 is formed in the DA of viewing area, and is formed on the first circuit region CA1 through the pad electrode 211b that the 4th hole H4 is electrically connected to liner composition 211a.The liner 211 that comprises liner composition 211a and pad electrode 211b is formed on the first circuit region CA1.
Therefore, because a plurality of the 3rd hole H3 that conduction bonding piece 150 is passed through adhesive segment 220 directly contact with base substrate 101, the cohesive force between conduction bonding piece 150 and the base substrate 101 is strengthened.Thereby, prevented that conduction bonding piece 150 from coming off from base substrate 101.As a result, the source IC and the cohesive force between the liner part 210 that are installed in the first circuit region CA1 are strengthened, and drive reliability thereby improve.
Fig. 3 A, 3B and 3C be explanation according to the present invention the partial cross section figure of the manufacturing approach of display base plate among Fig. 2 of first exemplary embodiments.
According to Fig. 1,2 and 3A, comprise that the first metal composition (not illustrating fully) of the gate metal composition 231 of gate lines G L, gate electrode GE and grid circuit part 230 adopts the first metal layer that is formed on the base substrate 101 to be formed on the base substrate 101.Then, gate insulator 110 is formed on and has on the first metal composition formation base substrate 101 above that.
Channel layer with active layer and ohmic contact layer is formed on to have on the gate insulator 110 formation base substrate 101 above that.Active layer can comprise a-Si.Ohmic contact layer can comprise n+a-Si, and it forms through injecting n+ impurity with high concentration to a-Si.Next, the channel layer composition is to form channel part CH, and the gate electrode GE on the cover gate insulation course 110 is shown in Fig. 3 A.
The first hole H1 is formed in the gate metal composition 231 through gate insulator 110 compositions.
Now according to Fig. 1; 2 and 3B; The second metal composition that comprises the source metal composition 232 of data line DL, source electrode SE, drain electrode DE, liner composition 211a and grid circuit part 230 is formed on the base substrate 101, and it has second metal level of employing and is formed on the first hole H1 on the base substrate 101.
The source metal composition 232 of grid circuit part 230 is electrically connected to gate metal composition 231 through the first hole H1.
Therefore, during protective seam 120 and organic layer 130 adopted the composition of mask 250 to handle, exposed portion 251 had been removed organic layer 130 and has been protected insulation course 120 to form second, third and the 4th hole H2, H3 and H4 respectively.Subsequently, half exposed portion 252 forms organic layer 130 on the first circuit region CA1, and it is thicker than the organic layer 130 that is formed on viewing area DA and the second circuit zone C A2, as stated.
Still, remove organic layer 130 and protection insulation course 120, and expose gate insulator 110 to the open air to form the hole of adhesive segment 220 according to Fig. 1,2 and 3B.In alternative embodiment of the present invention, organic layer 130, insulation course 120 and gate insulator 110 can be removed simultaneously, expose base substrate 101 then to the open air to form the hole of adhesive segment 220.Interchangeable, can remove organic layer 130 and expose protection insulation course 120 then to the open air to form second, third and the 4th hole H2, H3 and H4 of adhesive segment 220 respectively.
According to Fig. 1,2 and 3C, transparency conducting layer (not illustrating fully) is formed on and is formed with second to the 4th hole H2, H3 respectively on the base substrate 101 of H4.The transparency conducting layer composition is electrically connected to the pixel electrode PE of drain electrode DE to be formed on viewing area DA through the second hole H2, and is formed on the first circuit region CA1 is electrically connected to liner composition 211a through the 4th hole H4 pad electrode 211b.Therefore, form liner 211, it comprises liner composition 211a and pad electrode 211b.
Accordingly, the cohesive force between base substrate 101 and the conduction bonding piece 150, for example bonding force separates under preventing for example to protect insulation course 120 and organic layer 130 externally acting on, but is not restricted to this.
Fig. 4 is the partial cross section figure of the display base plate of second exemplary embodiments according to the present invention.Hereinafter, same reference number is used to indicate the same assembly of describing with display base plate 100a with reference to first exemplary embodiments according to the present invention, omits the description of repetition here.
According to Fig. 1 and 4, has the reflective-transmissive structure according to the display base plate 100b of second exemplary embodiments.For example, viewing area DA can comprise regional transmission TA and reflector space RA.Organic layer 130a is formed in the reflector space RA.The pixel electrode PE that is formed in the DA of viewing area comprises transparency electrode TE that is formed in the regional transmission TA and the reflecting electrode RE that is formed in the reflector space RA.
Comprise the adhesive segment 220 in a plurality of holes and comprise that the liner part 210 of a plurality of liners 211 is formed in the first circuit region CA1.Adhesive segment 220 forms through organic layer 130a composition with liner part 210.Part organic layer 130a in the reflector space RA is thicker than the part organic layer 130a in the first circuit region CA1, as shown in Figure 4.
Accordingly, the cohesive force of passing through adhesive segment 220 between base substrate 101 and the conduction tack coat 150 has been strengthened the cohesive force between protection insulation course 120 and the organic layer 130a.
Fig. 5 A and 5B are the partial cross section figure of explanation display substrate manufacturing method among Fig. 4 of second exemplary embodiments according to the present invention.
According to Fig. 1,4,5A and 5B, the first metal composition and the second metal composition are formed on the base substrate 101.Gate lines G L, data line DL and on-off element TFT are formed in the DA of viewing area, and liner composition 211a is formed in the first circuit region CA1, and grid circuit part 230 is formed in the second circuit zone C A2.
Half exposed portion 262 is arranged on the organic layer 130a in the first circuit region CA1, shown in Fig. 5 A.Light-blocking part 253 is arranged on the remaining area of organic layer 130a, and for example, the remaining area of organic layer 130a but is not restricted to this in second circuit zone C A2.
Therefore, during protective seam 120 adopts mask 260 compositions to handle with organic layer 130a, remove organic layer 130a and protection insulation course 120 forming second to the 4th hole H2, H3 and H4 respectively, and in regional transmission TA, expose gate insulator 120 to the open air.
Because half exposed portion 252, be thinner than thickness corresponding to the organic layer 130a of viewing area DA and second circuit zone C A2 corresponding to the thickness of the organic layer 130a of the first circuit region CA1.
According to Fig. 1,4 and 5B, reflective metal layer be formed on have second to the 4th hole H2 respectively, H3 and H4 form on the base substrate 101 above that.The reflective metal layer composition is to form the reflecting electrode RE of pixel electrode PE on the organic layer 130a of reflector space RA.Reflecting electrode RE is electrically connected to drain electrode DE through the second hole H2, shown in Fig. 5 B.
Transparent electrode layer is formed on to have on the reflecting electrode RE formation base substrate 101 above that, and the composition transparent electrode layer is electrically connected to the pad electrode 211B of liner composition 211a with the transmission electrode TE of formation pixel electrode PE with through the 4th hole H4 then.Therefore, form the liner 211 that comprises liner composition 211a and pad electrode 211b.
Conduction bonding piece 150 (Fig. 4) is formed on to be had on the pad electrode 211b formation first circuit region CA1 above that.Conduction bonding piece 150 is inserted the 3rd hole H3 of adhesive segment 220 with contact gate insulator 110.Accordingly, strengthened the cohesive force between protection insulation course 120 and the organic layer 130a through the cohesive force of adhesive segment 220 between base substrate 101 and the conduction bonding piece 150.
Fig. 6 is the partial cross section figure of the display of the 3rd exemplary embodiments according to the present invention.
According to Fig. 1 and 6, comprise display panel and source IC 600 according to the display of the 3rd exemplary embodiments.
Display panel comprises display base plate 100a, in the face of the relative substrate 400a of display base plate 100a, inserts the liquid crystal layer 500a between display base plate 100a and the relative substrate 400a.Display base plate 100a basically with Fig. 2 in display base plate identical.Therefore, can adopt same reference number, and any repeated explanation that relates to same components will be omitted below with the identical assembly described among indication and Fig. 2.
Under preventing for example to protect insulation course 120 and organic layer 130 externally acts on, cohesive force between adhesive segment 220 and the conduction bonding piece 150 separates.Therefore, the defective that electrically contacts between source IC 600 and the liner 211 can effectively prevent or reduce.
Fig. 7 is the partial cross section figure of the display of the 4th exemplary embodiments according to the present invention.Hereinafter, indicate the same assembly of the 3rd exemplary embodiments of describing according to Fig. 6, and will ignore the description of any repetition with same reference number.
According to Fig. 1 and 7, comprise display panel and source IC 600 according to the display of the 4th exemplary embodiments.
Display panel comprises display base plate 100b, faces the relative substrate 400b of display base plate 100b and the liquid crystal layer 500b between insertion display base plate 100b and the relative substrate 400b.Display base plate 100b is basically with identical according to the display base plate among Fig. 4 of second exemplary embodiments, and therefore any repetition of explanation will be left in the basket.Substrate 400b is set in the face of display base plate 100b relatively, and makes up to hold liquid crystal layer 500b with display base plate 100b through seal 330.
In reflector space RA, when first light incided the liquid crystal layer 500b of first module gap d 1 through relative substrate 400b, first light had double transmission path.More specifically, first light that sees through the liquid crystal layer 500b of the first module gap d 1 electrode RE reflection that is reflected, first light sees through the liquid crystal layer 500b of first module gap d 1 once more then.
Interchangeable, in regional transmission TA, in the time of in second light passes the liquid crystal layer 500b that display base plate 100b transmission gets into the second cell gap d2, second light has single transmission path.
The length of the second cell gap d2 is general 2 times of first module gap d 1.
Fig. 8 is the partial cross section figure of the display of the 5th exemplary embodiments according to the present invention.
According to Fig. 1 and 8, comprise display panel and source IC 600 according to the display of the 5th exemplary embodiments.
Display panel comprises the liquid crystal layer 500b between display base plate 100c, relative substrate 400c and insertion display base plate 100c and the relative substrate 400c.
Reflecting electrode RE is formed by the reflective metal layer in the reflector space RA.Transmission electrode TE is formed by the transparent electrode layer in the regional transmission TA.For example, transparent electrode layer can be electrically connected to on-off element TFT, and reflecting electrode RE is formed on the transparent electrode layer corresponding to reflector space RA then, but is not restricted to this.
Embossing pattern is formed in the second organic layer 130b under the reflecting electrode RE.Further, embossing pattern is formed on reflecting electrode RE and goes up the reflectivity with reinforcement reflecting electrode RE.
Fig. 9 is the partial cross section figure of the display of the 6th exemplary embodiments according to the present invention.
According to Fig. 1 and 9, display comprises display panel and source IC 600.Display panel comprises display base plate 100d, relatively substrate 400 and liquid crystal layer 500.
The second metal composition that is formed by second metal level forms on the base substrate 101 that is formed with channel part CH and virtual composition DP above that.The second metal composition comprises many data line DL; Be formed on source electrode SE and the drain electrode DE of the on-off element TFT on the DA of viewing area, and comprise liner composition 211a that is formed on the first circuit region CA1 and the source metal composition 232 that is formed on the grid circuit part 230 on the second circuit zone C A2.Source metal composition 232 is electrically connected to gate metal composition 231 through the first hole H1.
The second hole H2 is formed in protection insulation course 120 and the organic layer 130, with exposed portion drain electrode DE.Pixel electrode PE is formed in the DA of viewing area through the second hole H2, and it is electrically connected to drain electrode DE.
The 3rd hole H3 of adhesive segment 220 and the 4th hole H4 that exposes liner composition 211a to the open air are formed in the first circuit region CA1.The 3rd hole H3 of adhesive segment 220 exposes virtual composition DP to the open air through organic layer 130 and protection insulation course 120 compositions.
Before virtual composition DP formed, during protection insulation course 120 etch processes, gate insulator 110 was crossed etching to form the 3rd hole H3 of adhesive segment 220.More specifically, about 700
gate insulator 110 removes through etch processes.Therefore, the corresponding zone that is formed with the 3rd hole H3 on it of virtual composition DP forms, to prevent the etching excessively of gate insulator during 120 etchings of protection insulation course.The thickness of virtual composition DP is thicker than overetched thickness.For example; The thickness of virtual composition DP1 can be approximately 700
to 15; 000
, but be not restricted to this.
Thereby virtual composition DP prevents that thereby the etching conduction bonding piece 150 of etching and the protection insulation course 120 of gate insulator 110 from contacting virtual composition DP1 at the 3rd hole H3 and being bonded to protection insulation course 120 and organic layer 130.Therefore, the cohesive force between display base plate 100d and the conduction bonding piece 150 is strengthened.As a result, the source IC 600 and the cohesive force between the liner 211 that are installed in the first circuit region CA1 are strengthened, and drive reliability thereby improve.
Can be thinner than the thickness of the organic layer 130 that is formed on viewing area DA corresponding to the thickness of the organic layer 130 of the first circuit region CA1, as shown in Figure 9, thus the height ladder between the third and fourth hole H3 and the H4 can minimize.
The FPCB (not shown) that source IC 600 comprises the chip for driving (not shown) and is used for installing drive chip.Source IC 600 comprises a plurality of terminals 610.
Therefore, adhesive segment 220 and the cohesive force of conduction between the bonding piece 150 are separated with under preventing for example to protect insulation course 120 and organic layer 130 externally acts on.Therefore, can effectively prevent or reduce the defective that electrically contacts between source IC 600 and the liner 211.
Figure 10 is the partial cross section figure of the display of the 7th exemplary embodiments according to the present invention.
According to Fig. 9 and 10, display base plate 100e can further comprise the ladder compensation composition SP that is formed under the virtual composition DP1.Ladder compensation composition SP is formed by the first metal layer and ladder compensation composition SP is included in the first metal composition.Ladder compensation composition SP has reduced the ladder height that is formed on the organic layer 130 on the 3rd hole H3.
The ladder height of organic layer 130 is compensated by ladder compensation composition SP, thereby can strengthen through the cohesive force of the 3rd hole H3 between virtual composition DP1 and the conduction bonding piece 150.
Figure 11 is the partial cross section figure of the display of the 8th exemplary embodiments according to the present invention.
According to Fig. 1 and 11, comprise that the adhesive segment 220 of the 3rd hole H3 is formed on the first circuit region CA1 of display base plate 100f.The 3rd hole H3 of adhesive segment 220 forms through protection insulation course 120 and organic layer 130 compositions, to expose virtual composition DP2 to the open air.Virtual composition DP2 forms through second metal level, thereby the second metal composition comprises virtual composition DP2.
As a result, the source IC (not shown) and the cohesive force between the liner 211 that are installed in the first circuit region CA1 are strengthened, and drive reliability thereby improve.
Figure 12 is the partial cross section figure of the display of the 9th exemplary embodiments according to the present invention.
According to Figure 11 and 12, display base plate 100g further comprises the ladder compensation composition SP that is formed under the virtual composition DP2.
Ladder compensation composition SP is included in the first metal composition of the first metal layer formation.Ladder compensation composition SP has reduced the ladder height that is formed on the organic layer 130 in the 3rd hole H3.The ladder height of organic layer 130 is compensated by ladder compensation composition SP, thereby further strengthens through the cohesive force of the 3rd hole H3 between virtual composition DP2 and the conduction tack coat 150.
Figure 13 is the partial cross section figure of the display of the tenth exemplary embodiments according to the present invention.
According to Fig. 1 and 13, comprise that the adhesive segment 220 of the 3rd hole H3 is formed in the first circuit region CA1 of display base plate 100h.The 3rd hole H3 of adhesive segment 220 forms to expose virtual composition DP3 to the open air through protection insulation course 120 and organic layer 130 compositions.Virtual composition DP3 has sandwich construction, comprises the first virtual composition DP1 and is formed on the second virtual composition DP2 on the first virtual composition DP1.The first virtual composition DP1 is formed by channel layer.The second virtual composition DP2 is formed by second metal level.Virtual composition DP3 forms through the synchronous composition of the mask that adopts the channel layer and second metal level.
Therefore, conduction tack coat 150 is bonded to the second virtual composition DP2 of virtual composition DP3, is bonded to protection insulation course 120 and organic layer 130 then.Further, as described above, because the better characteristic of the cohesive force between metal material and the organic material, the cohesive force between second virtual composition DP2 that second metal level forms and the conduction bonding piece 150 is bigger.Accordingly, the cohesive force between organic layer 130 and the protection insulation course 120 is strengthened.
As a result, the source IC (not shown) and the cohesive force between the liner 211 that are installed in the first circuit region CA1 are strengthened, and drive reliability thereby improve.
Data line DL is formed on source electrode DI and the drain electrode DE of the on-off element TFT in the viewing area DA of display base plate 100h, through adopting the formation of the mask composition channel layer and second metal level.Therefore, data line DL, source electrode SE and drain electrode DE have sandwich construction, comprise channel layer and are formed on second metal level on the channel layer.
Figure 14 is the partial cross section figure of the display of the 11 exemplary embodiments according to the present invention.
According to Figure 13 and 14, display base plate 100i can further comprise the ladder compensation composition SP that is formed under the virtual composition DP3.Ladder compensation composition SP is included in the first metal composition that is formed by the first metal layer.Ladder compensation composition SP has reduced the ladder height that is formed on the organic layer 130 in the 3rd hole H3.The ladder height of organic layer 130 compensates through ladder compensation composition SP, thereby further strengthens through the cohesive force of the 3rd hole H3 between virtual composition DP3 and the conduction tack coat 150.
At last, shown in Fig. 9 to 14, virtual composition and ladder compensation composition can use in the display of second to the 5th exemplary embodiments according to the present invention, as top according to Fig. 4 to 8.
According to exemplary embodiments of the present invention described herein, comprise that the contiguous liner part of adhesive segment in a plurality of holes forms, thereby the cohesive force of passing through the IC of liner part and bonding piece electrical connection is strengthened.
The present invention should not be construed as and is limited to the exemplary embodiments of illustrating here.On the contrary, thus provide these exemplary embodiments these open will be fully with complete, and can scope of the present invention be conveyed to those skilled in the art fully.
For example, the lower insulation layer of display base plate for example gate insulator or protection insulation course can be through adhesive segment contact conduction tack coat, thereby strengthens the cohesive force between organic layer and the protection insulation course.Therefore, separate the IC that causes by organic layer with the protection insulation course and the defective that electrically contacts between the liner part can effectively reduce or stop.
Although according to exemplary embodiments; Special demonstration of the present invention and description; One with ordinary skill in the art would appreciate that and do not break away from purport of the present invention and, can make the variations and modifications on form and the details here by under the following situation like scope thereof.
Claims (65)
1. display base plate comprises:
Base substrate has the viewing area and around the outer peripheral areas of viewing area;
Be formed on the pixel electrode of viewing area;
Be formed on the liner part of outer peripheral areas;
Adhesive segment is formed on outer peripheral areas and has the formation of a plurality of holes and on outer peripheral areas, is close in the zone of liner part; With
The conduction bonding piece is formed on liner part and the adhesive segment, electrically contacting liner part and ic terminal,
Wherein said conduction bonding piece is inserted a plurality of holes of said adhesive segment.
2. like the display base plate in the claim 1, wherein, further comprise:
Be formed on first insulation course on the base substrate; With
Be formed on the organic layer on first insulation course.
3. like the display base plate in the claim 2, each hole in wherein said a plurality of holes through the part organic layer outer peripheral areas form and
The conduction bonding piece is bonded to first insulation course that exposes to the open air through each hole.
4. like the display base plate in the claim 2, wherein, further comprise second insulation course that is formed on the base substrate.
5. like the display base plate in the claim 4, the part of first insulation course and the organic layer of each hole in wherein said a plurality of holes through being formed on outer peripheral areas form and
The conduction bonding piece is bonded to second insulation course that exposes to the open air through each hole.
6. like the display base plate in the claim 4, each hole in wherein said a plurality of holes through being formed on outer peripheral areas first insulation course and the synchronous composition of organic layer forms and
Display base plate further comprises the virtual composition that is exposed to the open air by each hole.
7. like the display base plate in the claim 6, wherein, further comprise on-off element, it comprises channel layer that is electrically connected to the pixel electrode that is formed by the first metal layer and source electrode and the drain electrode that is formed by second metal level.
8. like the display base plate in the claim 7, wherein virtual composition forms through the channel layer composition.
9. like the display base plate in the claim 7, wherein virtual composition forms through the second metal level composition.
10. like the display base plate in the claim 7, wherein virtual composition is a sandwich construction, forms through the channel layer composition and the second metal level composition.
11., wherein, further comprise the ladder compensation composition that is formed on the base substrate like the display base plate in the claim 7.
12. like the display base plate in the claim 11, wherein ladder compensation composition forms through the first metal layer composition.
13. like the display base plate in the claim 4, each hole in wherein said a plurality of holes form through the synchronous composition of the part organic layer, first insulation course and second insulation course that are formed on outer peripheral areas and
The conduction bonding piece is bonded to second insulation course that exposes to the open air through each hole.
14. like the display base plate in the claim 2, wherein pixel electrode comprises transparency electrode and reflecting electrode.
15. like the display base plate in the claim 14, wherein reflecting electrode is formed on the part organic layer.
16. like the display base plate in the claim 15, wherein organic layer has formation recessed composition and protruding composition above that.
17. like the display base plate in the claim 2, wherein:
First with organic layer of first thickness is formed on the outer peripheral areas with liner part,
Second portion with organic layer of second thickness be formed on have pixel electrode form above that the viewing area and
Second thickness of the second portion of organic layer is greater than first thickness of the first of organic layer.
18., wherein, further comprise the grid circuit part that is formed on outer peripheral areas like the display base plate in the claim 2.
19., wherein be formed on the part organic layer cover gate circuit part of outer peripheral areas like the display base plate in the claim 18.
20. a display base plate comprises:
Base substrate has the viewing area and around the outer peripheral areas of viewing area;
Be formed on the pixel electrode on the viewing area;
Be formed on the liner part on the outer peripheral areas;
Circuit region is formed on the outer peripheral areas;
Adhesive segment is formed in the circuit region and has a plurality of holes and is formed in the zone of contiguous liner part;
Be installed in the integrated circuit on the circuit region; With
The conduction bonding piece is formed on liner part and the adhesive segment, electrically contacting liner part and ic terminal,
Wherein said conduction bonding piece is inserted a plurality of holes of said adhesive segment.
21., wherein, further comprise like the display base plate in the claim 20:
Be formed on first insulation course on the base substrate; With
Be formed on the organic layer on first insulation course.
22. like the display base plate in the claim 21, each hole in wherein said a plurality of holes forms in outer peripheral areas through the part organic layer.
23., wherein, further comprise second insulation course that is formed on the base substrate like the display base plate in the claim 21.
24. like the display base plate in the claim 23, first insulation course and the part of organic layer of each hole in wherein said a plurality of holes through being formed on outer peripheral areas forms.
25., wherein, further comprise the virtual composition that exposes to the open air by each hole like the display base plate in the claim 24.
26. like the display base plate in the claim 25, wherein, further comprise on-off element, this on-off element comprises channel layer that is electrically connected to the pixel electrode that is formed by the first metal layer and source electrode and the drain electrode that is formed by second metal level.
27. like the display base plate in the claim 26, wherein virtual composition is formed by the channel layer composition.
28. like the display base plate in the claim 26, wherein virtual composition is formed by the second metal level composition.
29. like the display base plate in the claim 26, wherein virtual composition has sandwich construction, and is formed by the channel layer composition and the second metal level composition.
30., wherein, further comprise the ladder compensation composition that is formed on the base substrate like the display base plate in the claim 26.
31. like the display base plate in the claim 30, wherein ladder compensation composition is formed by the first metal layer composition.
32. like the display base plate in the claim 23, each hole in wherein said a plurality of holes forms through the synchronous composition of the organic layer, first insulation course and second insulation course that are formed on outer peripheral areas.
33. like the display base plate in the claim 21, wherein pixel electrode comprises transparency electrode and reflecting electrode.
34. like the display base plate in the claim 33, wherein reflecting electrode is formed on the part organic layer.
35. like the display base plate in the claim 34, wherein organic layer has formation recessed composition and protruding composition above that.
36. like the display base plate in the claim 21, wherein:
First with organic layer of first thickness is formed on the outer peripheral areas with liner part,
Second portion with organic layer of second thickness form the viewing area be formed with pixel electrode above that and
Second thickness of the second portion of organic layer is greater than first thickness of the first of organic layer.
37., wherein, further comprise the grid circuit part that is formed on the outer peripheral areas like the display base plate in the claim 21.
38., wherein be formed on the part organic layer cover gate circuit part of outer peripheral areas like the display base plate in the claim 37.
39. the manufacturing approach of display base plate, this method comprises:
Form base substrate;
In the viewing area of base substrate, form on-off element;
In the outer peripheral areas of the viewing area that centers on base substrate, form the liner composition;
On base substrate, form organic layer;
The composition organic layer is to form adhesive segment on the part outer peripheral areas of contiguous liner composition, this adhesive segment has a plurality of holes and forms within it;
On base substrate, form pixel electrode and pad electrode;
Pixel electrode is electrically connected to on-off element and pad electrode is electrically connected to the liner composition; With
On pad electrode and adhesive segment, form the conduction bonding piece, this conduction bonding piece is electrically connected to pad electrode and ic terminal,
Wherein said conduction bonding piece is inserted a plurality of holes of said adhesive segment.
40., wherein, further be included in and form first insulation course on the base substrate like the method in the claim 39.
41. like the method in the claim 40, the bonding piece of wherein conducting electricity is bonded to first insulation course that exposes to the open air through each hole in said a plurality of holes.
42., wherein, further be included in and form second insulation course on the base substrate like the method in the claim 40.
43. like the method in the claim 42, wherein the formation of adhesive segment comprises synchronous composition first insulation course and organic layer.
44. like the method in the claim 43, the bonding piece of wherein conducting electricity is bonded to second insulation course that exposes to the open air through the hole.
45., wherein, further be included in outer peripheral areas and form the grid circuit part like the method in the claim 40.
46. like the method in the claim 45, wherein the formation of organic layer has formed a part of organic layer of cover gate circuit part.
47. a display comprises:
Display panel comprises:
Base substrate;
Be formed on the base substrate and have the viewing area and the display base plate of outer peripheral areas;
Relative substrate towards display base plate;
Be formed on the pixel electrode on the viewing area;
Be formed on the liner part of outer peripheral areas; With
Adhesive segment is formed on the outer peripheral areas and has a plurality of holes in the zone of the contiguous liner part of the outer peripheral areas of being formed on;
Be formed on the conduction bonding piece on liner part and the adhesive segment; With
Be electrically connected to the integrated circuit of liner part through the conduction bonding piece,
Wherein said conduction bonding piece is inserted a plurality of holes of said adhesive segment.
48. like the display in the claim 47, wherein display base plate further comprises:
Be formed on first insulation course on the base substrate; With
Be formed on first organic layer on first insulation course.
49. like the display in the claim 48, each hole in wherein said a plurality of holes forms through part first organic layer of outer peripheral areas, and the conduction bonding piece is bonded to first insulation course that exposes to the open air through each hole.
50., wherein, further comprise second insulation course that is formed on the base substrate like the display in the claim 48.
51. like the display in the claim 50, each hole in wherein said a plurality of holes forms through part first organic layer and part first insulation course of outer peripheral areas, and
The conduction bonding piece is bonded to second insulation course that exposes to the open air through each hole.
52. like the display in the claim 50, its mesopore constitutes through first insulation course and the synchronous composition of first organic layer that is formed on outer peripheral areas, and
Display base plate further comprises the virtual composition that exposes to the open air through each hole.
53. like the display in the claim 52, wherein, further comprise on-off element, it comprises channel layer that is electrically connected to the pixel electrode that is formed by the first metal layer and source electrode and the drain electrode that is formed by second metal level.
54. like the display in the claim 53, wherein virtual composition forms through the channel layer composition.
55. like the display in the claim 53, wherein virtual composition forms through the second metal level composition.
56. like the display in the claim 53, wherein virtual composition is a sandwich construction, and forms through the channel layer and the second metal level composition.
57., wherein, further comprise the ladder compensation composition that is formed on the base substrate like the display in the claim 53.
58. like the display in the claim 57, wherein ladder compensation composition forms through the first metal layer composition.
59. like the display in the claim 50, each hole in wherein said a plurality of holes through be formed on the synchronous composition of first organic layer, first insulation course and second insulation course in the outer peripheral areas and form and
The conduction bonding piece is bonded to second insulation course that exposes to the open air through each hole.
60. like the display in the claim 48, wherein pixel electrode comprises transparency electrode and reflecting electrode.
61. like the display in the claim 60, wherein reflecting electrode is formed on part first organic layer.
62. like the display in the claim 61, wherein first organic layer is formed with recessed composition and protruding composition.
63. like the display in the claim 60, wherein substrate comprises colour filter relatively, is formed with light hole in the colour filter, wherein light hole is formed on the reflecting electrode top.
64. like the display in the claim 63, wherein, relatively substrate further comprises second organic layer, is formed on the reflecting electrode top of the pixel electrode on the viewing area of display base plate.
65. like the display in the claim 48, wherein:
First with first organic layer of first thickness is formed on the outer peripheral areas with liner part,
Second portion with first organic layer of second thickness be formed on have that pixel electrode forms in the viewing area above that and
Second thickness of the second portion of first organic layer is greater than first thickness of the first of first organic layer.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20070017967A KR101365118B1 (en) | 2007-02-22 | 2007-02-22 | Display substrate, method of manufacturing the same and display device having the display substrate |
| KR17967/07 | 2007-02-22 | ||
| KR1020070043674A KR20080098242A (en) | 2007-05-04 | 2007-05-04 | Display substrate and display device having the same |
| KR43674/07 | 2007-05-04 |
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| Publication Number | Publication Date |
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| CN101320148A CN101320148A (en) | 2008-12-10 |
| CN101320148B true CN101320148B (en) | 2012-06-13 |
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| CN103080994B (en) * | 2010-08-31 | 2014-12-31 | 夏普株式会社 | Display panel, and method for producing same |
| TWI518405B (en) * | 2014-01-24 | 2016-01-21 | 友達光電股份有限公司 | Display panel and method for fabrication thereof |
| KR102351410B1 (en) * | 2015-06-02 | 2022-01-17 | 삼성디스플레이 주식회사 | Display module, display apparatus for vehicle, and manufacturing method for display module |
| CN107302011B (en) * | 2016-04-14 | 2020-11-20 | 群创光电股份有限公司 | Display device |
| KR20180007738A (en) | 2016-07-13 | 2018-01-24 | 삼성디스플레이 주식회사 | Display device |
| KR102615177B1 (en) * | 2016-10-06 | 2023-12-20 | 삼성디스플레이 주식회사 | Flat panel display |
| US11491305B2 (en) | 2018-05-02 | 2022-11-08 | Berner Fachhochschule, Technik Und Informatik | Method for producing a catheter comprising a FPCB |
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| US6506978B1 (en) * | 1999-09-03 | 2003-01-14 | Seiko Epson Corporation | Flexible wiring board, electrooptical device and electronic equipment |
| US6698077B2 (en) * | 2000-12-27 | 2004-03-02 | International Business Machines Corporation | Display fabrication using modular active devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100943731B1 (en) * | 2003-06-28 | 2010-02-23 | 엘지디스플레이 주식회사 | Chip on glass type Display Device |
| KR20050066643A (en) * | 2003-12-26 | 2005-06-30 | 엘지.필립스 엘시디 주식회사 | Fabrication method of transreflective liquid crystal display device |
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- 2007-02-22 KR KR20070017967A patent/KR101365118B1/en active IP Right Grant
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6506978B1 (en) * | 1999-09-03 | 2003-01-14 | Seiko Epson Corporation | Flexible wiring board, electrooptical device and electronic equipment |
| US6698077B2 (en) * | 2000-12-27 | 2004-03-02 | International Business Machines Corporation | Display fabrication using modular active devices |
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| KR101365118B1 (en) | 2014-02-25 |
| CN101320148A (en) | 2008-12-10 |
| KR20080078202A (en) | 2008-08-27 |
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Owner name: SAMSUNG MONITOR CO., LTD. Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD. Effective date: 20121029 |
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