CN101202272A - 一种用于微机电系统器件的密封结构及其方法 - Google Patents
一种用于微机电系统器件的密封结构及其方法 Download PDFInfo
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- CN101202272A CN101202272A CNA2007101703451A CN200710170345A CN101202272A CN 101202272 A CN101202272 A CN 101202272A CN A2007101703451 A CNA2007101703451 A CN A2007101703451A CN 200710170345 A CN200710170345 A CN 200710170345A CN 101202272 A CN101202272 A CN 101202272A
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Abstract
Description
Claims (55)
Applications Claiming Priority (2)
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US10/693,323 US7303645B2 (en) | 2003-10-24 | 2003-10-24 | Method and system for hermetically sealing packages for optics |
US10/693,323 | 2003-10-24 |
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CNB2004100863322A Division CN100454535C (zh) | 2003-10-24 | 2004-10-25 | 用于微机电系统器件的封装件及封装系统 |
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CN101202272A true CN101202272A (zh) | 2008-06-18 |
CN101202272B CN101202272B (zh) | 2010-06-02 |
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CN2007101703447A Expired - Fee Related CN101183675B (zh) | 2003-10-24 | 2004-10-25 | 一种用于多个个体的芯片的晶片级封装的方法和系统 |
CN2007101703466A Expired - Fee Related CN101252122B (zh) | 2003-10-24 | 2004-10-25 | 用于气密密封器件的系统及晶片级检测的微机电系统封装 |
CN2007101703451A Expired - Fee Related CN101202272B (zh) | 2003-10-24 | 2004-10-25 | 一种用于微机电系统器件的密封结构及其方法 |
CNB2004100863322A Expired - Fee Related CN100454535C (zh) | 2003-10-24 | 2004-10-25 | 用于微机电系统器件的封装件及封装系统 |
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CN2007101703447A Expired - Fee Related CN101183675B (zh) | 2003-10-24 | 2004-10-25 | 一种用于多个个体的芯片的晶片级封装的方法和系统 |
CN2007101703466A Expired - Fee Related CN101252122B (zh) | 2003-10-24 | 2004-10-25 | 用于气密密封器件的系统及晶片级检测的微机电系统封装 |
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CNB2004100863322A Expired - Fee Related CN100454535C (zh) | 2003-10-24 | 2004-10-25 | 用于微机电系统器件的封装件及封装系统 |
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US (7) | US7303645B2 (zh) |
JP (1) | JP5043297B2 (zh) |
KR (1) | KR20050039635A (zh) |
CN (4) | CN101183675B (zh) |
DE (1) | DE102004051361A1 (zh) |
GB (1) | GB2408145B (zh) |
TW (1) | TWI253182B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112105580A (zh) * | 2018-05-09 | 2020-12-18 | 罗伯特·博世有限公司 | 用于具有倾斜的光学窗的微机械设备的制造方法和相应的微机械设备 |
Families Citing this family (99)
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US6969635B2 (en) * | 2000-12-07 | 2005-11-29 | Reflectivity, Inc. | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
TWI289708B (en) | 2002-12-25 | 2007-11-11 | Qualcomm Mems Technologies Inc | Optical interference type color display |
US7483198B2 (en) * | 2003-02-12 | 2009-01-27 | Texas Instruments Incorporated | Micromirror device and method for making the same |
US8619352B2 (en) * | 2003-07-29 | 2013-12-31 | Silicon Quest Kabushiki-Kaisha | Projection display system using laser light source |
US7303645B2 (en) * | 2003-10-24 | 2007-12-04 | Miradia Inc. | Method and system for hermetically sealing packages for optics |
US8194305B2 (en) * | 2003-11-01 | 2012-06-05 | Silicon Quest Kabushiki-Kaisha | Package for micromirror device |
WO2005054147A1 (ja) * | 2003-12-02 | 2005-06-16 | Bondtech Inc. | 接合方法及びこの方法により作成されるデバイス並びに接合装置 |
US7342705B2 (en) | 2004-02-03 | 2008-03-11 | Idc, Llc | Spatial light modulator with integrated optical compensation structure |
US7329555B1 (en) * | 2004-07-20 | 2008-02-12 | National Semiconductor Corporation | Method of selectively forming MEMS-based semiconductor devices at the end of a common fabrication process |
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CN112105580A (zh) * | 2018-05-09 | 2020-12-18 | 罗伯特·博世有限公司 | 用于具有倾斜的光学窗的微机械设备的制造方法和相应的微机械设备 |
CN112105580B (zh) * | 2018-05-09 | 2024-04-16 | 罗伯特·博世有限公司 | 用于具有倾斜的光学窗的微机械设备的制造方法和相应的微机械设备 |
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JP2005167209A (ja) | 2005-06-23 |
CN100454535C (zh) | 2009-01-21 |
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CN101202272B (zh) | 2010-06-02 |
US7303645B2 (en) | 2007-12-04 |
TWI253182B (en) | 2006-04-11 |
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US8288851B2 (en) | 2012-10-16 |
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GB2408145B (en) | 2007-06-06 |
CN101252122B (zh) | 2012-01-25 |
US20060284295A1 (en) | 2006-12-21 |
GB2408145A (en) | 2005-05-18 |
CN101183675A (zh) | 2008-05-21 |
CN1638115A (zh) | 2005-07-13 |
US8022520B2 (en) | 2011-09-20 |
US7948000B2 (en) | 2011-05-24 |
TW200525769A (en) | 2005-08-01 |
JP5043297B2 (ja) | 2012-10-10 |
CN101183675B (zh) | 2010-06-09 |
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