CN101067642A - Electronic device test set and contact used therein - Google Patents
Electronic device test set and contact used therein Download PDFInfo
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- CN101067642A CN101067642A CN 200710092376 CN200710092376A CN101067642A CN 101067642 A CN101067642 A CN 101067642A CN 200710092376 CN200710092376 CN 200710092376 CN 200710092376 A CN200710092376 A CN 200710092376A CN 101067642 A CN101067642 A CN 101067642A
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- proving installation
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Abstract
A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the contact is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested.
Description
The reference each other of related application
The application is the universal application that proposes according to 35U.S.C. § 111 (a), requires before according to the right of priority of 35U.S.C. § 111 (b) at the provisional application series No.60/776654 of proposition on February 24th, 2006 according to 35U.S.C. § 119 (e) (1).
Technical field
The present invention relates generally to for example field tests of integrated circuit of electron device.But, more at large say, the present invention relates to be used for the proving installation that weld pad or lead-in wire with measured device engage with the corresponding weld pad of the circuit board of proving installation.Specific embodiments of the invention concentrate on the structure and the installation of the contact of proving installation.
Background technology
The test of carrying out integrated circuit (IC)-components has high as far as possible quality level to guarantee such device when being sold the user.Adopted various proving installations to finish test in recent years.Typically, tester comprises printed circuit board (PCB), has limited a plurality of conductive traces on it, and these tracks on circuit board or the load board and the corresponding function of proving installation interrelate.
In order to finish test, the lead-in wire in the time of need be with the leaded device of test, or test does not have the weld pad of lead-in wire device and interconnects with corresponding track on the load board.Proving installation or the test jack with a plurality of contacts are inserted between measured device and the load board, to realize interconnection.By lead-in wire or the weld pad of DUT, this depends on the type of tested DUT to contact, engages with its corresponding track on the load board in the top.The lower end of contact engages with track on the load board.
Along with the development of technology, the size of contact, shape and characteristic electron are developed according to the structure of the structure of proving installation and load board and measured device.Once thought at lead-in wire that passes through DUT or the weld pad on weld pad and the load board, need have longitudinal sliding motion at the diverse location that contact end engages, because in the good connection of its arbitrary end, such longitudinal sliding motion is considered to be convenient to generate the good transmission path of process contact.Be that thinking in the past that the longitudinal sliding motion of the transmission path that must be used for keeping good is measured does not need the degree thought in the past more apparently but become.In addition, recognize that too much longitudinal sliding motion action can destroy parts at the different abutments of contact, and the life-span of significantly reducing test jack and tester load board thus.Therefore, done various trials so that a surface is dropped to minimum with respect to another wearing and tearing, designed various elastic mounting devices with attempt will wearing and tearing and parts loss thus drop to minimum.
Another problem of having found is, the rough tin of employing can cause the reduction of tested performance on all kinds lead-in wire of DUT and weld pad.Give the such material of DUT parts coating of being convenient to be welded to final main circuit board, but because its flexibility, it is easy to adhere to gradually on the contact of DUT joint when friction takes place through composition surface in the test run process, at last, rough tin can be accumulated to a bit, will be lowered in this integrality by the signal of contact.
The requirement and the shortcoming of the technology formerly that the present invention that Here it is points to.The present invention is a kind of contact, and it has a kind of structure, and it can reduce to minimum with the accumulation of the tin on the contact.
Summary of the invention
The present invention is a kind of contact of proving installation of the load board that is used for being installed to tester apparatus.This contact is used at least one lead-in wire of measured device (DUT) and the respective metal track on the load board is electrically connected.This contact has first end, and it limits the contact point of the wire-bonded of a plurality of DUT of passing through, and it further has second end, and it has the arc limit that engages with metallic traces.When first end of contact by DUT wire-bonded and make it when being approximately perpendicular to axis rotation on the plane that contact limits, can roll through metallic traces in this arc limit.This contact is installed by elasticity as the part of the proving installation between load board and the DUT.When being engaged, first end of the contact lead-in wire by DUT is convenient to the rotation of contact thus around axis.
Adopt the proving installation of contact can use a plurality of contact points, it takes the form of a plurality of protuberances.In one embodiment of the invention, this protuberance is roughly parallel to each other.Similarly, this protuberance can be arranged essentially parallel to the axis on the plane that is approximately perpendicular to the contact qualification.
By structure contact like this, the first direction of the wire-bonded of and DUT initial from first end of contact wherein when contact rotates to contact wherein when being in the second direction of structure of operational testing around axis, and contact will have can be continuously and the protuberance of the wire-bonded of DUT.
When contact is positioned at its first direction, be unique protuberance with the wire-bonded of DUT with respect to the most inboard protuberance of proving installation.Subsequently when make contact from first direction when axis rotates to second direction, outside protuberance engages continuously.
Therefore the present invention is a kind of improved proving installation structure and the contact that is used for this proving installation, and with reference to the specific embodiment of the present invention, accessory claim book and accompanying drawing, it will be conspicuous obtaining more detailed feature and advantage in view of those features.
Description of drawings
Fig. 1 is that some parts illustrate in the cross section mode according to the side front view of the proving installation of employing contact of the present invention;
Fig. 2 is the view that is similar to Fig. 1, and first and second directions of contact are described; With
Fig. 3 is the skeleton view according to contact of the present invention.
Embodiment
Referring now to accompanying drawing,, wherein in all several views, identical Reference numeral is represented identical parts.Fig. 1 illustrates according to test jack 10 of the present invention.This test jack 10 is desired to use with the tester of the integrated circuit (IC)-components quality that typically is used for determining using in the electronic equipment.This tester is connected with tester load board 12, and this tester load board has the conductive traces 14 that is formed on its surface 16, so that can realize telecommunications between tester and the tested integrated circuit (IC)-components 18.In other words, between measured device 18 and proving installation, transmit electronic signal by test jack 10.
Be to utilize according to test jack of the present invention or proving installation and can test various integrated circuit (IC)-components 18 with being appreciated that.Fig. 1 illustrates leaded device, and it has the outward extending lead-in wire of telling from the main body 59 of device 18 58.But be, the device of nothing lead-in wire as shown in Figure 2 can be provided with being appreciated that, and this device has weld pad 61 rather than goes between 58.
Although can be, Fig. 1 illustrates measured device (DUT) encapsulation with understanding, and at lead-in wire shown in the front view, typically a plurality of leads 58 is parts of device 18.In this case, the contact of discussing hereinafter 24 will be provided to be used for the joint of each lead-in wire 58.Be understandable that, shown under the situation of type of device 18, substantially the same lead-in wire extends along the relative both sides of device package 18.
During operation, the main body 59 of device 18 is applied downward pressure by the piston mechanism (not shown).When piston is depressed device 18 downwards, the contact of installing with elastic type 24 discussed is hereinafter caused with respect to being approximately perpendicular to the axis rotation that extend on plane that contact 24 limits.Contact 24 can be denoted as Reference numeral 68 with respect to the axis of its rotation in Fig. 3.
Fig. 1 illustrates the location of device 18 and at first engages the preceding or inner direction of contact 24 26 time of contact 24 when lead-in wire 58.Fig. 2 illustrates the direction (second direction) when device contact 24 during at test position.Can be, in view of the structure of the contact 24 that will discuss hereinafter, the curved surfaces 28 on the rear end 30 of contact 24 will roll across the track 14 on the load board 12 with understanding, and that surface along track 14 does not have translation or rotational slide in fact.Fig. 1 and 2 illustrates the wall 70 of rear end 30 adjacency of contact 24.Such wall 70 is limited in the shell of test jack 10.Can notice that this wall 70 is sizable acute angle with respect to the surface 16 of load board 12.Typically this angle is approximately in the scope between 72 °-78 °.In order to prevent that edge 28 from sliding along track 14, this wall 70 is used for engaging with the rear end 30 of contact 24.
Contact 24 illustrated in the accompanying drawings comprises projection 40, and when installing by elastic body 46-48, projection 40 plays the shoulder 49 that joint is limited by shell 32.Projection 40 is used for limiting the degree that contact 24 moves up with engaging of shoulder 49, and the front end 26 of contact 24 will extend beyond the distance of the upper surface of shell 32 when contact 24 does not engage with measured device.
As previously discussed, elastic body 46,48 influences the installation of contact 24.Therefore test jack shell 32 is equipped with pair of channels 50,52, and when contact 24 was installed in the shell 32, described passage extended along the axis that is substantially transverse to the plane that is limited by contact 24. Elastic body 46,48 is accommodated in the passage 50,52.Back elastic body 48 is by preloading, and the result who engages with load board 12 as the curved surfaces 28 on the rear end 30 of contact 24, and back elastic body 48 will be on a position engages with the top edge of the rear end 30 of contact 24 with the front end 26 that promotes contact 24 upwards.Similarly, preceding elastic body 46 is compressed and also is used to promote contact 24 upwards.Contact 24 will be positioned in its neutral point direction and be directed, as shown in Figure 1.This is the first direction of contact 24 and is to be in and that direction that takies by device 18 before the upper end 26 of contact 24 engages at device 18.
Fig. 1 illustrates a plurality of contact points that the upper end 26 by contact 24 limits.Preferably as shown in Figure 3, the protuberance 60,62,64 that normally extends in parallel of this contact point.Although Fig. 3 illustrates three and is roughly parallel to the protuberance that axis 68 extends, as illustrated in fig. 1 and 2, littler contact also can only provide two protuberances 60,62.
Fig. 1 illustrates protuberance 60,62 location relative to each other when realizing engaging for the first time by the lead-in wire 58 of device 18.Can notice the protuberance 60 with the lead-in wire 58 engages and swell 62 less than the joint.When contact 24 was positioned on this direction, lead-in wire 58 and the interval of swelling between 62 were illustrated by Reference numeral 66.
When pressure is continuously applied device 18, will cause contact 24 roughly to be rotated counterclockwise around axis 68.On some points, lead-in wire is 58 with engage ridges 62, and swells and 60 will be rotated down away from lead-in wire 58.Under the situation of the embodiment of three protuberances, when the 3rd protuberance 64 bonding wires, second protuberance 62 also will 58 be removed from going between.
24 pairs of processing of contact of having found so a plurality of contact points are not effective by the rough standard cubic feet per day that the typical case is provided on the lead-in wire 58, so that be welded to final mainboard.The structure of these a plurality of protuberances is used to help to control the accumulation of tin on the front end 26 of contact 24.First protuberance 60 has the tendentiousness of collecting maximum tin.By providing a plurality of protuberances to stop undesirable accumulation.First protuberance moves in the maximum that absorbs tin and plays sacrificial action.
Fig. 3 illustrates the contact 24 with the front end 26 that narrows down.An embodiment like this defines has the littler pad 71 of shoulder 72 at interval on its either side.Can imagine that such feature will be used when measured device does not go between and have with the substantially flush weld pad of the bottom part body of device 18.Such pad embodiment in addition can be used in the weld pad of DUT or main body that a plurality of weld pad is recessed in integrated circuit in environment in.
Can be, content disclosed herein only be schematically in many aspects, under the situation that does not exceed scope of the present invention, can change in detail, particularly the shape of parts, size, material and setting with understanding.Thus, scope of the present invention is limited by additional claims.
Claims (8)
1, a kind of proving installation, its load board that is installed to tester apparatus is to be electrically connected at least one lead-in wire of measured device (DUT) and the respective metal track on this load board, and this proving installation comprises:
-contact, it has first end and second end, first end limit a plurality of can with the contact point of the wire-bonded of this device, second end has the arc limit that engages with metallic traces, when the wire-bonded of described first end of described contact and DUT and be caught when being approximately perpendicular to the axis rotation on the plane that is limited by described contact, the arc limit can roll across this track; With
-be used for described contact elasticity is installed in device between load board and the DUT, when being used for the wire-bonded as described first end of described contact and DUT around described axis rotation.
2, according to the proving installation of claim 1, wherein said a plurality of contact points comprise a plurality of protuberances.
3, according to the proving installation of claim 2, wherein said protuberance roughly is parallel to each other.
4, according to the proving installation of claim 3, wherein said protuberance is roughly parallel to described axis.
5, according to the proving installation of claim 4, wherein when described contact around described axis when first direction rotates to second direction, described protuberance can engage in turn with the lead-in wire of device, at first direction, described first end of described contact and the lead-in wire initial engagement of DUT, in second direction, described contact is in test position shape.
6, according to the proving installation of claim 5, wherein when described contact is positioned at described first direction, only the most inside protuberance and the wire-bonded of DUT.
7, according to the proving installation of claim 6, wherein when described contact around described axis when described first direction rotates to described second direction, outside protuberance engages in turn continuously.
8, a kind of contact, it is used for will treat being electrically connected by the respective metal track on the load board of at least one lead-in wire of the device of tester apparatus test and tester apparatus, this contact comprises the thin metallic object with first end and second end, described first end define a plurality of can with the contact point of the wire-bonded of DUT, described second end engages with metallic traces.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77665406P | 2006-02-24 | 2006-02-24 | |
US60/776,654 | 2006-02-24 |
Publications (1)
Publication Number | Publication Date |
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CN101067642A true CN101067642A (en) | 2007-11-07 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200710092376 Pending CN101067642A (en) | 2006-02-24 | 2007-02-25 | Electronic device test set and contact used therein |
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CN (1) | CN101067642A (en) |
Cited By (14)
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CN102483435A (en) * | 2009-04-21 | 2012-05-30 | 约翰国际有限公司 | Electrically conductive kelvin contacts for microcircuit tester |
CN102713621A (en) * | 2009-11-23 | 2012-10-03 | 西维克公司 | Method and apparatus for performing assays |
US8988090B2 (en) | 2009-04-21 | 2015-03-24 | Johnstech International Corporation | Electrically conductive kelvin contacts for microcircuit tester |
US9329204B2 (en) | 2009-04-21 | 2016-05-03 | Johnstech International Corporation | Electrically conductive Kelvin contacts for microcircuit tester |
US9500645B2 (en) | 2009-11-23 | 2016-11-22 | Cyvek, Inc. | Micro-tube particles for microfluidic assays and methods of manufacture |
US9546932B2 (en) | 2009-11-23 | 2017-01-17 | Cyvek, Inc. | Microfluidic assay operating system and methods of use |
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US9651568B2 (en) | 2009-11-23 | 2017-05-16 | Cyvek, Inc. | Methods and systems for epi-fluorescent monitoring and scanning for microfluidic assays |
US9700889B2 (en) | 2009-11-23 | 2017-07-11 | Cyvek, Inc. | Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results |
US9759718B2 (en) | 2009-11-23 | 2017-09-12 | Cyvek, Inc. | PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use |
US9855735B2 (en) | 2009-11-23 | 2018-01-02 | Cyvek, Inc. | Portable microfluidic assay devices and methods of manufacture and use |
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US10228367B2 (en) | 2015-12-01 | 2019-03-12 | ProteinSimple | Segmented multi-use automated assay cartridge |
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- 2007-02-25 CN CN 200710092376 patent/CN101067642A/en active Pending
Cited By (20)
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US9500673B2 (en) | 2009-04-21 | 2016-11-22 | Johnstech International Corporation | Electrically conductive kelvin contacts for microcircuit tester |
US10247755B2 (en) | 2009-04-21 | 2019-04-02 | Johnstech International Corporation | Electrically conductive kelvin contacts for microcircuit tester |
US8988090B2 (en) | 2009-04-21 | 2015-03-24 | Johnstech International Corporation | Electrically conductive kelvin contacts for microcircuit tester |
US9329204B2 (en) | 2009-04-21 | 2016-05-03 | Johnstech International Corporation | Electrically conductive Kelvin contacts for microcircuit tester |
CN102483435B (en) * | 2009-04-21 | 2016-06-08 | 约翰国际有限公司 | For conduction Kelvin's contact of microcircuit tester |
CN102483435A (en) * | 2009-04-21 | 2012-05-30 | 约翰国际有限公司 | Electrically conductive kelvin contacts for microcircuit tester |
US9651568B2 (en) | 2009-11-23 | 2017-05-16 | Cyvek, Inc. | Methods and systems for epi-fluorescent monitoring and scanning for microfluidic assays |
US9855735B2 (en) | 2009-11-23 | 2018-01-02 | Cyvek, Inc. | Portable microfluidic assay devices and methods of manufacture and use |
US9546932B2 (en) | 2009-11-23 | 2017-01-17 | Cyvek, Inc. | Microfluidic assay operating system and methods of use |
CN102713621A (en) * | 2009-11-23 | 2012-10-03 | 西维克公司 | Method and apparatus for performing assays |
CN102713621B (en) * | 2009-11-23 | 2016-10-19 | 西维克公司 | For the method and apparatus implementing chemical examination |
US9700889B2 (en) | 2009-11-23 | 2017-07-11 | Cyvek, Inc. | Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results |
US9759718B2 (en) | 2009-11-23 | 2017-09-12 | Cyvek, Inc. | PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use |
US9500645B2 (en) | 2009-11-23 | 2016-11-22 | Cyvek, Inc. | Micro-tube particles for microfluidic assays and methods of manufacture |
US10022696B2 (en) | 2009-11-23 | 2018-07-17 | Cyvek, Inc. | Microfluidic assay systems employing micro-particles and methods of manufacture |
US10065403B2 (en) | 2009-11-23 | 2018-09-04 | Cyvek, Inc. | Microfluidic assay assemblies and methods of manufacture |
CN106468760A (en) * | 2015-08-19 | 2017-03-01 | 创意电子股份有限公司 | Test unit and test device using same |
US10228367B2 (en) | 2015-12-01 | 2019-03-12 | ProteinSimple | Segmented multi-use automated assay cartridge |
CN111591177A (en) * | 2019-02-20 | 2020-08-28 | 李尔公司 | Electrical assembly |
CN111591177B (en) * | 2019-02-20 | 2023-02-28 | 李尔公司 | Electrical assembly |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20071019 Address after: Minnesota, United States Applicant after: Johnstech International Corporation Address before: Minnesota, United States Applicant before: Dennis B.Schell Co-applicant before: Matthew L.Gilk Co-applicant before: Jose E.Lopiz |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20071107 |