CN100555670C - Semi-conductor photodetector of inner reflector and preparation method thereof is arranged - Google Patents

Semi-conductor photodetector of inner reflector and preparation method thereof is arranged Download PDF

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CN100555670C
CN100555670C CNB038251531A CN03825153A CN100555670C CN 100555670 C CN100555670 C CN 100555670C CN B038251531 A CNB038251531 A CN B038251531A CN 03825153 A CN03825153 A CN 03825153A CN 100555670 C CN100555670 C CN 100555670C
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substrate
photoelectric detector
reflecting surface
input face
active region
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CN1768433A (en
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亨利·A·布劳维尔特
大卫·W·维尔努伊
李�浩
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Hoya Corp USA
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/035281—Shape of the body
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier
    • H01L31/105—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PIN type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier
    • H01L31/107—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier working in avalanche mode, e.g. avalanche photodiode
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
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Abstract

A kind of photoelectric detector comprises: the semiconductor chip of input face and reflecting surface is arranged, and they are formed on substrate upper surface.Reflecting surface and substrate surface form acute angle and are placed on such position, make transmission be internally reflected to substrate upper surface by the light beam that input face enters substrate from reflecting surface.The photoelectric detector active region is formed on substrate upper surface and is placed on such position, makes folded light beam incide the active region.Photoelectric detector can be installed on second substrate, receiving beam in the optical fiber of installing the planar waveguide that it can form from second substrate or the second substrate upper groove.

Description

Semi-conductor photodetector of inner reflector and preparation method thereof is arranged
Technical field
Field of the present invention relates to semi-conductor photodetector.Specifically, a kind of semi-conductor photodetector that comprises inner reflector is described herein.
Background technology
Figure 1A and 1B are illustrated in the common configuration that comprises planar waveguide 120 on the waveguide substrate 101.The photoelectric detector 110 of mounted on surface is placed on the waveguide substrate 101 (or directly, or on its alignment/support members), is used to detect the luminous power of propagating from waveguide 120 output faces.Fig. 1 C and 1D represent another kind of common configuration, and it comprises the optical fiber 150 of placing irradiates light photodetector 110 (are surface mounted to grooved substrate 151, shown in Fig. 1 C and 1D, or are fabricated directly on the grooved substrate) in the alignment slot 152.The reason of utilizing photoelectric detector under this environment is many-sided.For example, the luminous power of propagation by waveguide 120 or optical fiber 150 (for example can be included under the high data rate, be equal to or greater than 10Gbits/sec) the light long-range communication signal of modulation, and can utilize high speed optoelectronic detector 110 as receiver, light signal is transformed into electronic signal.In another example, propagate the part output that can comprise semiconductor laser or other light sources by the luminous power of waveguide 120 or optical fiber 150, it is to tell to be used to monitor purpose from main light output.Can be used for signal normalization from photodetector signal, as the feedback control signal of stabilized light source operation, and/or other purpose.In this type application, may require or not require the high speed optoelectronic detector.Can imagine many other environment, it may be useful wherein detecting the luminous power of propagating by waveguide or optical fiber.
Silicon is the planar waveguide substrate of using always, is typically one or more silica based planar waveguides (so-called planar waveguide circuit, or PLC) of making on configuration silica buffer layer and the silica buffer layer.This substrate can also easily dispose the groove of receiving optical fiber end.Common situation is (in a remote communication devices), and the luminous power wavelength of waveguide 120 or optical fiber 150 transmission is in being not suitable for 1.3 μ m to 1.5 μ m zones of silicon based opto-electronics detector.Be suitable for this wavelength zone based on the semi-conductive photoelectric detector of III-V family, but this material is incompatible with the photoelectric detector that directly is produced on silicon or the quartz surfaces.Even waveguide substrate and detector material are compatible, but still need provide semi-conductor photodetector to be used for assembling subsequently or other reason (inconsistent treatment step, design flexibility, the typing of waveguide and/or photoelectric detector etc.) as the element that separates.So separately the semi-conductor photodetector of making 110 (III-V family etc.) often is assembled on the substrate 101 or 151 (silicon etc.), and by aim at receive and detect propagate by waveguide 120 or optical fiber 150 to the small part luminous power.Content disclosed by the invention relates to suitable fabrication and/or adaptation of semiconductor 110, and it can and/or be convenient to this assembling.
On the substrate 101 or 151 that is installed to basic plane, advantageously photoelectric detector 110 is also made/is installed on the substrate on its basic plane.Detected light is propagated along being roughly parallel to these planar substrates.Yet each layer also is basically parallel to these substrates in the photoelectric detector active region that forms on substrate, and in many cases, it makes photoelectric detector go wrong to the absorption and the detection of light.Again direct light is to being parallel to the detection of being convenient to it outside this substrate plane.The photoelectric detector of realizing according to the disclosure of invention adopts the internal reflection from the photodetector substrate inclined plane, can direct light to its active region.
Summary of the invention
A kind of optical device includes first substrate surface and second substrate surface relative with first substrate surface.On the substrate of first substrate surface, form input face, and this input face shape is at an angle with it.On the substrate of first substrate surface, form reflecting surface, and this reflecting surface forms an acute angle with it.This reflecting surface is placed with respect to the plane of incidence, makes transmission be internally reflected to first substrate surface by the segment beam at least that input face enters substrate from reflecting surface.On first substrate surface, form the active region of photoelectric detector.The active region is in such position, makes to incide to the small part active region from the segment beam at least of reflecting surface reflection.The angle that the input face and first substrate surface form is between 60 ° to 120 °, and the angle that the reflecting surface and first substrate surface form is between 40 ° to 70 °.Be parallel to that first substrate surface is propagated and be refracted and leave first substrate surface by the incident beam that the input face transmission enters substrate.
A kind of method of making optical device comprises:
Form input face on the semiconductor chip of first substrate surface, the input face and the first substrate surface shape are at an angle;
Form reflecting surface on the substrate of first substrate surface, the reflecting surface and first substrate surface form acute angle, and place with respect to input face, make transmission be internally reflected to first substrate surface by the segment beam at least that input face enters substrate from reflecting surface; With
Form the photoelectric detector active region on first substrate surface, the active region is in such position, and feasible segment beam at least from the reflecting surface reflection incides the active region to small part;
Wherein the angle of each input face and first wafer surface formation is between 60 ° to 120 °;
Wherein the angle of each reflecting surface and first wafer surface formation is between 40 ° to 70 °; And
Be parallel to wherein that first substrate surface is propagated and incident beam that transmission enters substrate by input face is refracted and leaves first substrate surface.
A kind of optical device comprises:
Semiconductor chip;
The photoelectric detector active region that forms on the semiconductor chip;
Form refractive index on the semiconductor chip less than about 2.5 low-refraction optical medium, wherein inner reflector is placed on the photoelectric detector active region, makes the segment beam at least propagated in transmissive element be internally reflected to active region to small part from inner reflector.
Utilize wafer-scale spatial selectivity material processed technology, can make a large amount of photoelectric detectors of formation like this, it can be realized by only handling the single wafer surface.In case make and (if employing wafer-scale treatment technology, then with wafer on other photoelectric detectors separate), photoelectric detector can be inverted and be installed on the planar waveguide substrate, is used to receive the terminal light beam that penetrates of planar waveguide that forms from waveguide substrate.Can import by input face to the light beam of small part,, and incide the active region from the reflecting surface reflection.In this manner, photoelectric detector can easily be integrated into the complex optics device of forming on the planar waveguide substrate.Perhaps, photodetector substrate can dispose fiber-aligning grooves, maybe can be placed on second substrate of fiber-aligning grooves, makes the light that fiber end face penetrates from groove can import by input face, from the reflecting surface reflection, and incides the active region.
After the exemplary embodiments of representing in the reference accompanying drawing and following text description and/or claims, it is conspicuous that the purpose and the advantage of the semi-conductor photodetector of inner reflector are arranged.
Description of drawings
Figure 1A and 1B are the photoelectric detector schematic diagrames of installing on planar waveguide substrate.
Fig. 1 C and 1D are the photoelectric detector schematic diagrames of installing on the grooved substrate of optical fiber having.
Fig. 2 A and 2B are respectively photoelectric detector profile and the top views that inner reflector is arranged.
Fig. 3 A and 3B are respectively photoelectric detector profile and the top views that inner reflector is arranged.
Fig. 4 is the photoelectric detector end view that inner reflector is arranged.
Fig. 5 A and 5B are respectively end view and top view, and the process sequence of the photoelectric detector that is manufactured with inner reflector is described.
Fig. 6 A, 6B, 6C and 6D explanation are manufactured with the treatment step of the photoelectric detector of inner reflector.
Fig. 7 A and 7B are respectively photoelectric detector end view and the top views that inner reflector is arranged.
Fig. 8 explanation is equipped with the photoelectric detector of inner reflector on planar waveguide substrate.
Fig. 9 A and 9B are respectively photoelectric detector end view and the top views that inner reflector is arranged.
Figure 10 explanation is equipped with the photoelectric detector of inner reflector on planar waveguide substrate.
Figure 11 A and 11B are respectively photoelectric detector end view and the top views that inner reflector is arranged
Figure 12 explanation is equipped with the photoelectric detector of inner reflector on planar waveguide substrate.
Figure 13 explanation is equipped with the photoelectric detector of inner reflector on planar waveguide substrate.
Figure 14 explanation is having the photoelectric detector that inner reflector is installed on the grooved substrate of optical fiber.
Figure 15 explanation is equipped with the photoelectric detector of inner reflector on planar waveguide substrate.
Figure 16 explanation is having the photoelectric detector that inner reflector is installed on the grooved substrate of optical fiber.
Figure 17 is the photoelectric detector top view that inner reflector is arranged.
Figure 18 is the photoelectric detector top view that inner reflector is arranged.
Figure 19 is the photoelectric detector top view that inner reflector is arranged.
Should be noted that the relative scale of various structures shown in the accompanying drawing can be twisted in order more clearly to describe typical embodiment.Various optics, fiber waveguide, optical element, alignment/support members, the relative size between electrodes/contacts or the like and their relative horizontal and/or vertical ratios can be twisted.In many accompanying drawings, for clarity, the lateral dimension of optical element amplifies with respect to longitudinal size, thereby lateral dimension is exaggerated with the variation that lengthwise position takes place.The thickness of each layer also can be exaggerated.
Embodiment shown in the accompanying drawing is typical embodiment, should not be construed to restriction to the disclosure of invention and/or appended claims scope to them.
Embodiment
Fig. 2 A and 2B represent to have the exemplary photodetector of inner reflector.Semiconductor chip 302 is carried out the space selectively handle forming adjacent substrate upper surface area 301 and 303, they are at various height and are transfused to face 304 and separate.Selectively handle by the space, form reflecting surface 306 at substrate upper surface (frontier district 303).N type semiconductor layer 310 (that is, the n layer), intrinsic semiconductor layer 312 (that is i layer) and another n layer 314 are formed on substrate upper surface area 303.The typical material of making III-V family semiconductor detector is semi-insulated InP, that is, substrate 302 is n type InP, and n layer 310 and 314 is that n type InP and i layer 312 are InGaAs.Can mix top n floor selectively to produce p type district 316 (that is p layers) in the space.Perhaps, p type floor can be that initial (rather than n floor 314) and the space that exists is etched into p type district 316 (shown in Fig. 3 A and 3B) selectively.Formation p-i-n knot
Figure C0382515300091
310,312 and 316 have the function of photoelectric detector active region.Can add metal contact layer, for example, the contact 316a that forms on contact 310a that forms on n layer 310 expose portion and the p layer 316, thus the homonymy contact is provided for the p-i-n photoelectric detector.Perhaps, can adopt n type substrate, and contact 310 adds the opposition side of substrate 302 to.Incident optical power can enter substrate and propagate substrate 302 by part by input face 304, and can be internally reflected to photoelectric detector active region to small part from reflecting surface 306 to the incident optical power of small part, thereby produces the signal of telecommunication.
In the scope of the disclosure of invention and/or appended claims, can make
Figure C0382515300092
The photoelectric detector active region of what adequate types.These examples can include, but not limited to p
Figure C0382515300093
Photodiode (photoconduction or photovoltage), avalanche photodide, Schottky diode, photistor, metal-semiconductor-metal (MSM) photoelectric detector, their combination, and/or the suitable device of function.In the scope of the disclosure of invention and/or appended claims, can adopt any suitable semi-conducting material or combination of materials.These examples include, but not limited to silicon and/or silicon-based semiconductor; Germanium and/or Ge-based semiconductor; III-V family semiconductor and/or their alloy; Mix n and/or mix the variant of p; Their combination; And/or the suitable material of function.
The inclination angle that input face 304 forms can be within a large range, and it depends on the required optical arrangement of photoelectric detector.Angle [alpha] is in the scope between about 60 ° and about 120 ° in many useful optical arrangement, and the angle [alpha] that Typical Disposition adopts can be in the scope between about 85 ° and about 110 °.For along being roughly parallel to the light that adjacent substrate surface area 301 and 303 is propagated, between input face 304 and substrate upper surface area 301 and 303 about 85 ° of incidence angles to about 110 ° angles generations be from about 5 ° (the reflecting surface normal is lower than horizontal plane) by 0 ° (normal incidence) to about 20 ° (the reflecting surface normal is higher than horizontal plane).In the scope of the disclosure of invention and/or appended claims, can adopt other the incident direction of propagation.Can utilize dry-etching method (for example, active-ion-etch) to make input face, it can control the vertical angle and the horizontal alignment of final etching face.Can adopt other engraving methods of optional angle, perhaps,, can adopt along being etched with of crystal face in the material and realize required input face angle for given substrate material and crystal orientation.In order to form input face 304, can adopt saw cut or other mechanical material treatment technology.When making input face 304 no matter adopt what treatment technology, in some cases, do not have substrate upper surface area 301 in the photoelectric detector that processing subsequently can cause making, and in other cases, the photoelectric detector of making can comprise the substrate upper surface area 301 of part at least.By the cleavage substrate, can make input face 304 along high preferred orientation, it also makes does not have substrate surface area 301 in the photoelectric detector of making.
For airborne InP substrate (n ≈ 3.2) with along being roughly parallel to the incident beams that substrate surface area 301 and 303 is propagated, the input face orientation of described scope cause the scope at refraction angle be from be higher than horizontal plane about 2 ° by 0 ° to being lower than about 14 ° of horizontal plane.In subhorizontal refraction, deflecting light beams enters substrate more deeply, leaves adjacent substrate upper surface area 303 and leaves photoelectric detector active region (active region 318 of mark among Fig. 4).For the InP substrate of imbedding in typically transparent " perfusion " or the sealing medium (for example, n ≈ 1.4-1.5), the angular range that deflecting light beams forms be from be higher than horizontal plane about 2.3 ° to being lower than about 11 ° of horizontal plane.Can to be anti-reflective coating feed back to upstream optical devices or element (the InP/ air interface uncoated reflect 27% approximately reducing reflection loss and/or to reduce light input face 304; InP/ encapsulant interface uncoated reflects 14% approximately).The light that non-normal incidence also can reduce to reflect on the input face to input face 304 feeds back to upstream optical devices or element.If photoelectric detector is used in the optical system or device of multi-wavelength, then on input face, can form the wavelength selectivity filter coatings of any adequate types, for example long logical, short logical, band is logical, or notch filter.
Utilize the engraving method of spatial selectivity can make reflecting surface 306.Can adopt wet etch process to make reflecting surface 306, it is to form along the crystal face of substrate material.In InP (crystal face 100 is basically parallel to substrate surface), reflecting surface 306 and substrate surface form the angle (angle beta among Fig. 4) that (is about 55 ° usually) between about 51 ° and about 60 °, make the light beam that reflects (as mentioned above) and propagate in substrate on input face 304 can upwards be internally reflected to the photoelectric detector active region 318 of substrate surface.For other crystal orientation and/or other substrate material, reflecting surface 306 can form another angle along crystal face.Crystal face that utilize to determine reflecting surface 306 produces the repeatably reflecting surface of planar orientation and high optical quality.Perhaps, utilize any other suitable spatial selectivity engraving method, comprise dry-etching method, can make reflecting surface 306, it forms the reflecting surface of being determined angle by substrate crystalline structure, maybe can form the reflecting surface of any required angle.Can also utilize saw cut or other mechanical treatment technology to make reflecting surface 306.Angle between reflecting surface 306 and the substrate upper surface 303 is normally in the scope between about 40 ° and about 70 °, more typical is in the scope between about 45 ° and about 65 °, and in many common photoelectric detector embodiments, its scope can be between about 51 ° and about 60 °.
There is the photodiode size of inner reflector may be subjected to the constraint of various reality.Following typical sizes can be used for realizing the InP base photoelectric detector of inner reflector, but can not be construed to it the scope of the restriction disclosure of invention and/or claims.Main constraint is the minimum range (the size A among Fig. 4) between 318 edges, photoelectric detector active region and etching reflecting surface 306 edges.(leave InP and go up the distance of p-i-n photoelectric detector if etched edge is approached very much in the photoelectric detector active region approximately less than 5-7 μ m; This may be relevant with quality of materials and/or processing quality control), then the performance of photoelectric detector can be demoted, and this detector shows bad reliability and/or high dark current potentially.For the most of light beam that (leaves reflector edge 5-7 μ m at least) and arrive the photoelectric detector active region on this position, the top of light beam should be greater than photodiode substrate 302 in be reflected from reflecting surface 306 on the degree of depth of minimum-depth.This minimum-depth is also relevant with the angle of reflecting surface.For the InP of reflecting surface angle between about 51 ° and about 60 °, the top degree of depth of folded light beam is usually approximately greater than 5-7 μ m.In order to hold this distance and typical beam sizes/divergence (seeing following description), total etch depth of reflecting surface 306 (the size B among Fig. 4) in most of the cases should be typically between about 30 μ m and about 50 μ m approximately greater than 10 μ m.The size of incident beam and/or position may force this minimum etch depth to do more greatly.Yet this etch depth also has the actual upper limit.The thickness of InP photodetector substrate 302 approaches (perhaps being about 150 μ m or littler) usually.The etch depth of reflecting surface should not reach the part of this gross thickness too greatly, in order to avoid undue weakening substrate and potential component failure.Bigger etch depth also requires bigger photomask substrate area, thereby reduces the device density made on single base wafer.The etch depth of wet etching normally is subjected to the control of etchant concentration and etching period, though can adopt other technologies (seeing following description) with the control wet etching, dry ecthing, or other are used to form the degree of depth of reflecting surface 306 methods.
At input side, the etching of input face 304 should be enough dark, and it is below the height of photoelectric detector active region 318 (the size C among Fig. 4) at least, can hold the optical mode (comprising size and position) by input face 304 transmission.There is the optical mode of the planar waveguide support of relatively little and/or horizontal asymmetric core several microns only being arranged when waveguide is exported and correspondingly showing big luminous exitance.So this part divergent beams that enter input face 304 may be restricted, unless input face enough approaches Waveguide end face or enough big to hold the divergent beams away from Waveguide end face.Perhaps, the big and corresponding less optical mode of dispersing can penetrate from planar waveguide or optical fiber end; This bigger optical mode is no more than about 10 μ m usually on lateral extent.In this case, input face should be enough greatly to hold the little optical mode of the last variation of distance between Waveguide end face and the input face 304.The degree of depth of input face 304 may be subjected to the restriction (for example, if input face must be placed to towards the planar waveguide end, and the contact on the while photoelectric detector contacts with waveguide substrate) of used engraving method and/or planar waveguide substrate geometrical constraint.Form input face 304 minimum etch depth can be about 5 μ m (for example, be suitable for from the little optical mode of the waveguide ejaculation that approaches input face), and utilize the input face of etch depth between about 30 μ m and about 50 μ m, can make typical photoelectric detector.Light beam (in case photoelectric detector is installed on second substrate of planar waveguide or optical fiber) center by input face 304 transmission is normally on the input face between about 2.5 μ m below 318 height of active region and the about 50 μ m, and it is normally on the input face between about 10 μ m below the height of active region and the about 20 μ m.In the scope of the disclosure of invention and/or appended claims,, can adopt other etch depths and other positions of input face for transmitting beam on the input face.The top edge that should be noted that input face can overlap or not overlap with the active region height in making photoelectric detector, and it depends on and makes input face, the concrete spatial selectivity material processed technology that adopt reflecting surface and active region.
The angle of input face 304 (angle [alpha] among Fig. 4), angle (angle beta among Fig. 4) along distance (dimension D among Fig. 4) between the substrate upper surface between input face 304 top edges and reflecting surface 306 top edges and reflecting surface is determined the position that light beam reflects together on reflecting surface 306.The scope of exemplary photodetector input face 304 angle [alpha] is between about 95 ° and about 99 °, is about at reflecting surface angle β under 55 ° the situation, and the incidence angle on the reflecting surface is between about 29 ° and about 33 °.These incidence angles are that (air/InP interface is about 18 ° on the critical angle of total internal reflection; Sealant/InP interface is about 27 °), thus cause the change in depth of reflecting surface 306 to be about the 5%-10% of face-to-face distance.In order to realize the minimum-depth of 5-7 μ m (as discussed above) at least on reflecting surface, light beam can transmit by input face on more than or equal to the degree of depth of 5-7 μ m, or enough big face-to-face distance can adapt to the less input face degree of depth.The bigger input face degree of depth and/or bigger face-to-face distance cause the bigger reflecting surface degree of depth.The input face degree of depth has the upper limit (as described above), and the divergence of light beam, sensitivity/rate request to photoelectric detector, the dimension constraint of photoelectric detector, with any treatment limits (as discussed above) to reflecting surface 306 etch depths, make face-to-face distance have the upper limit (for example, approximately less than 250 μ m).The face-to-face distance of many exemplary photodetector can be between about 50 μ m and about 250 μ m; Yet the distance that exceeds this scope remains in the scope of the disclosure of invention and/or appended claims.
Under detection efficiency is important situation, may need less face-to-face distance.This situation is: light beam is to disperse; Incident optical signal power is little; Under high speed [being equal to or greater than 10Gbits/sec], just require photoelectric detector that less area is arranged, or the like.Less face-to-face distance causes the light beam of major part to incide the active region of photoelectric detector, thereby improves total detection efficiency of photoelectric detector.At detection efficiency is not (less divergent beams in the important use too, low-speed detection, bigger active region, big optical signal power etc.), can adopt bigger face-to-face distance, thereby relax fabrication tolerance potentially and/or improve device yield (for example, not needing photoelectric detector active region 318 so to approach etched reflecting surface 306).
Typical photoelectric detector can include the InP substrate of p-i-n active region, and its active region is about the wide and 24 μ m length of 15 μ m, wherein is about the gap of 12 μ m between active region and the reflecting surface edge.Reflecting surface angle (β) can be about 55 °, and distance is about 100 μ m face-to-face.The scope of input face angle (α) can be between about 95 ° and about 99 °, and the input face degree of depth (at active region height and transmission between the beam center by input face) is about 13.5 μ m and is about 15.5 μ m in the sealed photoelectric detector in the non-tight photoelectric detector.The respective reflective surfaces degree of depth (between the beam center of active region height and internal reflection) is about 18 μ m in the non-tight photoelectric detector, and is about 20 μ m in the sealed photoelectric detector.
Should be noted that perhaps various treatment steps or sequence can not produce the angle between clear or clear and definite edge or substrate upper surface and input face 304 or the reflecting surface 306.In some cases, the edge may be unintentional circle or curved shape, or burr or outstanding material can remain in the edge, and burr " bottom " can remain in the etching face substrate, and/or may residual time irregularity degree after handling.Under other situation, one or two surface may not meet the substrate upper surface of design.Angle is meant and realizes expecting angle (for example, the substantially flat part of smooth input face) between those part surfaces of geometry or the face between said herein each surface or the face, no matter in fact whether each surface and face satisfied.Similarly, said herein face-to-face distance is meant the measuring distance between each position, and wherein each surface or face are not having irregularity degree or removing after processing on the edge.
It should be noted that, for total detection efficiency that increases photoelectric detector and the relation that reduces face reflectivity and polarization, require experiences total internal reflection on reflecting surface 306, but angle subcritical angle, thereby cause the only relevant internal reflection of polarization of part, this remains in the disclosure of invention Or in the scope of appended claims.In absolute collection efficiency is under the unessential situation, and the photoelectric detector that inner reflector is arranged can only be the internal reflection on reflecting surface 306 tops.In addition, if the scope of incidence angle comprises critical angle, then in photoelectric detector, propagate and from the divergent beams of reflecting surface reflection only the part divergent beams stand total internal reflection.The height of part is dispersed input beam even can be directly incident on the photoelectric detector active region, and does not stand internal reflection.The reflectance coating of any adequate types can be formed on the reflecting surface 306 to strengthen the internal reflection under any required incidence angle, and its cost is the additional process steps of adding coating.The example of this reflectance coating comprises metal reflector coatings and multilayer dielectric reflector coatings.
Utilize following typical space selectivity treatment step sequence, can be manufactured with the photoelectric detector (end view among Fig. 5 A, the top view among Fig. 5 B) of inner reflector.Substrate 302 can comprise semi-insulated InP, and layer 310 and 314 can comprise n type InP, and layer 312 can comprise semi-insulating or lightly doped InGaAs layer.The masked diffusion that can adopt p type dopant is with formation p type district 316, and then formation metal contact layer 316a.Can remove protection contact 316a and p type district 316, in the time of the n type layer 314 of part and layer 312, can plated metal contact 310a to the expose portion of n type layer 310.Therefore, provide electricity to insert for p type layer 310 and n type layer 316, the insert layer 312 between these two layers forms p-i-n photoelectric detector active region.Can plated metal electricity wiring 310b and 316b, they respectively electricity be linked into contact 310a and 316a.Can adopt the input face 304 of dry ecthing to form required angle of mask, and the wet etching of employing mask is to form reflecting surface 306 (if formed, then each face can be protected contact and wiring) before etching input face and/or reflecting surface.Can finish all processing steps of making photoelectric detector and input face and reflecting surface on single surface of semiconductor chip, it does not need to handle two semiconductor surfaces, thereby reduces the complexity and the cost of processing procedure greatly.Typical processing sequence also produces the photoelectric detector of homonymy contact, and this is favourable in some cases.This processing sequence can realize on the wafer-scale substrate of many photodiodes simultaneously.In case finish treatment step, can be divided into wafer the device of independent layout and use.Can design and adopt many other combinations of materials, layer thickness and/or handle sequence be used to make the photoelectric detector active region of any adequate types, yet they all is in the scope of the disclosure of invention and/or appended claims.
In order repeatedly to realize the correct location of wet etching reflecting surface 306, must be noted that etching process does not have incision to be used for determining the mask at reflecting surface edge on the substrate surface.Only do not have under the situation of incision mask at etching process, reflecting surface ends at the precalculated position with high optical quality, arrives substrate surface basically always.Do not accord with substrate and the incision phenomenon takes place if mask is sticking well enough, then the position of reflecting surface termination is in close proximity to reflecting surface 306 and photodiode active region (size C and D among Fig. 4 are too little).This can damage the geometry of light path in the photodetector substrate, and reduces to arrive the incident light ratio of photoelectric detector active region.Inadequate distance can reduce the performance of photoelectric detector between photoelectric detector active region and reflecting surface 306 etched edge.At Fig. 2 A/2B, in the object lesson of 3A/3B and 5A/5B, the character that can utilize chosen material is to alleviate this potential processing problems.The original material of handling sequence can comprise usually: n mixes and/or p doping InP layer 310 and 314 and the InGaAs intrinsic layer 312 between them.These layers normally epitaxial growth and mutually between atom level contact (its interface is one or several single monolayer thick normally) closely.So the InGaAs layer can be used as the desirable mask material that wet etching is made reflecting surface 306.Can remove layer 310/314 and InGaAs layer 314 selectively corresponding to space on the substrate on reflecting surface 306 desired upper edge borders from the edge.When the InP substrate is during along the crystal face etching, the InGaAs layer is not subjected to etched the influence and the top edge of protection and inhibitory reflex face.Substrate, the object lesson of etchant and mask material are typical examples.Can considerably utilize and be suitable for sticking any mask of substrate material and any etchant of the required crystal face selection of displaying of according with.
If utilize along two crystal faces the etched spatial selectivity wet etching of selection is arranged, the size of then separating masked area can be used for determining the size (comprising the degree of depth) of wet etching.For example, in Fig. 6 A, rectangle region 620 is separated mask.Utilization has along two different crystal faces in the substrate 602 selects etched etchant (for example, to be added to the moisture HBr/H on InP (100) surface 3PO 4Along (111a) and (111b) crystal face etching selectively; Other etchant/crystal combination can be showed this double selection similarly).Fig. 6 B, 6C and 6D represent the result of double selection etching process.The tetrahedron cavity is etched into the substrate 602 that inclined plane 606a and 606b are arranged below substrate surface, so each inclined plane can be as the interior reflective surface of photoelectric detector.Surface 607a and 607b relatively tilt, and when meet in these two surfaces, etching process just stops (irrelevant with the continuation exposure of etchant).So the total etch depth of etching process and the exact position of reflecting surface and size are only determined by original size of separating masked area 620 and position, and this original size and position can accurately and accurately be determined.Substrate, the object lesson of etchant and mask material are typical examples.Can considerably utilize and be suitable for sticking any mask of substrate material and any etchant of the required crystal face selection of displaying of according with.
Input face 304 and/or reflecting surface 306 can be suitably crooked (along one dimension or two-dimensional directionals), are used to reduce the divergence of incident beam.The input face 304 (shown in Fig. 7 A) of cross curvature can be easily made, when forming,, protruding plane of refraction can be formed by suitably changing the etching process of spatial selectivity.For example, if utilize the mask etching process to make, then the appropriate change mask can make input face 304 that required cross curvature is arranged.Making input face 304 that longitudinal curvature be arranged is a more difficult making problem, yet can adopt such method, reduces incident beam divergence (shown in Fig. 7 B) vertically.Can produce required vertical curvature such as the photolithographic technology of GTG, make input face 304 that protruding plane of refraction be arranged.Can make reflecting surface 306 that suitable curved surface is arranged according to similar method, it forms the luminous exitance of recessed interior reflective surface to reduce to propagate from input face 304.(for example adopt suitable correlation space selectivity treatment step, change mask), can easily make reflecting surface 306 that cross curvature is arranged, but form the problem that vertical curvature may be difficulty (specifically, because reflecting surface 306 is recessed with respect to substrate surface).The etching process that utilization is confined to crystal face is not suitable for forming crooked reflecting surface 306.Utilize horizontal and/or the input face of buckling and/or the divergence that reflecting surface can reduce incident beam; Can increase the incident beam ratio that incides the photoelectric detector active region; Can use long face-to-face distance; Can use less, very fast and/or inefficient photoelectric detector; Can relax photoelectric detector and the fiber waveguide of incident beam or the alignment tolerance between the optical fiber are provided.
In case after on wafer, making photoelectric detector and separating with other photoelectric detectors, can be inverted inner reflector is installed photodiode (promptly, " flip-chip " is installed in the PLC waveguide, as the example among Fig. 8), its receives the light that the planar waveguide end is penetrated from the substrate.If desired, can provide such waveguide substrate 501, it has and holds the groove or the pit that may extend to any part in the following photoelectric detector of planar waveguide height.Planar waveguide 520 on the waveguide substrate 501 is suitable for propagating the light that passes through in its end with emission.When it when waveguide end is propagated, the light beam of ejaculation is dispersed according to the pattern size of waveguide support.The output of waveguide can be suitable for mode expansion to reduce the divergence of output beam.Light beam 513 can be along being basically parallel to the waveguide substrate propagation and entering photoelectric detector by input face 504.After the refraction, light beam is guided deeper to enter photodetector substrate 502 (being upwards, because photoelectric detector is inverted) again in Fig. 8 on input face 504.Internal reflection takes place in light beam on reflecting surface 506, and is directed into photoelectric detector active region 510.
Do not draw in the accompanying drawings and can be produced on alignment/support members on waveguide substrate 501 and/or the photodiode substrate 502, they help the correct photoelectric detector of placing on waveguide substrate 501, waveguide substrate 501 is aimed at (therefore, the light beam that penetrates from waveguide the photoelectric detector active region of illuminated portion) at least substantially with waveguide 520 ends.This support/alignment structures can comprise: groove, and flange, post, thin slice, otch, yoke, solder/metal surface tension etc. are used for the direct light photodetector and are placed into waveguide substrate.Waveguide substrate 501 can configured electrodes, and contact, and/or electric wiring are used to set up be electrically connected (the omitting in the accompanying drawings for clarity) with photoelectric detector.Contact may be incorporated in the support/alignment structures, maybe can comprise structure separately.Form and to cooperate the solder flux or the other materials that are electrically connected between the contact can also be to substrate on photoelectric detector upper contact and the waveguide substrate as the mechanical adhesion photoelectric detector.Perhaps, utilize suitable bonding can make the photoelectric detector mechanical adhesion to waveguide substrate.
The flush type medium of substantially transparent or sealant 1500 can roughly be filled the light path (Figure 15) between planar waveguide 520 ends and the photoelectric detector input face 504.The flush type medium of this substantially transparent can reduce from the planar waveguide end face with from the unnecessary reflection of photoelectric detector input face 504.The refractive index of flush type medium can approach in photoelectric detector and the planar waveguide one refractive index, or between between the two.Can utilize any suitable flush type medium or sealant (substantially transparent in required operating wavelength range), it reduces the reflection with respect to vacuum or surrounding air of Waveguide end face and photoelectric detector input face.Flush type medium 1500 can be added between Waveguide end face and the photoelectric detector input face in the space selectively, or can the sealed photoelectric detector and the adjacent end portion of planar waveguide, as shown in figure 15.Sealing interior reflective surface 506 can increase the critical angle of total internal reflection, if photoelectric detector needs total internal reflection, then increase critical angle can cause photoelectric detector angle square cun and linear dimension more among a small circle and/or tolerance, can also cause incident beam size and divergence more among a small circle and/or tolerance.
Figure 14 represents the exemplary photodetector according to disclosure of invention making, comprise: detector substrate 1402, input face 1404, interior reflective surface 1406, with the photoelectric detector active region 1418 (support/alignment structures omitted for clarity) of installing on the grooved substrate 1401.Groove 1452 is suitable for receiving optical fiber 1450.This typical composite class is similar to shown in Fig. 8, and wherein planar waveguide is replaced by optical fiber.The support/alignment structures (not shown) that suitable placement is arranged on the substrate 1401 makes the most of light beam 1413 that penetrates from optical fiber 1450 (being placed on the groove 1452) enter input face 1404, from reflecting surface 1406 reflections, and incides active region 1418.Substrate 1401 can comprise: hold the pit that photoelectric detector protrudes after installing downwards; Electric contact or wiring; And/or the support/alignment structures that photoelectric detector is installed on substrate.Light path between optical fiber 1450 ends and the photoelectric detector input face 1404 can be filled the flush type medium or the sealant 1600 (as described above) of substantially transparent, or sealant 1600 can sealed photoelectric detector and adjacent optical fiber end (Figure 16).(not shown) in another typical embodiment, groove is formed directly on the detector substrate 1402, and optical fiber is installed therein.The working method of this embodiment is similar to shown in Figure 14 and 16, but it does not use second substrate that is installed separately photoelectric detector and optical fiber.
Fig. 9 A and 9B represent to have another exemplary embodiments photoelectric detector of inner reflector, and photoelectric detector active region 918 and any required electric contact and/or wiring are wherein arranged on photodetector substrate 902.As mentioned above, photoelectric detector can be the on-chip p-i-n photoelectric detector of InP, or any other appropriate light photodetector that forms on the suitable substrate.Substrate 902 also disposes silica based, polymer, or other low refractive index dielectric flat boards 912, and it has the reflecting surface 914 of input face 913 and sloped-etch.The angle of making sloping reflector 914 is enough narrow, propagates into the light experiences total internal reflection that substrate 902 is propagated downwards from dull and stereotyped 912.Perhaps, can form reflectance coating (metal, medium etc.) on the sloping reflector 914, make light reflex to substrate downwards.Sloping reflector 914 is in such position, and the light beam of propagating in its guiding dull and stereotyped 912 arrives photoelectric detector 918 downwards.Reflector layer 916 (metal, multilayer dielectricity, or other suitable reflectors) in the middle of can having between substrate 902 and dull and stereotyped 912 can stop light to bleed to substrate 902 from layer 912 before arriving active region 918 substantially.The light beam that enters flat board 912 by input face 913 can propagate into reflecting surface 914, and reflexes to photoelectric detector 918.Figure 10 represents on the planar waveguide substrate 1001 to be inverted photoelectric detector among Fig. 9 A that installs and the 9B, is used to receive the light that penetrates from planar waveguide 1020 ends and guide this light to photoelectric detector 918 (support/alignment structures omitted for clarity).Input face 913 and/or reflecting surface 914 can be basic planes, or can be crooked along one dimension or two-dimensional directional, in order that reduce the divergence of incident beam.The photoelectric detector embodiment that installs among Figure 10 can comprise the flush type medium of substantially transparent between waveguide and photoelectric detector, or can seal according to the mode that is similar to Figure 15.Photoelectric detector embodiment among Fig. 9 A and the 9B also can be installed on the substrate of optical fiber, and its mode is similar to shown in Figure 14 or 16.
Figure 11 A and 11B represent to have another exemplary embodiments photoelectric detector of inner reflector.Photoelectric detector active region 1118 and any required electric contact and/or wiring are arranged on the photodetector substrate 1102.As mentioned above, photoelectric detector can be the on-chip p-i-n photoelectric detector of InP, or any other appropriate light photodetector that forms on the suitable substrate.Can make silica based, polymer, or other low-index waveguide 1112 (comprising any kind waveguide of sandwich layer/covering) are to waveguide substrate 1102, and the end face 1114 that configuration is tilted on photoelectric detector active region 1118.Can be manufactured with enough inclined end faces 1114 of narrow angle, the luminous power total internal reflection that it causes propagating by waveguide 1112 is to photoelectric detector active region 1118.Perhaps, can dispose reflectance coating (metal, medium etc.) on the reflecting surface 1114, its downward high efficiency reverberation is to substrate.
The importation 1116 of waveguide 1112 can be suitable for variety of way and receive the luminous power that photoelectric detector detects.Photoelectric detector shown in Figure 12 presentation graphs 11A and the 11B (comprising substrate 1102, photoelectric detector 1118 and waveguide 1112) is inverted and is installed to (support/alignment structures omitted for clarity) on the planar waveguide substrate 1201.In this example, the input 1116 of waveguide 1220 and waveguide 1112 is suitable for carrying out the end-transfer luminous power between them, and it requires enough accurate relative positioning and aims to realize that the acceptable luminous power of operation shifts.The output face of waveguide 1220, the input face of waveguide 1112, and/or reflecting surface 1114 can be tabular surface, or wherein one or more faces can be suitably crooked faces along one dimension or two-dimensional directional, are used to reduce the divergence of incident beam.Photoelectric detector shown in Figure 13 presentation graphs 11A and the 11B (comprising substrate 1102, photoelectric detector 1118 and waveguide 1112) is inverted and is installed to (support/alignment structures omitted for clarity) on the planar waveguide substrate 1301.In this example, the input 1116 of waveguide 1320 and waveguide 1112 is suitable for carrying out horizontal transfer luminous power (pattern is interfered coupling or basic adiabatic coupling) between them, it requires enough accurate relative positioning and aims to realize that the acceptable luminous power of operation shifts (normally, tolerance is looser with respect to end-transfer).Reflecting surface 1114 can be a tabular surface, or can be suitably crooked face along one dimension or two-dimensional directional, is used to reduce the divergence of incident beam.The photoelectric detector embodiment that installs among Figure 12 can comprise the flush type medium of substantially transparent between optical fiber and photoelectric detector, or can seal according to the mode that is similar to Figure 15.The photoelectric detector embodiment that installs among Figure 13 also can seal according to the mode that is similar to Figure 15.Photoelectric detector embodiment among Figure 11 A and the 11B can be installed on the substrate of optical fiber, and its mode is similar to shown in Figure 14 or 16.
In disclosed exemplary embodiments so far, the input face of photoelectric detector and reflecting surface along continuous straight runs are parallel to each other (as Fig. 2 B, 3B basically, 5B, 7B is shown in 9B and the 11B), light beam almost is that vertical incidence is passed through input face (as shown in figure 17) in the horizontal direction.Again being inducted into irradiating light beam mainly is at vertical direction (shown in Fig. 8 and Figure 14-16), transmission is by the point of input face, the point that reflects from reflecting surface, with the illuminated portion along continuous straight runs of photoelectric detector active region be basically mutual alinement (as shown in figure 17, its expression transmission is by the light beam 1701 of input face 1704, from reflecting surface 1706 reflections, and incide photoelectric detector active region 1710).In the device of Figure 17, be basically in identical vertical plane with respect to the nominal plane of incidence of input face and reflecting surface.In some cases, may require light beam being guided (shown in Figure 18 and 19) again along level and vertical direction after the internal reflection.In these devices, not parallel with respect to each plane of incidence of input face and reflecting surface, and be not vertical with respect to the plane of incidence of reflecting surface.This multi-direction light beam guides again and causes bigger incidence angle usually, because light beam incides the photoelectric detector active region, thereby increases the effective interaction length of passing through active region thickness.So, by increasing interaction length, can improve detection efficiency, because bigger incidence angle can use thin material layer (being easier to and/or cheap the manufacturing) to form the photoelectric detector active region.In addition, along level and vertical direction lead beam again can with respect to the different orientation location photoelectric detector of waveguide on the substrate to waveguide substrate (promptly, some beam steerings take place in photodetector substrate), thus can on less waveguide substrate area, arrange optics more thick and fast.
In the exemplary embodiments of Figure 18, input face 1804 is substantially parallel with reflecting surface 1806, wherein incident beam 1801 (along continuous straight runs) off-normal after input face 1804 is passed through in transmission.The refraction cause horizontal direction again lead beam also (along continuous straight runs) non-normal incidence to reflecting surface 1806.Photoelectric detector active region 1810 is on such position, in order that receive at least from the segment beam of reflecting surface 1806 reflections.When watching from above, transmission is by the point of input face 1804, do not have along linear array from the point of reflecting surface 1806 reflections and the part active region 1810 of folded light beam irradiation, and the incidence angle on the photoelectric detector active region is greater than the incidence angle among the horizontal aligument embodiment.In the exemplary embodiments of Figure 19, input face 1804 is uneven with reflecting surface 1806, and incident beam 1901 is vertical substantially (along continuous straight runs) after transmission is by input face 1904.Non-parallel arrangement input face 1904 and reflecting surface 1906 cause (along continuous straight runs) non-normal incidence to reflecting surface 1906.Photoelectric detector active region 1910 is on such position, in order that receive at least from the segment beam of reflecting surface 1906 reflections.When watching from above, transmission is by the point of input face 1904, do not have along common linear array from the point of reflecting surface 1906 reflections and the part active region 1910 of folded light beam irradiation, and the incidence angle on the photoelectric detector active region is greater than the incidence angle among the horizontal aligument embodiment.Utilize the non-normal incidence on the input face and the non-parallel arrangement of input face and reflecting surface, can realize other some embodiment.
In above text description and/or appended claims, term " fiber waveguide " (or considerably, " waveguide " or " transmission optical component ") expression herein is suitable for supporting the structure of one or more optical modes.This waveguide is limited to usually along two horizontal support optical modes when allowing longitudinally to propagate.Horizontal and vertical dimensions/directions is the local definition of curved waveguide.The example of fiber waveguide can include, but not limited to various types of optical fiber and various types of planar waveguides.Term " planar optical waveguide " (or considerably, " planar waveguide ") is illustrated in any fiber waveguide that forms on the basic planar substrates herein.Vertically (that is the direction of propagation) is to be basically parallel to substrate.What be basically parallel to substrate laterally is meant horizontal direction, and be basically perpendicular to substrate laterally be meant vertical direction.The example of this waveguide comprises: ridge waveguide, buried waveguide, semiconductor waveguide, other high index waveguide (" high index of refraction " is to be approximately higher than 2.5 refractive index), the silica based waveguide, polymer waveguide, other low-index waveguide (" low-refraction " is to be less than about 2.5 refractive index), sandwich layer/cladding type waveguide, mattress reflector (MLR) waveguide, metal-covering waveguide, air guiding waveguide, vacuum guiding waveguide, photonic crystal base or photon band gap based waveguides contain the waveguide of electric light (EO) and/or electric absorption (EA) material, contain the waveguide of nonlinear optics (NLO) material, and countless other examples that herein do not offer some clarification on, then, they all are in the scope of the disclosure of invention and/or claims.Can use many suitable substrate materials, comprising: semiconductor, crystal, quartz or silica based, other glass, pottery, metal, and countless other examples that herein do not offer some clarification on, then, they all are in the scope of the disclosure of invention and/or claims.
A kind ofly be applicable to that the Typical Planar type fiber waveguide of optical element disclosed herein is so-called PLC waveguide (a plane lightwave circuit).This waveguide typically comprises quartz or silica based waveguide (ridge waveguide or buried waveguide often; Also can adopt other waveguide arrangement that (quartz or silica based light resilient coating that insertion is often arranged) supported on the basic plane silicon chip).The combination of one or more this waveguides can be referred to as the planar waveguide circuit, light integrated circuit, or photoelectron integrated circuit.There is the PLC substrate of one or more PLC waveguides easily to be suitable for installing one or more light sources, laser, modulator, and/or other optics, it is fit to carry out with the PLC waveguide end-transfer of luminous power.There is the PLC substrate of one or more PLC waveguides (for example easily to be suitable for, according to U.S.Patent Application Pub.No.2003/0081902 and/or U.S.Appl.No.60/466,799) one or more light sources are installed, laser, modulator, photoelectric detector, and/or other optics, it is fit to carry out with the PLC waveguide horizontal transfer (pattern is interfered coupling, or basic adiabatic horizontal transfer, also is referred to as lateral) of luminous power.
In above text description and/or appended claims, " spatial selectivity material processed technology " comprising: extension, layer growth, offset printing, photoetching, hydatogenesis, sputter, vapor deposition, chemical vapour desposition, the beam deposition, beam assistant depositing, ion beam depositing, ion beam assisted depositing, plasma ion assisted deposition, wet etching, dry ecthing, ion(ic) etching (comprising active-ion-etch), ion beam milling erosion, laser engine processing, rotating and depositing, jet deposition, electrochemistry plating or deposition, electroless plating, photoetch, UV solidifies and/or is fine and close, utilize the micromachined of accurate sawtooth and/or other machine cuts/shaping tools, selective metallization and/or solder flux deposition are used for the chemico-mechanical polishing of complanation, the spatial selectivity material processed technology that any other is suitable, their combination, and/or the suitable technology of function.The step that particularly should be noted that any relating to " spatial selectivity formation " layer or structure can comprise: spatial selectivity deposition and/or growth, or basic deposition uniformly and/or growth (in the given area) spatial selectivity are afterwards removed.Any spatial selectivity deposition is removed, or other processes can be the described processes of writing direct, and maybe can be mask process.Should be noted that so-called " layer " can comprise basic material layer uniformly, maybe can comprise the non-homogeneous combination of one or more material sub-layers herein.Spatial selectivity material processed technology can realize on wafer-scale, processes/handle multiple structure on common base wafer simultaneously.
Should be noted that various element described herein, the unit, structure, and/or layer " being fixed to ", " being connected to ", " be installed to " " depositing to ", " being formed on ", " being placed on " on the substrate can be to contact with the direct of substrate material, or can with the contacting of existing one or more other layers on the substrate and/or other intermediate structures, so it is " to be fixed to " indirectly,, on " being placed on " substrate.Should also be noted that, such as " substrate upper surface ", " vertically ", " level ", " highly " the not absolute direction of representation space or position when being used for describing photodetector substrate such as word and expression, but expression is with respect to the direction or the position on semiconductor chip or processing of wafers surface." substrate upper surface " is meant processed substrate surface (or most of surface of handling takes place at least, be used to form each face and active region); " level " is meant the direction that is basically parallel to processed surface; " vertically ", " highly " etc. is meant the direction that is basically perpendicular to processed surface; Or the like.
The phrase " work can be accepted " of the various performance levels of photoelectric detector appears describing herein, for example, collection efficiency, detector responsivity, detection bandwidth, or the like.The work acceptable level can determine that they are performances by following relevant content, processing, device yield, assembling, test, validity, cost, supply, requirement, and/or around making, dispose, and/or utilize the applicable elements and/or the requirement of other factors such as Optical devices that photoelectric detector maybe can comprise.So this " work can be accepted " level of these parameters can change with applicable elements and/or requirement.For example, in some cases, lower collection efficiency may be obtain higher detection bandwidth accept trade off; And under other situation, although reduced detection bandwidth, the collection efficiency that may have relatively high expectations.Therefore, the collection efficiency of " work can be accepted " changes under different situations with detection bandwidth.Can imagine many other this compromise examples.In the tolerance of different accuracy, applicable elements and/or requirement that it depends on " work can be accepted " can realize semi-conductor photodetector, its manufacture method, and they merge to optics disclosed herein and/or the device in.Use herein such as " substantially transparent ", " substantially adiabatic ", " fundamental space pattern matching ", " substantially parallel ", phrases such as " basic vertical incidence " is in the notion of " work can be accepted " performance.
Though object lesson described herein adopts certain material and/or combination of materials and specific size and configuration is arranged, but it should be noted that, in size that in the disclosure of invention and/or claims scope, limits and/or the configuration, can adopt other suitable material and/or combination of materials.
Our idea is that the content suitable with method with disclosed exemplary embodiments is in the scope of the disclosure of invention and/or appended claims.Our idea is in the scope of the disclosure of invention and/or appended claims, can change the content suitable with method with disclosed exemplary embodiments.

Claims (19)

1. optical device comprises:
Semiconductor chip has first substrate surface and second substrate surface relative with first substrate surface;
Input face, be formed on the substrate of first substrate surface and with this first substrate surface shape at an angle;
Reflecting surface, be formed on the substrate of this first substrate surface and and form an acute angle with this first substrate surface, this reflecting surface is placed with respect to input face, makes to transmit the segment beam at least that enters substrate by input face, is internally reflected to first substrate surface from this reflecting surface; With
The photoelectric detector active region that forms on first substrate surface, active region are in such position, make to incide to the small part active region from the segment beam at least of reflecting surface reflection;
Wherein the angle of the input face and first substrate surface formation is between 60 ° to 120 °;
Wherein the angle of the reflecting surface and first substrate surface formation is between 40 ° to 70 °; And
Be parallel to wherein that first substrate surface is propagated and incident beam that transmission enters substrate by input face is refracted and leaves first substrate surface.
2. according to the equipment of claim 1, wherein the photoelectric detector active region comprises p-i-n photodiode or avalanche photodide.
3. according to the equipment of claim 1, wherein:
Angle between input face and substrate surface form 85 ° and 105 °; With
Angle between reflecting surface and substrate surface form 51 ° and 60 °.
4. according to the equipment of claim 1, wherein the edge is parallel to incident beam experiences total internal reflection on reflecting surface that substrate surface is propagated and transmission enters substrate by input face.
5. according to the equipment of claim 1, wherein photoelectric detector active region and the reflecting surface distance of separating on substrate surface is greater than 5 μ m.
6. according to the equipment of claim 1, wherein photoelectric detector active region and the reflecting surface distance of separating on substrate surface is greater than 50 μ m with less than 250 μ m.
7. according to the equipment of claim 1, also comprise: at least two electric contacts, they are formed on the substrate surface and are connected to the photoelectric detector active region.
8. according to the equipment of claim 1, wherein at least one face is crooked in input face or the reflecting surface.
9. according to the equipment of claim 1, also comprise: the transmission optical component of placing on second substrate, wherein semiconductor chip is installed on second substrate, its substrate surface is towards second substrate, make the transmission of penetrating from the transmission optical component end face of segment beam at least enter substrate by input face, internal reflection takes place on reflecting surface, and incides the photoelectric detector active region of part at least.
10. according to the equipment of claim 9, wherein transmission optical component is the optical fiber of installing in the planar waveguide that forms on second substrate or the second substrate upper groove.
11. according to the equipment of claim 9, wherein the center of light beam is at 2.5 μ m below the height of photoelectric detector active region and below the height of photoelectric detector active region on the input face between the 50 μ m.
12. equipment according to claim 1, also comprise: the optical fiber of installing on the substrate in groove that forms on the substrate and the groove, make the transmission of penetrating from fiber end face of segment beam at least enter substrate by input face, internal reflection takes place on reflecting surface, and incides the photoelectric detector active region of part at least.
13. a method of making any one described optical device in the claim 1 to 12 comprises:
Form input face on the semiconductor chip of first substrate surface, the input face and the first substrate surface shape are at an angle;
Form reflecting surface on the substrate of first substrate surface, the reflecting surface and first substrate surface form acute angle, and place with respect to input face, make transmission be internally reflected to first substrate surface by the segment beam at least that input face enters substrate from reflecting surface; With
Form the photoelectric detector active region on first substrate surface, the active region is in such position, and feasible segment beam at least from the reflecting surface reflection incides the active region to small part;
Wherein the angle of each input face and first wafer surface formation is between 60 ° to 120 °;
Wherein the angle of each reflecting surface and first wafer surface formation is between 40 ° to 70 °; And
Be parallel to wherein that first substrate surface is propagated and incident beam that transmission enters substrate by input face is refracted and leaves first substrate surface.
14. the method according to claim 13 also comprises:
On the first surface of common semiconductor substrate wafer, form many input face and reflectings surface to correspondence, each input face and wafer surface shape are at an angle, each reflecting surface and first wafer surface form acute angle, each reflecting surface is to place like this, makes transmission be internally reflected to first wafer surface by the segment beam at least that corresponding input face enters base wafer from reflecting surface;
Input face and reflecting surface for every pair of correspondence, on first wafer surface, form corresponding photoelectric detector active region, each active region is on the position with respect to corresponding input face and reflecting surface, and feasible segment beam at least from corresponding reflecting surface reflection incides the active region to small part; With
Semiconductor wafer is divided into a plurality of photodetector substrate, and each photodetector substrate has the input face of one group of correspondence at least, reflecting surface and photoelectric detector active region.
15. an optical device comprises:
Semiconductor chip;
The photoelectric detector active region that forms on the semiconductor chip;
What form on the semiconductor chip has a low-refraction optical medium less than 2.5 refractive index, and wherein inner reflector is placed on the photoelectric detector active region, makes the segment beam at least propagated in transmissive element be internally reflected to active region to small part from inner reflector.
16. according to the equipment of claim 15, wherein the low-refraction optical medium comprises: transparent dielectric piece, or comprise: the planar waveguide that forms on the semiconductor chip.
17. equipment according to claim 16, also comprise: the transmission optical component of placing on second substrate, wherein semiconductor chip is installed on second substrate, make to propagate and to enter the low-refraction optical medium to the small part luminous power by transmission optical component on second substrate, by the inner reflector internal reflection, and incide the photoelectric detector active region of part at least.
18. according to the equipment of claim 17, wherein transmission optical component comprises: the planar waveguide that forms on second substrate, or the optical fiber of installing in the second substrate upper groove.
19. according to the equipment of claim 15, light beam experiences total internal reflection on reflecting surface wherein, or wherein comprise reflectance coating on the reflecting surface.
CNB038251531A 2002-10-10 2003-09-12 Semi-conductor photodetector of inner reflector and preparation method thereof is arranged Expired - Fee Related CN100555670C (en)

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