CN100550180C - Semiconductor storage and use its USB storage device - Google Patents
Semiconductor storage and use its USB storage device Download PDFInfo
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- CN100550180C CN100550180C CNB2006101541931A CN200610154193A CN100550180C CN 100550180 C CN100550180 C CN 100550180C CN B2006101541931 A CNB2006101541931 A CN B2006101541931A CN 200610154193 A CN200610154193 A CN 200610154193A CN 100550180 C CN100550180 C CN 100550180C
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Abstract
The 1st interarea at circuit substrate is formed with the USB terminal, and it has the conductor layer of the input and output terminal that becomes USB connector.Forming on the 2nd interarea of face opposition side with terminal of circuit substrate memory component is installed, this memory component is utilized sealing resin and is sealing.The zone except that the formation zone of USB terminal at circuit substrate is equipped with electronic unit.Thus, formation is as the semiconductor storage of USB storage main body.By the USB storage main body is accommodated in the USB connector housing, constitute USB storage.
Description
Cross reference to related application
The application is willing to 2006-029220 number right of priority and it is advocated right of priority so that the Japanese publication of special hope of the Japanese publication of submitting on September 16th, 2005 2005-270991 number and submission on February 7th, 2006 is special, and the full content of these former patented claims is contained in this as a reference.
Technical field
The present invention relates to a kind of semiconductor storage and use its USB storage device.
Background technology
With flash memory and USB (USB (universal serial bus): the incorporate USB storage of connector Universal Serial Bus), have with the writing property of the connectivity of various device, information, portability etc. good, and the also very large feature of memory capacity self.Based on these characteristics, USB storage as PC (personal computer: Personal Computer) and peripheral equipment, portable communication device, audio player, HDD (hard drive: Hard Disk Drive) register and DVD (digital video disk: the storage medium of register etc. Digital Video Disk), popularize rapidly.General USB storage has the structure that USB connector parts and the circuit substrate that flash memory has been installed are linked into an integrated entity.
The USB connector parts have in the metal shell (USB connector housing) that inserts USB port, and the configuration using resin plate keeps the structure as the parts of the metal terminal of input and output terminal.On the other hand, at the circuit substrate upper surface IC packaging body, capacitor, resistance, the quartz vibrator electronic units such as (oscillators) that comprises memory component, controller component etc. is installed.These electronic units are connected and incorporate USB storage, can't miniaturization become smaller or equal to the substrate size that each parts have been installed and add size after the size of USB connector parts.Particularly because the IC packaging body is bigger than miscellaneous part, its size hinders the miniaturization of circuit substrate, and then hinders the miniaturization of USB storage.
USB storage is inserted in the USB port of PC and peripheral equipment thereof etc. and uses.Therefore, if USB storage self is bigger, then when unwanted direction had only applied small power, connecting portion etc. were also damaged easily.Therefore, study and make the further miniaturization of USB storage.For example, open the USB storage of putting down in writing in the 2003-331249 communique,, and at the terminal of circuit substrate face is set memory component, controller component etc. are installed at a distolateral input and output terminal that USB connector is set of circuit substrate the Jap.P. spy.But, memory component, controller component etc. are installed as the IC packaging body herein, adopted the structure identical with storage card.Therefore, identical with in the past USB, fully miniaturization.
The USB storage of in No. 2004/0153595 communique of U.S. Patent Publication, putting down in writing, the upper surface side of the circuit substrate in being disposed at the USB connector housing disposes the input and output terminal of USB connector, has the semiconductor devices of memory component, controller component etc. in the lower face side configuration of circuit substrate., memory component is installed on substrate, controller component waits and makes multi-chip encapsulation body herein, and it is installed in the lower face side of the circuit substrate that is provided with input and output terminal.The multi-chip encapsulation body that comprises memory component, controller component etc. can not be avoided the maximization of himself thickness, size etc.Therefore, in order to be installed on the circuit substrate that is disposed in the USB connector housing, the big young pathbreaker of multi-chip encapsulation body self becomes obstacle.
Summary of the invention
The objective of the invention is to, a kind of semiconductor storage of the miniaturization that can realize USB storage is provided and uses its USB storage device.
A semiconductor storage that mode relates to of the present invention is characterized in that having: circuit substrate, its have the 1st interarea and with the 2nd interarea of described the 1st interarea opposition side; The USB terminal, it is formed on described the 1st interarea of described circuit substrate, has the conductor layer of the input and output terminal that becomes USB connector; Memory component, it is installed on described the 2nd interarea of described circuit substrate; Sealing resin, it is located on described the 2nd interarea of described circuit substrate, to seal described memory component; And electronic unit, it is installed on the zone except that the formation zone of described USB terminal of described circuit substrate.
The USB storage device that other modes of the present invention relate to, it is characterized in that, have semiconductor storage and take in the USB connector housing of at least a portion of described semiconductor storage, described semiconductor storage has: circuit substrate, its have the 1st interarea and with the 2nd interarea of described the 1st interarea opposition side; The USB terminal, it is formed on described the 1st interarea of described circuit substrate, has the conductor layer of the input and output terminal that becomes USB connector; Memory component, it is installed on described the 2nd interarea of described circuit substrate; Sealing resin, it is located on described the 2nd interarea of described circuit substrate, to seal described memory component; And electronic unit, it is installed on the zone except that the formation zone of described USB terminal of described circuit substrate.
Description of drawings
Fig. 1 is the sectional view of structure of the USB storage device of expression the 1st embodiment of the present invention.
Fig. 2 is a stereographic map of the structure partial of the USB storage device of the 1st embodiment of the present invention being cut open expression.
Fig. 3 is the sectional view of a variation of expression USB storage device main body part shown in Figure 1.
Fig. 4 is the sectional view of other variation of expression USB storage device main body part shown in Figure 1.
Fig. 5 is the sectional view of other other variation of expression USB storage device main body part shown in Figure 1.
Fig. 6 is the sectional view of structure of the USB storage device of expression the 2nd embodiment of the present invention.
Fig. 7 is the sectional view of other structures of the USB storage device of expression the 2nd embodiment of the present invention.
Fig. 8 is the sectional view of a variation of expression USB storage device shown in Figure 6.
Fig. 9 is the sectional view of other variation of expression USB storage device shown in Figure 6.
Figure 10 is the sectional view of other other structures of the USB storage device of expression the 2nd embodiment of the present invention.
Figure 11 is the sectional view along the Width of USB storage device shown in Figure 10.
Figure 12 is the vertical view of structure of the USB storage device of expression the 3rd embodiment of the present invention.
Figure 13 is the side view of USB storage device shown in Figure 12.
Figure 14 is the sectional view along the Width of USB storage device shown in Figure 12.
Figure 15 is the side view of other structures of the USB storage device of expression the 3rd embodiment of the present invention.
Figure 16 is the sectional view of USB storage device shown in Figure 15.
Figure 17 is the stereographic map of structure of the USB storage device of expression the 4th embodiment of the present invention.
Figure 18 is the sectional view of USB storage device shown in Figure 17.
Figure 19 A and Figure 19 B are the structure of variation of expression USB storage device shown in Figure 17 and the sectional view of manufacturing process thereof.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.In addition, below narrate embodiments of the present invention with reference to the accompanying drawings, but these accompanying drawings provide based on graphic purpose just, the present invention is not limited to these accompanying drawings.
Fig. 1 and Fig. 2 are the figure of structure of the USB storage device of expression the 1st embodiment of the present invention, and Fig. 1 is along the sectional view of the length direction of USB storage device (longitudinal diagram), and Fig. 2 is the stereographic map that the partial cut of USB storage device is represented.These USB storage 1 shown in the drawings have the circuit substrate 2 that the double as terminal forms the installation base plate of substrate and memory component etc.Circuit substrate 2 has the width that can insert in the USB connector housing 3 that is described in detail later.In other words, the width of circuit substrate 2 is set according to the size of USB connector housing 3.
Be formed with the conductor layer 4 of the input and output terminal that becomes USB connector at the 1st interarea 2a of circuit substrate 2.That is, in the USB storage 1 of this embodiment, on the 1st interarea 2a of circuit substrate 2, form conductor layer 4, the USB terminal 5 that constitutes USB connector is set based on the USB specification by utilizing electrochemical plating etc.The conductor layer 4 that constitutes USB terminal 5 is electrically connected with the cloth gauze of circuit substrate 2.
On the 2nd interarea (back side) 2b of the opposition side of the 1st interarea of the circuit substrate 2 that is provided with this USB terminal 5 (terminal forms face/surface) 2a, memory components 6 such as NAND formula flash memory are installed.Memory component 6 is installed on the 2nd interarea 2b of circuit substrate 2 by non-packed.That is, memory component 6 for example is bonded on the 2nd interarea 2b of circuit substrate 2 by film like insulativity bonding agent 7 under the non-packed state.
In addition, memory component 6 is electrically connected with the connection pads (not shown) of circuit substrate 2 by closing line 8.The state of 1 memory component 6 has been installed in expression in Fig. 1 and Fig. 2, but also can stacked a plurality of memory components 6 and be installed on the 2nd interarea 2b of circuit substrate 2.Be installed in the quantity of the memory component 6 on the circuit substrate 2, suitably set according to the setting capacity of the memory capacity of each element, USB storage 1 etc. etc.On memory component 6 for example by film like insulativity bonding agent 10 bonding controller component 9.
On the 1st interarea 2a of circuit substrate 2, electronic units such as capacitor, resistance 12 and BGA formula electronic unit 13 etc. in the substrate regions mounted on surface except that the formation zone of USB terminal 5 and constitute USB storage 1 needed electronic unit.A part of example of these electronic units 12,13 as shown in Figure 4 and Figure 5, the installed surface that can be installed in memory component 6 is the 2nd an interarea 2b side of circuit substrate 2. Electronic unit 12,13 is installed at least one side in the zone except that the element installation region of the zone except that terminal forms the zone of the 1st interarea 2a and the 2nd interarea 2b. Electronic unit 12,13 also can be installed in these regional either party.
On the 2nd interarea 2b of the circuit substrate 2 that memory component 6, controller component 9 etc. are installed, the mold formed sealing resin 14 that epoxy resin etc. is arranged.That is, memory component 6, controller component 9 etc. and a part that is installed in the electronic unit 12,13 of the 2nd interarea 2b side are utilized resin-sealed 14 sealings.Like this, utilize resin-sealed 14 will be directly installed on memory component 6 on the 2nd interarea 2b of circuit substrate 2, controller component 9 etc. and be sealed to one, thereby form the semiconductor package body of having used the circuit substrate 2 that is formed with USB terminal 5.Thus, formation is as the semiconductor storage of USB storage main body 15.
As mentioned above, terminal at the circuit substrate 2 that is formed with USB terminal 5 forms on the opposite side surfaces (the 2nd interarea 2b) of face (the 1st interarea 2a), memory component 6, controller component 9 etc. directly are installed, thereby can be significantly dwindled the size of circuit substrate 2 and USB storage main body (semiconductor storage) 15.In addition, also can cut down number of components.In addition, make shape sealing resin 14, and seal each element 6,9 formation packaging bodies, thereby realize the miniaturization and the high reliabilityization of USB storage main body 15 simultaneously at the 2nd interarea 2b side form of circuit substrate 2.
USB storage main body 15 is inserted in the USB connector housing 3, thereby constitutes USB storage 1.USB connector housing 3 has width W and the height H based on the connector specification of USB.These sizes are identical with the connector shell of in the past USB connector parts.In other words, in USB storage in the past, outside the USB connector parts, the circuit substrate of the IC packaging body that comprises memory component, controller component etc. need be installed, and the size of 1 utilization of the USB storage of this embodiment USB connector parts in the past can constitute whole device.
When being accommodated in circuit substrate 2 in the USB connector housing 3, the USB terminal 5 that is formed at the 1st interarea 2a of circuit substrate 2 is adjusted to such an extent that make it highly become the USB connector height.Specifically, to have the height h that can guarantee USB terminal 5 be the thickness of USB connector height to sealing resin 14.Like this, on the basis of the thickness of having considered circuit substrate 2,, can give the function of USB terminal 5 as USB connector by regulating the thickness of sealing resin 14.
The USB storage 1 of this embodiment is accommodated in USB connector main body 15 in the USB connector housing 3, constitutes whole device with the size of this USB connector housing 3.Therefore, according to USB storage 1, compare USB connector in the past, significantly miniaturization.The miniaturization of USB storage 1 not only improves and the connection reliability of the USB port of equipment side, portability etc., for example also helps to reduce the manufacturing cost of miniaturization based on circuit substrate 2 etc.That is,, can provide and realize miniaturization and low cost according to this embodiment, and good USB storage 1 such as practicality, convenience, reliability.
The USB storage 1 of the 1st embodiment has USB storage main body (semiconductor storage) the 15 all or part of structures that are accommodated in the USB connector housing 3.Herein, if only USB storage main body 15 is inserted in the USB connector housing 3 simply, USB storage main body 15 might before and after or move up and down.USB storage main body 15 also can utilize bonding agent etc. to be fixed on the USB connector housing 3, but illustrates with reference to Fig. 6～Figure 11 and to be suitable for the USB storage 1 that more simply prevents travel mechanism.
Fig. 6 is the longitudinal diagram of structure of the USB storage 1 of expression the 2nd embodiment of the present invention.USB storage main body 15 is inserted formation USB storage 1 in the USB connector housing 3, and this point is identical with the 1st embodiment, and its concrete structure as previously described.In addition, in Fig. 6, omitted the diagram of memory component 6, controller component 9 etc., but on the 2nd interarea 2b of circuit substrate 2 in the mold formed sealing resin 14, identical with Fig. 1～Fig. 5, dispose memory component 6, controller component 9 etc., reach a part that disposes electronic unit 12,13 as required.That is, 14 expressions of the symbol among Fig. 6 have the SiP (System inPackage) of memory component 6, controller component 9 etc.Fig. 7～Figure 19 is also identical.
In USB storage shown in Figure 61, the part of the upper surface of USB connector housing 3 (with the relative face of the 1st interarea 2a of circuit substrate 2) is become " コ " shape by otch.With the 1st interarea 2a side of this notch bending, thereby form projection 16 to circuit substrate 2.The length towards the below of projection 16 is set to the height of electronic unit 12 and overlaps.And, with USB storage main body 15 when end (front ends) side with USB terminal 5 is inserted USB connector housing 3, make the side of the projection 16 contact electronic units 12 of USB connector housing 3.Thus, can prevent that USB storage main body 15 from forwards moving.
In addition, making the parts of projection 16 butts of USB connector housing 3 be not limited to the electronic unit 12 of actual act, also can be virtual electronic unit.By making the virtual electronic unit of projection 16 butts, can improve the reliability of USB storage 1.About the rear side of USB storage main body 15, as shown in Figure 7, case member 17 is installed in the rear side end of USB connector housing 3.Thus, can prevent USB storage main body 15 rearward with the moving of above-below direction.
In each above-mentioned embodiment, illustrated and used and whole to take in the USB connector housing 3 of USB storage main body 15, but USB connector housing 3 is not limited thereto.For example shown in Figure 8, USB connector housing 3 also can only be taken in the part of USB storage main body 15.As long as USB connector housing 3 is the part of taking in USB terminal 5 at least.When USB connector housing 3 exposed, this exposed portions serve can kept by molded resin, perhaps is accommodated in the external shell in the part of USB storage main body 15.
Fig. 6 and Fig. 7 represent the projection 16 with the about 90 ° of formation of the notch portion of USB connector housing 3 relative below bending.But the shape of projection 16 is not limited thereto.For example shown in Figure 9, also can be made as acute angle to the bending angle of the notch portion of USB connector housing 3, it is outstanding that projection 16 is tilted.Intensity during this projection 16 butt electronic units 12 is good, comes off because of projection 16 breakages etc. so can prevent USB storage main body 15 more reliably.
As preventing USB storage main body 15, for example can be suitable for Figure 10 and mechanism shown in Figure 11 in the mechanism that above-below direction moves.In Figure 10 and USB storage 1 shown in Figure 11, the part of the two sides of USB connector housing 3 is become " コ " shape by otch.These notchs are after inserting USB connector housing 3 with USB storage main body 15, by the 1st interarea 2a side of bending to circuit substrate 2.Contact and push circuit substrate 2 by the projection 18 that the notch bending is formed with the 1st interarea 2a.Utilize this projection 18, also can prevent USB storage main body 15 up and down direction move.
Below, the USB storage of the 3rd embodiment of the present invention is described with reference to Figure 12～Figure 16., in the above-described 2nd embodiment, make the projection 16 butt electronic units 12 of USB connector housing 3 herein, suppress USB storage main body 15 moving of side forwards.During this situation,, might produce infringement to electronic unit 12 based on the pressing force of projection 16.In addition, make projection 16 excessively not push electronic unit 12 if consider tolerance, then USB storage main body 15 might produce loosening.In addition, when making projection 16 butt virtual components, the needed cost of virtual component becomes the reason that manufacturing cost increases.
Therefore, in the USB storage 1 of the 3rd embodiment, with a part and the pad soldering of being located at the 1st interarea 2a of circuit substrate 2 of USB connector housing 3.Figure 12～shown in Figure 14 for example is provided with the weld zone of can soldering installing 19 in the rear side end of the 1st interarea 2a of circuit substrate 2.On the other hand, USB connector housing 3 has the claw 20 that the rear side otch is formed corresponding to the position of weld zone 19.
The claw 20 of USB connector housing 3 is arrived weld zone 19 sides by bending after USB storage main body 15 is inserted USB connector housing 3.Had projection 18 identical functions with the 2nd embodiment by the claw 20 of bending 19 sides to the weld zone.Claw of USB connector housing 3 (projection) 20 and weld zone 19 solderings.Like this, circuit substrate 2 is by weld zone 19 and 3 solderings of USB connector housing.By with circuit substrate 2 solderings on USB connector housing 3, can prevent USB storage main body 15 forwards, backwards direction move.In addition, also can prevent USB storage main body 15 up and down direction move.
At this moment, weld zone 19 can form the ground-electrode of USB storage main body 15.That is, connect weld zone 19, can be considered as metallic USB connector housing 3 part of ground connection wiring by ground connection wiring with USB storage main body 15.Thus, when preventing that USB storage main body 15 from moving, can realize simplification of connecting up etc.In addition, by USB connector housing 3 is made as earthing potential, the static in the time of can suppressing memory component, controller component etc. because of the use operation etc. are damaged.
By the circuit substrate 2 of soldering on USB connector housing 3, can guarantee the height of USB terminal 5 and for example not rely on the thickness of sealing resin 14.That is,, make the thickness attenuation of sealing resin 14, then can not guarantee necessary terminal height if consider the reduction of material cost, effective utilization of existing molding die etc.To this, by the claw 20 of USB connector housing 3 is set in the position that can guarantee the terminal height, do not rely on the thickness of sealing resin 14, can be the height control of USB terminal 5 the USB connector height.Thus, can reduce the manufacturing cost of USB storage 1.
The position of the claw 20 of USB connector housing 3 such as Figure 15 and shown in Figure 16 can be located near the central authorities of USB connector housing 3.Like this, be located near the claw 20 support circuit substrates 2 the central authorities of USB connector housing 3 by utilization, the support strength of circuit substrate 2 improves.Therefore, under situation, also can improve the reliability of the supporting construction of circuit substrate 2 with the state support circuit substrate 2 that floats from USB connector housing 3.This structure is very effective when utilizing by the height of the 2 adjustment USB terminals 5 of the circuit substrate on the claw 20 of soldering at USB connector housing 3.
Below, the USB storage of the 4th embodiment of the present invention is described with reference to Figure 17～Figure 19.Herein, in the above-described 3rd embodiment, with the claw 20 and weld zone 19 solderings that are located on the circuit substrate 2 of USB connector housing 3.The claw 20 (notch) 20 of USB connector housing 3 is not limited to be bonded on the weld zone 19, also can soldering on the electronic unit 12 of the 1st interarea 2a that is installed on circuit substrate 2.Thus, can prevent that also direction and above-below direction move USB storage main body 15 forwards, backwards.At least one side's soldering of claw 20 and weld zone 19 and electronic unit 12.
In Figure 17 and USB storage 1 shown in Figure 180, the part of the upper surface of USB connector housing 3 is become " コ " shape by otch, by this notch bending is formed claw 20a, 20b to the 1st interarea 2a side of circuit substrate 2.On the other hand, be provided with the weld zone (ground-electrode pad) 19 that is connected with the ground connection wiring of USB storage main body 15 at the 1st interarea 2a of circuit substrate 2.On weld zone 19, be pre-formed solder fillet 21.The solder fillet 21 that engages usefulness is provided simultaneously with the solder fillet 22 that is used to install electronic unit 12.
And the claw 20a of USB connector housing 3 engages with the weld zone 19 with ground-electrode function by solder fillet 21.In addition, the solder fillet 22 of another claw 20b by usefulness is installed engages with electronic unit 12 on the 1st interarea 2a that is installed in circuit substrate 2.Claw 20a, the 20b of USB connector housing 3 engages with weld zone 19 and electronic unit 12 both sides on the 1st interarea 2a that is located at circuit substrate 2.Thus, can prevent USB storage main body 15 forwards, backwards direction and above-below direction move, and make the effect of USB connector housing 3 performance ground connection wirings.
The claw 20 of USB connector housing 3 also can engage with the electrode 23 of electronic unit 12 shown in Figure 19 A and Figure 19 B.That is, shown in Figure 19 A, the 1st interarea 2a soldering of side's electrode 23a and circuit substrate 2 is also installed with 12 of claw 20b electronic component bonded.On the opposing party's electrode 23b of electronic unit 12, only form solder fillet 24.That is, electronic unit 12 is installed with erectility, and to make electrode 23b be the top.On weld zone 19, also form solder fillet 2L
Shown in Figure 19 B, this USB storage main body (semiconductor storage) 15 is inserted USB connector housing 3.The 1st claw 20a engages with weld zone 19 by solder fillet 21.The 2nd claw 20b is connected with the electrode 23b of electronic unit 12 by solder fillet 24.Two ends have the electronic unit 12 of electrode 23a, 23b, have only side's electrode 23a connecting circuit substrate 2, and the opposing party's electrode 23b is connected with the USB connector housing 3 that plays ground connection wiring effect.
By being suitable for the installation and the type of attachment of above-mentioned electronic unit 12, with need not be at the installation pad (connection pads) of the electrode 23b of electronic unit 12, so can reduce the parts installation region of circuit substrate 2.In addition, identical with Figure 17 and USB storage 1 shown in Figure 180, can obtain to prevent the effect that USB storage main body 15 moves and the stiffening effect of ground connection wiring.Therefore, the effect that USB storage main body 15 moves and the stiffening effect of ground connection wiring can be obtained to prevent, the miniaturization of circuit substrate 2, the simplification of wiring etc. can be realized.The electronic unit 12 that is connected with the claw 20 of USB connector housing 3 also can be a plurality of.
In addition, the invention is not restricted to each above-mentioned embodiment, also go for forming the USB terminal, the semiconductor storage, USB storage device of memory component etc. have been installed at the interarea of its opposition side at side's interarea of circuit substrate.This device also is contained among the present invention.Embodiments of the present invention can be expanded in technical conceive scope of the present invention or change, and the embodiment of this expansion, change also is contained in the technical scope of the present invention.
Claims (20)
1. semiconductor storage is characterized in that having:
Circuit substrate, its have the 1st interarea and with the 2nd interarea of described the 1st interarea opposition side;
The USB terminal, it is formed on described the 1st interarea of described circuit substrate, has the conductor layer of the input and output terminal that becomes USB connector;
Memory component, it is installed on described the 2nd interarea of described circuit substrate;
Sealing resin, it is located on described the 2nd interarea of described circuit substrate, to seal described memory component; With
Electronic unit, it is installed on the zone except that the formation zone of described USB terminal of described circuit substrate.
2. semiconductor storage according to claim 1 is characterized in that, also has controller component, and described the 2nd interarea side that it is configured in described circuit substrate is sealed by described sealing resin with described memory component.
3. semiconductor storage according to claim 2 is characterized in that described controller component is laminated on the described memory component.
4. semiconductor storage according to claim 2 is characterized in that, described controller component with the arranged side by side mode of configuration of described memory component, be installed on described the 2nd interarea of described circuit substrate.
5. semiconductor storage according to claim 1, it is characterized in that described electronic unit is installed at least one side in the zone except that the installation region of described memory component in described the 2nd interarea in the zone except that the formation zone of described USB terminal and described circuit substrate in described the 1st interarea of described circuit substrate.
6. USB storage device is characterized in that having: semiconductor storage and take in the USB connector housing of at least a portion of described semiconductor storage;
Wherein, described semiconductor storage has:
Circuit substrate, its have the 1st interarea and with the 2nd interarea of described the 1st interarea opposition side;
The USB terminal, it is formed on described the 1st interarea of described circuit substrate, has the conductor layer of the input and output terminal that becomes USB connector;
Memory component, it is installed on described the 2nd interarea of described circuit substrate;
Sealing resin, it is located on described the 2nd interarea of described circuit substrate, to seal described memory component; With
Electronic unit, it is installed on the zone except that the formation zone of described USB terminal of described circuit substrate.
7. USB storage device according to claim 6 is characterized in that described semiconductor storage also has controller component, and described the 2nd interarea side that it is configured in described circuit substrate is sealed by described sealing resin with described memory component.
8. USB storage device according to claim 7 is characterized in that described controller component is laminated on the described memory component.
9. USB storage device according to claim 7 is characterized in that, described controller component with the arranged side by side mode of configuration of described memory component, be installed on described the 2nd interarea of described circuit substrate.
10. USB storage device according to claim 6, it is characterized in that described electronic unit is installed at least one side in the zone except that the installation region of described memory component in described the 2nd interarea in the zone except that the formation zone of described USB terminal and described circuit substrate in described the 1st interarea of described circuit substrate.
11. USB storage device according to claim 6, it is characterized in that, described USB connector housing has projection, its described the 1st interarea at described circuit substrate is side-prominent, and contact with at least one side of described the 1st interarea and described electronic unit, move in described USB connector housing to prevent described circuit substrate.
12. USB storage device according to claim 11, it is characterized in that, described USB connector housing has notch, the part of the upper surface relative with described the 1st interarea of described circuit substrate of this USB connector housing of this notch is formed by otch, and by described notch bending is constituted described projection to described the 1st interarea side of described circuit substrate.
13. USB storage device according to claim 12 is characterized in that, described notch has the bending angle of acute angle, so that described projection is outstanding at vergence direction, and the described electronic unit of described projections.
14. USB storage device according to claim 11, it is characterized in that, described USB connector housing has notch, the part of the side of this USB connector housing of this notch is formed by otch, and by described notch bending is constituted described projection to described the 1st interarea side of described circuit substrate.
15. USB storage device according to claim 14 is characterized in that, described projection contacts with described the 1st interarea of described circuit substrate.
16. USB storage device according to claim 14 is characterized in that, described projection and the pad soldering that is located on described the 1st interarea of described circuit substrate.
17. USB storage device according to claim 16 is characterized in that, described weld zone is connected with the ground connection wiring of described circuit substrate, and described USB connector housing constitutes the part of described ground connection wiring.
18. USB storage device according to claim 6, it is characterized in that, described USB connector housing be located at the pad on described the 1st interarea of described circuit substrate and be installed at least one side's soldering of the described electronic unit on described the 1st interarea.
19. USB storage device according to claim 18, it is characterized in that, described USB connector shell has claw, the part of this USB connector housing of this claw is formed by otch, and described claw by bending to described circuit substrate side, and with at least one side's soldering of described pad and described electronic unit.
20. USB storage device according to claim 19 is characterized in that, described USB connector housing has: by soldering with described pad that the wiring of the ground connection of described circuit substrate is connected on the 1st claw; With by 2nd claw of soldering on the electrode of described electronic unit.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP270991/2005 | 2005-09-16 | ||
| JP2005270991 | 2005-09-16 | ||
| JP029220/2006 | 2006-02-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1933011A CN1933011A (en) | 2007-03-21 |
| CN100550180C true CN100550180C (en) | 2009-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006101541931A Expired - Fee Related CN100550180C (en) | 2005-09-16 | 2006-09-18 | Semiconductor storage and use its USB storage device |
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| CN (1) | CN100550180C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103001030B (en) * | 2011-09-15 | 2015-05-20 | 致伸科技股份有限公司 | Universal serial bus application device and assembly method thereof |
| JP5969405B2 (en) * | 2013-01-30 | 2016-08-17 | 日立オートモティブシステムズ株式会社 | Automotive electronic module |
| JP6363441B2 (en) * | 2014-09-11 | 2018-07-25 | 東芝情報システム株式会社 | USB memory device |
| JP6495791B2 (en) * | 2015-09-14 | 2019-04-03 | 東芝メモリ株式会社 | Semiconductor device |
| JP2022050235A (en) * | 2020-09-17 | 2022-03-30 | キオクシア株式会社 | Usb memory and manufacturing method therefor |
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2006
- 2006-09-18 CN CNB2006101541931A patent/CN100550180C/en not_active Expired - Fee Related
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| CN1933011A (en) | 2007-03-21 |
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