CN100508708C - Flat plate heat transfer device - Google Patents
Flat plate heat transfer device Download PDFInfo
- Publication number
- CN100508708C CN100508708C CNB2004800348245A CN200480034824A CN100508708C CN 100508708 C CN100508708 C CN 100508708C CN B2004800348245 A CNB2004800348245 A CN B2004800348245A CN 200480034824 A CN200480034824 A CN 200480034824A CN 100508708 C CN100508708 C CN 100508708C
- Authority
- CN
- China
- Prior art keywords
- mesh layer
- heat transfer
- flat plate
- transfer device
- plate heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- A—HUMAN NECESSITIES
- A42—HEADWEAR
- A42C—MANUFACTURING OR TRIMMING HEAD COVERINGS, e.g. HATS
- A42C5/00—Fittings or trimmings for hats, e.g. hat-bands
- A42C5/02—Sweat-bands
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D20/00—Wristbands or headbands, e.g. for absorbing sweat
-
- A—HUMAN NECESSITIES
- A42—HEADWEAR
- A42B—HATS; HEAD COVERINGS
- A42B1/00—Hats; Caps; Hoods
- A42B1/004—Decorative arrangements or effects
-
- A—HUMAN NECESSITIES
- A42—HEADWEAR
- A42B—HATS; HEAD COVERINGS
- A42B1/00—Hats; Caps; Hoods
- A42B1/018—Hats; Caps; Hoods with means for protecting the eyes, ears or nape, e.g. sun or rain shields; with air-inflated pads or removable linings
- A42B1/0186—Hats; Caps; Hoods with means for protecting the eyes, ears or nape, e.g. sun or rain shields; with air-inflated pads or removable linings with means for protecting the ears or nape
- A42B1/0188—Protection for the ears, e.g. removable ear muffs
-
- A—HUMAN NECESSITIES
- A42—HEADWEAR
- A42B—HATS; HEAD COVERINGS
- A42B1/00—Hats; Caps; Hoods
- A42B1/18—Coverings for protecting hats, caps or hoods against dust, rain, or sunshine
Abstract
Disclosed is a flat plate heat transfer device, which includes a thermally conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid evaporated with absorbing heat from the heat source and condensed with emitting heat to the heat emitting unit; and a mesh layer aggregate installed in the flat case and having a structure that a fine mesh layer for providing a flowing path of liquid and a coarse mesh layer for providing a flowing path of liquid and a dispersion path of vapor simultaneously are laminated. On occasions, the coarse and the fine mesh layers are alternately laminated repeatedly, and the fine mesh layer is replaced with a wick structure. The coarse mesh layer is preferably a screen mesh layer with wire diameter of 0.2 mm ~ 0.4 mm and mesh number of 10 ~ 20. This device improves heat transfer performance.
Description
Technical field
The present invention relates to a kind of flat plate heat transfer device that can utilize evaporation and condensation to make working fluid (working fluid) circulation and will distribute, relate more specifically to a kind of with the thin structure and the flat plate heat transfer device of good heat transfer and radiator structure from the heat of thermal source.
Background technology
Recently, along with development of integration technology, diminish gradually and attenuation such as electronic equipments such as notebook computer or PDA.In addition, in height response and the improved increase in demand of function to electronic equipment, energy consumption also is tending towards increasing.Therefore, when electronic device works, electronic unit wherein produces a large amount of heat, thereby adopts various flat plate heat transfer devices so that heat is dispersed into the external world.
The conventional example of conventional flat plate heat transfer device is heat pipe (heat pipe), wherein flat metal shell is decompressed to vacuum, injects working fluid then and with its sealing.
Heat pipe is installed as with the electronic component that produces heat (or thermal source) part and contacts.In this case, near the working fluid the thermal source is heated and evaporates, and diffusion (disperse) is to the relatively low zone of temperature then.Then, steam is condensed into liquid once more, and heat is dispersed into the external world, next returns its initial position again.By this working fluid cycles mechanism of carrying out in flat metal shell, the heat that thermal source is produced is dispersed into the external world, thereby can make temperature of electronic component remain on proper level.
Fig. 1 illustrates conventional flat plate heat transfer device 10 and is installed between thermal source 20 and the radiator 30, with will be from the heat transferred of thermal source 20 to radiator 30.
Referring to Fig. 1, conventional flat plate heat transfer device 10 has metal shell 50, and the inner space of metal shell 50 40 is filled by working fluid.On the inboard of metal shell 50, form capillary (wick) structure 60, so that effective working fluid cycles mechanism to be provided.
The heat that thermal source 20 produces is passed to the capillary structure 60 in the flat plate heat transfer device 10 that contacts with thermal source 20.Then, the contained working fluid of capillary structure 60 (promptly as " evaporation component ") that roughly is arranged in directly over the thermal source 20 is evaporated, and along 40 diffusions of all directions through the inner space, and after the capillary structure under roughly being positioned at radiator 30 60 (promptly as " condensate component ") located distribute heat, working fluid is condensation once more subsequently.The working fluid of condensation is accommodated in the capillary structure 60, returns evaporation component once more by capillary force then.At this moment, if the temperature of thermal source 20 is higher than the evaporating point of working fluid, then repeated evaporation, diffusion, condensation and return course.The heat that distributes in condensing steps is passed to radiator 30, and the forced convertion that produces by fan 70 is discharged away then.
In order to improve the heat transfer property of flat plate heat transfer device 10, in time per unit, should make a large amount of working fluid cycles.For this reason, should guarantee bigger surface area, be used for evaporation and condensation working fluid, and the working fluid that should be provided for making evaporation effectively the steam channel and being used to of diffusion make the working fluid of condensation flow near the fluid passage of thermal source 20 as early as possible.
Yet, in the flat plate heat transfer device 10 of routine, the surface of working fluid evaporation or condensation is limited to towards the inner surface of the metal shell 50 of thermal source 20 or radiator 30, thereby obtaining bigger surface area, restriction is used for evaporation or condensation working fluid.
In addition, in the flat plate heat transfer device 10 of routine, the working fluid of condensation is accommodated in the uneven part that is arranged at the capillary structure 60 on metal shell 50 inner surfaces, and flow to evaporation component by capillary force.That is to say that the passage that the working fluid of condensation can be flowed through only forms along the inner surface of metal shell 50 restrictedly.
Therefore, should the flow through distance of fluid passage of the working fluid of condensation is flow through several times of distance of steam channel of the working fluid of evaporation.Thus, the working fluid of condensation returns the time that is spent and is longer than the time that the working fluid diffusion of evaporation is spent far away.If returning between the time that the working fluid diffusion of the time that spent and evaporation spent, the working fluid of condensation has significant difference, then the flow velocity of the time per unit working fluid that can circulate descends, so the heat transfer property of flat plate heat transfer device also reduces.
In addition because the inside of flat plate heat transfer device 10 almost is decompressed to vacuum, so the ability of its opposing external impact slightly a little less than.Thereby if flat plate heat transfer device 10 is clashed into when making or deliver, then metal shell 50 crushes easily.
Summary of the invention
The present invention is intended to solve the problem that prior art exists, therefore an object of the present invention is to provide a kind of flat plate heat transfer device, its structure that has can reduce the mobile distance of working fluid of condensation, thereby make the heat transfer property maximization of flat plate heat transfer device, liquid and steam are flowed simultaneously, and under the situation that keeps former heat transfer mechanism, improve the mechanical strength of device.
Another object of the present invention provides a kind of flat plate heat transfer device, and its geometry that has allows a large amount of working fluid evaporation or condensation, thereby makes the heat transfer property maximization.
To achieve these goals, the invention provides a kind of flat plate heat transfer device, it comprises: the heat conduction flat shell, be installed between thermal source and the heat-sink unit, and comprising working fluid, this working fluid evaporates the condensation by heat being dispersed into this heat-sink unit by absorbing heat from this thermal source; And mesh layer group, be installed in this flat shell, make the upper surface of this mesh layer group and lower surface contact with the inwall of this flat shell; And have capillary structure and a stacked toward each other structure of coarse mesh layer, wherein this capillary structure is used for providing by capillary force the flow path of liquid, the line of this coarse mesh layer is woven into alternately and intersects up and down, be used to provide the evolving path of steam, the flow path of liquid is provided by capillary force simultaneously, and wherein this coarse mesh layer is to have the linear diameter of 0.20mm to 0.40mm and the screen cloth of 10 to 20 mesh.
Preferably, this coarse mesh layer provides the flow path of liquid along level and vertical direction by the capillary force while.In addition, in order to improve heat transfer property, this coarse mesh layer is preferably made by metal material.
Selectively, this mesh layer group also can comprise another capillary structure, and this another capillary structure is relative with this capillary structure and contact with this coarse mesh layer, and this coarse mesh layer is clipped between above-mentioned two capillary structures.
In the present invention, this capillary structure can be made by sintered copper, stainless steel, aluminium or nickel powder, or by etching polymer, silicon, silicon dioxide (SiO
2), copper, stainless steel, nickel or aluminium sheet make.
Selectively, available fine mesh layer replaces this capillary structure, and this fine mesh layer is compared with the coarse mesh layer, has relatively large mesh count and less linear diameter.In this case, the mesh line braiding of this fine mesh layer diameter that can be 0.03mm to 0.13mm forms and has the screen cloth of 80 to 400 mesh.
In another program of the present invention, a kind of flat plate heat transfer device also is provided, it comprises: the heat conduction flat shell, be installed between thermal source and the heat-sink unit, and comprising working fluid, this working fluid evaporates the condensation by heat being dispersed into this heat-sink unit by absorbing heat from this thermal source; And mesh layer group, be installed in this flat shell, make the upper surface of this mesh layer group and lower surface contact with the inwall of this flat shell; And having a plurality of fine mesh layers and the repeatedly alternately laminated structure of a plurality of coarse mesh layers, the line of described a plurality of fine mesh layers and a plurality of coarse mesh layers is woven into alternately and intersects up and down.
Described fine mesh layer and coarse mesh layer are preferred alternately laminated and be in contact with one another.In addition, described coarse mesh layer and fine mesh layer are preferably formed by the mesh line braiding that metal, polymer, plastics or glass fibre are made.
For example, this mesh layer group can have the structure that stacks gradually from bottom to up to fine mesh layer, coarse mesh layer, fine mesh layer, coarse mesh layer and fine mesh layer.
For example, this mesh layer group also can have the structure that stacks gradually from bottom to up to fine mesh layer, coarse mesh layer, fine mesh layer and coarse mesh layer.
For example, this mesh layer group can have also that to stack gradually from bottom to up be the structure of two fine mesh layers, a coarse mesh layer, a fine mesh layer and a coarse mesh layer.
For example, this mesh layer group can have also that to stack gradually from bottom to up be the structure of two fine mesh layers, a coarse mesh layer, a fine mesh layer, a coarse mesh layer and two fine mesh layers.
In another scheme of the present invention, a kind of flat plate heat transfer device also is provided, it comprises: the heat conduction flat shell, be installed between thermal source and the heat-sink unit, and comprising working fluid, this working fluid evaporates the condensation by heat being dispersed into this heat-sink unit by absorbing heat from this thermal source; And mesh layer group, be installed in this flat shell, make the upper surface of this mesh layer group and lower surface contact with the inwall of this flat shell; And has a structure that capillary structure and coarse mesh layer are repeatedly alternately laminated and be in contact with one another, wherein this capillary structure is used for providing by capillary force the flow path of liquid, the line of this coarse mesh layer is woven into alternately and intersects up and down, be used to provide the evolving path of steam, and the flow path of liquid is provided by capillary force simultaneously.
In the present invention, this flat shell can be by metal, thermal conductive polymer, scribble the metal of thermal conductive polymer and any material in the heat-conducting plastic is made, and is perhaps made by electrolytic copper foil.Under latter event, the uneven surface of electrolytic copper foil preferably constitutes the inner surface of flat shell.This flat shell utilize from laser welding, plasma welding, TIG (Wolfram Inert Gas) welding, ultrasonic bonding, brazing connect, scolder welds and the set of the stacked formation of hot pressing the mode selected seal.
In the present invention, working fluid can be water, methyl alcohol, ethanol, acetone, ammonia, CFC working fluid, HCFC working fluid, HFC working fluid or their mixture.
Description of drawings
Below embodiment of the invention will be described with reference to drawings, thereby other purpose of the present invention and scheme will become more obvious.In the accompanying drawings:
Fig. 1 is the cutaway view of conventional flat plate heat transfer device;
Fig. 2 is the cutaway view according to the flat plate heat transfer device of first embodiment of the invention;
Fig. 3 is the plane graph according to the grid of the mesh layer of first embodiment of the invention composition mesh layer group (mesh layer aggregate);
Fig. 4 is the cutaway view along the A-A ' line among Fig. 3;
Fig. 5 illustrates the liquid film that is arranged in adjacent fine mesh layer and coarse mesh layer according to first embodiment of the invention and is connected to each other in mesh layer group;
Fig. 6 illustrates the liquid film that is formed on mesh line (mesh wire) intersection point place according to first embodiment of the invention and is connected to each other in the coarse mesh layer;
Fig. 7 is the cutaway view according to the flat plate heat transfer device of second embodiment of the invention;
Fig. 8 to Figure 10 is the cutaway view according to the various modifications of mesh layer group of the present invention;
Figure 11 to Figure 13 is the stereogram according to the various outward appearances of flat plate heat transfer device of the present invention; And
Figure 14 to Figure 16 is the cutaway view according to the various examples of the flat shell that uses in the flat plate heat transfer device of the present invention.
Embodiment
Below, in order to describe the present invention in detail, will be described, and, provide detailed explanation with reference to the accompanying drawings in order to understand the present invention better to embodiment.Yet, can revise embodiments of the invention with multiple mode, and should not be construed as of the present invention range limited in following embodiment.Provide embodiments of the invention just in order to provide clearer, more precisely bright to those skilled in the art.In the accompanying drawings, identical label is represented components identical.
As shown in Figure 2, flat plate heat transfer device 100 according to first embodiment of the invention comprises flat shell 130 and mesh layer group 140, wherein flat shell 130 is installed between thermal source 110 and heat radiation (heat emitting) unit (for example radiator) 120, and mesh layer group 140 is made of the mesh layer in a plurality of insertion flat shells 130.Inject working fluid in flat shell 130, this working fluid can evaporate by the heat that absorbs thermal source 110 generations, and can the condensation by heat being dispersed into heat-sink unit 120.
As shown in Figure 3, fine mesh layer 140a and coarse mesh layer 140b are preferably the screen cloth (screen mesh) that forms as follows: horizontal line 160a and ordinate 160b are woven into alternately and intersect up and down.Here, ordinate 160b is the mesh line that is arranged in row when braiding along the length direction of mesh layer, and horizontal line 160a is perpendicular to the mesh line that ordinate 160b arranges.
With reference to Fig. 3, the space that exists in the unit grids of mesh layer 140a and 140b (empty space) width (a) is typically expressed as following equation 1.Width (a) is the call parameter of the functional character of definite mesh layer 140a and 140b.
Equation 1
a＝(1-Nd)/N
Here, d is the diameter (inch) of mesh line, and N is the grid number that exists in 1 inchage.For example, if N is 100, then in 1 inchage, there are 100 grids.
Make flat plate heat transfer device 100 not carry out heat transfer operations if be lower than the evaporating temperature of working fluid owing to the temperature of thermal source 110, then on the surface of the line that constitutes mesh layer 140a and 140b and the intersection point place have the working fluid of Physical Absorption.For coarse mesh layer 140b, the space of grid does not have the liquid film of complete filling working fluid.Yet for fine mesh layer 140a, the whole space of grid is filled with the liquid film of working fluid.
Be higher than in the temperature of thermal source 110 under the situation of evaporating temperature of working fluid, flat plate heat transfer device 100 begins from thermal source 110 to heat-sink unit 120 heat transfer operations.Specifically, the heat that thermal source 110 produces is passed to adjacent fine mesh layer 140a, thereby makes the working fluid evaporation among the fine mesh layer 140a.Certainly, also cause the working fluid evaporation among the coarse mesh layer 140b, but among the coarse mesh layer 140b evaporation capacity of working fluid less than the evaporation capacity of working fluid among the fine mesh layer 140a.Then, the working fluid of above-mentioned evaporation is through adjacent coarse mesh layer 140b diffusion, then on the inner surface of flat shell 130, temperature is lower than in the zone of working fluid evaporating temperature, just in the fine mesh layer 140a that roughly is arranged under the heat-sink unit 120, the working fluid condensation of above-mentioned evaporation.
In evaporation that repeats working fluid and condensation, working fluid obtains heat from thermal source 110, then with heat transferred to heat-sink unit 120.Then, the heat that is passed to heat-sink unit 120 is outwards discharged by the forced convertion of fan 150 generations, thereby the temperature of thermal source 110 is remained in the proper level.In ideal conditions, utilize the evaporation of working fluid and the working fluid heat transfer mechanism of condensation to continue to carry out, till the temperature of thermal source 110 is substantially equal to the temperature of heat-sink unit 120.
If cause the evaporation and the condensation of working fluid in flat plate heat transfer device 100, then the mesh layer equilibrium state of organizing 140 median surface energy broken.Here, interfacial energy is meant the energy of the contact interface between the surface of working fluid under liquid and mesh layer 140a and 140b.That is to say, be not (equilibrium state) but in the moment (point) that causes the working fluid evaporation, interfacial energy increases under the situation before conduct heat producing; And not (equilibrium state) but in the moment that causes the working fluid condensation, interfacial energy reduces under the situation before conduct heat producing.Thus, in mesh layer group 140, produce the trend of eliminating the interfacial energy disturbance.
Therefore, produce from introducing the trend of working fluid on every side, and produce trend around working fluid is discharged in the moment of working fluid condensation in the moment of working fluid evaporation.This makes the working fluid of condensation flow in mesh layer group 140.In general, the working fluid of the condensation that produces from heat-sink unit 120 flows to the periphery of mesh layer group 140, and flows to thermal source 110 from periphery once more.
In flat plate heat transfer device 100, coarse mesh layer 140b mainly provides the evolving path of the working fluid of evaporation as mentioned above.Particularly, in coarse mesh layer 140b, exist by horizontal line 160a and ordinate 160b as shown in Figure 4 and intersect up and down and the wedge shape space that produces, this space is as the diffusion of vapor passage 170 that can spread steam through it.
By following equation 2, but the geometric area of calculation of steam diffusion admittance 170 (A).
Equation 2
A＝(a+d)d-πd
2/4
Referring to equation 2, along with mesh count (N) reduces and mesh linear diameter (d) increase, the geometric area of diffusion of vapor passage 170 increases.
Because the grid of coarse mesh layer 140b always has four diffusion of vapor passages 170 that have with adjacent grid, thus the diffusion of steam with grid element center (referring to " 0 " of Fig. 3) be benchmark along four direction (referring to the arrow among Fig. 3
) carry out.
Simultaneously, when flat plate heat transfer device 100 real works of the present invention, as shown in Figure 5, the wedge gap place of the diffusion of vapor passage 170 on coarse mesh layer 140b forms liquid film 180 by the working fluid of liquid state.As shown in Figure 6, liquid film 180 is formed on all intersection point places of coarse mesh line 160, and the liquid film adjacent one another are that forms is connected to each other (referring to the label among Fig. 6 190).
When the diameter (d) of the width (N) of grid in the parameter of suitable control coarse mesh layer 140b and/or mesh line, a plurality of liquid films 180 are connected, and the effect that makes the working fluid bottom horizontal flow sheet by capillary force is played in the connection of described liquid film 180.Therefore,, mainly cause the diffusion of steam, but also cause the bottom horizontal flow sheet of liquid by the capillary force that the liquid film 180 that connects produces via diffusion of vapor passage 170 at coarse mesh layer 140b place.The horizontal flow velocity that cause this moment is lower than the horizontal flow velocity that fine mesh layer 140a place causes relatively.
As mentioned above, the zone being positioned at the fine mesh layer 140a directly over the thermal source 110 causes evaporation of liquid constantly in diabatic process, therefore liquid correspondingly should be continued to be fed to herein.Yet, for the liquid continuous fine mesh layer 140a that be fed to, consider the geometry of mesh layer group 140, be arranged on the crosslinked action that coarse mesh layer 140b between the fine mesh layer 140a should play the working fluid perpendicular flow that is used to make condensation.This perpendicular flow of working fluid can be by being arranged in fine mesh layer 140a and realizing vertical connection the (referring to the label 200 of Fig. 5) of the liquid film 180 at coarse mesh layer 140b place.That is to say that the vertical connection of liquid film 180 keeps the capillary force of vertical direction, thereby even the working fluid of condensation vertically also can be flowed reposefully.
Because coarse mesh layer 140b provides aforesaid diffusion of vapor passage 170, thereby coarse mesh layer 140b makes the working fluid of fine mesh layer 140a place evaporation promptly be diffused into the zone that temperature is lower than thermal source 110, coarse mesh layer 140b plays the crosslinked action that is used to make the working fluid perpendicular flow simultaneously, thereby the working fluid of condensation can be fed to reposefully adjacent fine mesh layer 140a.Therefore, when flat plate heat transfer device 100 work, the working fluid of condensation is fed near the thermal source 110 reposefully, makes the heat transfer efficiency maximization of flat plate heat transfer device 100 thus.In addition, coarse mesh layer 140b also plays the effect of supporting flat shell 130, to strengthen the mechanical strength of flat plate heat transfer device 100, makes flat plate heat transfer device 100 extremely thin thus.
At coarse mesh layer 140b place, flowing of the diffusion of steam and liquid take place simultaneously, therefore need suitably select the diameter of mesh count and mesh line.At this moment, be noted that if the mesh count of coarse mesh layer 140b is very big and the diameter mesh line is very little, then the area of diffusion of vapor passage 170 reduces, and the flow resistance of steam is increased, and diffusion of vapor passage 170 is own owing to surface tension is filled with liquid, and the diffusion of steam can't be produced.
Consider this point, meet in use under the situation of screen cloth of ASTM specification E-11-95 that screen cloth preferably has the mesh linear diameter of 10 to 20 mesh and 0.2mm to 0.4mm as coarse mesh layer 140b.If the screen cloth that selection has these conditions then can cause the diffusion of steam and the level and the perpendicular flow of liquid simultaneously in coarse mesh layer 140b.
In the course of work of flat plate heat transfer device 100, produce evaporation of liquid among near the fine mesh layer 140a thermal source 110, produce the condensation of steam among near the fine mesh layer 140a heat-sink unit 120.In this process, in general, by the capillary force in level or vertical direction generation, liquid should continue to be fed to reposefully the part that is positioned at thermal source 110 tops from the part that is positioned at heat-sink unit 120 belows.
For this reason, preferably, the line intersection point place that provides the interconnected liquid film 180 of capillary force to be positioned at fine mesh layer 140a, and the space of grid is filled with liquid film.This can obtain by mesh count and the mesh linear diameter of suitably selecting fine mesh layer 140a.
Meet in use under the situation of screen cloth as fine mesh layer 140a of ASTM specification E-11-95, preferably, selection has the screen cloth of the mesh linear diameter of 80 to 400 mesh and 0.03mm to 0.13mm.
In first embodiment of the invention described above, fine mesh layer 140a can be substituted by capillary structure.In some cases, can remove the fine mesh layer 140a of heat-sink unit 120 belows.In this case, owing to liquid film is formed among the coarse mesh layer 140b, and working fluid condensation at this portion, as shown in Figure 5 and Figure 6, so the coarse mesh layer itself plays the effect of the condensate component of working fluid.This capillary structure can be made by sintered copper, stainless steel, aluminium or nickel powder, perhaps makes by etching polymer, silicon, silicon dioxide, copper, stainless steel, nickel or aluminium sheet.In addition, can adopt in the U.S. Pat 6,056,044 that Benson etc. submits to disclosed methods of micro-mechanics to make this capillary structure.
In the present invention, the flat shell 130 that comprises mesh layer group 140 is depressurized to vacuum, and its material is selected from metal, the thermal conductive polymer with thermal conductive resin, the metal that scribbles thermal conductive polymer or heat-conducting plastic, thereby can easily absorb heat and heat is dispersed into heat-sink unit 120 once more from thermal source 110.
Preferably, metal is any in copper, aluminium, stainless steel and the molybdenum, perhaps their alloy.Especially, flat shell 130 make by electrolytic copper foil and side surface on unevenness be that this uneven surface preferably constitutes the inner surface of flat shell 130 under the so little situation of about 10 μ m.In this case, on the inner surface of flat shell 130, also produce flowing of working fluid, so working fluid can be back to more promptly near the thermal source 110, further improve the heat transfer property of flat plate heat transfer device 100 thus by capillary force.Consider the heat-transfer character and the mechanical strength of flat shell 130, flat shell 130 preferably has the thickness of 0.01mm to 3.0mm.
Fig. 7 illustrates the flat plate heat transfer device according to second embodiment of the invention.The flat plate heat transfer device of second embodiment is except the overlapped way of mesh layer group, and is basic identical with the flat plate heat transfer device of first embodiment.
With reference to Fig. 7, comprise mesh layer group 140 according to the flat plate heat transfer device 100 ' of second embodiment of the invention, in this mesh layer group 140, fine mesh layer 140a and coarse mesh layer 140b are alternately laminated.Here, fine mesh layer 140a and coarse mesh layer 140b are basically the same as those in the first embodiment, and are in contact with one another along stacked direction.
This structure of mesh layer group 140 is guaranteed than the better relatively heat transfer property of flat plate heat transfer device shown in Figure 2 100.The reason that can realize this good heat transfer performance is: cause the evaporation of working fluid simultaneously in many positions of a plurality of fine mesh layer 140a, cause in many positions simultaneously that then steam spreads rapidly through a plurality of coarse mesh layer 140b, and coarse mesh layer 140b plays the effect of diffusion of vapor passage and makes the crosslinked action of the liquid perpendicular flow of condensation, reduce the return time of working fluid thus, and increase the flow velocity that time per unit is supplied near the working fluid the thermal source 110.
In mesh layer group 140, the unit of alternately laminated mesh layer is not limited to one.Yet,, thereby hinder liquid flow if comprise that above three fine mesh layer 140a, the working fluid of evaporation may accumulate in the stepped construction of fine mesh layer 140a.Therefore, the quantity of stacked fine mesh layer 140a is preferably two or still less.
In the course of work of flat plate heat transfer device 100 ', the heat that thermal source 110 produces not only is passed to adjacent fine mesh layer 140a, and be passed to non-conterminous fine mesh layer 140a, therefore in each fine mesh layer 140a, cause the evaporation of working fluid simultaneously in many positions.Therefore, the heat transfer property in the time per unit improves.The evaporation that in coarse mesh layer 140b, also produces working fluid, but its evaporation capacity is far smaller than the evaporation capacity of the working fluid that produces among the fine mesh layer 140a.
The working fluid of evaporation is through adjacent with fine mesh layer 140a a plurality of coarse mesh layer 140b diffusions, is lower than the zone of working fluid evaporating point, promptly roughly is being positioned at regional condensation under the heat-sink unit 120 in temperature on the inner surface of flat shell 130 then.Then, the heat that produces in the working fluid condensation process is dispersed into the external world through heat-sink unit 120.
In general, by the capillary force that produces in mesh layer group 140, the working fluid of condensation flows near the thermal source 110.At this moment, flowing of the working fluid of condensation mainly is created between the fine mesh layer 140a and coarse mesh layer 140b that constitutes different layers, although it also produces in fine mesh layer 140a itself and coarse mesh layer 140b itself.The contact interface that flow through described mesh layer between of working fluid between the mesh layer that constitutes different layers realized.At this moment, a mechanism relevant with the perpendicular flow of working fluid and a last embodiment's is basic identical.
Especially, the coarse mesh layer 140b provide the diffusion of vapor passage, make the working fluid that evaporates among the fine mesh layer 140a can promptly be diffused into the function that temperature is lower than the zone of thermal source 110 to provide, and provide and make the working fluid perpendicular flow and make the working fluid of condensation can be fed to the crosslinked function of adjacent fine mesh layer 140a.Therefore, in the course of work of flat plate heat transfer device 100 ', the working fluid of condensation promptly is supplied near the thermal source 110, makes the heat transfer efficiency maximization of flat plate heat transfer device 100 ' thus.
In the second embodiment of the present invention,, can revise the method that constitutes mesh layer group 140 with fine mesh layer 140a and coarse mesh layer 140b with multiple mode based on example shown in Figure 7.Fig. 8 to Figure 10 illustrates multiple modification.
Comparison diagram 7 and with reference to Fig. 8 to Figure 10 as an example, is organized the fine mesh layer 140a (referring to Fig. 8) that can remove top layer at 140 o'clock constituting the mesh layer.As another example, top layer and bottom all can constitute (referring to Figure 10) by a plurality of fine mesh layer 140a.As another example, the fine mesh layer 140a of top layer can remove, and bottom can constitute (referring to Fig. 9) by a plurality of fine mesh layer 140a.
Simultaneously, in the second embodiment of the present invention and modification thereof, the fine mesh layer that constitutes mesh layer group can be replaced by known various capillary structures in this field, and is similar with first embodiment.
Can have different shape according to flat plate heat transfer device of the present invention, for example Figure 11 is to square, rectangle shown in Figure 13, T font etc.In addition, the flat shell of flat plate heat transfer device can be made of upper shell 130a and lower house 130b, and upper shell 130a and lower house 130b can and shown in Figure 15ly provide a perhaps integrated as shown in figure 16 housing separately as Figure 14.
In the present invention, after working fluid being filled in the flat shell and the inner space of flat shell is decompressed to vacuum, carry out the final seal process of flat shell.Use that for example laser welding, plasma welding, TIG (Wolfram Inert Gas) welding, ultrasonic bonding, brazing connect, scolder welds and hot pressing is stacked etc. that mode seals.
The working fluid that injects flat shell can adopt water, methyl alcohol, ethanol, acetone, ammonia, CFC working fluid, HCFC working fluid, HFC working fluid or their mixture.
In the above-mentioned flat plate heat transfer device that constitutes according to the present invention, the coarse mesh layer plays the effect of diffusion of vapor passage and makes fluid level and the crosslinked action of perpendicular flow.This double action of coarse mesh layer is essential for flat plate heat transfer device of the present invention, and can realize by mesh count and the mesh linear diameter of suitably selecting the coarse mesh layer.
Below, the mesh count of the coarse mesh layer that the performance by following experiment 1 actual measurement heat transfer unit (HTU) of the present invention and the present invention adopt and the relation between the mesh linear diameter are to calculate the condition that the coarse mesh layer can play double action.
Experiment 1
Under every kind of situation as shown in table 1 below, choose the screen cloth that is made of copper as the coarse mesh layer.In addition, choose be made of copper, mesh count be 100 and the mesh linear diameter be that the screen cloth of 0.11mm is as the fine mesh layer.Then, constitute 11 mesh layer groups by structure shown in Figure 2.
Table 1
| Situation | Linear diameter [mm] | Mesh count [#/inch] | R[℃/W] |
| 1 | 0.20 | 15 | 0.70 |
| 2 | 0.20 | 24 | 0.74 |
| 3 | 0.20 | 50 | ∞ |
| 4 | 0.35 | 10 | 0.67 |
| 5 | 0.35 | 12 | 0.63 |
| 6 | 0.35 | 14 | 0.61 |
| 7 | 0.35 | 16 | 0.65 |
| 8 | 0.35 | 18 | 0.67 |
| 9 | 0.35 | 30 | ∞ |
| 10 | 0.48 | 10 | 0.78 |
| 11 | 0.71 | 8 | ∞ |
Subsequently, a plurality of mesh layer group are installed in (referring to Figure 14) between the upper and lower flat shell, and (denatured) acrylic acid two-part adhesive (HARDLOC by sex change
TH, Japanese DENKA makes) and with the flat shell sealing, and stay the working fluid hand-hole.At this moment, thickness is that the non-oxidation copper coin of 0.2mm is used for flat shell, and the length of this flat shell is that 80mm, width are 70mm.
After sealing flat shell as mentioned above, utilize rotary vacuum pump and diffusion type vacuum pump inner pressure relief to 1.0 * 10 with flat shell
-7Holder, the distilled water of filling 0.23cc in flat shell finally seals flat shell then, thereby prepares the sample of 11 flat plate heat transfer devices as working fluid.
After making each flat plate heat transfer device, the heat transfer property of each device of measurement as described below, and in measurement result shown in the thermal resistance hurdle of table 1.
At first, length is that 30mm and width are the top of the copper billet thermal source of 30mm attached to heat transfer unit (HTU).(50W 240V) is installed in the copper billet two cartridge type (cartridge-type) heaters that are used for heat supply.On the surface of thermocouple attached to copper billet, to measure the temperature on copper surface.The fin that is made of copper (finheatsink) is attached to the bottom of heat transfer unit (HTU), thereby can be used as heat-sink unit.
By using this structure, working fluid returns its initial position along the direction opposite with gravity, and can be to the resettability of each heat transfer unit (HTU) comparative assessment working fluid.Fin has length identical with heat transfer unit (HTU) and width.
In instantiation, supply the thermal capacity of 90W altogether by cartridge heater.Afterwards, temperature is under 22 ℃ the condition around, measures the surface temperature of copper billet.Then, calculate thermal resistance (R[℃/W]) based on the difference of the surface temperature of copper billet and environment temperature.
The thermal resistance of each heat transfer unit (HTU) shown in the table 1.Experimental result is that linear diameter is that 0.35mm and mesh count are 14 o'clock thermal resistance minimums.When linear diameter was 0.35mm, along with mesh count increases to greater than 14 or is reduced to less than 14, thermal resistance increased.
When linear diameter was 0.35mm, if mesh count is reduced to less than 14, then the area geometry character ground of steam channel increased.Yet, the increase of thermal resistance is caused by following reason: the area that occupies owing to the wedge shape liquid film that is formed on coarse mesh floor district increases together, therefore the pure area of steam channel does not increase basically, but owing to the minimizing of mesh count causes the heat-transfer capability of coarse mesh layer to descend.Thus, be appreciated that the material of coarse mesh layer influences the performance of heat transfer unit (HTU).Therefore, when constituting heat transfer unit (HTU), the coarse mesh layer preferably is made of metal.
In addition, when linear diameter was 0.35mm, if mesh count increases to greater than 14, then thermal resistance increased, this be because: the increase of the flow resistance that causes along with the minimizing by steam channel, the recruitment of thermal resistance are far longer than the recruitment of the heat-transfer capability that the thermal conductivity by the coarse mesh layer causes.
Especially, be 50 if linear diameter is 0.2mm and mesh count, then the temperature on copper surface continues to increase, thereby can not provide the result.This is because steam channel too reduces, thereby steam is not diffused into all parts of flat plate heat transfer device, so steam does not have condensation.
By these experimental results, the inventor can analogize the performance of flat plate heat transfer device according to the mesh count of coarse mesh layer and the variation of linear diameter, if and discovery coarse mesh layer has linear diameter and 10 to 20 mesh of 0.2mm to 0.4mm, then flat plate heat transfer device can provide the effective efficiency as actual cooling device.
Below, the inventor is by relatively according to first embodiment and heat transfer property according to the flat plate heat transfer device of second embodiment, the relation between the structure of the heat transfer property of test flat plate heat transfer unit (HTU) and mesh layer group.
Experiment 2
The inventor is in order to check the effect according to flat plate heat transfer device of the present invention, made length and is 150mm, width and be 50mm, highly has been the flat plate heat transfer device of 2.25mm (below be called sample 1).Flat shell constitutes by the upper and lower flat shell in conjunction with preparation respectively, and is that the Copper Foil of 0.1mm is made by thickness.
Utilize copper content to be at least 99% copper screen cloth, the mesh layer group that will be installed in the flat shell is stacked as shown in Figure 7.The coarse mesh layer uses the screen cloth that is made of copper, and linear diameter is that 0.35mm, bed thickness are that 0.74mm, mesh count are 14 in this screen cloth.In addition, the fine mesh layer uses the screen cloth that is made of copper, and linear diameter is that 0.11mm, bed thickness are that 0.24mm, mesh count are 100 in this screen cloth.
For sample 1 is used for this experiment, at first mesh layer group is installed between the lower house, and the acrylic acid two-part adhesive (HARDLOC by sex change
TM, Japanese DENKA makes) and with the flat shell sealing, and stay the working fluid hand-hole.
Afterwards, use rotary vacuum pump and diffusion type vacuum pump inner pressure relief to 1.0 * 10 with flat shell
-7Holder is filled in the flat shell distilled water of 3.91cc as working fluid, then flat shell is finally sealed.
Simultaneously, in order to compare performance, make the flat plate heat transfer device (hereinafter referred to as sample 2) of simple stacked coarse mesh layer and fine mesh layer as the flat plate heat transfer device of above-mentioned manufacturing.The coarse mesh layer that is used for the perparation of specimen 2 and fine mesh layer are identical with sample 1.Except the thickness of sample 2 is that the loading of 1.35mm and working fluid is the 3.12cc, with the mode perparation of specimen 2 identical with sample 1.
As above-mentioned preparation sample 1 and 2 after, on the upper surface of sample 1 and 2, fin is installed respectively, the lower surface length of this fin is that 80mm, width are 61mm, and the height of this fin is 40mm, on this fin cooling fan is installed then.In addition, length and width are respectively the lower surface of the copper billet thermal source of 31mm attached to each sample 1 and 2.Then, utilize the thermal source of thermal capacity, measure the surface temperature of thermal source with identical environmental condition and constant fan speed for 70W.
As experimental result, find that for sample 2, heat source temperature is 69 ℃ when environment temperature is 25 ℃, for sample 1, heat source temperature is 58 ℃.This performance that shows flat plate heat transfer device when fine mesh layer and coarse mesh layer are alternately laminated improves.
By above-mentioned experiment, be appreciated that, if as alternately laminated coarse mesh layer and fine mesh layer according to the flat plate heat transfer device of second embodiment, the then diffusion of the working fluid that in a plurality of coarse mesh layers, evaporates in many positions simultaneously, and the coarse mesh layer causes that the working fluid of condensation returns rapidly via the coarse mesh layer, thereby improves heat transfer property
Commercial Application
According to a scheme of the present invention, coarse mesh layer and the stacked of fine mesh layer (or capillary structure) are impelled the working fluid perpendicular flow by capillary force in the flat shell, thereby the working fluid of condensation can be supplied to rapidly and reposefully near the thermal source.
According to another aspect of the present invention, can in mesh layer group, cause the evaporation and the diffusion of working fluid simultaneously in many positions.Especially, owing to can guarantee that in alternately laminated screen cloth bigger surface area is used for the evaporation and the condensation of working fluid, thereby make the heat transfer property maximization of flat plate heat transfer device.
In accordance with yet a further aspect of the invention, because mesh layer group supports flat shell, also can prevent the flat plate heat transfer device distortion even therefore be subjected to mechanical impact.
Described the present invention in detail as preceding.Yet should be appreciated that, because for a person skilled in the art, the various changes and the modification that fall in the spirit and scope of the present invention can become clearly by describing in detail, therefore show that the detailed description of the preferred embodiment of the present invention and instantiation only provide for the purpose of illustration.
Claims (31)
1. flat plate heat transfer device comprises:
The heat conduction flat shell is installed between thermal source and the heat-sink unit, and comprises working fluid, and this working fluid evaporates the condensation by heat being dispersed into this heat-sink unit by absorbing heat from this thermal source; And
Mesh layer group is installed in this flat shell, makes the upper surface of this mesh layer group and lower surface contact with the inwall of this flat shell; And having fine mesh layer and the stacked toward each other structure of coarse mesh layer, the line of described fine mesh layer and coarse mesh layer is woven into alternately and intersects up and down;
Wherein, this coarse mesh layer is to have the linear diameter of 0.20mm to 0.40mm and the screen cloth of 10 to 20 mesh.
2. flat plate heat transfer device according to claim 1 wherein, also comprises another fine mesh layer, and this another fine mesh layer is relative with this fine mesh layer and contact with this coarse mesh layer, and this coarse mesh layer is clipped between above-mentioned two fine mesh layers.
3. flat plate heat transfer device according to claim 1 and 2,
Wherein, the mesh line braiding of this fine mesh layer diameter that is 0.03mm to 0.13mm forms and has the screen cloth of 80 to 400 mesh.
4. flat plate heat transfer device according to claim 1 and 2,
Wherein, this coarse mesh layer is made by metal material.
5. flat plate heat transfer device comprises:
The heat conduction flat shell is installed between thermal source and the heat-sink unit, and comprises working fluid, and this working fluid evaporates the condensation by heat being dispersed into this heat-sink unit by absorbing heat from this thermal source; And
Mesh layer group is installed in this flat shell, makes the upper surface of this mesh layer group and lower surface contact with the inwall of this flat shell; And having fine mesh layer and the stacked toward each other structure of coarse mesh layer, the line of described fine mesh layer and coarse mesh layer is woven into alternately and intersects up and down;
Wherein, this coarse mesh layer is for being made and had the linear diameter of 0.20mm to 0.40mm and the screen cloth of 10 to 20 mesh by metal material, and the evolving path of steam is provided, and provides the flow path of liquid along level and vertical direction by capillary force.
6. flat plate heat transfer device comprises:
The heat conduction flat shell is installed between thermal source and the heat-sink unit, and comprises working fluid, and this working fluid evaporates the condensation by heat being dispersed into this heat-sink unit by absorbing heat from this thermal source; And
Mesh layer group is installed in this flat shell, makes the upper surface of this mesh layer group and lower surface contact with the inwall of this flat shell; And having capillary structure and the stacked toward each other structure of coarse mesh layer, the line of described coarse mesh layer is woven into alternately and intersects up and down;
Wherein, this coarse mesh layer is to have the linear diameter of 0.20mm to 0.40mm and the screen cloth of 10 to 20 mesh.
7. flat plate heat transfer device according to claim 6 wherein, also comprises another capillary structure, and it is relative with this capillary structure and contact with this coarse mesh layer, and this coarse mesh layer is clipped between above-mentioned two capillary structures.
8. according to claim 6 or 7 described flat plate heat transfer devices,
Wherein, this capillary structure is made by sintered copper, stainless steel, aluminium or nickel powder.
9. according to claim 6 or 7 described flat plate heat transfer devices,
Wherein, this capillary structure is to make by etching polymer, silicon, silicon dioxide, copper, stainless steel, nickel or aluminium sheet.
10. according to claim 6 or 7 described flat plate heat transfer devices,
Wherein, this coarse mesh layer is made by metal material.
11. a flat plate heat transfer device comprises:
The heat conduction flat shell is installed between thermal source and the heat-sink unit, and comprises working fluid, and this working fluid evaporates the condensation by heat being dispersed into this heat-sink unit by absorbing heat from this thermal source; And
Mesh layer group is installed in this flat shell, makes the upper surface of this mesh layer group and lower surface contact with the inwall of this flat shell; And having capillary structure and the stacked toward each other structure of coarse mesh layer, the line of described coarse mesh layer is woven into alternately and intersects up and down;
Wherein, this coarse mesh layer is for being made and had the linear diameter of 0.20mm to 0.40mm and the screen cloth of 10 to 20 mesh by metal material, and the evolving path of steam is provided, and provides the flow path of liquid along level and vertical direction by capillary force.
12. a flat plate heat transfer device comprises:
The heat conduction flat shell is installed between thermal source and the heat-sink unit, and comprises working fluid, and this working fluid evaporates the condensation by heat being dispersed into this heat-sink unit by absorbing heat from this thermal source; And
Mesh layer group is installed in this flat shell, makes the upper surface of this mesh layer group and lower surface contact with the inwall of this flat shell; And having a plurality of fine mesh layers and the repeatedly alternately laminated structure of a plurality of coarse mesh layers, the line of described a plurality of fine mesh layers and a plurality of coarse mesh layers is woven into alternately and intersects up and down.
13. flat plate heat transfer device according to claim 12,
Wherein, the mesh line braiding of this coarse mesh layer diameter that is 0.2mm to 0.4mm forms and has the screen cloth of 10 to 20 mesh.
14. flat plate heat transfer device according to claim 12,
Wherein, the mesh line braiding of this fine mesh layer diameter that is 0.03mm to 0.13mm forms and has the screen cloth of 80 to 400 mesh.
15. flat plate heat transfer device according to claim 12,
Wherein, described fine mesh layer and coarse mesh layer are alternately laminated and be in contact with one another.
16. flat plate heat transfer device according to claim 12,
Wherein, this mesh layer group has the structure that stacks gradually from bottom to up to fine mesh layer, coarse mesh layer, fine mesh layer, coarse mesh layer and fine mesh layer.
17. flat plate heat transfer device according to claim 12,
Wherein, this mesh layer group has the structure that stacks gradually from bottom to up to fine mesh layer, coarse mesh layer, fine mesh layer and coarse mesh layer.
18. flat plate heat transfer device according to claim 12,
Wherein, this mesh layer group has that to stack gradually from bottom to up be the structure of two fine mesh layers, a coarse mesh layer, a fine mesh layer and a coarse mesh layer.
19. flat plate heat transfer device according to claim 12,
Wherein, this mesh layer group has that to stack gradually from bottom to up be the structure of two fine mesh layers, a coarse mesh layer, a fine mesh layer, a coarse mesh layer and two fine mesh layers.
20. flat plate heat transfer device according to claim 12,
Wherein, described fine mesh layer provides the flow path of liquid.
21. flat plate heat transfer device according to claim 12,
Wherein, described coarse mesh layer provides the flow path of liquid and the evolving path of steam simultaneously.
22. according to each the described flat plate heat transfer device in the claim 1 to 2,5 to 7 and 11 to 12,
Wherein, this flat shell is made by electrolytic copper foil; And
The uneven surface of this electrolytic copper foil constitutes the inner surface of this flat shell.
23. flat plate heat transfer device according to claim 12,
Wherein, described coarse mesh layer and fine mesh layer are formed by the braiding of mesh line, and described mesh line is made by metal, polymer or glass fibre.
24. according to each the described flat plate heat transfer device in the claim 1 to 2,5 to 7,11 to 21 and 23,
Wherein, this flat shell is made by metal, thermal conductive polymer or the metal that scribbles thermal conductive polymer.
25. flat plate heat transfer device according to claim 24,
Wherein, this metal is copper, aluminium, stainless steel, molybdenum or their alloy.
26. according to each the described flat plate heat transfer device in the claim 1 to 2,5 to 7,11 to 21 and 23,
Wherein, this flat shell utilization from laser welding, plasma welding, Wolfram Inert Gas welding, ultrasonic bonding, brazing connect, scolder welds and the set of the stacked formation of hot pressing the mode selected seal.
27. according to each the described flat plate heat transfer device in the claim 1 to 2,5 to 7,11 to 21 and 23,
Wherein, this working fluid is selected from the set that water, methyl alcohol, ethanol, acetone, ammonia, CFC working fluid, HCFC working fluid, HFC working fluid and their mixture constitute.
28. a flat plate heat transfer device comprises:
The heat conduction flat shell is installed between thermal source and the heat-sink unit, and comprises working fluid, and this working fluid evaporates the condensation by heat being dispersed into this heat-sink unit by absorbing heat from this thermal source; And
Mesh layer group is installed in this flat shell, makes the upper surface of this mesh layer group and lower surface contact with the inwall of this flat shell; And has a structure that capillary structure and coarse mesh layer are repeatedly alternately laminated and be in contact with one another, wherein this capillary structure is used for providing by capillary force the flow path of liquid, the line of this coarse mesh layer is woven into alternately and intersects up and down, be used to provide the evolving path of steam, the flow path of liquid is provided by capillary force simultaneously.
29. flat plate heat transfer device according to claim 28,
Wherein, this capillary structure is made by sintered copper, stainless steel, aluminium or nickel powder.
30. flat plate heat transfer device according to claim 28,
Wherein, this capillary structure is to make by etching polymer, silicon, silicon dioxide, copper, stainless steel, nickel or aluminium sheet.
31. flat plate heat transfer device according to claim 28,
Wherein, this capillary structure or the no more than double-layer structure of this coarse mesh layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20030085182 | 2003-11-27 | ||
| KR1020030085182 | 2003-11-27 | ||
| KR1020040022676 | 2004-04-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1887037A CN1887037A (en) | 2006-12-27 |
| CN100508708C true CN100508708C (en) | 2009-07-01 |
Family
ID=37584180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800348245A Expired - Fee Related CN100508708C (en) | 2003-11-27 | 2004-11-24 | Flat plate heat transfer device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100633922B1 (en) |
| CN (1) | CN100508708C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013139058A1 (en) * | 2012-03-22 | 2013-09-26 | 深圳市华星光电技术有限公司 | Thermal dissipation substrate and manufacturing method therefor |
| US9205515B2 (en) | 2012-03-22 | 2015-12-08 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation substrate and method for manufacturing the same |
| CN107003076A (en) * | 2014-10-28 | 2017-08-01 | 科罗拉多州立大学董事会法人团体 | The hot ground plane of based on polymer, micro manufacturing |
| US11353269B2 (en) | 2009-03-06 | 2022-06-07 | Kelvin Thermal Technologies, Inc. | Thermal ground plane |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
| US11930621B2 (en) | 2020-06-19 | 2024-03-12 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286767A (en) * | 2005-03-31 | 2006-10-19 | Hitachi Ltd | Cooling jacket |
| KR100809587B1 (en) * | 2007-02-02 | 2008-03-04 | 이용덕 | Plate heat transfer device |
| JP2010286134A (en) * | 2009-06-09 | 2010-12-24 | Sony Corp | Manufacturing method of heat transport device and heat transport device |
| CN103123234B (en) * | 2011-11-18 | 2015-10-28 | 奇鋐科技股份有限公司 | Thin heat pipe structure and forming method thereof |
| US9476652B2 (en) | 2012-01-04 | 2016-10-25 | Asia Vital Components Co., Ltd. | Thin heat pipe structure having enlarged condensing section |
| CN103019346A (en) * | 2012-12-27 | 2013-04-03 | 冯进 | Efficient heat radiation device |
| KR101497069B1 (en) * | 2013-05-24 | 2015-03-05 | 주식회사 비다스테크 | Device for pre-heating of brew group head in espresso machines |
| CN103617969B (en) * | 2013-12-04 | 2016-06-29 | 广州先艺电子科技有限公司 | A kind of weld the heat sink and preparation method thereof of gold-tin alloy thin film |
| KR101810167B1 (en) * | 2015-11-11 | 2017-12-19 | 전남대학교산학협력단 | A device for three dimensional heat absorption |
| EP3803247A4 (en) | 2018-06-11 | 2022-03-23 | The Regents of the University of Colorado, a body corporate | Single and multi-layer mesh structures for enhanced thermal transport |
| AT521573B1 (en) * | 2018-08-29 | 2020-12-15 | Miba Emobility Gmbh | Heat transfer device |
| KR102641742B1 (en) * | 2018-09-20 | 2024-02-29 | 삼성전자주식회사 | Heat dissipation device formed of non-metallic material and electronic device including the same |
| TWI692610B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 Ｊ＆Ｊ 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
| CN110783838A (en) * | 2019-11-22 | 2020-02-11 | 徐州硕途电气配件有限公司 | Power distribution cabinet closed mutual transmission type stacked cooling fin assembly in high-heat area |
| KR102620257B1 (en) * | 2021-07-20 | 2024-01-03 | 주식회사 씨지아이 | Vapor chamber and working fluid used therefor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4193188B2 (en) | 1997-02-26 | 2008-12-10 | アクトロニクス株式会社 | Thin composite plate heat pipe |
| US6037658A (en) | 1997-10-07 | 2000-03-14 | International Business Machines Corporation | Electronic package with heat transfer means |
| JP2003148822A (en) | 2001-11-12 | 2003-05-21 | Fuji Electric Co Ltd | Cold storage unit for very low temperature refrigerator |
| US6460612B1 (en) | 2002-02-12 | 2002-10-08 | Motorola, Inc. | Heat transfer device with a self adjusting wick and method of manufacturing same |
-
2004
- 2004-04-01 KR KR1020040022676A patent/KR100633922B1/en not_active IP Right Cessation
- 2004-11-24 CN CNB2004800348245A patent/CN100508708C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11353269B2 (en) | 2009-03-06 | 2022-06-07 | Kelvin Thermal Technologies, Inc. | Thermal ground plane |
| WO2013139058A1 (en) * | 2012-03-22 | 2013-09-26 | 深圳市华星光电技术有限公司 | Thermal dissipation substrate and manufacturing method therefor |
| US9205515B2 (en) | 2012-03-22 | 2015-12-08 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation substrate and method for manufacturing the same |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
| CN107003076A (en) * | 2014-10-28 | 2017-08-01 | 科罗拉多州立大学董事会法人团体 | The hot ground plane of based on polymer, micro manufacturing |
| CN107003076B (en) * | 2014-10-28 | 2019-07-26 | 科罗拉多州立大学董事会法人团体 | Hot ground plane based on polymer, micro manufacturing |
| US11930621B2 (en) | 2020-06-19 | 2024-03-12 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1887037A (en) | 2006-12-27 |
| KR100633922B1 (en) | 2006-10-16 |
| KR20050051530A (en) | 2005-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100508708C (en) | Flat plate heat transfer device | |
| CN100507429C (en) | Flat plate heat transfer device | |
| Bulut et al. | A review of vapor chambers | |
| JP2007518953A (en) | Plate heat transfer device | |
| US8596341B2 (en) | Enhanced two phase flow in heat transfer systems | |
| TWI459889B (en) | Vapor chamber | |
| JP2006503436A (en) | Plate heat transfer device and manufacturing method thereof | |
| US20070012429A1 (en) | Heat Transfer Device | |
| CN101667561B (en) | Silicon-based vapor-liquid phase separating heat radiation chip and preparation method thereof | |
| Shahsavar et al. | Numerical study of melting and solidification in a wavy double-pipe latent heat thermal energy storage system | |
| US20110088875A1 (en) | Loop heat pipe | |
| US20110088873A1 (en) | Support structure for flat-plate heat pipe | |
| JP2018115858A (en) | Cooling device, heat receiving part and ebullition part for use therein, and method for producing the same | |
| CN1849049A (en) | Flat column shape thermal tube | |
| Zuo et al. | Combined pulsating and capillary heat pipe mechanism for cooling of high heat flux electronics | |
| Tong et al. | Liquid cooling devices and their materials selection | |
| Penley et al. | Correlation of subatmospheric pressure, saturated, pool boiling of water on a structured-porous surface | |
| CN114777540A (en) | Multistage V-shaped groove liquid absorption core thermal diode and processing method thereof | |
| CN104132569B (en) | A kind of silicon-base miniature pulsating heat pipe with function channel design | |
| Rashidi et al. | Potentials of boiling heat transfer in advanced thermal energy systems | |
| Li et al. | Development of a high performance heat sink based on screen-fin technology | |
| JP4193188B2 (en) | Thin composite plate heat pipe | |
| Volodin et al. | Heat Transfer Enhancement on Multilayer Wire Mesh Coatings and Wire Mesh Coatings Combined with Other Surface Modifications—A Review | |
| CN113207271B (en) | Phase-change energy-storage type radiator | |
| JPH10220975A (en) | Composite plate heat pipe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090701 Termination date: 20121124 |