CN100426452C - 用于材料控制系统接口的方法和设备 - Google Patents
用于材料控制系统接口的方法和设备 Download PDFInfo
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- CN100426452C CN100426452C CNB2005100697172A CN200510069717A CN100426452C CN 100426452 C CN100426452 C CN 100426452C CN B2005100697172 A CNB2005100697172 A CN B2005100697172A CN 200510069717 A CN200510069717 A CN 200510069717A CN 100426452 C CN100426452 C CN 100426452C
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- carrier storage
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Images
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- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the transport system
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/0053—Cutting members therefor having a special cutting edge section or blade section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/006—Cutting members therefor the cutting blade having a special shape, e.g. a special outline, serrations
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32266—Priority orders
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
Description
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54858804P | 2004-02-28 | 2004-02-28 | |
US60/548,588 | 2004-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1681083A CN1681083A (zh) | 2005-10-12 |
CN100426452C true CN100426452C (zh) | 2008-10-15 |
Family
ID=35067599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100697172A Expired - Fee Related CN100426452C (zh) | 2004-02-28 | 2005-02-28 | 用于材料控制系统接口的方法和设备 |
Country Status (4)
Country | Link |
---|---|
US (3) | US7177716B2 (zh) |
KR (1) | KR20060043261A (zh) |
CN (1) | CN100426452C (zh) |
TW (1) | TWI316044B (zh) |
Families Citing this family (39)
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JP3975360B2 (ja) * | 2003-10-31 | 2007-09-12 | セイコーエプソン株式会社 | 供給制御システムおよび方法、プログラム並びに情報記憶媒体 |
US7720557B2 (en) * | 2003-11-06 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
US7218983B2 (en) * | 2003-11-06 | 2007-05-15 | Applied Materials, Inc. | Method and apparatus for integrating large and small lot electronic device fabrication facilities |
US20050209721A1 (en) * | 2003-11-06 | 2005-09-22 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
TW200524073A (en) * | 2003-11-13 | 2005-07-16 | Applied Materials Inc | Kinematic pin with shear member and substrate carrier for use therewith |
JP4490124B2 (ja) * | 2004-01-23 | 2010-06-23 | セイコーエプソン株式会社 | 搬送状況提示システムおよび方法、プログラム並びに情報記憶媒体 |
US7413069B2 (en) * | 2004-02-28 | 2008-08-19 | Applied Materials, Inc. | Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility |
US7177716B2 (en) * | 2004-02-28 | 2007-02-13 | Applied Materials, Inc. | Methods and apparatus for material control system interface |
US7831459B2 (en) * | 2004-03-26 | 2010-11-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for balancing production capacity |
US7477958B2 (en) * | 2005-05-11 | 2009-01-13 | International Business Machines Corporation | Method of release and product flow management for a manufacturing facility |
US8573097B2 (en) * | 2005-12-14 | 2013-11-05 | Siemens Product Lifecycle Management Software Inc. | System and method for automatic local return for lathe NC-machining cycle interruption |
KR100929944B1 (ko) * | 2006-02-07 | 2009-12-04 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치의 제어 장치 및 기판 처리 장치의 제어 프로그램을 기록한 기억 매체 |
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KR101029257B1 (ko) * | 2006-05-12 | 2011-04-18 | 무라타 기카이 가부시키가이샤 | 반송 시스템과 반송 방법 |
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DE102007025339A1 (de) * | 2007-05-31 | 2008-12-04 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter |
US20090089772A1 (en) * | 2007-09-28 | 2009-04-02 | International Business Machines Corporation | Arrangement for scheduling jobs with rules and events |
US8369976B2 (en) * | 2008-06-23 | 2013-02-05 | International Business Machines Corporation | Method for compensating for tool processing variation in the routing of wafers/lots |
US8095230B2 (en) | 2008-06-24 | 2012-01-10 | International Business Machines Corporation | Method for optimizing the routing of wafers/lots based on yield |
TWI380145B (en) * | 2008-07-25 | 2012-12-21 | Inotera Memories Inc | A cross-fab control system and a method for using the said system |
US20100162954A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Integrated facility and process chamber for substrate processing |
US8110511B2 (en) * | 2009-01-03 | 2012-02-07 | Archers Inc. | Methods and systems of transferring a substrate to minimize heat loss |
US7897525B2 (en) * | 2008-12-31 | 2011-03-01 | Archers Inc. | Methods and systems of transferring, docking and processing substrates |
US8367565B2 (en) * | 2008-12-31 | 2013-02-05 | Archers Inc. | Methods and systems of transferring, docking and processing substrates |
US20100162955A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Systems and methods for substrate processing |
US8483866B2 (en) * | 2009-04-30 | 2013-07-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Automated materials handling system having multiple categories of overhead buffers |
JP5445006B2 (ja) * | 2009-10-05 | 2014-03-19 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP5392190B2 (ja) * | 2010-06-01 | 2014-01-22 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
TWI549217B (zh) * | 2014-01-10 | 2016-09-11 | 華亞科技股份有限公司 | 載具重組系統以及載具重組方法 |
US9576834B2 (en) * | 2015-03-16 | 2017-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stocker and method for dispatching wafer carrier in stocker |
US10146439B2 (en) * | 2016-04-13 | 2018-12-04 | Samsung Electronics Co., Ltd. | System and method for high performance lockless scalable target |
CN112309887B (zh) * | 2019-07-29 | 2023-03-21 | 华润微电子(重庆)有限公司 | 晶圆制造的预派工方法、电子装置、计算机设备和系统 |
CN111276429B (zh) * | 2020-01-19 | 2021-07-20 | 长江存储科技有限责任公司 | 半导体机台控制方法、装置及存储介质 |
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US7603196B2 (en) | 2009-10-13 |
US20070124010A1 (en) | 2007-05-31 |
KR20060043261A (ko) | 2006-05-15 |
US20050273190A1 (en) | 2005-12-08 |
TWI316044B (en) | 2009-10-21 |
US20070276530A1 (en) | 2007-11-29 |
CN1681083A (zh) | 2005-10-12 |
TW200535078A (en) | 2005-11-01 |
US7177716B2 (en) | 2007-02-13 |
US7522969B2 (en) | 2009-04-21 |
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