CN100416791C - Method for placing silicon chip center on electrostatic chuck center - Google Patents
Method for placing silicon chip center on electrostatic chuck center Download PDFInfo
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- CN100416791C CN100416791C CNB200510126439XA CN200510126439A CN100416791C CN 100416791 C CN100416791 C CN 100416791C CN B200510126439X A CNB200510126439X A CN B200510126439XA CN 200510126439 A CN200510126439 A CN 200510126439A CN 100416791 C CN100416791 C CN 100416791C
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Abstract
The present invention relates to a method which ensures that a silicon chip center is placed on electrostatic chuck center by the way that two ordinary photoelectric switch sensors are installed on the connecting part of a vacuum transmission chamber and an etching reaction chamber, a silicon chip deviation position on a mechanical hand is calculated and whether the silicon chip exists on the mechanical hand or not is calculated, and the mechanical hand is guided to automatically regulate to place the silicon chip in a deviation way.
Description
Technical field
The present invention relates to a kind of method that silicon chip is centrally located in reaction equation electrostatic chuck center, particularly two normal optical electric switch transducers are installed by junction at vacuum transmission chamber and etching reaction chamber, accurately calculate silicon chip the having or not of silicon chip on the deviation position of manipulator and manipulator, instruct manipulator to adjust the deviation film releasing automatically, guarantee that silicon chip is centrally located in the method for reaction equation electrostatic chuck center.
Background technology
Diameter in standard circular is in silicon chip (for example 2R equals 300mm or the 200mm) transmission course of 2R, manipulator is transported to reaction chamber to silicon chip from atmospheric environment, the track of the manipulator that straight line moves between transmission chamber and the reaction chamber is known, and can feed back the centre coordinate position of manipulator at any time by the manipulator controller, but in the transmission course of silicon chip, whether the situation that is certain to silicon chip center and position of manipulator deviation to occur or falls sheet can not be positioned at reaction equation electrostatic chuck center thereby there is collateral security silicon chip center.In traditional solution, establish a positioning adjustment device at the propagation in atmosphere end, device is mainly by a vision, and motor and controller constitute, and in the junction of vacuum transmission chamber and reative cell a common photoelectric transducer are installed and are detected having or not of silicon chip.Yet in the vacuum end transmission course, atmosphere machinery handgrip silicon chip is placed among the LOAD LOCK, finish by vacuum mechanical-arm again and get sheet from LOAD LOCK and advance reative cell to film releasing, such process silicon chip can occur and depart from the manipulator center, thereby can not guarantee the center of silicon chip is placed on the situation at electrostatic chuck center.The present invention in light of this situation, two normal optical electric switch transducers have been installed in the junction of vacuum transmission chamber and etching reaction chamber, can accurately calculate silicon chip the having or not of silicon chip on the deviation position of manipulator and manipulator, its deviation value can instruct manipulator to adjust the deviation film releasing automatically.
Summary of the invention
A kind of center with silicon chip is placed on the method at electrostatic chuck center, two normal optical electric switch transducers are installed in junction at vacuum transmission chamber and etching reaction chamber, the i.e. first optoelectronic switch transducer S1 and the second optoelectronic switch transducer S2, wherein S1 is placed on the track of manipulator central motion of reaction chamber and transmission chamber junction, promptly be positioned on the X-axis, S2 is placed in the plane that is parallel to silicon chip on the straight line Y-axis perpendicular to X-axis, and the distance between S1, the S2 equals the radius R of silicon chip; Utilize above-mentioned first an optoelectronic switch transducer S1 to obtain the displacement L with respect to silicon chip center of S1 emission light on X-axis, just silicon chip is by the distance of optoelectronic switch transducer S1; Utilize above-mentioned second optoelectronic switch transducer S2 to judge deviant or skew down in the heart in the silicon chip; Calculate the center of silicon chip, with optoelectronic switch transducer S1 is the center of circle, R is that radius is done a circle, work is perpendicular to a center line of above-mentioned distance L, obtain two joinings of this straight line and this circumference, under the situation that silicon chip upwards is offset, the intersection point near apart from S2 is the center of circle of silicon chip, under the situation that silicon chip offsets downward, the intersection point far away apart from S2 is the center of circle of silicon chip; According to the center of leaving S1 emission light time manipulator and the silicon chip center that calculates, instruct manipulator to adjust the deviation film releasing automatically.
The above-mentioned first optoelectronic switch transducer S1 switching value signal is directly inputted to and picks up counting on the controller and go out silicon chip through the radiative distance L of S1 in the movement velocity that silicon chip blocks radiative time of S1 and manipulator.Wherein utilizing above-mentioned distance L is that zero judgement machinery does not have silicon chip on hand, and the diameter 2R that above-mentioned distance L equals silicon chip judges the skew up and down of silicon chip center, and above-mentioned distance L is judged the upper and lower skew in silicon chip center less than the diameter 2R of silicon chip.Wherein above-mentioned second optoelectronic switch transducer S2 emission light has displacement with respect to silicon chip, judges that then the silicon chip center is offset to the above-mentioned second optoelectronic switch transducer S2; Otherwise judge that the silicon chip center is offset away from the above-mentioned second optoelectronic switch transducer S2.
The S1 amount of opening the light signal also can be worked in coordination with encoder and is linked in the motion control card.The distance of L can be passed through encoder like this, and the servomotor rotational pulse of scanning manipulator is realized.
Advantage of the present invention is can accurately calculate the deviation position at silicon chip center from the vacuum transmission chamber to etching reaction chamber process and adjust automatically at silicon chip, guarantees that silicon chip is centrally located in reaction equation electrostatic chuck center, has improved etching technics.
Description of drawings
Fig. 1 is the plane graph that description silicon chip center and manipulator center do not have deviation.
Fig. 2 is described on the X-direction silicon chip centre coordinate at the plane graph on the left side of manipulator centre coordinate.
Fig. 3 is described on the X-direction silicon chip centre coordinate at the plane graph on the right of manipulator centre coordinate.
Fig. 4 is described in the plane graph that the silicon chip centre coordinate is offset up and down at the manipulator centre coordinate on the Y direction.
Fig. 5 is described in silicon chip centre coordinate direction on manipulator centre coordinate plane graph devious on X, the Y direction.
Embodiment
The track of manipulator before entering reaction chamber is constant, after having guaranteed that like this manipulator enters into reaction chamber under contraction state, the centre coordinate of manipulator remains at point (X0, Y0), and manipulator is all the time along process reaction chamber and the center that is connected the family of power and influence of transmission chamber and the rectilinear motion of point (X0, Y0).The track of the manipulator that among the present invention straight line between transmission chamber and the reaction chamber is moved can be used as the X-axis that has or not of calculating silicon chip silicon chip on the deviation position of manipulator and manipulator, the centre coordinate of manipulator can feed back to control device by the manipulator controller, and control device can be controlled the manipulator arbitrary motion.At the photoelectric sensor S1, the S2 that are fixed on two of transmission chamber and reaction chamber junction placements.Photoelectric sensor S1 detects the silicon chip center with respect to the concrete numerical value of manipulator centre deviation with judge machinery having or not of silicon chip on hand, and photoelectric sensor S2 is used for judging that whether up and down the silicon chip center with respect to the skew of manipulator center.In the firm shading light electric transducer of the silicon chip S1 emission light time, the real-time centre coordinate value of a manipulator of manipulator controller feedback is left the S1 emission light time at silicon chip, the real-time centre coordinate value of a manipulator of manipulator controller feedback.Wherein S1 is positioned on the track of manipulator of reaction chamber and transmission chamber junction, promptly be positioned on the X-axis, S2 is positioned on the straight line of plane perpendicular to X-axis that is parallel to silicon chip, distance between S1, the S2 equals the radius R of silicon chip, and promptly S2 is located at silicon chip without any under the deviation situation, when the intersection point place of S1 emission light during by the silicon chip center, Y-axis and silicon chip circumference.S1 switching value signal is directly inputted on the controller picks up counting.The movement velocity that silicon chip blocks radiative time of S1 and manipulator can be counted out silicon chip through the radiative distance L of S1.When L is zero, there is not silicon chip on the manipulator.The diameter 2R that L equals silicon chip judges the not skew up and down of silicon chip center, and L judges the upper and lower skew in silicon chip center less than the diameter 2R of silicon chip.Utilize photoelectric sensor S2 to judge that silicon chip is to go up skew or skew down.With S1 is the center of circle, and R is that radius is done a circle, makes a center line perpendicular to L, obtains two joinings of this straight line and this circumference.Under the situation that silicon chip upwards is offset, the point near apart from S2 is exactly the center of circle of silicon chip.The center that utilization calculates silicon chip when leaving S1, i.e. the centre coordinate of silicon chip, when leaving S1 in conjunction with silicon chip, the centre coordinate of manipulator (x1 y1) can draw the deviation that the manipulator center is left at the silicon chip center.Manipulator controller instructs manipulator to adjust the deviation film releasing automatically.Center in the time of also can using other mathematical methods calculating silicon chips to leave S1.
Silicon chip center and the manipulator center situation without any deviation has been described among Fig. 1.Calculation element in the manipulator controller calculates by predefined method, when silicon chip leaves the S1 emission light time, S1 emission light equals the diameter of silicon chip with respect to the displacement L of silicon chip, be L=2R, the manipulator center without any under the deviation situation that manipulator center and we that the manipulator controller feeds back set in advance is identical, just can think that without any deviation the center that at this moment calculates silicon chip should be same as the center of manipulator at this moment.
The silicon chip centre coordinate has only been described on X-direction in the situation on the left side of manipulator centre coordinate among Fig. 2.Leaving the S1 emission light time, speed V and the time of blocking S1 by manipulator draw the L value, and the silicon chip centre coordinate is on the left side of manipulator centre coordinate, and its coordinate figure calculates by S 1 coordinate and distance L.If L equals diameter 300mm, be L=2R, proof does not have last partially and down inclined to one side situation, and its silicon chip centre coordinate value is calculated real-time coordinate that silicon chip leaves the S1 emission light time and X-axis difference without any the real-time centre coordinate value of the manipulator under the deviation situation, on the occasion of being to represent the silicon chip left avertence.Deviate is the difference of silicon chip centre coordinate and real-time manipulator centre coordinate.
The silicon chip centre coordinate has only been described on X-direction in the situation on the right of manipulator centre coordinate among Fig. 3.At this moment, L=2R, silicon chip do not have last partially with inclined to one side down, and its concrete deviation value is the absolute value of their difference.Silicon chip centre coordinate value is calculated real-time coordinate that silicon chip leaves the S1 emission light time and X-axis difference without any the real-time centre coordinate value of the manipulator under the deviation situation, negative value is represented silicon chip right avertence, and deviate is the difference of silicon chip centre coordinate and real-time manipulator centre coordinate.
The situation that only the silicon chip centre coordinate is offset up and down at the manipulator centre coordinate on Y direction has been described among Fig. 4.Be positioned at S2 on the positive axis of Y-axis, silicon chip leaves the S1 emission light time, and the L value of the speed V that passes through manipulator that calculates and the time of blocking S1 is less than the diameter 2R of silicon chip, i.e. L＜2R judges in the silicon chip in the heart partially or inclined to one side down.In this case, when silicon chip upwards was offset and be not offset, S2, will be blocked by in the radiative process of S1 at silicon chip.Yet when silicon chip offset downward, the S2 point can not block.With the center that the univeral mathematics method is calculated silicon chip, be the center of circle with S1, R is that radius is done a circle, makes a center line perpendicular to L, obtains two joinings of this straight line and this circumference.Under the situation that silicon chip upwards is offset, the point near apart from S2 is exactly the center of circle of silicon chip.Under the situation that silicon chip offsets downward, the point far away apart from S2 is exactly the center of circle of silicon chip.
Equally, S2 can be placed the negative axle of Y-axis and go up (this situation is of no use to be illustrated), at this moment, under the situation that silicon chip offsets downward, the point near apart from S2 is exactly the center of circle of silicon chip.Under the situation that silicon chip upwards is offset, the point far away apart from S2 is exactly the center of circle of silicon chip.
Fig. 5 has described in the direction on the manipulator centre coordinate of silicon chip centre coordinate on X, Y direction situation devious.Two photoelectric sensors that are fixed on transmission chamber and reaction chamber junction, whether up and down one be used for judging skew, be defined as S2; Another detects the concrete numerical value of all possible deviations and judges mechanical having or not of silicon chip on hand, is defined as S1.And S1 switching value signal is directly inputted on the controller picks up counting.The movement velocity that silicon chip blocks radiative time of S1 and manipulator can be counted out silicon chip through the radiative distance L of S1.Silicon chip leaves the S1 emission light time, the relation between the diameter 2R of the speed V that passes through manipulator that calculates and the L of the time of blocking S1 and silicon chip, and whether go up partially at L＜2R decidable silicon chip center or down partially, L=2R decidable silicon chip center is skew not.The coordinate of S1 is fixed, the center in the time of can calculating silicon chip like this and leave S1.When leaving S1 in conjunction with silicon chip, the centre coordinate of manipulator can draw the silicon chip center and leave the manipulator centre deviation.Its position can be by the center of silicon chip without any the S1 under the deviation situation at silicon chip.In conjunction with the judgement of S2, the coordinate of distance L, S1 and the centre coordinate that leaves S1 emission light time manipulator calculate the value that silicon chip departs from the manipulator center.Utilize the method for above-mentioned machinery mapping or utilize other mathematical method to draw silicon chip the center when leaving S1, the centre coordinate of silicon chip when promptly silicon chip leaves S1, the centre coordinate with manipulator compares again, i.e. up and down deviate as can be known.Instruct manipulator to adjust the deviation film releasing automatically by manipulator controller.
An alternative embodiment of the invention, the S1 amount of opening the light signal also can be worked in coordination with encoder and is linked in the motion control card.The distance of L can be passed through encoder like this.The servomotor rotational pulse of scanning manipulator is realized.
Above-mentioned several embodiment is only for the usefulness that the present invention is described; and be not limitation of the present invention; the those of ordinary skill in relevant technologies field; under the situation that does not break away from spirit and scope of the present utility model; can also make various variations and modification; therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be limited by each claim.
Claims (5)
1. the center with silicon chip is placed on the method at electrostatic chuck center, it is characterized in that,
The first optoelectronic switch transducer (S1) and the second optoelectronic switch transducer (S2) are installed in the junction of vacuum transmission chamber and etching reaction chamber, wherein the first optoelectronic switch transducer (S1) is placed on the track X-axis of manipulator central motion of reaction chamber and transmission chamber junction, the second optoelectronic switch transducer (S2) is placed in the plane that is parallel to silicon chip on the straight line Y-axis perpendicular to the track of robot movement, and the distance between the first optoelectronic switch transducer (S1) and the second optoelectronic switch transducer (S2) equals the radius R of silicon chip;
Utilize the above-mentioned first optoelectronic switch transducer (S1) to obtain silicon chip through the radiative distance L of the first optoelectronic switch transducer (S1);
Utilize the above-mentioned second optoelectronic switch transducer (S2) to judge skew or skew down in the heart in the silicon chip;
Calculate the center of silicon chip, with the first optoelectronic switch transducer (S1) is the center of circle, R is that radius is done a circle, work is perpendicular to a center line of above-mentioned distance L, obtain two joinings of this center line and this circumference, under the situation that silicon chip upwards is offset, the near intersection point of the distance second optoelectronic switch transducer (S2) is the center of circle of silicon chip, under the situation that silicon chip offsets downward, the distance second optoelectronic switch transducer (S2) intersection point far away is the center of circle of silicon chip;
According to the center of leaving the first optoelectronic switch transducer (S1) emission light time manipulator and the silicon chip center that calculates, instruct manipulator to adjust the deviation film releasing automatically.
2. the method in the claim 1, wherein first optoelectronic switch transducer (S1) the switching value signal is directly inputted to and picks up counting on the controller and calculate silicon chip through the radiative distance L of the first optoelectronic switch transducer (S1) with the movement velocity that silicon chip blocks the first radiative time of optoelectronic switch transducer (S1) and manipulator.
3. the method in the claim 2, wherein utilizing above-mentioned distance L is zero to judge that machinery does not have silicon chip on hand, and above-mentioned distance L equals the diameter of silicon chip and judges the skew up and down of silicon chip center, and above-mentioned distance L is judged the upper and lower skew in silicon chip center less than the diameter of silicon chip.
4. the method in the claim 1, wherein the emission light of the second optoelectronic switch transducer (S2) has displacement with respect to silicon chip, judges that then the silicon chip center is offset to above-mentioned optoelectronic switch transducer (S2); Otherwise judge that the silicon chip center is offset away from above-mentioned optoelectronic switch transducer (S2).
5. the method in the claim 1, wherein first optoelectronic switch transducer (S1) the switching value signal also can be worked in coordination with encoder and is linked in the motion control card, and distance L can be passed through encoder, and the servomotor rotational pulse of scanning manipulator is realized.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB200510126439XA CN100416791C (en) | 2005-12-09 | 2005-12-09 | Method for placing silicon chip center on electrostatic chuck center |
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| CNB200510126439XA CN100416791C (en) | 2005-12-09 | 2005-12-09 | Method for placing silicon chip center on electrostatic chuck center |
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| CN1848401A CN1848401A (en) | 2006-10-18 |
| CN100416791C true CN100416791C (en) | 2008-09-03 |
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| US8060330B2 (en) * | 2008-12-12 | 2011-11-15 | Lam Research Corporation | Method and system for centering wafer on chuck |
| CN105300333A (en) * | 2015-11-24 | 2016-02-03 | 杭州士兰微电子股份有限公司 | Chip tester, and chip tester monitoring device and method |
| CN110860870A (en) * | 2019-11-13 | 2020-03-06 | 珠海格力智能装备有限公司 | Control method and device of elbow inserting machine |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4819167A (en) * | 1987-04-20 | 1989-04-04 | Applied Materials, Inc. | System and method for detecting the center of an integrated circuit wafer |
| US5483138A (en) * | 1992-11-12 | 1996-01-09 | Applied Materials, Inc. | System and method for automated positioning of a substrate in a processing chamber |
| JPH08124995A (en) * | 1994-10-27 | 1996-05-17 | Nec Corp | Measuring method of place of wafer and wafer alignment and method thereof |
| JPH1012707A (en) * | 1996-06-24 | 1998-01-16 | Kokusai Electric Co Ltd | Correction device for wafer misalignment in boat |
| CN1393034A (en) * | 2000-09-14 | 2003-01-22 | 奥林巴斯光学工业株式会社 | Alignment apparatus |
| US6760976B1 (en) * | 2003-01-15 | 2004-07-13 | Novellus Systems, Inc. | Method for active wafer centering using a single sensor |
| US20040167743A1 (en) * | 2002-12-20 | 2004-08-26 | Martin Hosek | System and method for on-the-fly eccentricity recognition |
| CN1684803A (en) * | 2002-05-30 | 2005-10-19 | 罗兹株式会社 | Automatic reference position teaching method, automatic positioning method, and automatic carrying method for disk-like object, automatic reference position teaching device, automatic positioning devi |
-
2005
- 2005-12-09 CN CNB200510126439XA patent/CN100416791C/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4819167A (en) * | 1987-04-20 | 1989-04-04 | Applied Materials, Inc. | System and method for detecting the center of an integrated circuit wafer |
| US5483138A (en) * | 1992-11-12 | 1996-01-09 | Applied Materials, Inc. | System and method for automated positioning of a substrate in a processing chamber |
| JPH08124995A (en) * | 1994-10-27 | 1996-05-17 | Nec Corp | Measuring method of place of wafer and wafer alignment and method thereof |
| JPH1012707A (en) * | 1996-06-24 | 1998-01-16 | Kokusai Electric Co Ltd | Correction device for wafer misalignment in boat |
| CN1393034A (en) * | 2000-09-14 | 2003-01-22 | 奥林巴斯光学工业株式会社 | Alignment apparatus |
| CN1684803A (en) * | 2002-05-30 | 2005-10-19 | 罗兹株式会社 | Automatic reference position teaching method, automatic positioning method, and automatic carrying method for disk-like object, automatic reference position teaching device, automatic positioning devi |
| US20040167743A1 (en) * | 2002-12-20 | 2004-08-26 | Martin Hosek | System and method for on-the-fly eccentricity recognition |
| US6760976B1 (en) * | 2003-01-15 | 2004-07-13 | Novellus Systems, Inc. | Method for active wafer centering using a single sensor |
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| CN1848401A (en) | 2006-10-18 |
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Address after: 100176 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100015 Jiuxianqiao East Road, Chaoyang District, Chaoyang District, Beijing Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |