CN100415943C - 工件湿法处理 - Google Patents
工件湿法处理 Download PDFInfo
- Publication number
- CN100415943C CN100415943C CNB028102150A CN02810215A CN100415943C CN 100415943 C CN100415943 C CN 100415943C CN B028102150 A CNB028102150 A CN B028102150A CN 02810215 A CN02810215 A CN 02810215A CN 100415943 C CN100415943 C CN 100415943C
- Authority
- CN
- China
- Prior art keywords
- workpiece
- sealing
- flexible finger
- margin
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/827,084 US6540899B2 (en) | 2001-04-05 | 2001-04-05 | Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces |
US09/827,084 | 2001-04-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1509348A CN1509348A (zh) | 2004-06-30 |
CN100415943C true CN100415943C (zh) | 2008-09-03 |
Family
ID=25248275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028102150A Expired - Fee Related CN100415943C (zh) | 2001-04-05 | 2002-03-15 | 工件湿法处理 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6540899B2 (zh) |
EP (1) | EP1412561B1 (zh) |
JP (1) | JP3955532B2 (zh) |
KR (1) | KR20040019286A (zh) |
CN (1) | CN100415943C (zh) |
HK (1) | HK1067157A1 (zh) |
WO (1) | WO2002081783A1 (zh) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6773560B2 (en) * | 1998-07-10 | 2004-08-10 | Semitool, Inc. | Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces |
US7645366B2 (en) * | 1999-07-12 | 2010-01-12 | Semitool, Inc. | Microelectronic workpiece holders and contact assemblies for use therewith |
JP3730836B2 (ja) * | 2000-05-24 | 2006-01-05 | 株式会社山本鍍金試験器 | 電気めっき試験器の陰極カートリッジ |
US6800187B1 (en) * | 2001-05-31 | 2004-10-05 | Novellus Systems, Inc. | Clamshell apparatus for electrochemically treating wafers |
US6551487B1 (en) | 2001-05-31 | 2003-04-22 | Novellus Systems, Inc. | Methods and apparatus for controlled-angle wafer immersion |
US20030019741A1 (en) * | 2001-07-24 | 2003-01-30 | Applied Materials, Inc. | Method and apparatus for sealing a substrate surface during an electrochemical deposition process |
US6989084B2 (en) * | 2001-11-02 | 2006-01-24 | Rockwell Scientific Licensing, Llc | Semiconductor wafer plating cell assembly |
US20040077140A1 (en) * | 2002-10-16 | 2004-04-22 | Andricacos Panayotis C. | Apparatus and method for forming uniformly thick anodized films on large substrates |
US7138039B2 (en) * | 2003-01-21 | 2006-11-21 | Applied Materials, Inc. | Liquid isolation of contact rings |
US20040140217A1 (en) * | 2003-01-22 | 2004-07-22 | Applied Materials, Inc. | Noble metal contacts for plating applications |
US7087144B2 (en) * | 2003-01-31 | 2006-08-08 | Applied Materials, Inc. | Contact ring with embedded flexible contacts |
US7445697B2 (en) * | 2003-10-22 | 2008-11-04 | Nexx Systems, Inc. | Method and apparatus for fluid processing a workpiece |
US7727366B2 (en) | 2003-10-22 | 2010-06-01 | Nexx Systems, Inc. | Balancing pressure to improve a fluid seal |
US20050092614A1 (en) * | 2003-10-29 | 2005-05-05 | Gallina Mark J. | Distributing forces for electrodeposition |
US20050283993A1 (en) * | 2004-06-18 | 2005-12-29 | Qunwei Wu | Method and apparatus for fluid processing and drying a workpiece |
US8726675B2 (en) * | 2007-09-07 | 2014-05-20 | The Boeing Company | Scalloped flexure ring |
US20090067917A1 (en) | 2007-09-07 | 2009-03-12 | The Boeing Company | Bipod Flexure Ring |
US7985325B2 (en) * | 2007-10-30 | 2011-07-26 | Novellus Systems, Inc. | Closed contact electroplating cup assembly |
US7935231B2 (en) * | 2007-10-31 | 2011-05-03 | Novellus Systems, Inc. | Rapidly cleanable electroplating cup assembly |
US10011917B2 (en) | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
US8172992B2 (en) * | 2008-12-10 | 2012-05-08 | Novellus Systems, Inc. | Wafer electroplating apparatus for reducing edge defects |
US9677188B2 (en) | 2009-06-17 | 2017-06-13 | Novellus Systems, Inc. | Electrofill vacuum plating cell |
US20100320081A1 (en) | 2009-06-17 | 2010-12-23 | Mayer Steven T | Apparatus for wetting pretreatment for enhanced damascene metal filling |
US9455139B2 (en) | 2009-06-17 | 2016-09-27 | Novellus Systems, Inc. | Methods and apparatus for wetting pretreatment for through resist metal plating |
US9138784B1 (en) | 2009-12-18 | 2015-09-22 | Novellus Systems, Inc. | Deionized water conditioning system and methods |
US9385035B2 (en) | 2010-05-24 | 2016-07-05 | Novellus Systems, Inc. | Current ramping and current pulsing entry of substrates for electroplating |
US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
US9221081B1 (en) | 2011-08-01 | 2015-12-29 | Novellus Systems, Inc. | Automated cleaning of wafer plating assembly |
US9988734B2 (en) | 2011-08-15 | 2018-06-05 | Lam Research Corporation | Lipseals and contact elements for semiconductor electroplating apparatuses |
US10066311B2 (en) | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
US9228270B2 (en) | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
US9309603B2 (en) | 2011-09-14 | 2016-04-12 | Applied Materials, Inc | Component cleaning in a metal plating apparatus |
JP5782398B2 (ja) * | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
WO2013148890A1 (en) | 2012-03-28 | 2013-10-03 | Novellus Systems, Inc. | Methods and apparatuses for cleaning electroplating substrate holders |
KR102092416B1 (ko) | 2012-03-30 | 2020-03-24 | 노벨러스 시스템즈, 인코포레이티드 | 역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝 |
US10416092B2 (en) | 2013-02-15 | 2019-09-17 | Lam Research Corporation | Remote detection of plating on wafer holding apparatus |
US9746427B2 (en) | 2013-02-15 | 2017-08-29 | Novellus Systems, Inc. | Detection of plating on wafer holding apparatus |
KR101467475B1 (ko) * | 2013-02-18 | 2014-12-01 | 주식회사 윌비에스엔티 | 전기 도금 장치의 콘택트 링 |
US9613833B2 (en) | 2013-02-20 | 2017-04-04 | Novellus Systems, Inc. | Methods and apparatus for wetting pretreatment for through resist metal plating |
US9435049B2 (en) | 2013-11-20 | 2016-09-06 | Lam Research Corporation | Alkaline pretreatment for electroplating |
CN106471162B (zh) * | 2014-06-26 | 2018-09-25 | 株式会社村田制作所 | 电镀用夹具 |
JP6078186B2 (ja) * | 2014-12-24 | 2017-02-08 | 株式会社荏原製作所 | めっき装置 |
US9481942B2 (en) | 2015-02-03 | 2016-11-01 | Lam Research Corporation | Geometry and process optimization for ultra-high RPM plating |
US9617648B2 (en) | 2015-03-04 | 2017-04-11 | Lam Research Corporation | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias |
US10053793B2 (en) * | 2015-07-09 | 2018-08-21 | Lam Research Corporation | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
US10113245B2 (en) * | 2016-03-24 | 2018-10-30 | Applied Materials, Inc. | Electroplating contact ring with radially offset contact fingers |
US11274377B2 (en) * | 2018-04-20 | 2022-03-15 | Applied Materials, Inc. | Seal apparatus for an electroplating system |
US11201079B2 (en) * | 2018-05-30 | 2021-12-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer chuck |
CN110735175B (zh) * | 2019-10-27 | 2020-08-14 | 国营四达机械制造公司 | 一种襟翼滑轨镀铬夹具及方法 |
US11791192B2 (en) * | 2020-01-19 | 2023-10-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Workpiece holder, wafer chuck, wafer holding method |
US20230009502A1 (en) * | 2021-07-09 | 2023-01-12 | Medtronic, Inc. | Electrical contact for a medical device lead |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5227041A (en) * | 1992-06-12 | 1993-07-13 | Digital Equipment Corporation | Dry contact electroplating apparatus |
WO2000003072A1 (en) * | 1998-07-10 | 2000-01-20 | Semitool, Inc. | Method and apparatus for copper plating using electroless plating and electroplating |
EP1010780A2 (en) * | 1998-11-30 | 2000-06-21 | Applied Materials, Inc. | Cathode contact ring for electrochemical deposition |
US6193859B1 (en) * | 1997-11-13 | 2001-02-27 | Novellus Systems, Inc. | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5316278A (en) * | 1992-09-18 | 1994-05-31 | Applied Materials, Inc. | Clamping ring apparatus for processing semiconductor wafers |
US6080291A (en) * | 1998-07-10 | 2000-06-27 | Semitool, Inc. | Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member |
US6217734B1 (en) * | 1999-02-23 | 2001-04-17 | International Business Machines Corporation | Electroplating electrical contacts |
JP2000277460A (ja) * | 1999-03-24 | 2000-10-06 | Shin Etsu Polymer Co Ltd | 薄膜形成装置及びそのコンタクト治具の製造方法 |
JP3916340B2 (ja) * | 1999-03-24 | 2007-05-16 | 信越ポリマー株式会社 | 薄膜形成装置及びそのコンタクト治具の製造方法 |
JP2001323397A (ja) * | 2000-05-12 | 2001-11-22 | Shin Etsu Polymer Co Ltd | 薄膜形成装置及びそのコンタクト治具の製造方法 |
JP2002069698A (ja) * | 2000-08-31 | 2002-03-08 | Tokyo Electron Ltd | 液処理装置及び液処理方法 |
-
2001
- 2001-04-05 US US09/827,084 patent/US6540899B2/en not_active Expired - Lifetime
-
2002
- 2002-03-15 KR KR10-2003-7013050A patent/KR20040019286A/ko not_active Application Discontinuation
- 2002-03-15 EP EP02703809.0A patent/EP1412561B1/en not_active Expired - Lifetime
- 2002-03-15 JP JP2002579542A patent/JP3955532B2/ja not_active Expired - Lifetime
- 2002-03-15 CN CNB028102150A patent/CN100415943C/zh not_active Expired - Fee Related
- 2002-03-15 WO PCT/IB2002/000779 patent/WO2002081783A1/en active Application Filing
-
2004
- 2004-12-22 HK HK04110152.9A patent/HK1067157A1/xx not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5227041A (en) * | 1992-06-12 | 1993-07-13 | Digital Equipment Corporation | Dry contact electroplating apparatus |
US6193859B1 (en) * | 1997-11-13 | 2001-02-27 | Novellus Systems, Inc. | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating |
WO2000003072A1 (en) * | 1998-07-10 | 2000-01-20 | Semitool, Inc. | Method and apparatus for copper plating using electroless plating and electroplating |
EP1010780A2 (en) * | 1998-11-30 | 2000-06-21 | Applied Materials, Inc. | Cathode contact ring for electrochemical deposition |
Also Published As
Publication number | Publication date |
---|---|
WO2002081783A1 (en) | 2002-10-17 |
KR20040019286A (ko) | 2004-03-05 |
US6540899B2 (en) | 2003-04-01 |
JP3955532B2 (ja) | 2007-08-08 |
JP2004525263A (ja) | 2004-08-19 |
HK1067157A1 (en) | 2005-04-01 |
CN1509348A (zh) | 2004-06-30 |
EP1412561B1 (en) | 2017-02-15 |
US20020144900A1 (en) | 2002-10-10 |
EP1412561A1 (en) | 2004-04-28 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1067157 Country of ref document: HK |
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ASS | Succession or assignment of patent right |
Owner name: WITH FOX SYSTEMS INC. Free format text: FORMER OWNER: ALL WET TECHNOLOGY INC. Effective date: 20060825 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20060825 Address after: Massachusetts USA Applicant after: Nexx Systems Inc. Address before: Massachusetts USA Applicant before: All Wet Technology Inc. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080903 Termination date: 20170315 |