CN100403477C - Solid-state battery-powered devices and manufacturing methods - Google Patents

Solid-state battery-powered devices and manufacturing methods Download PDF

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Publication number
CN100403477C
CN100403477C CNB2003801100863A CN200380110086A CN100403477C CN 100403477 C CN100403477 C CN 100403477C CN B2003801100863 A CNB2003801100863 A CN B2003801100863A CN 200380110086 A CN200380110086 A CN 200380110086A CN 100403477 C CN100403477 C CN 100403477C
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CN
China
Prior art keywords
substrate
switch
cantilever beam
circuit
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2003801100863A
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Chinese (zh)
Other versions
CN1757086A (en
Inventor
马克·L·詹森
乔迪·J·克拉森
斯图尔特·K·沙克斯皮尔
詹姆斯·R·沙利文
里查德·E·比利翁
查理·A·勒迈尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CYMBET公司
Integrated Power Solutions Inc
Original Assignee
Integrated Power Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/336,621 external-priority patent/US7294209B2/en
Priority claimed from US10/336,620 external-priority patent/US6906436B2/en
Priority claimed from US10/336,662 external-priority patent/US7603144B2/en
Priority claimed from US10/336,619 external-priority patent/US20040131760A1/en
Application filed by Integrated Power Solutions Inc filed Critical Integrated Power Solutions Inc
Publication of CN1757086A publication Critical patent/CN1757086A/en
Application granted granted Critical
Publication of CN100403477C publication Critical patent/CN100403477C/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H35/00—Switches operated by change of a physical condition
    • H01H35/14—Switches operated by change of acceleration, e.g. by shock or vibration, inertia switch
    • H01H35/145—Switches operated by change of acceleration, e.g. by shock or vibration, inertia switch operated by a particular acceleration-time function
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H83/00—Protective switches, e.g. circuit-breaking switches, or protective relays operated by abnormal electrical conditions otherwise than solely by excess current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0436—Small-sized flat cells or batteries for portable equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/058—Construction or manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/40—Printed batteries, e.g. thin film batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/08—Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/84—Processes for the manufacture of hybrid or EDL capacitors, or components thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H2037/008—Micromechanical switches operated thermally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H35/00—Switches operated by change of a physical condition
    • H01H35/14—Switches operated by change of acceleration, e.g. by shock or vibration, inertia switch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/056—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes
    • H01M10/0561—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes the electrolyte being constituted of inorganic materials only
    • H01M10/0562—Solid materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
    • H01M2004/027—Negative electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
    • H01M2004/028—Positive electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2300/00—Electrolytes
    • H01M2300/0017—Non-aqueous electrolytes
    • H01M2300/0065—Solid electrolytes
    • H01M2300/0068—Solid electrolytes inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2300/00—Electrolytes
    • H01M2300/0017—Non-aqueous electrolytes
    • H01M2300/0065—Solid electrolytes
    • H01M2300/0068—Solid electrolytes inorganic
    • H01M2300/0071—Oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/36—Selection of substances as active materials, active masses, active liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/36—Selection of substances as active materials, active masses, active liquids
    • H01M4/48—Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides
    • H01M4/52—Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron
    • H01M4/525—Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/102—Primary casings, jackets or wrappings of a single cell or a single battery characterised by their shape or physical structure
    • H01M50/11—Primary casings, jackets or wrappings of a single cell or a single battery characterised by their shape or physical structure having a structure in the form of a chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

A system includes a thin-film battery and an activity-activated switch. The system is placed on a substrate with an adhesive backing. In some embodiments, the substrate is flexible. Also formed on the substrate is an electrical circuit that includes electronics. The activity-activated switch places the thin-film battery in electrical communication with the circuit and electronics. The battery and the circuit are formed on the substrate and may be comprised of one or a plurality of deposited layers.

Description

Solid-state battery-powered devices and manufacture method thereof
Technical field
The present invention relates to device integrated that a kind of solid-state energy storage device and these have activity-triggered switch and circuit.More particularly, the present invention relates to a kind of give different equipment provide solid-state energy storage device (as, battery) method and system, in certain embodiments, this solid-state energy storage device can automatically be activated in the time a little later, and/or active radio frequency (RF) Mk system that provides a kind of bar-rod to use.The invention still further relates to the solid-state energy storage device of film that a kind of substrate net that uses the reel-to-reel type to move mask and/or move with independent controlled velocity at deposition station forms.
Background technology
Electronic equipment has been applied to many portable sets, in computer, mobile phone, tracking system and scanner etc.A shortcoming of portable equipment is the power supply that need comprise to its power supply.Portable equipment uses battery as its power supply usually.Battery must have the power supply at least for a long time when can use to equipment of enough capacity.The common quality of enough battery capacities of use galvanic cell commonly used is heavy, volume is big, can not be applied in the compact package.Another shortcoming is must manually connect when counting the battery use extremely greatly.In many application, a kind of demand is arranged: promptly can automatically be connected in response to some incident or burst process battery.
In the Sign Board of little profiles such as electronic equipment has been applied to that many properties are followed the tracks of, maintained secrecy, finance and storage.The common method of Sign Board generally includes inactive component, promptly from external resource, for example from receiving the RF energy, receives the equipment of its power supply.This has just limited the function of mark.The shortcoming of using battery is exactly that battery must have enough capacity powering at least for a long time to the equipment in using.Having enough battery capacities may cause power supply to be compared with other parts of equipment seeming quality heavy or volume is big.In other words, the common volume of battery commonly used is quite big, can not be encased in compact package, in Sign Board.
Today, exhausted big number battery price is very expensive.The result is that economic factor has stoped the extensive use of battery, because the retailer seldom considers to provide battery as the packed part relevant with many article at present.Usually, battery can be used as the part of shipment product and does not assign to provide as encapsulation.
Summary of the invention
Some embodiments of the present invention provide a kind of hull cell and a kind of active actuation switch.For example, a kind of system comprises: substrate, the circuit that is connected with substrate is with the hull cell that is connected and is connected with circuit with substrate.This hull cell is given circuit supply.Quickening starting switch also is connected with substrate with this circuit of energy electric actuation.In certain embodiments, this acceleration starting switch is a kind of MEMS equipment.In certain embodiments, this acceleration starting switch comprises a cantilever beam at least.Described at least one cantilever beam is in response to quickening the contact electric contact.In another embodiment, this acceleration starting switch comprises a cantilever beam and an electric contact at least.At least one cantilever beam contacts this electric contact in response to acceleration.In another embodiment, this acceleration starting switch comprises the first cantilever beam Closing Switch and the second cantilever beam Closing Switch.The first cantilever beam Closing Switch is quickened to form in response to first and is electrically contacted, and the second cantilever beam Closing Switch is quickened to form in response to second and electrically contacted.First acceleration and second is quickened different.In another embodiment, this acceleration starting switch quickens to form in response to first and electrically contacts, and quickens to form in response to second to electrically contact.First acceleration and second is quickened different.In yet another embodiment, first quicken starting switch in response to any acceleration start-up circuit differently in two Different Plane.The first cantilever beam Closing Switch is quickened to form in response to first in first plane and is electrically contacted, and the second cantilever beam Closing Switch is quickened to form in response to second in second plane and electrically contacted.
Some embodiment also comprise memory and/or timer.Timer writes down one of them first cantilever beam Closing Switch in response to first time that quicken to form when electrically contacting, and perhaps the second cantilever beam Closing Switch is in response to second time of quickening to form when electrically contacting, and this time is stored in the memory.Time when the time when in certain embodiments, another first cantilever beam Closing Switch electrically contacts in response to the first acceleration formation or the second cantilever beam Closing Switch electrically contact in response to the second acceleration formation is stored in the memory.
In certain embodiments, the battery splash is on substrate, and circuit is formed on the battery.In another embodiment, the circuit splash is on substrate, on the battery splash system circuit.In yet another embodiment, this system is installed in as in the encapsulation or the equipment of ammunition.In another embodiment, the bonding substrate of adhesive, wherein this system is adhered to this equipment.The bonding substrate of adhesive.
Some embodiment comprise substrate and the hull cell that is positioned on this substrate.Hull cell also comprises first lead-in wire, carries out first electric contact of electric connection with first lead-in wire, second lead-in wire and second electric contact that communicates with second lead-in wire.This system also comprise with substrate on first lead-in wire and second one of them active actuation switch that is connected that goes between, be used for this hull cell is electrically connected with first electric contact and second electric contact.The bonding substrate of adhesive.Active actuation switch activated in response to acceleration.In certain embodiments, active actuation switch activated in response to magnetic field.In another embodiment, active actuation switch activated in response to moisture.In yet another embodiment, active actuation switch activated in response to wireless signal.In going back an embodiment, active actuation switch activated in response to pressure.In another embodiment, active actuation switch activated in response to light.This system also comprises the electronic equipment that is connected with second lead-in wire with first lead-in wire.Electronic equipment also is connected with substrate.In certain embodiments, electronic equipment is connected on the substrate, and hull cell is connected on the electronic equipment.In another embodiment, hull cell is connected on the substrate, and the part of electronic equipment is connected on the hull cell at least.Active actuation switch uses microelectronic manufacturing technology and forms.
Some embodiment provide a kind of method, comprising: start active actuation switch so that hull cell communicates with one group of electronic equipment; The electronic equipment guiding ammunition (ordinance) that use is powered.Another kind method comprises: start active actuation switch so that hull cell communicates with one group of electronic equipment; The zero-time of the electronic equipment storage guarantee that use is powered.In certain embodiments, start active actuation switch and be included in the active actuation switch of acceleration startup on the selected level.In another embodiment, this method also comprises the execution self check, and in response to starting active actuation switch storage self-detection result.In other embodiments, store other acceleration.Also write down and surpass the relevant time of other acceleration of selected threshold value.To other accelerating time of this time can with other cycle, as the time that the owner of cargo occupies this active actuation switch, compare.
Advantage is, comprise one or more batteries and start or activate the equipment of battery or battery pack, and the system of circuit can form on the film, and can be placed in compact package or the product.In addition, battery pack, actuating device and circuit can be formed on the film that has adhesive above it, so that this encapsulation comes down to a kind ofly can be placed on outer package, perhaps place with the packing of product, perhaps are placed on the Sign Board on product or the equipment.A kind of complete system can also install in product or equipment with profile that can control appliance or write down the information of relevant product or equipment.Start or actuating device can time response after a while in the incident starting switch.This system needn't carry out manual activation.On the contrary, this system responses can automatically be activated in incident, as rapid acceleration (opening fire), acceleration (as selected stock) or middle acceleration (as dropping on the floor) slowly.
The price of this whole system is not expensive.Therefore, these systems can have application foundation widely.The result is, manufacturer, whole seller and or even the retailer so a kind of system can both be provided, it can either be installed on the equipment, again can be as the part of the packing relevant with many equipment or product.In addition, these system bulk are little, in light weight, and enough energy storage can be provided and can realize at least a function.This system be make by non-toxic material so that can not produce harm when using with product or equipment.
In certain embodiments, the invention provides a kind of reel-to-reel depositing system that uses the reel-to-reel mask, this reel-to-reel mask has many different mask patterns so that different electroless copper deposition operation is used.The protection object that is intended that patent application of the present invention of summary of the present invention provides a kind of summary.It is not to the invention provides a kind of explanation proprietary or limit.Here the detailed description that is comprised is to be used for providing more information to the protection object of patent application of the present invention.
Description of drawings
Figure 1A is the cross sectional view according to energy storage device of the present invention.
Figure 1B is the cross sectional view according to another embodiment of energy storage device of the present invention.
Fig. 1 C is the cross sectional view according to energy storage device of the present invention.
Fig. 1 D is the cross sectional view according to energy storage device of the present invention and super-capacitor.
Fig. 2 A is the flow chart of the embodiment of the manufacture process of instruction according to the present invention.
Fig. 2 B is the flow chart of the embodiment of the manufacture process of instruction according to the present invention.
Fig. 2 C is the flow chart of the embodiment of the manufacture process of instruction according to the present invention.
Fig. 3 A is a kind of view of making the equipment of hull cell of the instruction according to the present invention.
Fig. 3 B is a kind of view of making the equipment of hull cell of the instruction according to the present invention.
Fig. 4 is the view of another embodiment of a kind of equipment of making hull cell of the instruction according to the present invention.
Fig. 5 A is the view of another embodiment of a kind of equipment of making hull cell of the instruction according to the present invention.
Fig. 5 B is the view of another embodiment of a kind of equipment of making hull cell of the instruction according to the present invention.
Fig. 6 is the view of another embodiment of a kind of equipment of making hull cell of the instruction according to the present invention.
Fig. 7 is the view of another embodiment of a kind of equipment of making hull cell of the instruction according to the present invention.
Fig. 8 A represents to have the plan view of initial substrate of the embodiment of the integrated battery of having shared common terminal and equipment.
Fig. 8 B is illustrated in deposition and shares the plan view of substrate shown in Fig. 8 A after the integrated battery of common terminal and the equipment.
Fig. 8 C is illustrated in the plan view of substrate shown in the 8B after the chip of the independent manufacturing that placement and the wiring and the integrated battery of shared common terminal be connected with equipment.
Fig. 8 D is illustrated in the loop antenna plan view of substrate shown in Fig. 8 C afterwards of placing and connect up.
Fig. 8 E represents that the top sealant has been deposited the plan view of substrate shown in Fig. 8 D afterwards.
The front view of the initial substrate of Fig. 8 F presentation graphs 8A.
The front view of local structure equipment shown in Fig. 8 G presentation graphs 8B.
The front view of local structure equipment shown in Fig. 8 H presentation graphs 8C.
The front view of local structure equipment shown in Fig. 8 I presentation graphs 8D.
The front view of Fig. 8 J presentation graphs 8E apparatus shown.
Fig. 8 K is illustrated in the perspective view that magnetic fills Fig. 8 E apparatus shown at station again.
Fig. 8 L is illustrated in the perspective view that light fills Fig. 8 E apparatus shown at station again.
Fig. 8 M is illustrated in the roughly view that wireless wave fills Fig. 8 E apparatus shown at station again.
Fig. 9 A represents to comprise the roughly view of the system of battery, circuit and activity-triggered switch, and wherein the activity-triggered switch is shown in an open position.
Fig. 9 B represents to comprise the roughly view of the system of battery, circuit and activity-triggered switch, and wherein the activity-triggered switch is in the close position.
Fig. 9 C represents to comprise the roughly view of the system of battery, circuit and activity-triggered switch, and wherein the activity-triggered switch is shown in an open position, and circuit comprises memory section and timing portion.
Fig. 9 D represents to comprise the roughly view of the system of battery, circuit and activity-triggered switch, and wherein the activity-triggered switch is shown in an open position, and circuit comprises memory section, timing portion and processor portion.
The flow chart of the method for operation of system shown in Figure 10 presentation graphs 9A-9D.
Figure 11 represents to have the roughly view of the system of battery and activity-triggered switch.
Figure 12 A represents the vertical view of an embodiment of activity-triggered switch.
The end view of the embodiment of the activity-triggered switch shown in Figure 12 B presentation graphs 12A.
Figure 13 represents to comprise and is used at X, detects another embodiment of the activity-triggered switch of the part of quickening on Y and the Z axle.
Figure 14 A represents to comprise an embodiment of the Sign Board of the system with activity-triggered switch.
Figure 14 B represents to comprise another embodiment of the Sign Board of the system with activity-triggered switch.
Figure 15 represents to comprise the ammunition of the system with activity-triggered switch.
Figure 16 A represents the top view by an embodiment of the activity-triggered switch of magnetic field actuating.
The end view of the embodiment of the activity-triggered switch shown in Figure 16 B presentation graphs 16A.
Figure 17 represents an embodiment of pressure sensing activity-triggered switch.
Figure 18 represents an embodiment of moisture sensed activity trigger switch.
Figure 19 represents an embodiment of RF-trigger switch.
Figure 20 represents another embodiment of activity-triggered switch.
Figure 21 A represents the perspective view of radio mark system.
Figure 21 B represents the perspective view of another embodiment of radio-frequency (RF) identification (RFID) equipment.
Figure 21 C represents the perspective view of another embodiment of RFID equipment.
Figure 21 D represents the perspective view of another embodiment of RFID equipment.
Figure 21 E represents the perspective view of another embodiment of RFID equipment.
Figure 21 F represents the cross sectional view of an embodiment of adhesive on the flexible substrate.
Figure 22 is illustrated in the cross sectional view of an embodiment of the battery that forms on the flexible substrate.
Figure 23 A represents the roughly view of RFID equipment.
Figure 23 B represents the roughly view of another embodiment of RFID equipment.
Figure 24 A represents to use an embodiment of the transportation Sign Board of RFID equipment.
Figure 24 B represents to use an embodiment of the product mark board of RFID equipment.
Figure 25 A represents to use the flow chart of a kind of method of RFID equipment.
Figure 25 B represents to use the flow chart of another embodiment of a kind of method of RFID equipment.
Figure 25 C represents to use the flow chart of another embodiment of a kind of method of RFID equipment.
Figure 25 D represents to use the flow chart of another embodiment of a kind of method of RFID equipment.
Figure 25 E represents to use the flow chart of another embodiment of a kind of method of RFID equipment.
Figure 26 A represents to form the flow chart of a kind of method of RFID equipment.
Figure 26 B represents to form the flow chart of another embodiment of a kind of method of RFID equipment.
Figure 27 represents that a kind of formation comprises the view of scheme of the RFID equipment of roll extrusion releasing layer.
Figure 28 A represents to make the cross sectional view of the system of RFID equipment.
Figure 28 B represents the another kind of view of the system of the RFID equipment shown in the shop drawings 28A.
Figure 29 A represents to make the cross sectional view of an embodiment of the system of RFID equipment.
Figure 29 B represents the another kind of view of the system of the RFID equipment shown in the shop drawings 29A.
In these accompanying drawings, reference number identical in several accompanying drawings is represented identical parts in fact.Signal can be described with identical reference number with being connected also, and its implication will be appreciated that from contextual description.
Embodiment
Below in the detailed description of preferred embodiment, will be with reference to forming its a part of accompanying drawing, wherein accompanying drawing shows by implementing explanation of the present invention and specific embodiment.Should be understood that: other embodiment also can use, and can modify its structure under the situation that does not break away from protection range of the present invention.
Should be understood that: in different embodiments of the invention, each battery pack in accompanying drawing or the description can realize that if use a plurality of cell devices to realize, cell device can carry out serial or parallel connection with lead by using one or more cell devices.Therefore, if describe or show a battery pack or a plurality of element, other embodiment just uses the single battery element, if describe or show the single battery element, other embodiment just uses a battery pack or a plurality of cell device.And, to relational language, refer to illustrative as quoting of top, bottom, top, bottom and other relational language and point to usefulness, as using in the accompanying drawings, not necessarily the sensing of using in manufacturing or use is used.
Here employed term " wafer " and " substrate " comprise any structure that has film or be deposited upon the exposed surface above it, for example, and can form integrated circuit (IC) structure or energy storage device.Term " substrate " can be understood to include semiconductor wafer, plastic film, sheet metal, molded plastics shell and can make other structure of energy storage device according to instruction of the present invention in the above.Term " substrate " also is used for relating to the structure that the processing process had comprised in the above before or formed subsequently other layer.In certain embodiments, the epitaxial semiconductor layer that wafer and substrate comprise doping and unadulterated semiconductor, supported by base semiconductor or insulator, and other semiconductor structure well known to those skilled in the art." substrate " also can be used as any any beginning material that uses with manufacture method described herein of description here.
Term used herein " battery pack " refers to an example of energy storage device.Battery pack can be formed by the battery unit of single battery unit perhaps many serial or parallel connections.Battery unit is with chemical energy, as the ion energy, is converted to the primary cell unit of electric energy.Battery unit generally includes two electrodes that dissimilar material forms, the electrolyte mutually insulated that they can move by ion.
Term used herein " task " relates to software or firmware program, state machine widely and/or be suitable for carrying out the combinational logic of specific function when operation or operation.Term used herein " adatom " relates to particle, molecule or the ion that does not also form the material of structure or film.
Term used herein " insertion " relates to and allows ion to move into easily and move out material and material does not change the material properties of its phase.Therefore, solid-state insertion film remains on solid-state state in the process of energy storage device discharge and charging.Term used herein " radio frequency (RF) " comprises, if the low-down frequency electromagnetic signal that coupled of mutual inductance for example, and frequency range would be from kHz to MHz and the wireless transmission signal of GHz.
Figure 1A represents an embodiment of the energy storage device 50 according to the present invention.A substrate 55 is set, forms contact membranes 57 in the above.Contact membranes 57 is used as current collector, and is connected with lead-in wire 58, and in certain embodiments, lead-in wire 58 utmost points with energy storage device 50 are connected with external circuit.In certain embodiments, electronic circuit is fixed on the battery pack of formation like this.In other embodiments, circuit can for example, not be fixed on the battery pack of formation like this away from battery pack.On contact membranes 57, form electrode film 59.In certain embodiments, electrode film 59 covers the surface of contact membranes 57 basically, making resistance become minimum by making the interfacial area maximization between the film.In certain embodiments, electrode film 59 is negative electrodes of hull cell.In other embodiments, electrode film 59 is electrodes of super-capacitor.On electrode film 59, form dielectric film 61.On dielectric film 61, form electrode film 63.On electrode film 63, form contact membranes 65.Contact membranes 65 is used as current collector, and is connected with lead-in wire 67, and lead-in wire 67 utmost points with energy storage device 50 are connected with external circuit.In certain embodiments, contact membranes 65 is the surface of coated electrode film 63 basically, making resistance become minimum by making the interfacial area maximization between these films.In certain embodiments, electrode film 63 is anodes of hull cell.In other embodiments, electrode film 63 is electrodes of super-capacitor.
Figure 1B represents another embodiment of energy storage device 50.Embodiment shown in this certain embodiments and Figure 1A is closely related, and therefore, for the sake of brevity, their difference only is discussed here.The main difference point is that adhesive phase 56 is positioned on the substrate 55.Be noted that adhesive 56 may be the adhesive that comprises any kind of releasable adhesive or permanent adhesives.In certain embodiments, adhesive phase 50 is a kind of by the sticking type adhesive of stripping of release paper or plastic membranous layer 156 coverings.In certain embodiments, adhesive phase 56 covers the surface of entire substrate 55, and in other embodiments, adhesive phase only covers the part of substrate surface 55.In other embodiments, adhesive 56 is fixed on the energy storage device 50 (as, the top of contact membranes 65), and is not directly fixed on the substrate 55.
Fig. 1 C is the cross sectional view of an embodiment of energy storage device 50C.Substrate 55 is set, and in certain embodiments, substrate 55 comprises extra play and/or the equipment that therewith forms.As below will discussing and show, such miscellaneous equipment comprises activity-triggered switch and circuit.In certain embodiments, battery pack, or energy storage device, or miscellaneous equipment is formed on the battery pack or on the top.In other embodiments, battery pack is formed on circuit, or on circuit and the active actuating top of opening.In certain embodiments, substrate 55 comprises that other locates described substrate with this paper as mentioned above.Contact membranes 57 and electrode 59 are formed on the substrate 55 according to method as herein described.In certain embodiments, contact membranes 57 and electrode 59 are metal films, and it is deposited on the substrate according to other method well known in the art.Contact membranes 57 is used as the contact that energy storage device 50C is connected with other circuit element (not shown) with electrode 59.
On contact membranes 57, form electrode first film 59.In certain embodiments, for example, among the hull cell group embodiment, electrode first film 59 comprises metal or sandwich material, and wherein electrode first film 59 is as negative electrode.In certain embodiments, electrode first film 59 comprises metal and/or lithium intercalation material.In other embodiments, in super-capacitor, electrode first film 59 is metal oxides.Wish to make the contact interface maximization between electrode first film 59 and the contact membranes 57.Therefore, in certain embodiments, electrode first film 59 covers contact membranes 57 basically, except being the reserved part that is connected with external circuit.
Dielectric film 61C is formed on, or is formed on electrode first film 59 to small part, in certain embodiments, and dielectric film 61C complete closed electrode first film 59.Dielectric film 61C forms by using system and method as herein described.In certain embodiments, first material of dielectric film 61C first source of using deposits, and on the substrate position is guided first electrolyte (adatom) in first source, or guides certain position on electrode first film 59 shown in Fig. 1 C into.
On dielectric film 61C, form electrode second film 63.Dielectric film 61C keeps apart electrode first film 59 fully with electrode second film 63.In certain embodiments, for example, among the hull cell group embodiment, electrode second film 63 comprises metal or sandwich material, and wherein electrode second film is an anode.In other embodiments, in super-capacitor, electrode second film 63 is metal oxides.In certain embodiments, electrode second film 63 deposits according to method as herein described.In other embodiments, electrode second film 63 forms according to method well known in the art.
Comprise electrolyte as the dielectric film 61C that is deposited.In certain embodiments, first source of electrolyte (as, source 311,511 as herein described, 511A and 711) be the physical vapour deposition (PVD) source.In another embodiment, first source is the chemical vapour deposition (CVD) source.Second source offers this position with the particle of energizing.The particle hits of energizing helps the structure of these required dielectric film 61C on electrolyte.In certain embodiments, second source provides the particle of energizing to first source of supplying with electrolyte simultaneously.The use of the particle of energizing makes dielectric film 61C consistent with electrode first film 59, so that dielectric film provides necessary insulation attribute, prevent that promptly electronics from directly moving between electrode first film 59 and electrode second film 63, promptly avoid shortening electrode, ion (that is lithium ion) (according to equipment moving direction of charge or discharge whether) between negative electrode 59 and anode 63 is moved.In certain embodiments, electrode 59 is designated as " anode ", and electrode 63 is designated as " negative electrode ", and conversion is being charged and the ion moving direction that is discharging thus.In certain embodiments, second source is an ion source as herein described, as source 313,413 or 713.Second source offers electrolyte from first source with the ion of energizing of energize.The energy of supplying with by ion helps to make formed dielectric film 61C consistent with electrode ground floor 59.Can believe the migration expansion phase that the growth electrolyte is provided on the priority of use cephacoria surface of the particle of energizing in energy range as herein described, this migration expansion phase permission electrolyte is grown in a kind of more free of contamination mode.
In certain embodiments, the formation of wishing dielectric film 61C as far as possible thin (" ultra-thin ") so that reduce its effect to the energy storage device internal resistance.Also wish to keep the electrolyte attribute of block electrons stream (will cause negative electrode not reach anode), allow to provide the ion flow of battery pack function to cross electrolyte again simultaneously.By using system and method as herein described, dielectric film 61C forms about thickness 61C ' less than 5000 dusts.In certain embodiments, the thickness of dielectric film 61C is approximately less than 1000 dusts.In certain embodiments, the thickness 61C ' of dielectric film 61C is approximately less than 500 dusts.In certain embodiments, the thickness 61C ' of dielectric film 61C is approximately less than 250 dusts.In certain embodiments, the thickness 61C ' of dielectric film 61C is approximately less than 100 dusts.In certain embodiments, the thickness 61C ' scope of dielectric film 61C is approximately between 10 dusts and 200 dusts.In certain embodiments, the thickness 61C ' scope of dielectric film 61C is approximately between 10 dusts and 100 dusts.
In certain embodiments, dielectric film 61C comprises LiPON, and forms with second source 313 or 413 by first source 311 of using.Just as used herein like that, LiPON typically refers to from the phosphorus oxymtride material.An example is Li 3PO 4N.In order to improve lithium ion by electrolytical mobility, other example has comprised the ratio of higher nitrogen.In certain embodiments, first source 311 provides Li in nitrogen atmosphere 3PO 4In other embodiments, first source 311 provides Li in the vacuum environment of background pressure less than the 1E-3 holder 3PO 4 Second source 313 or 413 provides the particle of energizing from the gas of source.In certain embodiments, second source is from comprising that oxygen is (as O 2) or nitrogen (as, N 2) the source in the ion source of the particle of energizing is provided.In other embodiments, source gas comprises inert gas, as argon gas, xenon, helium, neon and krypton gas.Particle of energizing and/or ion have increased the energy that forms the material of dielectric film 61C, have therefore promoted growth successively.In sum, the quality of the dielectric substrate that the mass ratio of this dielectric film is commonly used will be got well.
An embodiment who forms LiPON dielectric film 61C comprises first source and second source, and first source provides Li in the position that will form the LiPON dielectric film 3PO 4, second source provides the nitrogen particle of energizing to identical position or near position.Nitrogen particle of energizing and the Li that provides in the position that forms dielectric film 3PO 4React.This has just improved the content of nitrogen in the LiPON dielectric film.The increase of nitrogen content is preferably used in the raising lithium ion and passes electrolytical mobility.
In yet another embodiment, substrate 55 residing chambers have the air that nitrogen improves.The Li that LiPON dielectric film 61C provides by first source 3PO 4React with nitrogen in the chamber and form.Second source provides and helps the film formed particle of energizing of electrolyte.In another embodiment, second source also provides nitrogen to Li in this position 3PO 4Therefore, Li 3PO 4The nitrogen of energizing that comprises particle that provides with the nitrogen in the chamber and second source reacts.This has just improved the nitrogen content of dielectric film 61C.In certain embodiments, be the nitrogen content that wish to improve among the dielectric film 61C, because the data of announcing from the Ministry of Energy laboratory in Ao Keli season (Oak Ridge) of being arranged in Tennessee State (Tennessee) show that the raising of nitrogen content can increase the ionic conductance or the mobility of dielectric film.
Will be appreciated that by reading the present invention the system that is used for deposit film shown in this article is suitable for forming dielectric film 61C according to the present invention.The example of some systems is shown in Fig. 3 A-7 like this.
Fig. 1 D represents another embodiment of the energy storage device of instruction according to the present invention.Super-capacitor 70 is formed on the energy storage device 50C with ultra-thin electrolyte membranes 61.The energy storage device 50C representative that was forming on the substrate before formation super-capacitor 70 is at the embodiment that the techniques described herein is used to form the layer/equipment that forms before energy storage and/or the energy conversion on substrate.Super-capacitor 70 be included in electrode film 71 with during 75 physics contact and the intermediate coat 73 that forms.In certain embodiments, intermediate coat 73 is to be used for by faradic process storage and release electric charge electrolyte.In certain embodiments, intermediate coat 73 comprises dielectric material.Contact membranes 65 forms physics with electrode 71 and electrically contacts.Therefore, in this embodiment, contact membranes 65 is the contact membraneses shared that are used for energy storage device 50C and super-capacitor 70.In other embodiments, energy storage device 50C has the contact membranes that separates with super-capacitor 70.In certain embodiments, intermediate coat 73 comprises LiPON.In certain embodiments, dielectric film 73 comprises TaO.In certain embodiments, electrode film is RuO 2 On electrode film 75, form contact membranes 77.Lead-in wire 76 extends a pole plate of super-capacitor can be contacted with external circuit from contact membranes 77.
In certain embodiments, contact membranes 65 has been omitted, and single electrode film is as the electrode 71 of device 70 and the electrode 63 of device 50C.
The manufacture method 250A of solid-state energy storage device 50 is described referring now to Figure 1A and 2A.This method comprises provides substrate 55 (operating process 251) and deposition cathode contact membranes 57 (operating process 253) on substrate 55.In certain embodiments, operating process 251 comprises provides substrate, and this substrate has insulating barrier or other the layer/equipment that forms in the above.This method also is included in the operating process 255 of certain position deposition of electrode material on the substrate, and the particle of energizing is offered the electrode material on the substrate simultaneously.In certain embodiments, auxiliary source provides the particle of energizing.In some such embodiment, the particle beams of energizing is directed to the position identical with the substrate upper electrode material.In one embodiment, the particle of energizing is the ion of energizing.The ion of energizing in one embodiment, comprises the material different with electrode material.Particle of energizing or ion beam help the growth of the structure of control electrode material in this position.In certain embodiments, operating process 255 is used to form the layer 59 of cathodic coating or solid-state thin-film battery group.Cathodic coating 59 forms electricity with cathode contact and contacts with physics.Dielectric film 61 is deposited on the cathodic coating 59 in operating process 257.Anode film 63 is deposited on the dielectric film in operating process 259.Dielectric film 61 separation cathodic coatings 59 and anode film are to prevent to shorten energy storage device 50, i.e. battery pack.Anode contact forms electricity with anode film and contacts with physics in operating process 261.The membrane according to the invention battery pack forms now, and energy storage device manufacturing operation process 263 after the warp.
The deposition of cathodic coating comprises guides first material (as adatom) on the substrate certain position, and the particle of energizing (as ion) of second material is offered this position on the substrate simultaneously.In certain embodiments, second material is different with first material.The particle of energizing provide energy to first material can help the growth of required crystal structure in the cathodic coating.And, the stoichiometry of may command growing film this position on substrate like this.In certain embodiments, first material is the lithium intercalation material as solid-state thin-film battery group negative electrode.Auxiliary source offers the lithium intercalation material with the ion of energy supply scope between 5eV-3000eV.Control of energy provides control on the spot for the lithium intercalation film growth with crystal structure in the ion that is produced by auxiliary source.Energy of ions impels the lithium intercalation material to form crystal structure when deposition.In certain embodiments, the gas that is used to form ion is used for the stoichiometry of control growing crystal film.For example, a kind of O 2The ionization auxiliary bundle be used to control LiCoO 2The growth of sandwich material and stoichiometry.In some such embodiment, the O in the ionization auxiliary bundle 2Combine with LiCo in this position and form LiCoO 2Sandwich material.
The crystal structure of the film that instruction forms according to this paper has higher exponent number than the crystal structure that uses cathodic coating formation technology commonly used to obtain.Technology commonly used relies on high temperature, back cathodic deposition to anneal to reset and the structure of crystallization cathodic coating commonly used.Regrettably, this technology commonly used is annealed into identical temperature with entire infrastructure, and this is undesirable, when reason is that substrate must stand such temperature, will get rid of the consideration of many other suitable substrate material.And different layers just can not be provided as the different annealing in process that are suitable for their different demands.According to instruction as herein described, by providing required energy to form required high-order and appropriate location crystal structure, and do not make substrate and be formed on other layer process high annealing that comprises the negative electrode contact membranes on the substrate, just can obtain high-order crystal cathodic coating with achieving one's goal.And, each layer use different annealing in process (as, different layers uses has the ion auxiliary bundle of different-energy, perhaps deposits with different speed or different run duration and anneals) can anneal.And, by the annealing superficial layer of layer formerly, back layer can be deposited on ad hoc fashion (as, obtain particular crystal orientation, or the specific ion adhesive surface) on the surface of sorting, this ad hoc fashion can improve the quality of succeeding layer.
Fig. 2 B represents an a kind of embodiment who makes the method 250B of energy storage device.Operating process 251,253,259,261 with 263 in fact with top identical with reference to the described operating process of figure 2A.Operating process 255C is one cathodic coating to small part is deposited on operating process on the negative electrode contact membranes.In one embodiment, the target film deposits as described in top operating process 255.In other embodiments, cathodic coating deposits according to other deposition process well known in the art.By electrolyte being deposited on certain position, forming to small part and cathodic coating and contact (operating process 257C) and formation dielectric film.In preferred embodiment, if do not contact with the whole surface of cathodic coating, electrolyte just forms with entity part and contacts.In certain embodiments, when it formed dielectric film, auxiliary source provided the particle of energizing to electrolyte simultaneously.In one embodiment, auxiliary source provides the ion of energizing of a branch of auxiliary material different with electrolyte.In certain embodiments, second strands of material is drawn towards the position identical with electrolyte on the substrate.The ion beam of energizing in certain embodiments, is not focused.Ion beam is focused in another embodiment.
The deposition of dielectric film comprises guides electrolyte to small part and certain position that cathodic coating formation contacts into, provides energy to electrolyte simultaneously.In certain embodiments, this energy provides by the particle of energizing.In some such embodiment, the particle of energizing is the ion of energizing.In some such embodiment, be the material different with electrolyte from the particle of energizing of auxiliary source.The particle of energizing provide energy to electrolyte first material to help to grow required solid electrolyte membrane structure.And, the Chemical Calculation of may command growth dielectric film like this.
In an example, electrolyte is a lithium phosphorus nitrogen oxide.In certain embodiments, auxiliary source offers lithium phosphorus nitrogen oxide (" LiPON ") with the ion of energy supply scope between about about 3000eV of 5eV-.Control energy provides control on the spot for the growth in the lithium phosphorus oxynitrides structure of this position in the ion that is produced by auxiliary source.Energy of ions impels lithium phosphorus oxynitrides to form required structure when deposition.In certain embodiments, the gas that is used to form ion is used for the Chemical Calculation of control growing dielectric film.For example, a kind of O 2The ionization auxiliary bundle be used to control the growth and the Chemical Calculation of lithium phosphorus oxynitrides material.In another embodiment, used N 2The ionization auxiliary bundle.In this embodiment, N 2Not only control the growth and the Chemical Calculation of dielectric film, and other nitrogen is expelled in the dielectric film.This is desirable, because the ion transport of LiPON dielectric film depends on the nitrogen content in the film.
Fig. 2 C represents an another kind of embodiment who makes the method 250C of energy storage device.Operating process 251,253,257,261 with 263 in fact with top identical with reference to the described operating process of figure 2A.Operating process 255C is deposited on operating process on the negative electrode contact membranes with cathodic coating to small part.In one embodiment, cathodic coating deposits as described in figure 2A as top.In other embodiments, cathodic coating deposits according to other deposition process well known in the art.Operating process 259D deposits to electrode material at least partially in certain position on the dielectric film, and the particle of the energizing operating process to electrode material is provided simultaneously.The particle of energizing in certain embodiments, is drawn towards the position identical with electrode material.The particle of energizing in one embodiment, is the ion of energizing.The ion of energizing in one embodiment, comprises second material different with first material.Particle of energizing or ion beam help the growth of control electrode material structure.In certain embodiments, operating process 259D is used to form the anode film of solid-state thin-film battery group.This anode film forms electricity with anode contact and dielectric film and contacts with physics.
The deposition of anode film comprises guides electrode material to small part and certain position that dielectric film formation contacts into, and the particle of energizing of second material is provided simultaneously.The particle of energizing provide energy to electrode material to help to grow the crystal structure in the required anode film.And, the Chemical Calculation of may command growing film like this.In certain embodiments, electrode material comprises the lithium intercalation material as battery anode.In one embodiment, anode comprises lithium metal or lithium alloy.In another embodiment, anode comprises carbonaceous material, as graphite or diamond-like-carbon.In another embodiment, anode comprises metal oxide, as RuO or VaO.In another embodiment, anode comprises nitride material.Second source provides particle, and they are ions, in certain embodiments, the scope that they provide approximately between 5eV to the energy between the 300eV to the lithium intercalation material.In certain embodiments, the energy that provides of ion is approximately 135eV.In certain embodiments, the energy range that provides of ion approximately between 5eV between the 100eV.In certain embodiments, energy range approximately between 5eV between the 1000eV.In another embodiment, energy range approximately between 50eV between the 90eV.In another embodiment, energy range approximately between 55eV between the 85eV.In another embodiment, energy range approximately between 60eV between the 80eV.In another embodiment, energy range approximately between 65eV between the 75eV.In another embodiment, energy range approximately between 10eV between the 100eV.In another embodiment, energy range approximately between 10eV between the 90eV.In another embodiment, energy range approximately between 30eV between the 300eV.In another embodiment, energy range approximately between 60eV between the 150eV.In another embodiment, the energy of ions in second source is approximately 70eV.In certain embodiments, the energy range that provides of ion approximately between 45eV between the 95eV.
Control energy provides control on the spot for the growth at the lithium intercalation crystal structure of this position in the ion that is produced by auxiliary source.Energy of ions impels the lithium intercalation material to form crystal structure when deposition.In certain embodiments, the gas that is used to form ion is used for the Chemical Calculation of control growing crystal film.
The crystal structure of the electrode film that instruction forms according to this paper has higher exponent number than the crystal structure that uses film formation technology commonly used to obtain.Technology commonly used relies on high temperature, back deposition anneal, can influence substrate and other layer like this and wants to reset and the film of crystalline film structure.In contrast to this, the invention provides and a kind ofly reset the deposited film surface in when deposition or after deposition and do not heat the controlled energy of low layer or substrate in fact.In certain embodiments, when each atomic layer of deposited film, provide energy so that each atomic layer sorts during for film in crystallization.The example of this energy comprises or reacts with the adatom that just is being deposited, or/and provide kinetic energy to help the atomic beam of film deposition.Other example of the energy comprises high temperature, short thermal source, short plasma source, laser and other high strength sensitization source of continuing of continuing, and they are reset in abutting connection with the crystal structure on film surface can not influence other layer or substrate.Can obtain high-order negative electrode or anode according to instruction as herein described with achieving one's goal.
Though above-mentioned manufacture process has been described with certain and formed negative electrode and anode in proper order, other embodiment can put upside down the formation order of cathodic coating and anode film.And this manufacture process has for example been described, and forms cathodic coating and anode film in battery pack.In certain embodiments, negative electrode and anode film are the electrodes of battery pack.Other embodiment comprises the film that forms different super-capacitor layers.Super-capacitor is worked in these embodiments, one of them forms the film of super-capacitor, as electrode film 71,75 and electrolyte and/or dielectric film 73 improved crystal structure, crystalline size, or do not have defective, and do not take high annealing so that these attributes to be provided to entire infrastructure.Therefore, the technology and the system of the manufacturing film that uses in energy storage device as described herein all can be applicable to solid state battery group and solid-state capacitor.
In another embodiment, on substrate, form the film energy storage device.Form contact membranes on substrate, it can conduct electricity, and does not react with the adjacent cathodic coating that deposits afterwards.Contact membranes is as the barrier layer between substrate and the cathodic coating.Contact membranes is also as current collector, and as being connected between the external circuit of cathodic coating and energy storage device.In one embodiment, the thickness of contact membranes is greater than 0.3 micron.
Fig. 3 A represents to comprise the view of the precipitation equipment 305 of substrate 309 place reative cells 307, and wherein energy storage device is made on substrate 309.In certain embodiments, reative cell 307 is to hold the gas that is used to react and auxiliary atmospheric closed chamber is provided.In certain embodiments, wish the air pressure that holds in the reative cell approximately less than one times 10 -3Holder.First material source 311 is set in reative cell.First source 311 is created in a branch of adatom 312 of first material of deposition on the substrate 309.In certain embodiments, first material source 311 is physical vapour deposition (PVD) sources.In a kind of such embodiment, material source 311 is electron beam sources.In another this embodiment, first source 311 is to comprise, for example, and the arc source of cathode arc source, anode arc source and CAVAD arc source.Arc source is specially adapted to as the source, and is very effective because they are worked in the reative cell of cold operation.In another embodiment, first source 311 is to comprise, for example the physical deposition source of sputtering source.In another embodiment, source 311 is to comprise, for example uses the chemical deposition source in the direct ion source of alkyl precursor gases (hydrocarbon precursor gas).Bundle 312 certain position 319 that focuses on the substrate 309, at this, the material of bundle 312 deposits can form the film of energy storage device.Auxiliary source 313 is arranged in the reative cell, and produces a branch of particle of energizing be drawn towards the position 319 on the adjacent substrate 309 at least.In certain embodiments, auxiliary source 313 is that the ion of energizing produces former.In certain embodiments, auxiliary source 313 departs from first source 311 so that the bundle in these sources does not overlap.The particle beams 314 of energizing is provided for controlling that material in first bundle 312 is grown and Chemical Calculation is the required energy of crystal structure on substrate, these will at length make an explanation.The particle beams 314 of energizing in certain embodiments, also is provided at element required in the film that deposits.In another embodiment, bundle 314 is drawn towards at least near position 319, so that form the enough energy of required crystal structure and the Chemical Calculation transmitted beam 314 of the film that depositing offers first material of restrainting in 312.In certain embodiments, depositing system 305 comprises an additional auxiliary source 313A at least.In certain embodiments, each additional source 313A provides an additional auxiliary bundle 314A, and it provides the adatom of energy to the arrival on the substrate.The different embodiment of auxiliary bundle 314 will be described below.
Fig. 3 B represents another embodiment of precipitation equipment 305.Auxiliary source 313 produce power bundles 314, energy beam 314 is along must being that the path that is orthogonal to substrate 319 moves ahead.The material source 311 that is deposited is departed from auxiliary source 313.In certain embodiments, source 311 produces adatom bundle 312, and atomic beam 312 moves ahead along the path that is not orthogonal to substrate 319.Energy beam provides energy to adatom from bundle 312 as herein described.
Fig. 4 is similar to Fig. 3 A basically schematic diagram, is used to produce the auxiliary source 413 of energizing and restrainting except precipitation equipment 405 comprises, auxiliary source 413 pivotally is installed on the carriage that is fixed in the reative cell 307.Auxiliary source 413 pivots so that the particle beams 414 of energizing is guided the surface of substrate 309 into required projected angle of impact.In one embodiment, the scope of projected angle of impact 401 is approximately spent to 70 degree between 15 from being orthogonal to substrate.Therefore, in certain embodiments, projected angle of impact 401 is changeable.In certain embodiments, projected angle of impact approximately is 45 degree.In certain embodiments, depositing system 405 comprises an additional auxiliary source 413A at least.In certain embodiments, each source 413A provides additional auxiliary bundle 414A with angle 402, provides energy to the arrival adatom on the substrate in this angle 402.In certain embodiments, the energy that is provided by one of them auxiliary bundle 414A is provided the energy that has auxiliary bundle 414 to provide.In certain embodiments, auxiliary bundle 414 and 414A needn't give adatom by the while transmission of power.In certain embodiments, the mode of bundle 414 and 414A transmission of power is different.In certain embodiments, the bundle 414 with 414A in material be different.
Fig. 5 A is similar to Fig. 3 basically schematic diagram, except precipitation equipment 505 comprises many first sedimentary origins 511.In certain embodiments, wherein each first sedimentary origin 511 is restrainted 512 positions of guiding on the substrate 309 309 accordingly with it.In certain embodiments, each first source 511 produces the bundle 512 that comprises same material.In other embodiments, one of them first source 511 produces the strands of material 512 different with another first source 511.In certain embodiments, from the material in many first sources 512 in the position 309 in conjunction with to form required film.In other embodiments, the material in first bundle 512 combines to form required film with the material of auxiliary bundle 314.In certain embodiments, one of them its bundle 512 of first source, 511 guiding is to substrate 319, still away from position 309.In certain embodiments, two or more auxiliary sources 313 provide the adatom of energy to bundle 512.
Fig. 5 B represents another embodiment of precipitation equipment 505B.Settled many auxiliary sources 313 energy is offered the formation film on the substrate 319. Many material source 511A, 511B and 511C provide material to reative cell 307, and in abutting connection with the surface of substrate 309.In certain embodiments, each material source 511A, 511B and 511C provide identical materials, and therefore, their capable ratios wherein provide a more quantity in an independent source.In certain embodiments, one of them material source 511A, 511B provide the material different with another material source with 511C.In certain embodiments, these different materials react in reative cell 307 and will form the adatom material of film producing on substrate 319.In certain embodiments, one of them material source 511A, 511B and 511C supply parent material to reative cell 307, and another material source provides reaction material to reative cell.Original and reaction material reacts together and produces the material that will form film.In certain embodiments, one of them material source 511A, 511B and 511C comprise the chemical reactor that chemical reaction takes place.This source is expelled to synthetic material in the reative cell then.This synthetic material is included in the film forming process.
Fig. 6 is similar to Fig. 5 A basically schematic diagram, except precipitation equipment 605 comprises many first sedimentary origins 511 and pivot auxiliary source 413.In certain embodiments, provide more material to given deposition position.In certain embodiments, provide deposition in a plurality of positions.In other embodiments, the different materials of homology carries out combination with regard to allowing not like this.
Fig. 7 represents another embodiment of the precipitation equipment 705 of instruction according to the present invention.Precipitation equipment 705 comprises the flexible substrate 709 that elongated reative cell 707 is set in it and makes energy storage device in the above.Substrate 709 is supplied with from source cylinder 710 on arc thermal control surface 715, and is received by head pulley 713.First material source 711 is arranged in the reative cell 707, and it is a physical deposition source.First source 711 produces adatom 712 bundles of the material that will deposit on substrate 709.In certain embodiments, first source 711 is to comprise, for example, and the arc source of cathode arc source, anode arc source and CAVAD arc source.In another embodiment, first source 711 is to comprise, for example the physical vapour deposition (PVD) source of sputtering source.In another embodiment, source 711 is chemical vapour deposition (CVD) sources.And, in certain embodiments, the source of the many different materials of source 711 representatives.Bundle 712 certain position 719 that focuses on the substrate 709 deposit can form the film of energy storage device at the adatom of this bundle.Auxiliary source 713 is arranged in the reative cell, and is created in the beam of the particle 714 of energizing of guiding on the substrate 709.In one embodiment, auxiliary source 713 produces the beam of the ion 714 of energizing.The particle beams 714 of energizing is provided for controlling the growth and the required energy of Chemical Calculation of the deposition materials of first bundle 712.Therefore, form crystal structure on substrate 709, these will at length make an explanation.In certain embodiments, substrate 709 is synthetic rubber, polymer or plastic wires (film) of making energy storage device in the above.Elongated substrate 709 allows many energy storage devices to be deposited on the continuous position of substrate, has improved the production efficiency of energy storage device with this.And in certain embodiments, many precipitation equipments 705 or source 711 are to be provided with for the diverse location of while on substrate 709 deposits many films.
Thermal control surface 715 connects thermal source 725, the temperature of thermal source 725 control surfaces 715.Substrate 709 forms heat with surface 715 and dynamically contacts, and is controlled at thus and carries out the required underlayer temperature of particular deposition process on the specific substrate.In certain embodiments, thermal source is a coolant source, for example, and for the helium that will compress discharges to surface 715 to cool off its cryogenic vacuum pumps.Use on the thermal control surface 715 that directly contacts with substrate 709, particularly, when the position consistency that direct contact forms through collimation or with film, just allow to use substrate, these substrates are than using solid-state thin-film battery group manufacture process commonly used to have lower thermal gradient temperature.
Provide above and realized the description of the present invention with the different embodiment of the system that can make energy storage device or transducing head.In protection scope of the present invention, can use with shown in and described different modes make up the parts of this system, as long as method as herein described is executable for such system.For example, in certain embodiments, flexible substrate 709 and cylinder 710,713 can make up with any embodiment of Fig. 3 A-6.In certain embodiments, thermal source 725 can also make up with any embodiment of Fig. 3 A-6.In certain embodiments, the auxiliary source 413 of pivot can make up with any embodiment of Fig. 3 A, 3B, 5A, 5B and 7.In certain embodiments, thermal source 511A, 511B and 511C can make up with the embodiment of Fig. 3 A-5A and 6-7.
In certain embodiments, second film of electrode as, film 59 or 71, is overlapping portion first film at least, as contact membranes 57 or 63, but does not extend the lithium intercalation material of first membrane boundary.Therefore, interlayer second film remains on solid-state in energy storage device charging and discharge process.In certain embodiments, second film use first sedimentary origin with provide energize ion to the growth second film second source deposit simultaneously.In certain embodiments, first sedimentary origin is the physical vapour deposition (PVD) source.In certain embodiments, second source is from comprising oxygen (that is O, 2) or nitrogen (that is N, 2) source gas supply with the ion source of the ion of energizing.In another embodiment, source gas comprises inert gas, as argon gas, xenon, helium, neon and krypton gas.In yet another embodiment, source gas comprises hydrocarbon material, as the hydrocarbon precursor.The selection of the second source gas is based on to the required influence of stoichiometry of deposited film.In certain embodiments, second source provides the narrow beam of the ion of energizing.In certain embodiments, second source provides the not narrow beam of the ion of energizing.The ion of energizing provide scope approximately between 5eV to the energy between the 3000eV to the lithium intercalation material.In certain embodiments, the energy range that provides of ion approximately between 5eV between the 1000eV.In certain embodiments, energy range approximately between 30eV between the 300eV.In another embodiment, energy range approximately between 60eV between the 150eV.In another embodiment, energy range is approximately 140eV.In certain embodiments, the energy that provides of ion is approximately 135eV.In certain embodiments, energy range approximately between 5eV between the 100eV.In certain embodiments, energy range approximately between 5eV between the 1000eV.In another embodiment, energy range approximately between 50eV between the 90eV.In another embodiment, energy range approximately between 55eV between the 85eV.In another embodiment, energy range approximately between 60eV between the 80eV.In another embodiment, energy range approximately between 65eV between the 75eV.In another embodiment, energy range approximately between 10eV between the 100eV.In another embodiment, energy range approximately between 10eV between the 90eV.In another embodiment, energy range approximately between 30eV between the 300eV.In another embodiment, energy range approximately between 60eV between the 150eV.In another embodiment, the energy of second source ion is approximately 70eV.In certain embodiments, the energy range that provides of ion approximately between 45eV between the 95eV.
In one embodiment, the thickness of second film is greater than 10 microns.In certain embodiments, the thickness range of second film is approximately between 10 microns to 20 microns.In certain embodiments, the thickness range of second film is approximately between 1 micron to 5 microns.
The electrolyte tertiary membrane, that is, film 61,61C or 73 has the ion transfer quality, but does not have conductivity (electrolyte), and it is through being deposited as second deposited film that can superpose fully.In certain embodiments, tertiary membrane uses first sedimentary origin and the providing ion of energizing to deposit to second source of growing film.In certain embodiments, first sedimentary origin is the physical vapour deposition (PVD) source.In certain embodiments, second source is that the ion source of energy greater than the ion of energizing of 5eV can be provided.In another embodiment, energy range approximately between 5eV between the 3000eV.In certain embodiments, energy range approximately between 5eV between the 1000eV.In another embodiment, energy range approximately between 10eV between the 500eV.In another embodiment, energy range approximately between 30eV between the 300eV.In another embodiment, energy range approximately between 60eV between the 150eV.In another embodiment, the ion energy in second source is approximately 140eV.In certain embodiments, the energy that provides of ion is approximately 135eV.In certain embodiments, the energy range that provides of ion approximately between 5eV between the 100eV.In certain embodiments, energy range approximately between 5eV between the 1000eV.In another embodiment, energy range approximately between 50eV between the 90eV.In yet another embodiment, energy range approximately between 55eV between the 85eV.In yet another embodiment, energy range approximately between 55eV between the 85eV.In yet another embodiment, energy range approximately between 60eV between the 80eV.In yet another embodiment, energy range approximately between 65eV between the 75eV.In yet another embodiment, energy range approximately between 10eV between the 100eV.In yet another embodiment, energy range approximately between 10eV between the 90eV.In yet another embodiment, energy range approximately between 30eV between the 300eV.In yet another embodiment, energy range approximately between 60eV between the 150eV.In another embodiment, the energy that provides of second source ion is approximately 70eV.In certain embodiments, the energy range that provides of ion approximately between 45eV between the 95eV.
In certain embodiments, second source is from comprising oxygen (that is O, 2) or nitrogen (that is N, 2).In another embodiment, the second source gas comprises inert gas, as argon gas, xenon, helium, neon and krypton gas.In yet another embodiment, the second source gas comprises hydrocarbon material, as the hydrocarbon precursor.The selection of the second source gas is based on to the required influence of stoichiometry of deposited film.In certain embodiments, second source provides the narrow beam of the ion of energizing.In certain embodiments, second source provides the not narrow beam of the ion of energizing.Wish that electrolyte and tertiary membrane are thin as far as possible, and avoid negative electrode and anode layer to shorten.In one embodiment, the thickness of tertiary membrane is less than 1 micron.In certain embodiments, the thickness of tertiary membrane is less than 5000 dusts.In another embodiment, the thickness range of tertiary membrane is less than 1000 dusts.In another embodiment, the thickness range of tertiary membrane approximately between 10 microns between 100 dusts.
In another embodiment, tertiary membrane uses to spend to the projected angle of impacts of 70 degree with 15 provides the ion of energizing (5eV is between the 3000eV) to give first source of material source (target) and provides the ion of energizing to deposit to second source of growing film.First sedimentary origin comprises the focusing of the gas source ion beam of energizing.Gas source comprises one of them gas source as herein described.
Anode, the 4th film, that is, film 65 or 75 comprises and is deposited on top and the tertiary membrane that superposes, but do not contact the lithium intercalation material of first film (barrier layer) or second film (negative electrode).In certain embodiments, the 4th film uses first sedimentary origin to deposit simultaneously to second source of growth regulation four films with the ion of energizing is provided.In certain embodiments, first sedimentary origin is the physical vapour deposition (PVD) source.In certain embodiments, second source is from comprising oxygen (that is O, 2) or nitrogen (that is N, 2) source gas supply with the ion source of the ion of energizing.In another embodiment, source gas comprises inert gas, as argon gas, xenon, helium, neon and krypton gas.In yet another embodiment, source gas comprises hydrocarbon material, as the hydrocarbon precursor.The selection of the second source gas is based on to the required influence of stoichiometry of deposited film.In certain embodiments, second source provides the narrow beam of the ion of energizing.In certain embodiments, second source provides the not narrow beam of the ion of energizing.The ion of energizing provide scope approximately between 5eV to the energy between the 3000eV to the lithium intercalation material.In certain embodiments, energy range approximately between 5eV between the 1000eV.In another embodiment, energy range approximately between 10eV between the 500eV.In another embodiment, energy range approximately between 30eV between the 300eV.In another embodiment, energy range approximately between 60eV between the 150eV.In another embodiment, the energy of second source ion is approximately 140eV.In one embodiment, the thickness of the 4th film is greater than 10 microns.The thickness range of the 4th film is approximately between 10 microns-40 microns.
In another embodiment, the 4th film, forms from the interlayer anode with this on the surface of substrate by former hydrogen compound precursor deposition.In certain embodiments, deposition realizes with the improved CVD of plasma by using the hydrocarbon precursor.In certain embodiments, deposition comprises dopant, as N 2In certain embodiments, second source provides the ion of energizing to help the deposition of the 4th film.The ion of energizing provides the energy in the scope described herein.In certain embodiments, second source is identical with any source as herein described.
In another embodiment, anode, the 4th film deposit by the direct ion bundle from sandwich material that uses the hydrocarbon precursor.First sedimentary origin provides the bundle that focuses on ion (5eV-3000eV) that energize from the source gaseous hydrocarbons precursor of definite object material.In certain embodiments, second source provides the ion of energizing helping the growth of the 4th film, and as second source as herein described.
Contact the 5th film, that is, film 65 or 77 has conductivity, does not react with the 4th film, and it forms with part the 4th film at least and contacts.The 5th film does not contact second film (negative electrode).In one embodiment, the thickness of the 5th film is greater than 0.5 micron.The 5th film is as the anode current collector that contacts with external circuit.
In certain embodiments, passivation does not have conductivity and inactive the 6th film 79 of chemical property must cover the energy storage device that so far forms, promptly, all second, third and the 4th film, so that they can be packaged, and avoid environmental contaminants, these pollutants can react with these films, and reduce the performance of energy storage device.Environmental contaminants can further comprise the manufactured materials with the integrally formed device of energy storage device.In certain embodiments, first outside that partly is exposed to the 6th film with the 5th contact membranes is being connected with the outer circuit of energy storage device.
On it substrate 55,309 or 709 of deposition film described herein comprise any can support film and can stand the material of deposition process described herein.In certain embodiments, substrate is to form by having at this material owing to the temperature that begins to reduce less than 70 centigrade thermal effects.Another embodiment comprises having at this and lives through the substrate that is less than or equal to the low temperature of about 30 centigrade heat drops.The heat drop of substrate is low to comprise the loss of substrate shape, enough support that the chemistry of loss, substrate of energy storage device rigidity is damaged, crosslinked, the fusing of the material on substrate and/or the film and burning.The example of substrate comprises the silicon on silicon chip and the insulation system.Other example of backing material comprises metal, and insulating barrier is formed on the metal before forming energy storage device as herein described.In another example, this metal can be used as energy storage device with insulating barrier dielectric film, anode film and anode contact and metal substrate is carried out the contact that electricity is isolated.Other example that has than the material of low-heat reduction temperature comprises paper, fabric (natural and synthetic), polymer, plastics, glass and pottery, and these materials are applicable to makes energy storage device as herein described.
Substrate 55,309 or 709 has a kind of form, and it is applicable to the type of device that is used for making according to the described energy storage device of instruction of this paper.An example of substrate shape is a semiconductor wafer.Other form of substrate comprises elongated net, fabric, paillon foil and thin layer.Provide a kind of size enough big substrate within the scope of the invention, on this substrate, can make many energy storage devices and/or many transducing heads.
Substrate 55,309 or some embodiment of 709 are included in the substrate that keeps its support performance in the scene temperature processing procedure.In the Temperature Treatment process, substrate is arranged to and hot controlled surface at the scene, as surface 715, and contact closely.In certain embodiments, hot controlled surface is that the surface of cooling is so that the heat relevant with the deposition of any film as herein described reaches heat balance, so that can not heat drop hang down any other structure member of substrate or online formation on substrate.Therefore, in certain embodiments, have low-heat and reduce temperature, as the substrate of low melting point or low combustion temperature as the substrate in this manufacture method.For example, substrate comprises the material based on pottery, glass, polymer, plastics and paper.In the described embodiment according to the instruction of this paper, substrate is that many energy storage devices deposit superincumbent plastics or metal substrate.Then, this substrate is divided into the cutting plate with at least one energy storage device.Then, these cutting plates can be processed, as, carry out cold working, become the required form of using defined as energy storage device.
In another embodiment, substrate is to be made by flexible material, as, substrate 709.Flexible substrate forms the elongated volume that rolls, and its generation can transmit crooked object, and makes material form close the contact with the surface of curved object.Curved object is hot controlled device (that is, device 725 shown in Figure 7), to control substrate temperature and be equilibrated at the thermal effect that produces on substrate and the film in deposition process.For example, this object is a hollow, and intercepts the environment of deposition vessel.In certain embodiments, cavity is filled cooling agent, that is, cryogenic gas is as from liquid N 2Or the gas of liquid helium acquisition, cooling agent will often replenish simultaneously.The area of the close contact between substrate and the object is consistent, and impinges upon the position on the substrate over against material from sedimentary origin.In another embodiment, cooling agent is a kind of chilled water that often replenishes.In another embodiment, electric heating cooling device thermal control curved object.In another embodiment, curved object be a kind of not only can static but also rotary drum on the direction that axle moves at substrate.
In another embodiment, substrate 55 or 309 is that lath by rigid material forms.The formation of rigid substrate can cooling, transmit on the hot controlled surface.The example of cooling surface is described here.An example of cooling surface is that it is by discharging cryogenic liquid, as liquid N 2Or liquid helium carries out cooling off in the passage in the object body, and this object has the surface, but intercepts the environment of settling chamber.Other coolant source comprises chilled water, cryogenic gas and electric calorifie installation.
Fig. 8 A represents to have the plan view of initial substrate of the embodiment of the integrated battery group of having shared common terminal and equipment.The front view of the initial substrate of Fig. 8 F presentation graphs 8A.
Fig. 8 B is illustrated in the plan view that deposition has been shared the integrated battery group 820 of common terminal and installed the substrate 810 of Fig. 8 A after 2430.In certain embodiments, integrated battery group 820 and device 2430 are hull cell group and circuit, and they have electric wiring 2322,2324 and 2431 respectively.The front view of the local structure equipment of Fig. 8 G presentation graphs 8B.
Fig. 8 C is illustrated in chip 2440 plan view of the substrate of Fig. 8 B afterwards of placing the single manufacturing that is connected with equipment 2430 with wiring and the integrated battery group 2320 of having shared common terminal.The front view of the local structure equipment of Fig. 8 H presentation graphs 8C.
Fig. 8 D represents to place in certain embodiments and loop antenna 850 plan view of the substrate 810 of Fig. 8 C afterwards that connects up.The front view of the local structure equipment of Fig. 8 I presentation graphs 8D.
Fig. 8 E represents to have after top sealant 860 has been deposited the plan view of final equipment 800 of the local structure equipment of Fig. 8 D.In certain embodiments, equipment 800 comprises embossment and/or printed matter 880, and/or readable 870 of magnetic.
The cross sectional elevation of the equipment of Fig. 8 J presentation graphs 8E.The front view of Fig. 8 E-8J is not proportional sizes figure.In certain embodiments, roughly the credit card with common is identical with thickness for the size of equipment 800.In certain embodiments, magnetic stripe 870 and protrusion letter 880 also can form on equipment 800.
Fig. 8 K is illustrated in the perspective view of the equipment of the station Fig. 8 E that magnetizes.In illustrated embodiment, the magnetic field that coil 890 uses internal current to produce 60Hz, and, be formed on the faradic transformer (unmarked) that flows in the coil 850 with coil 850, this electric current is used for off switch through over commutation.When switch closure, adjunct circuit is just executed the task.The application of an example of this system will be described now.At present, the station of magnetizing is used to forbid anti-theft circuit work.The resonance frequency antenna work of burglary-resisting installation is forbidden in magnetic field in fact, so that the buyer is when card reader is crossed in retail company's walking, antenna will can not start warning.In an embodiment of the present invention, be used to forbid that the magnetic field of burglary-resisting installation work can start the switch of giving circuit supply successively.In certain embodiments, circuit picks up counting, and indicates the beginning of the guarantee period relevant with sell goods.
The perspective view of Fig. 8 L presentation graphs 8E equipment 800, but also comprise photocell 2650.In certain embodiments, equipment 800 is made as shipping label.Shipping label comprises the opaque backing of peeling off.In case be stripped from, light just is radiated on the photocell, and Closing Switch is to give circuit supply.In certain embodiments, this circuit picks up counting, and indicates the beginning of the guarantee period relevant with sell goods.
Fig. 8 M is illustrated in the roughly view of the equipment of Fig. 8 E in the wireless wave station 892.The wireless wave at wireless wave station 892 picks up by antenna 850, and the power process filtering of received wireless wave is with Closing Switch, and enforcement in circuit 2440.In certain embodiments, circuit picks up counting, and indicates the beginning of the guarantee period relevant with sell goods.
Aforesaid solid state rechargeable batteries group has directly with the integrated unique ability of their electronic equipment powered.And, will be used as thin wire antenna/coil 850 integrated of two one of them coil of phase transformer shown in Fig. 8 K and/or as enter the RF filtering technique permission of using in the system at no key solid-state thin-film battery 820 is carried out wireless charging (passing through air).By using shared technology in RF I.D. sign, the energy that is communicated with can conversion dc voltage, and is used for carrying out on circuit board function.Already under the situation on the circuit board, direct voltage is used for powering up the battery pack on the circuit board being carried out wireless charging to charging circuit in battery pack.
In industry, there is some demand, can be benefited from energy, storage and electronic equipment being integrated in single platform.
The invention provides and a kind of electronic equipment, solid state battery group and incident actuation switch are concentrated on platform on the single platform.In many cases, system or platform have very little shape factor.The roughly view of Fig. 9 A to 20 such system of expression or platform.Concrete example is discussed below.
Fig. 9 A and 9B represent to comprise the roughly view of the system 900 of battery pack 908, circuit 910 and active actuation switch 930.Such formation that battery pack 908 is discussed with reference to figure 1A-8M.Battery pack 908 is a kind of substrates that typically are formed on, the hull cell group shown in Figure 1A-1D on the substrate 55.Circuit can be combined in and be fixed in the battery pack 908 on the substrate 55.But in the another kind selection scheme, circuit 910 can be formed on the substrate 55, and battery pack 908 is formed on circuit 910 tops.Active actuation switch 930 (as the mems switch by actuatings such as acceleration described below, magnetic and static discharges) can be formed on the substrate with battery pack 908 and circuit 910.Fig. 9 A represents that wherein the incident actuation switch is not worked or opened with the system 900 or the platform of circuit 910, solid state battery group 908 and incident actuation switch 930 form integrated electronics.Fig. 9 B represents identical system or platform, and wherein switch 930 has been activated, and it places the solid state battery group with circuit or electronic equipment 910 and is electrically connected.Then, circuit 910 or electronic equipment are powered carrying out some task in response to the actuating of active actuation switch.
Fig. 9 C represents to comprise the system 900 or the platform of battery pack 908, circuit 910 and active actuation switch 930.In Fig. 9 C, circuit or electronic equipment 910 comprise optional equipment, as solid-state memory 912 and/or timing circuit 914.Shown in Fig. 9 C, comprise that the platform 900 of battery pack 908, circuit 910 and active actuation switch 930 is in non operating state.
Platform 900 shown in Fig. 9 C and the 9D is in non operating state, or switch or active actuation switch 930 be shown as disconnection, only is that the illustrative purpose is used.Be noted that to be noted that platform also can be shown as starting state, and active actuation switch 930 is in closure state.Memory 912 as shown in the figure is a kind of typical static state non-volatile (NV) memories.The information whether NV memory stores circuit 910 is powered.In other words, use nonvolatile storage 912 and timing circuit 914, it can be recorded in the memory 912 in the circuit 910 supplying time frame processes time with some incident in battery pack 908.For example, in some cases, active actuation switch 930 is closed or place the impact event of active state or time can be recorded in memory 912.Timing circuit 914 comprises timer, is used to write down the date and time of the specific activities that starting switch 903 takes place or only is the time.
Fig. 9 D represents to comprise battery pack 908, circuit 910 and is in to open or another system 900 or platform of the active actuation switch 930 of non-actuation position.Circuit 910 comprises memory 912, timer 914 and microprocessor 916.In the specific embodiment shown in Fig. 9 D, active actuation switch 930 can be activated, and timer 914 can be recorded in the date and time that starts in the NV memory 912.In case be activated, microprocessor 916 just can be carried out specific function.In some cases, microprocessor 916 can have very special and concrete task, and can be described as microcontroller, because it is exclusively used in the execution special duty.Be noted that Fig. 9 A, 9B, the solid state battery group 908 shown in 9C and the 9D may only be a kind of disposable battery pack, perhaps may form long charging.Battery pack 908 is charged by using photoelectric cell and platform being exposed to light, perhaps use the recurrent pulse of radio frequency, or any other similar mode is charged.The application number that proposes in March 23 calendar year 2001 that uses of rechargeable battery is No.09/815,884, and name is called in " battery-operated radio communication device and method " application to be discussed, and its content is this for referencial use quoting.
The flow chart of the method for work of the circuit shown in Figure 10 presentation graphs 9A-9D.As shown in figure 10, comprise that the platform of battery pack 908, circuit 910 and active actuation switch 930 or system 900 are initially located in non operating state, represent with reference number 1010.Be noted that and be noted that usually said non operating state is that switch 930 is shown in an open position.But, also may be these situations, non operating state is that active actuation switch is in the close position.And, may be that many switching mechanisms are arranged, when another switch was activated, a specific switch may be in non operating state.From non operating state 1010, action 1020 can take place to start.Start the common closed active actuation switch 930 of action and battery pack is electrically connected with circuit or electronic equipment 910.In other words, when active actuation switch was closed, battery pack 908 gave circuit 910 power supplies now.After starting action 1020, circuit 910 or electronic equipment 910 work, or place mode of operation 1030.Operation 1030 may comprise according to timing circuit 914 (shown in Fig. 9 A-9D) storage incident in the memory 912 when the specific timing.And this operation can comprise the special duty of carrying out by microprocessor or microcontroller 916 (shown in Fig. 9 D).
Figure 11 represents an alternative embodiment of the invention.Comprise battery pack 1110 and active actuation switch 1130 in this particular example.In other words, battery pack 1110 is as shown in Fig. 1-8 and the hull cell that forms, and active actuation switch 1130 is fixed on (or being integrated in) battery pack 1110.Active actuation switch 1130 can be as the part of hull cell group and is formed, and perhaps more precisely, can form on substrate 55 with battery pack 1110.Circuit, or other electronic equipment is not arranged on the substrate 55, but be connected with 1142 with contact 1141 afterwards.In other words, electronic equipment or circuit are away from the thin film solid state group 1110 and the active actuation switch 1130 that are arranged on the substrate 55, and thin film solid state group 1110 can be connected with any type of electronic equipment that is not arranged on the substrate with active actuation switch 1130.
Figure 12 A and 12B represent one type the active actuation switch that can use in Fig. 9 A-9D apparatus shown and other suitable equipment.Active actuation switch shown in Figure 12 A and the 12B is a MEMS equipment.Figure 12 A represents the top view of the active actuation switch 1230 of MEMS, and Figure 12 B represents the front view or the bottom view of the active actuation switch 1230 of MEMS.Active actuation switch 1230 comprises bottom 1201.Being fixed in bottom 1201 is first (length) cantilever beam, 1210, the second (middle length) cantilever beam 1212 and the 3rd (weak point) cantilever beams 1214.In the end of first cantilever beam is weight or load side 1211, same, is load sides 1213 in the end of second cantilever beam 1212, is cantilever ends 1215 in the end of the 3rd cantilever beam 1214.The end of each cantilever beam also comprises contact material.Cantilever beam can be along power path or electric locus guiding electric current.First cantilever beam 1210 has the electric track 1240 in contact or pad regions 1241 end.Second cantilever beam 1212 is included in the electric track 1242 of electric liner or end 1243 end, and the 3rd cantilever beam 1214 is included in the electric track 1244 of liner or end 1245 end.Cantilever beam 1210,1212 has different length respectively with 1214.The result is, the varying in size of the power that each bending cantilever beam is required.In other words, the long cantilever beam with load side will be crooked, and contact electric liner 1220 under than the littler impact load of bending cantilever beam 1212 required impacts, and make it contact electric liner 1222.The 3rd cantilever beam 1214 is than any one is all lacked in cantilever beam 1210 or 1212.The result is that it is crooked so that it electrically contacts contact 1224 that impact load or power must cause cantilever beam 1214 to produce very greatly.Active actuation switch 1230 (shown in Figure 12 A and the 12B) is the three step switch that starts with the impact grade that changes basically.In other embodiment of this specific active actuation switch 1230, each cantilever beam may have identical length, load in the cantilever beam end may change in case bigger weight in response to lower impact load, and lighter load beam will be only in response to bigger impact load.As further contemplating that, may be a cantilever beam or many cantilever beams.In other words, the invention of active actuation switch need not be confined to three cantilever beam structures.
Figure 13 represents another embodiment of active actuation switch 1330.In fact active actuation switch 1330 comprises the separating switch of X-axis, Y-axis and the activity of Z axle.Z axle switch 1330A is the MEMS equipment that comprises three kinds of cantilever beams, and three kinds of cantilever beams have the identical length of essence and are respectively equipped with load side 1311,1313 and 1315.Every end 1311,1313 is identical with weight essence on 1315.But, each cantilever beam 1310,1312 and 1314 body or width can change, so that the width of first cantilever beam 1310 is less, the width of last cantilever beam 1314 is than the wideer reality of the width of cantilever beam 1312, and the width of cantilever beam 1312 is the mean value of beam 1310 width and beam 1314 width.Like this, the load of identical size will influence each arm or cantilever beam 1310,1312 and 1314 under different impact loads.The end of cantilever beam and liner 1320,1322 and 1324 form and electrically contact.Each beam has electric track so that each switch when being activated owing to impact load, and the time of incident can be stored in the static memory.
As previously mentioned, 1330A represents the active actuation switch of Z axle.System or platform or active actuation switch 1330 also comprise the switch 1330B of directions X, the switch 1330C of Y direction.Each switch is identical, therefore, for convenience's sake, will only describe one of them switch 1330B.And active actuation switch 1330B comprises one group of cantilever beam 1310 ', 1312 ' and 1314 '.In the end of cantilever beam 1310 are loads 1311 ', are load 1313 ' in the end of cantilever beam 1312 ', are load 1315 ' in the end of cantilever beam 1314 '.The pedestal of active actuation switch 1330B is fixed in one group of contact.Switch 1320 ' is arranged to contact the end of first cantilever beam 1310 '.Equally, the end 1313 ' of second cantilever beam 1312 ' is arranged to receive or to contact in contact 1322 '.In addition, the end 1315 ' of cantilever beam 1314 ' is arranged to receive in contact 1324 '.Active actuation switch 1330B is designed so that one of them switch can start or closure in different impact load levels.Therefore, cantilever beam 1310 ', 1312 ' and 1314 ' may form more substantial, and perhaps the load of end can change, and perhaps length can change so that the different piece of switch can start at different impact loads.Active actuation switch 1330B is slightly different with the MEMS equipment shown in Figure 133 0A.Switch 1330B also is a MEMS equipment.Same switch 1330C is arranged to detect the impact load on the Y direction.Be noted that the impact load actuatable switches on each X-, Y-and Z-axle prevents that the impact that produces is not detected on some.The different components that are noted that impact load will in X-axis, Y-axis and the Z axle is perceived arrive.
Figure 20 represents to comprise another embodiment of the system 2000 of battery pack 2008, circuit 2010 and active actuation switch 2030.Battery pack 2008, circuit 2010 and active actuation switch 2030 are positioned on the substrate 2001.Substrate comprises adhesive material 56.Barrier layer 156 covers adhesive material 56.In certain embodiments, barrier layer 156 is a kind of can being removed and the peeling paper removed of exposed adhesive 56.Active actuation switch 2030 comprises first cantilever lever 2031 and second cantilever lever 2032.First cantilever lever 2031 is arranged between first contact 2033, second contact 2034 and the 3rd contact 2035.Contact 2033 and 2034 is L shaped shapes, comprises being arranged in the part that is parallel to substrate plane, and substrate in fact also comprises a part of cantilever 2031.Therefore, the acceleration that is in selected level on X or Y direction in the plane of substrate can make cantilever 2031 contact electric contact 2033 or electric contacts 2034.Electric contact 2035 is positioned at below the cantilever, perhaps is positioned at the plane that is parallel to cantilever 2031 ends.Acceleration on the Z direction can make arm 2031 contact or connecting terminals 2035.When initial acceleration back boom beam passed through on other direction, the acceleration that makes cantilever beam depart from contact 2035 also was electrically connected on contact 2035.In other words, cantilever beam 2031 is patted contact 2035 can form electrical connection.
Cantilever beam 2032 is between contact 2036 and another contact 2037.Contact 2036 and 2037 is L shaped shapes, comprises the part that is positioned at basically with substrate 2001 parallel plane planes.The end of cantilever beam 2032 is also in identical plane.In certain embodiments, cantilever beam 2031 similarly forms with 2032 so that the selected accelerating stage in some plane will produce and electrically contact or be connected in different contacts.In other embodiments, the formation of cantilever beam 2031 and cantilever beam 2032 will be to quickening to have different responses so that one of them basis in cantilever beam contact component 2031 and 2032 be sensitiveer to other cantilever beam contact element of response ratio that quickens.Cantilever beam contact component 2031 contacts with 2032 or forms when being electrically connected with the contact of relevant cantilever beam element therein, and battery pack is with regard to start-up circuit 2010.Circuit 2010 is carried out specific function.
In operation, such switch can be used for detecting impact load and their time of record.For example, such one group of switch or active actuation switch 1330,1230,2030 are useful under some transportation situations.Shipping person can comprise the active actuation switch with very low impact load threshold value, to begin to start more a plurality of one of them that respond in the part of active actuation switch.In other words, shipping person can have a kind of switch that can start when taking packing away from shelf, and this switch just can be activated by low-down impact load.Should activity carry out record then, be placed on then in the memory 912 by timer or timing circuit 914.If packing is fallen or is subjected to other load impact seriously At All Other Times in transportation or after transportation, another cantilever beam will form contact in its corresponding contact.In other words, bigger impact event will carry out record than short or less response beam by one of them.Say that alternatively in the incident of greater impact load, at least two beams form contact with their corresponding contacts, perhaps may contact with all three beams formation in the active actuation switch.Then, the time also can be recorded, and determines that who undertakes the damaged product that betransported.In other words, transport in having the time frame process of packing as fruit product, shipping person just should undertake the expense of damaged product so.Be sent out if show it, the consumer just undertakes the expense of damaged product so, and perhaps manufacturer or shipping person just should not bear product losses.
Use the time of the beginning that another example of this specific active actuation switch of impact load may the mark guarantee period.For example, if one of them impact load actuatable switches is very sensitive in packing and when transportation, clock or timer will according to the mark guarantee period begin or At All Other Times the actuating of switch of frame start working.When the consumer sought the time afterwards of guarantee use, requirement may be that packing is returned with product.Can check the guarantee time then.Will prevent that like this consumer from ordering another kind of product, and be under warranty it is returned as a kind of new product.
In certain embodiments, comprise that the system of impact load actuation switch 1330 or 1230 or 2030 can be included in the Sign Board of peeling off or transportation Sign Board, these Sign Boards not only can be directly fixed on the product but also can be directly fixed on the packing of product.Figure 14 A and 14B represent that use comprises the impact load actuation switch, as two specific identifier boards of 1230,1330 or 2030 (the not switch that shows in Figure 14 A or 14B) system.Be further noted that: impact load actuation switch 1230,1330 and 2030 also can be referred to as accelerometer.Comprise battery pack, film, solid state battery group, accelerometer or impact load actuation switch 1230,1330 and 2030, can form the part of Sign Board with the system of circuit or electronic equipment 910 (shown in Fig. 9 A and the 9B), transportation Sign Board as shown in Figure 14 A, or the product mark board shown in Figure 14 B.Each Sign Board comprises platform or system 1410,1410 ', and platform or system comprise film, solid state battery group (shown in Fig. 9 A and the 9B), circuit 910 (shown in Fig. 9 A and the 9B) and active actuation switch 930 (shown in Fig. 9 A and the 9B).
As defined in certain embodiments, Figure 15 represents to comprise bullet or other decrees 1500 of platform or system 1520, platform or system 1520 have battery pack 908, circuit 910 and active actuation switch 930 (shown in Fig. 9 A and the 9B), as switch 1230 or 1330 or 2030 (not showing in Figure 15).Figure 15 comprises bullet or decree 1510.Be installed with is system or the platform that comprises battery pack 908, circuit 910 (shown in Fig. 9 A and the 9B), active actuation switch 1230 or 1330 or 2030 (not showing) in Figure 15 in bullet or decree.Circuit 910 can comprise microprocessor or microcontroller 916 (shown in Fig. 9 A and the 9B).Bullet or decree 1510 also comprise and have the empennage shown in the reference number 1512.Empennage 1512 is controllable.When decree 1510 was shot or quickened, active actuation switch just made system enter starting state from non-started state.Empennage 1512 just can be subjected to microprocessor in the system 1520 or microprocessor controls with can be with the decree definite object then.The circuit or the electronic equipment 910 that are fixed on battery pack 908 and the active actuation switch 930 can comprise additional sensor 1530.For example, transducer 1530 can be the infrared sensor that is used for calorimetric, or is used to detect the phototube of light or the transducer of some other other characteristic of detection target.Be noted that bullet or decree with system 1520 are very little sizes, comprise the decree that goes out from rifle or pistol shooting, the very large size that perhaps from artillery, penetrates.
Figure 16 A represents the top view of the active actuation switch 1630 that mangneto is moving.Figure 16 B represents another embodiment of the moving switch of mangneto.And switch 1630 or switch 1630 ' are a kind of MEMS equipment with a series of cantilever beams 1610,1612,1614.MEMS equipment has the paramagnetic end in response to magnetic field.Beam 1610,1612,1614 has different cross-sectional widths so that they will be in response to the magnetic field of different certain strength.Magnetic switch shown in Figure 16 B comprises cantilever beam 1610 ', 1612 ' and 1614 '.These cantilever beams or arm are also in response to different magnetic field.Arm 1610,1612,1614 forms with electric contact 1620,1622 and 1624 and contacts.In case one of them in the arm 1610,1612,1614,1610 ', 1612 ' or 1614 ' contacts electric contact 1620,1622,1624,1620 ', 1622 ' or 1624 ' in electric field, battery pack in the case is with regard to the circuit 910 shown in the connection layout 9B.Specific active actuation switch 1630,1630 ' is used to open the beginning of guarantee period or record guarantee period.For example, when the consumer bought commodity in the retail market, a common magnetic apparatus was used to eliminate burglar-proof mechanism.Magnetic apparatus produces the magnetic field that does not start burglar-proof mechanism.Identical magnetic field can be used for starting shown in Figure 16 A or the 16B or several arms 1610,1612,1614,1610 ', 1612 ' or 1614 '.Therefore, the same magnetic field that is used for not starting burglary-resisting installation can be used for starting or beginning the guarantee time.Another kind of potential effect is that commodity in the purchased packing or equipment have made burglary-resisting installation carry out demagnetization and can not start, and is that also Magnetic Sensor 1630,1630 ' triggers the self check of just buying product or commodity.The time of self check and result can be recorded in the memory 912 (as shown in Figure 9) of static RAM or static state so that in the retrieval on date afterwards.Therefore, when buying, can attention equipment by self check, help guarantee work afterwards like this.
Figure 17 represents another embodiment of active actuation switch 930.Figure 17 represents the roughly view of pressure sensitive switch 1730.Pressure sensitive switch 1730 comprises the first elongated electric contact 1710 and the second elongated electric contact 1712.First electric contact 1710 and second electric contact 1712 are isolated.Pressure sensitive switch 1730 can be positioned in the Sign Board shown in Figure 14 A or the 14B.This Sign Board can be provided with the back side of peeling off, and peels off the pure action that needs main Sign Board softness or curved surface and may be the activity that is connected with second contact 1712 of pressure sensitive switch 1730 is arranged in first contact 1710.And the active actuation switch of pressure-sensitive may be used for transport applications or guarantee work.These examples of applications have been directed to active actuation switch 1230 and 1330 and have discussed in the above.
Figure 18 represents that moisture activates the view of some embodiment of movable switch 1830.Moisture actuation switch 1830 comprises first inclined surface 1801 and second inclined surface 1802.First electric contact 1810 is fixed or is connected on first inclined surface 1801, and second electric contact 1812 is fixed or is connected on second inclined surface 1802.When running into or produce moisture, inclined surface move moisture to minimum may point, suppose that moisture actuation switch 1830 is arranged to make its center of gravity to be used for that moisture on movable inclined surperficial 1801,1802 is extremely minimum may point.Because moisture move to minimum may point, moisture just is collected in the liquid reservoir 1820.Liquid reservoir 1820 is filled with the moisture of moisture in liquid reservoir 1820 and tides over slit between first electric contact 1810 and second electric contact 1812.Therefore, switch receives rainwater in this zone and just can be activated, and perhaps in a single day equipment be immersed in the wet environment and just can be activated.In addition, the dew that is collected on inclined surface 1801 and 1802 can provide moisture to fill the level position that liquid reservoir 1820 to first electric contacts 1810 and second electric contact 1812 are electrically connected.Closed or provide when electrically contacting by switch 1830 at enough moistures, such switch can be used for battery pack 908 is arranged to be connected with circuit or electronic equipment (seeing that Fig. 9 A is with shown in the 9B).
Other application of active actuation switch also can be considered.In certain embodiments, use thermal actuation movable switch 930.This structure and the required structural similarity of automatic sprinkler system in building.In this particular example, the thermal actuation switch is arranged to battery pack 908 to be connected with circuit 910 or electronic equipment 910.The application of an example will be used in the automatic sprinkler system, after startup, be lower than certain threshold value if no longer detect the temperature in smog or room with this water injector, and it just can not start.
Another example of the use of active actuation switch 930 will be to quicken actuating type switch 1230,1330 to be used in the aircraft Aviatrix and to launch in the seat.The Aviatrix drives an airplane on the very high height above sea level of being everlasting, if a height above sea level need be launched therein, the chutist could must release a parachute when the pilot on the seat was in them and has the height above sea level of oxygen of enough existence.In other words, if in high height above sea level flight, launching the seat must be unfolded, and its benefit is even that when lifesaving, the pilot also can drop to the height above sea level that the pilot has the oxygen of enough existence from higher height above sea level.Such height above sea level can be from 10-15, the height in any height of 000 foot or other any selected scope.Therefore, active actuation switch 1230,1330 will be given electronic equipment or circuit 910 power supplies that comprise altimeter.Electronic equipment will use altimeter reading to launch to be fixed in the parachute that launches on the seat to determine when.Will give the better escape chance of pilot that to launch in higher height above sea level like this.
Figure 19 represents the RF actuation switch.Imagination will be available at the active actuation switch 930 of RF signal enabling and 1930 other application of back.Figure 20 represents content recited above.
Figure 21 A represents an embodiment of radio mark system 2100.This system comprises radio frequency identifiers (RFID) equipment 2170 and the remote RF equipment 2160 that communicates with RFID equipment.RFID equipment 2170 comprises the battery pack 2120 that is deposited on the flexible substrate 2110, be positioned on the battery pack 2120 and couple battery pack 2120 in an orderly manner in case battery pack 2120 give electronic circuit 2130 power supplies electronic circuit 2130, be deposited on the battery pack 2120 and the RF antenna 2140 that couples electronic circuit 2130 and the side that is deposited on battery pack 2120 and 2130 layers of relative flexible substrate of electronic circuit on adhesive phase 2150.In illustrated embodiment, wiring 2131 is connected with battery pack 2120 electronic circuit 2130 with antenna 2140.In another embodiment, wiring and contact is deposited upon between battery pack 2120 and the electronic circuit 2130 to provide electronic circuit 2130 to be connected with battery pack 2120.In certain embodiments, electronic circuit forms the layer on the RFID equipment.In other embodiments, electronic circuit comprises pre-formation (that is the prebuild) integrated circuit that is installed in sedimentary deposit and is connected with battery pack by wiring layer.
In another embodiment of the system shown in Figure 21 B 2100, RF antenna 2140 is deposited on the flexible substrate 2110.
In another embodiment of the system shown in Figure 21 C 2100, RF antenna 2140 is deposited on the flexible substrate 2110.Electronic circuit 2130 is arranged to adjacent with battery pack 2120 on flexible substrate 2110, and adhesive phase 2150 is deposited on the side of the flexible substrate relative with battery pack 2120 and electronic circuit 2130.
In another embodiment of the system shown in Figure 21 D 2100, it is adjacent to form uniform surface with battery pack 2120 that electronic circuit 2130 is arranged on flexible substrate 2110, thereby allow adhesive phase 2150 ' to be deposited on the uniform outer surface that forms by battery pack 2120 and electronic circuit 2130, perhaps allow adhesive phase 2150 ' to be formed on the flexible substrate 2110.
In another embodiment of the system shown in Figure 21 E 2100, battery pack 2120 is deposited on first side of flexible substrate 2110, and electronic circuit 2130 and RF antenna 2140 are placed on the opposite flank of flexible substrate 2110, to allow adhesive phase 2150 ' to be deposited on the electronic circuit 2130, perhaps allow adhesive phase 2150 ' to be deposited on the battery pack 2120.
Figure 21 F represents to be positioned at an embodiment of the adhesive 2150 on the flexible substrate 2110.Be noted that adhesive 2150 can be the adhesive that comprises any kind of release type adhesive or permanent adhesives.In certain embodiments, adhesive phase 2150 is peeled off the stripe shape adhesive by what release paper (also being referred to as to discharge paper) or plastic layer 2152 covered.In certain embodiments, adhesive phase 2150 covers entire substrate 2110, and in some other embodiment, adhesive phase 2150 only covers a part of substrate surface 2110.In certain embodiments, adhesive phase 2150 covers all or part battery pack 2120.In certain embodiments, adhesive phase 2150 covers all or part electronic circuit.In certain embodiments, adhesive phase 2150 covers all or part and is deposited near the uniform outer surface that forms the battery pack 2120 by electronic circuit 2130.
Figure 22 represents an embodiment of battery pack 2220.A kind of substrate 2210 is set, forms contact membranes 2257 in the above.Contact membranes 2257 is used as current collector, and is connected with lead-in wire 2258, and in certain embodiments, lead-in wire 2258 electrodes with battery pack 2220 are connected with external circuit.In certain embodiments, electronic circuit 2130 (shown in Figure 21 A-21E) is fixed on the formed battery pack 2220.In other embodiments, electronic circuit 2220 can for example, not be fixed on the formed battery pack 2220 away from battery pack 2220.Electrode film 2259 is formed on the contact membranes 2257.In certain embodiments, electrode film 2259 covers the surface of contact membranes 2257 basically making minimum resistance by the maximization of the interface area between the film.In certain embodiments, electrode film 2259 is negative electrodes of hull cell group 2220.Dielectric film 2261 is formed on the electrode film 2259.Electrode film 2263 is formed in the anode on the dielectric film 2261.Dielectric film 2261 insulate electrode film 2259 mutually with electrode film 2263.Contact membranes 2265 is formed on the electrode film 2263.Contact membranes 2265 is used as current collector, and is connected with lead-in wire 2267, and lead-in wire 2267 electrodes with battery pack 2220 are connected with external circuit.In certain embodiments, contact membranes 2265 make minimum resistance maximizing by the interface area between these films in the surface of coated electrode film 2263 basically.In certain embodiments, electrode film 2263 is anodes of hull cell group 2220.
In one embodiment, dielectric film 2261 comprises LiPON.Just as used herein, LiPON typically refers to lithium phosphorus oxymtride material.An example is exactly Li 3PO 4Other example comprises the nitrogen of higher proportion content and passes electrolytical mobility so that improve lithium ion.
The manufacture method of solid state battery group 2220 is described below.
In certain embodiments, solid state battery group 2220 formed in five or six stages.Phase I, this prerinse was undertaken by use Mk II ion gun system in argon gas from the prerinse substrate, and argon gas is that 70v and electric current are that 2A crosses ion gun with the data rate stream of four minutes 5sccm at voltage.On substrate 2210, form 2500 by electron beam gun nickel deposited then with 200mA and 6500V
Figure C20038011008600421
The cathode nickel metal level.Second stage is from the sputter etching of nickel cathode gatherer, sputter etching power with 250W in the argon gas of 12mT pressure carried out 1 minute, carried out 5 minutes target pre-burning time subsequently in the gas of 80% oxygen of 15mT pressure and 20% argon gas with the power of 1200W.Then by in the gas of 80% oxygen of 15mT pressure and 20% argon gas with the power deposition LiCoO of 1200W 2On the cathodic metal layer, formed cathode layer 2259 in 60 minutes.Phase III, pre-burning phase power with 750W in the nitrogen of 5mT pressure carried out 5 minutes from the target pre-burning phase.Then by in the nitrogen of 40sccm under 5mT pressure with the power deposition Li of 750W 3PO 4Formed dielectric substrate 2261 in 57 minutes.In other embodiments, carry out the center of gravity anodic deposition stage then with the energy deposition anode.The prerinse of the before procambium of quadravalence section begins, and this prerinse is undertaken by use Mk II ion gun system in argon gas, and argon gas is that 70v and electric current are to cross ion gun with the data rate stream of 4 minutes 5sccm under the 2A at voltage.On dielectric substrate, form 2500 by electron beam gun deposited copper then with 150mA and 7600V The anode copper metal level.Five-stage is from the prerinse of before procambium, and this prerinse is undertaken by use Mk II ion gun system in argon gas, and argon gas is that 70v and electric current are to cross ion gun with the data rate stream of 4 minutes 5sccm under the 2A at voltage.Then when the Mk II ion gun system with 90V and 2A bombards growing film simultaneously with the stream of nitrogen gas that flows through the 18sccm of ion gun, with the electron beam gun formation 2500 of 150mA and 7600V
Figure C20038011008600423
The SiN passivation layer.
Figure 23 represents to comprise roughly the attempting of RFID equipment 2300 of battery pack 2320, electronic circuit 2330, RF antenna 2340 and RF actuation switch 2350.The hull cell group that battery pack normally forms on Figure 21 A-21F and substrate 2110 shown in Figure 22.Circuit can be equipped in and be fixed in the battery pack on the substrate 2110.But in the another kind selection scheme, electronic circuit 2330 can be formed on or be arranged on the substrate 2110, and battery pack 2320 is formed on electronic circuit 2330 tops.RF actuation switch 2350 also can be formed on the substrate with battery pack 2320 and electronic circuit 2330.The RF energy that RF antenna 2340 receives is through detecting, and amplifier circuit 2352 is caught event.Closing Switch 2354 then, and operationally battery supply are coupled to electronic circuit 2330.Electronic circuit 2330 comprises optional equipment, as: solid-state memory 2334, timing circuit 2336 and microprocessor 2332.Memory 2334 as shown in the figure is nonvolatile memory normally.The information whether nonvolatile memory stores electronic circuit 2330 is powered.In other words, by using nonvolatile memory 2334 and timing circuit 2336, it can be recorded in the memory 2334 can in the electronic circuit 2330 supplying time frame processes time with some incident in battery pack 2320.For example, in some cases, RF actuation circuit 2350 time closed or that be arranged to starting state can be recorded in the memory 2334.The timing circuit 2336 that can comprise timer can be used in record data and time or only is the time of RF dependent event actuation switch 2350.In case electronic circuit 2330 is activated, microprocessor 2332 just can be carried out specific function.In some cases, microprocessor 2332 may have task very special and that limit, and it also can be referred to as microcontroller, because it has the special and specific task of carrying out.
Figure 23 B represents the roughly view of another embodiment of RFID equipment 2301.The RF energy is received by RF antenna 2340, and detects through amplifier circuit 2352.This trigger 2356 that will start electronic circuit 2330 is set at start-up mode from low-power mode.In order to reenter low-power mode, LOW-POWER signal 2357 reset flip-flops 2356.In case be activated, this equipment just carries out work as Figure 23 A discusses.
Be noted that the solid state battery group 2320 shown in Figure 23 A and the 23B may only be disposable battery pack, or form and repeatedly to charge.Battery pack 2320 perhaps by the periodic radio-frequency pulse, perhaps uses any other similar mode to charge by using photoelectric cell (optionally be formed on or be deposited on the substrate surface) and the platform exposure being charged.The name that the use of rechargeable battery proposed in March 23 calendar year 2001 is called the Application No. 09/815 of " battery operated radio communication device and method ", 884, the Application No. 10/336 that is called " solid State Active actuating cell apparatus and method " with the name that proposes on January 2nd, 2003, discussed in 620, the applicant that these two applications are the application is common, and its content is this for referencial use quoting.
Have some demand in industry, soon energy, memory and electronic equipment are integrated in is of value to industry on the single platform.
The invention provides and a kind of electronic equipment (comprising the RF electronic equipment) and solid state battery group are integrated in device in the individual equipment.In many cases, this system or platform have less shape factor.Figure 21 A to 24B represents the roughly view of the typical sample of this system or platform.Below concrete example will be discussed.
The use of example or particular RFID equipment is the time started of mark guarantee period.For example, if RFID equipment is fixed on the product, the RF energy just can be when buying product starting device, the initial or time frame of clock beginning label guarantee.But the another kind selection scheme is that the RF energy will be launched the time stamp of permanent storage in equipment.So allow time of beginning very much near the guarantee period.When consumer afterwards wished to return product in the guarantee period scope, the requirement of guarantee period may be exactly that packing or Sign Board return with product.Can check time guarantee period then.Will prevent that like this consumer from ordering another kind of product, and prevent to be under warranty it is returned as new product.In certain embodiments, the system that comprises the RF actuation switch may be included in and not only can be directly fixed on product but also can be directly fixed on peeling off in Sign Board or the transportation Sign Board in the packing of product.Figure 24 A and 24B represent to use two embodiment of the used Sign Board that comprises RF actuation switch 2350 systems.In certain embodiments, comprise that the system of thin film solid state group 2320, RF actuation switch 2350 and electronic circuit 2330 forms the part of Sign Board, the transportation shown in Figure 24 A or mailing Sign Board, perhaps the product mark board shown in Figure 24 B.Each Sign Board comprises platform or system 2410,2410 ', and platform or system comprise thin film solid state group 2320, electronic circuit 2330 and RF actuation switch 2350.
Another example will use RFID equipment in mailing or transportation Sign Board 2410 (seeing Figure 24 A), to detect and record haulage time and delivery dependent event.The RF transmitter will start RF actuation switch 2350, and opening timing circuit 2336 is to detect and to write down the beginning of haulage time.The use of another example or particular RFID equipment comprises as backup or additional printing mark board information to be used.If printing information is no longer readable, perhaps because loss is unavailable, RFID equipment may send to canned data suggested RF receiving equipment.
Another example is the RFID equipment that uses in product mark board 2410 ' (seeing Figure 24 B), can follow and follow the trail of article.The remote RF transmitting and receiving apparatus can be placed in the different websites in warehouse or transportation and the reception area.Remote RF equipment detects and record when packing by this website then.In another example, RFID equipment also is used for article are placed with the portable RF transmitting and receiving apparatus.In certain embodiments, the interrogation code of remote RF device transmission particular RFID equipment.The RF energy of inquiry will start RFID equipment, RFID device analysis interrogation code then, and respond by transmission RFID authentication code, thus the location of particular RFID equipment is indicated to remote RF equipment.
Another example is that RFID equipment is used in the medicine treatment system, and this medicine treatment system uses the medicine plaster that is attached at skin discharging medicine by a kind of for example ionotherapy.The use permission electronic circuit of thin film solid state group penetrates in the treatment equipment in electron ion and uses, and keeps the small device profile simultaneously so that can not disturb patient's clothing.In this example, RFID equipment is fixed on the medicine plaster that comprises the medicine locker room.Electronic circuit 2330 starting devices begin to discharge pill.Microprocessor 2332 will, as time of device start, time that pill discharges and the information stores that discharges how many pills in memory 2334.Timing circuit 2336 can be used to optionally prevent that patient or care-giver's taking dose are too frequent.The care-giver can optionally use remote RF equipment transmitting RF energy can begin to discharge pill, and perhaps interrogating rfid equipment determines that the medicine treatment that this equipment provided is historical.In certain embodiments, when RF device start RF actuation switch, start RFID equipment.In other embodiments, when the RFID of equipment partial fixing was in equipment medicine locker room, RFID equipment was by switch activated.
Figure 25 A represents an a kind of embodiment of method 2500 of the RFID of use equipment.This method 2500 comprises the flexible peel strip RFID equipment 2100 (2510) that is provided with, and this equipment 2100 comprises multidigit identifier value and the hull cell group that is deposited on the flexible substrate; With RFID equipment 2100 pressure bindings in article (2520); On RFID equipment, receive RF energy (2530); With RF energy, battery supply is coupled to RFID equipment 2170 (shown in Figure 21 A) with energy start-up circuit (2540) according to reception; A beginning task (2550) in being enabled in RFID equipment 2170, this task comprise that the multidigit identifier according to RFID equipment 2170 sends identifier (ID) value.
In another embodiment, shown in Figure 25 B, task is the movable time started (2551) in the storage RFID equipment 2170.In another embodiment shown in Figure 25 C, task is to carry out self check (2552) in RFID equipment 2170, and storage self-detection result (2553).In another embodiment of method shown in Figure 25 D, the interrogation code (2554) of RFID equipment 2170 receiving remote RF transmitters 2160, and carry out analysis (2555) to interrogation code, according to the analysis of interrogation code the ID value is transferred to remote RF receiver apparatus (2556).In another embodiment, receive the timestamp (2557) that interrogation code makes RFID equipment 2170 storage incidents from remote equipment.In another embodiment shown in Figure 25 E, the very first time of RFID equipment 2170 storage mark shipment events is stabbed second timestamp (2558) of (2557) and storage mark reception incident, and the timestamp of relatively storing (2559) is can determine the duration of transportation dependent event then.
Another kind of method shown in Figure 26 comprises forming RFID equipment 2170.An embodiment of method (2600) comprises provides flexible substrate (2610); Deposition comprises anode, negative electrode and separates anode and the electrolytical battery pack of negative electrode (2620); Deposition wiring layer (2630); Place the electronic circuit (2640) on battery pack that is connected with battery pack; The deposition contact adhesive is used (2650) to allow peel strip; With covering RFID equipment (2660).Some embodiment comprise with order shown in Figure 26 and carry out these processes, and other embodiment makes up one or more processes as single operation, perhaps carries out this process with different orders, causes the layer of different order.Embodiment comprises the parts of arranging RFID equipment as (i) cover layer, (ii) electronic circuit, (iii) wiring layer, (iv) battery pack, (v) substrate and (vi) contact adhesive.In another embodiment, method 2600 is included in and forms printing mark board (2670) on the RFID equipment.
In another embodiment shown in Figure 26 B, the ion auxiliary energy between 50eV and 95eV is deposited on (2620) on the substrate to battery pack by using approximately.
In another embodiment, battery pack is deposited on the substrate by using the ion auxiliary energy between 75eV and 90eV.In other embodiments, battery pack is deposited on the substrate by using the ion auxiliary energy between 65eV and 70eV.In other embodiments, battery pack is deposited on the substrate by using the ion auxiliary energy between 70eV and 75eV.In other embodiments, battery pack is deposited on the substrate by using the ion auxiliary energy between 75eV and 80eV.In other embodiments, battery pack is deposited on the substrate by using the ion auxiliary energy between 80eV and 85eV.In other embodiments, battery pack is deposited on the substrate by using the ion auxiliary energy between 85eV and 90eV.In other embodiments, battery pack is deposited on the substrate by using the ion auxiliary energy between 90eV and 95eV.In other embodiments, battery pack is deposited on the substrate by using the ion auxiliary energy between 65eV and 95eV.In other embodiments, battery pack is deposited on the substrate by using the ion auxiliary energy between 65eV and 85eV.In other embodiments, battery pack is deposited on the substrate by using the ion auxiliary energy between 65eV and 75eV.In other embodiments, one or two end points of above-mentioned scope is an approximation.In other embodiments, battery pack is deposited on the substrate by the ion auxiliary energy that uses about 65eV.In other embodiments, battery pack is deposited on the substrate by the ion auxiliary energy that uses about 70eV.
In certain embodiments, the battery pack that is deposited on the flexible substrate is a rechargeable battery.
Another kind of scheme of the present invention provides a kind of flexible peel strip battery operated device.Some embodiment of this equipment 2170 comprise flexible substrate 2110, are deposited on hull cell group 2120 on the flexible substrate 2110, are deposited on the battery pack 2120 and couple battery pack 2120 with radio frequency (RF) antenna 2140 that the electronic circuit 2130 of power supply to electronic circuit 2130 is provided, couples with electronic circuit 2130 and the adhesive 2150 that is applied to flexible substrate 2110 shown in Figure 21 A-21F.In other embodiments, the order of layer is with shown in Figure 26 different, and for example, in certain embodiments, electronic circuit is arranged on the substrate next door, or below the battery pack layer.
In another embodiment of this equipment, electronic circuit 2130 comprises the RF starting switch, and this switch can start electronic circuit 2130 by electricity.In another embodiment, the RF starting switch comprises MEMs equipment.In another embodiment, the RF antenna 2140 of equipment is integrated on the substrate 2110.In another embodiment, the battery pack 2120 of equipment is a rechargeable battery.The another kind of scheme of formation RFID equipment as shown in figure 27 comprises rolling releasing layer 2710, but this layer is with fixed thereon of many RFID equipment 2770 release property ground.
Another kind of scheme of the present invention provides the system of the RFID equipment of a kind of manufacturing shown in Figure 28 A.This system 2800 comprises one or more feed reels 2810 of presenting one or more sources substrate 2809, one or more feed reel 2810 of presenting one or more electronic circuits and RF antenna, one or morely will be deposited upon deposition station 2811 on one or more substrates, present the feed reel 2827 of the peel strip adhesive that is fixed on the substrate and comprise the vacuum chamber 2807 of feed reel 2810, deposition station 2811 and auxiliary source 2817.Be deposited on that layer in the system comprises the layer that forms battery and with battery pack and electronic circuit couples and wiring layer that RF antenna and electronic circuit are coupled.The layer that the deposition back forms battery comprises (a) cathode layer, (b) dielectric substrate and (c) anode layer.Substrate is presented by arc hot surface 2815, and is received by end spool 2813.The first material deposition station 2811 produces the adatom bundle 2812 that is deposited on the substrate 2809.Bundle 2812 focuses on the position 2819 of substrate 2809 can form battery layers.Auxiliary source 2817 produces the particle beams 2814 of energizing that points to substrate 2809.The particle beams 2814 of energizing provides the growth and the stoichiometry of the required energy deposition materials can control first bundle 2812.Therefore, on substrate 2809, form crystal structure, will make an explanation in more detail below.In different embodiment, substrate 2809 comprises synthetic rubber, polymer, paper and/or plastic wire or the sheet of making energy storage device in the above.Elongated substrate 2809 allows many energy storage devices to be deposited on the continuous position of substrate, improves the productivity ratio of energy storage device with this.In certain embodiments, the setting of many deposition stations 2811 is to be used for the many films of deposition on the diverse location of substrate 2809 simultaneously.
In certain embodiments, the deposition of dielectric film comprises guides electrolyte to small part and cathodic coating position contacting, simultaneously energy is offered electrolyte.In one embodiment, energy is provided by the particle of energizing.In such embodiments, the particle of energizing is the ion of energizing.In some such embodiment, the particle of energizing that comes from auxiliary source is a kind of material different with electrolyte, inert gas in this way.In other embodiments, energize other composition of ion and deposition reacts to help the growth of required solid electrolyte membrane structure.And, stoichiometry that like this can the control growing dielectric film.
In certain embodiments, the first material deposition station 2811 or first source in first source provide Li in blanket of nitrogen 3PO 4In other embodiments, first source 2811 provides Li in vacuum environment 3PO 4, wherein background pressure is less than 0.001 holder.The auxiliary source 2817 or second source provide the particle of energizing from source gas.In certain embodiments, second source 2817 is from comprising oxygen (that is O, 2) and/or nitrogen (that is N, 2) source gas in the ion source of the ion of energizing is provided.In other embodiments, source gas comprises inert gas, as argon gas, xenon, helium, neon and krypton gas.Energize particle and/or ion increased the energy of the material of the dielectric film 2261 that forms battery pack among Figure 22, therefore, improved growth successively.Thereby the quality of dielectric film is than the quality height of common electrolyte film.
An embodiment who forms LiPON dielectric film 2261 comprises first source and second source, and first source provides Li in the position that will form the LiPON dielectric film 3PO 4Or with Li 3PO 4Offer the position that will form the LiPON dielectric film, second source provide energize the nitrogen particle to or near identical position.Nitrogen particle and the Li that provides in the position that forms dielectric film energize 3PO 4React.This has just increased the content of nitrogen in the LiPON dielectric film.In certain embodiments, improving nitrogen content is to wish to be used to improve lithium ion by electrolytical mobility.
In yet another embodiment, substrate 2809 residing chambers have high nitrogen air.The Li that reacts and provide by the nitrogen in first source and this chamber 3PO 4Form the LiPON dielectric film.Second source provides the particle of energizing that helps form dielectric film.In another embodiment, second source also provides nitrogen to Li in this position 3PO 4Therefore, Li 3PO 4The nitrogenous particle of energizing that provides with the nitrogen in the chamber and second source reacts.This has just improved the nitrogen content of dielectric film 2261.In certain embodiments, wish to improve the content of nitrogen in the dielectric film 2261, because the data of announcing from the Ministry of Energy laboratory in Ao Keli season of being arranged in the Tennessee State show that the raising of nitrogen content can increase the ionic conductance or the mobility of dielectric film.
The film crystal structure that forms according to the instruction of this paper is than form the higher exponent number that has that metal realizes with cathodic coating commonly used.Technology commonly used relies on high temperature, back cathodic deposition annealing to write down and the structure of cathodic coating is used in crystallization always.Regrettably, Chang Yong technology is annealed into identical temperature with total like this, and this is undesirable, and reason is that substrate must stand many other suitable substrate material are got rid of the temperature of considering.And different layers can not be provided with the difference annealing that is suitable for their different demands.According to instruction as herein described by providing required energy can form required high-order and suitably directed crystal structure, and can not make substrate and comprise that negative electrode contacts under the situation that other layer that forms on the substrate of touching stand high annealing, is hopeful to realize high-order crystal cathodic coating.And each layer can use different annealing process (have the ion auxiliary bundle of different-energy as using at different layers, perhaps deposit and anneal with different speed or with the different duration) to anneal.And, by the superficial layer of annealing previous layer, can be deposited on to improve on the surface that ad hoc fashion in back layer quality (for example, in order to realize the particular crystal orientation, or the specific ion adhesive surface) sorted at back layer.
In certain embodiments, according to the present invention, the system that is used for deposit film as shown in the figure is applicable to and forms dielectric film 2261 here.The example of some such systems is shown in Figure 28 A-29B.
In the system shown in Figure 28 A, thermal control surface 2815 connects thermal source 2825, and thermal source 2825 is used for the temperature of control surface 2815.Substrate 2809 forms heat with surface 2815 and dynamically contacts, control substrate temperature when being used for needing the particular deposition process on specific substrate.In one embodiment, thermal source is a coolant source, for example, discharges compressed helium and gives surface 2815 and cool off its cryogenic vacuum pumps.The use of the hot controlled surface 2815 that directly contacts with substrate 2809, particularly at direct contact collimation or when position that film forms overlaps, it is possible allowing to use the substrate that has than low-heat reduction temperature than solid-state thin-film battery manufacturing process commonly used.
Figure 28 B represents another block diagram of system 2800.In the figure, vacuum chamber 2807 is installed with many feed reels 2810 can present many substrates 2809 that are fixed on the peel strip adhesive of presenting from feed reel 2827.Substrate is at arc hot surface 2815 enterprising line feeds, and received by many ends spool 2813.
In one embodiment, feed reel 2810 keeps the band of different materials.In another embodiment, wide band of parts of feed reel 2810 clampings.Many feed reels are set allow the tension force and the speed of the deposited material of each dish to be controlled separately, and can make many different parts be designed to and to be loaded simultaneously and to handle.
In another embodiment, thermal control surface 2815 and thermal source 2825 are arranged on the drum, and drum is controlled the rate travel of the substrate below deposition station 2811 and the auxiliary source 2817.Use a benefit of many material bands to be that it passes through the problem that drum has solved the tension distribution inequality, these material bands are that parts are wide, and drum has wide of many parts by use sometimes can be seen.In relating to the process of many different Component Design, all parts must pass through on drum with identical speed.Therefore, many Component Design otherwise have identical layer and act on their identical layer thickness.
In another embodiment, many substrates 2809 move at deposition station 2811 and auxiliary source 2817 fronts with different speed, therefore allow the layer of different-thickness to act on different being with.In one embodiment, different speed realize can control the speed of substrate band by different drums is provided.
Figure 29 A represents to make another system 2900 of RFID equipment.This system 2900 comprises one or more feed reels 2910 of presenting one or more sources substrate 2909, with the one or more deposition stations 2911 that are deposited upon on one or more substrates, one or more auxiliary sources 2917, present one or more one or more ends spools 2930 that are fixed in the mask 2933 on one or more substrates, on arc hot surface 2915, present one or more ends spool 2913 that the back receives formed equipment and one at substrate and comprise feed reel 2910,2927, end spool 2930,2913, the vacuum chamber 2907 of deposition station 2911 and auxiliary source 2917.
Figure 29 B represents another view of system 2900.Keep many feed reels 2927 of many masks 2933 will allow many parts to be deposited on many substrates 2909 in the system 2900.By using the mask of reel-to-reel, can change the mask that uses at each station easily.For example, if four deposition stations are set, at four masks that will use first group for the first time, each mask is the deposited picture that corresponding separately station defines oneself.Afterwards, mobile mask spool used four masks of second group.So just allow to change mask pattern, and needn't open the settling chamber making different equipment.It also allows to change mask when mask wearing and tearing (for example, being accumulated on the mask by deposition materials, perhaps by the ion(ic) etching away from mask).
Another embodiment of system provides the system in combination to shown in Figure 28 and 29 in the system of feed reel 2827,2927, and feed reel is used for adhesive phase and mask layer are offered source substrate 2909.
A kind of scheme of the present invention provides a kind of radio-frequency apparatus (RFID) equipment with hull cell group.System 2100 shown in Figure 21 A-21F comprises the RFID equipment 2170 of communicating by letter with remote radio frequency (RF) reflector and/or receiver 2160.In one embodiment, the RFID equipment 2170 of system 2100 comprises flexible substrate 2110, is deposited on hull cell group 2120 on the flexible substrate 2110, is arranged on the battery pack 2120 and couples radio frequency (RF) antenna 2140 of battery pack 2120 the electronic circuit 2130 of power supply to electronic circuit 2130 to be provided, to couple with electronic circuit 2130.In another embodiment, the battery pack 2120 of RFID equipment 2170 is rechargeable batteries, from remote equipment 2160 transmission of power the time battery pack 2120 is charged, and in another embodiment, RFID equipment comprises the switch that RF activates.
An embodiment of RFID equipment 2170 comprises the RF actuation switch shown in Figure 22 A.The RF energy receives by antenna 2240, and starts RF actuation switch 2250, and this switch 2250 is arranged to make hull cell group 2220 to be connected with electronic circuit 2230.In another embodiment, RF actuation switch 2250 starts electronic circuit 2230 from low-power sleep mode.
Another kind of scheme of the present invention provides a kind of method 2500 shown in Figure 25 A.Method 2500 comprises the flexible peel strip RFID equipment 2100 (2510) that is provided with, and this equipment 2100 comprises multidigit identifier value and the hull cell group that is deposited on the flexible substrate; With RFID equipment pressure binding (2520) on article; On RFID equipment, receive RF energy (2530); With RF energy, battery supply is coupled to RFID equipment with energy start-up circuit (2170) according to reception; A beginning task (2550) in being enabled in RFID equipment 2170, this task comprise that the multidigit identifier according to RFID equipment 2170 sends identifier (ID) value.In another embodiment, shown in Figure 25 B, task is stored in (2551) in the RFID equipment 2710 with the time started of activity.In another embodiment, shown in Figure 25 C, task is being carried out the self check (2552) among the RFID2710, and the result (2553) of storage self check.In another embodiment of this method, shown in Figure 25 D, the interrogation code (2554) of RFID equipment 2170 receiving remote RF transmitters 2160, and carry out analysis (2555) to interrogation code is transferred to remote RF receiver apparatus (2556) according to the analysis of interrogation code with the ID value.In another embodiment, receive the timestamp (2557) that interrogation code makes RFID equipment 2170 storage incidents from remote equipment.In another embodiment shown in Figure 25 E, the very first time of RFID equipment 2170 storage mark shipment events is stabbed second timestamp (2558) of (2557) and storage mark reception incident, and the timestamp of relatively storing (2559) is can determine the duration of transportation dependent event then.
Another kind of method shown in Figure 26 A comprises forming RFID equipment 2170.An embodiment of method 2600 comprises provides flexible substrate (2610); Deposition comprises anode, negative electrode and separates anode and the electrolytical battery pack of negative electrode (2620); Deposition wiring layer (2630); Place the electronic circuit (2640) on battery pack that is connected with battery pack; The deposition contact adhesive is used (2650) to allow peel strip; With covering RFID equipment (2660).Embodiment comprises the parts of arranging RFID equipment as (i) cover layer, (ii) electronic circuit, (iii) wiring layer, (iv) battery pack, (v) substrate and (vi) contact adhesive.Other embodiment uses the different orders or the position of layer or circuit.In another embodiment, method 2600 is included in and forms printing mark board (2670) on the RFID equipment.In another embodiment shown in Figure 26 B, battery pack is by using the approximately energy deposition (2620) on substrate between 50eV and 95eV.In another embodiment, battery pack is passed through the energy deposition of use between 70eV and 90eV on substrate.In another embodiment, being deposited on the battery pack that flexibility sinks to the bottom is rechargeable battery.
The another kind of scheme of the present invention provides a kind of equipment of flexible peel strip start battery.An embodiment of this equipment 2170 comprises flexible substrate 2110, is deposited on hull cell group 2120 on the flexible substrate 2110, is deposited on the battery pack 2120 and couples battery pack 2120 with radio frequency (RF) antenna 2140 that the electronic circuit 2130 of power supply to electronic circuit 2130 is provided, couples with electronic circuit 2130 and the adhesive 2150 that is applied to flexible substrate 2110 shown in Figure 21 A-21F.In another embodiment of this equipment, electronic circuit 2130 comprises the RF starting switch, and this switch can start electronic circuit 2130 by electricity.In another embodiment, the RF starting switch comprises MEMs equipment.In another embodiment, the RF antenna 2140 of equipment is integrated on the substrate 2110.In another embodiment, the battery pack 2120 of equipment is a rechargeable battery.The another kind of scheme of formation RFID equipment as shown in figure 27 comprises rolling releasing layer 2710, but this layer is with fixed thereon of many RFID equipment 2770 release property ground.
Another kind of scheme of the present invention provides the system of the RFID equipment of a kind of manufacturing shown in Figure 28 A.This system comprises one or more feed reels 2810 of presenting one or more sources substrate 2809, one or more feed reel 2810 of presenting one or more electronic circuits and RF antenna, one or morely will be deposited upon deposition station 2811 on one or more substrates, presents the feed reel 2827 of the peel strip adhesive that is fixed on the substrate with thermal source 2825 and comprise feed reel 2810 and the vacuum chamber 2807 of deposition station 2811.Be deposited on that layer in the system comprises the layer that forms battery and with battery pack and electronic circuit couples and wiring layer that RF antenna and electronic circuit are coupled.The layer that the deposition back forms battery comprises (a) cathode layer, (b) dielectric substrate and (c) anode layer.
Some embodiment provide a kind of system, and it comprises vacuum chamber; Many in the vacuum chamber to source and machine reel, wherein source and machine reel comprise article one that backing material is provided and first source tray of first machine reel, and provide first mask strip with many different masks and second source tray of second machine reel; First deposition station, it is arranged to material is deposited on article one of the substrate that moves between first source tray and first machine reel, as limiting by first mask strip that moves between second source tray and second machine reel; And controller, be used for operationally coupling with can be between first source tray and first machine reel with first independently speed and tension force move article one of substrate, and can be between second source tray and second machine reel mobile mask strip.
Some embodiment also comprise the 3rd source tray that backing material second and the 3rd machine reel are provided, and its middle controller is coupled is used between the 3rd source tray and the 3rd machine reel that independently speed and tension force move the second of substrate with second.
In certain embodiments, first mask strip is provided for the mask of first and second substrate strip.
Some embodiment also comprise provides second mask strip with many different masks and the 4th source tray of the 4th machine reel; Second deposition station, it is arranged to material is deposited on the second of the substrate that moves between the 3rd source tray and the 3rd machine reel, as limiting by second mask strip that moves between the 4th source tray and the 4th machine reel; Be used for operationally coupling with can independently speed and tension force move the second of substrate with second with its middle controller.
In certain embodiments, controller is operationally coupled, and is used for that independently speed and tension force move second mask strip according to second.
Other embodiment provides a kind of method, comprising: article one that backing material is provided by deposition station; Move first mask strip by deposition station; The form of the pattern that the ground floor of the material of deposition station is limited with the first area by first mask strip is deposited on first deposition materials; Be deposited on first backing material with the form of the pattern that the second layer of the material of deposition station is limited with the second area by first mask strip.
Some embodiment of this method also comprise: the second that backing material is provided by deposition station; Move second mask strip by deposition station; The form of the pattern that the ground floor of the material of deposition station is limited with the first area by second mask strip is deposited on second deposition materials; Be deposited on first backing material with the form of the pattern that the second layer of the material of deposition station is limited with the second area by second mask strip.
In certain embodiments, first and second of backing material are moved with different speed.
In certain embodiments, first and second of backing material are moved with different tension force.
Some embodiment of this method also comprise adhesive and releasing layer are deposited on the substrate.
Some embodiment of this method also comprise pressure sensitive adhesive layer are bonded on the substrate.
Other embodiment provides a kind of method, comprising: flexible substrate is provided; The deposition battery pack comprises anode, negative electrode and being used to of being limited by different mask regions is isolated the electrolyte deposition of anode and negative electrode in mask strip; The deposition wiring layer; Electronic circuit is arranged on the sedimentary deposit, and wherein electronic circuit is connected with battery pack by wiring layer; The deposition contact adhesive is to allow the application of peel strip; And overlay device.
In certain embodiments, the layer order of the element of RFID equipment distributes and comprises protective layer, electronic circuit, wiring layer, battery pack, substrate and the contact adhesive of following ordering.
Some embodiment of this method also are included in and form the printing mark board on the equipment.
In certain embodiments, battery pack is deposited on and comprises the energy of use between 50eV and 95eV on the flexible substrate.
In certain embodiments, battery pack is deposited on and comprises the energy of use between 70eV and 90eV on the flexible substrate.
In certain embodiments, the battery pack that is deposited on the substrate is chargeable.
Another scheme of the present invention provides the embodiment that comprises many layers, wherein these layers mutually keep forming individual packaging, and these layers comprise: flexible substrate, electronic circuit, be used for operationally coupling with the hull cell group that power supply can be provided, radio frequency (RF) antenna and the adhesive phase that is used for operationally coupling electronic circuit with electronic circuit.
In certain embodiments, electronic circuit comprises that electricity starts the RF actuation switch of electronic circuit.
In certain embodiments, RF allows switch to comprise MEMS equipment.
In certain embodiments, these layers carry out stacked with following order: adhesive phase, flexible substrate, hull cell group, wiring layer and electronic circuit, wherein adhesive phase be pressure-sensitive and covered by peelable releasing layer, the hull cell group is deposited on the flexible substrate, wiring layer comprises the RF antenna that is deposited on the previous layer, and electronic circuit comprises the RF starting switch that is deposited on the wiring layer.
In certain embodiments, the RF antenna is integrated on the substrate.
In certain embodiments, battery pack is chargeable.
In certain embodiments, the present invention includes above-mentioned a lot of any one equipment and adhere in the above rolling releasing layer releasedly.
In certain embodiments, adhesive phase is contact adhesive and is covered by peelable releasing layer.
In certain embodiments, these layers stack gradually from the group of being made up of following layer: adhesive phase, substrate layer, battery pack layer, electronic circuit layer and RF antenna stack.
In certain embodiments, these layers stack gradually from the group of being made up of following layer: substrate layer, battery pack layer, comprise electronic circuit and RF antenna layer, adhesive phase.
In certain embodiments, these layers stack gradually from the group of being made up of following layer: substrate layer; Comprise a) battery pack layer, b) electronic circuit and c) layer of RF antenna; And adhesive phase.
Other embodiment comprises the system that makes RFID equipment, and this system comprises: one or more feed reels of presenting one or more sources substrate; One or more feed reels of presenting one or more electronic circuits and RF antenna; One or more deposition stations that will be deposited upon on one or more substrates; Wherein these the layer comprise: form solid-state lithium-base battery layer, comprise the battery layers of anode layer, dielectric substrate anode layer, the wiring layer that makes battery pack and electronic circuit layer couple and make RF antenna and electronic circuit to couple; The activity mask strip, it has the many different masked areas that are used for different electroless copper deposition operation; Present the feed reel of peel strip adhesive phase; With the vacuum chamber that comprises feed reel and deposition station.
Some embodiments of the present invention provide a kind of hull cell and a kind of active actuation switch.A kind of exemplary systems comprises: substrate, the circuit that is connected with substrate is with the hull cell that is connected and is connected with circuit with substrate.This hull cell is given circuit supply.Quickening starting switch also is connected with substrate with this circuit of energy electric actuation.In certain embodiments, this acceleration starting switch is a kind of MEMS equipment.In certain embodiments, this acceleration starting switch comprises a cantilever beam at least.In another embodiment, this acceleration starting switch comprises a cantilever beam and an electric contact at least.At least one cantilever beam contacts this electric contact in response to acceleration.In another embodiment, this acceleration starting switch comprises the first cantilever beam Closing Switch and the second cantilever beam Closing Switch.The first cantilever beam Closing Switch is quickened to form in response to first and is electrically contacted, and the second cantilever beam Closing Switch quickens to form electric contact in response to second.First acceleration and second is quickened different.In another embodiment, this acceleration starting switch quickens to form in response to first and electrically contacts, and quickens to form in response to second to electrically contact.First acceleration and second is quickened different.In yet another embodiment, first quicken starting switch differently in response to any acceleration start-up circuit in two Different Plane.The first cantilever beam Closing Switch is quickened to form in response to first in first plane and is electrically contacted, and the second cantilever beam Closing Switch is quickened to form in response to second in second plane and electrically contacted.
In certain embodiments, circuit also comprises memory, and timer.Time when timer writes down one of them first cantilever beam Closing Switch in response to the first acceleration formation electric contact, the time when perhaps the second cantilever beam Closing Switch is quickened to form electric contact in response to second, this time is stored in the memory.In certain embodiments, the time when another first cantilever beam Closing Switch quicken to form electric contact in response to first, perhaps the time when (the second cantilever beam Closing Switch is quickened to electrically contact according to second) is stored in the memory.
In certain embodiments, the battery splash is on substrate, and circuit is formed on the battery.In another embodiment, the circuit splash is on substrate, on the battery splash system circuit.In yet another embodiment, this system is installed in as in the encapsulation or the equipment of ammunition.In another embodiment, the bonding substrate of adhesive, wherein this system is adhered to this equipment.The bonding substrate of adhesive.
Some embodiment comprise substrate and the hull cell that is positioned on this substrate.Hull cell also comprises first lead-in wire, carries out first electric contact of electric connection with first lead-in wire, second lead-in wire and second electric contact that communicates with second lead-in wire.This system also comprise with substrate on first lead-in wire and second one of them active actuation switch that is connected in going between, be used for this hull cell is electrically connected with first electric contact and second electric contact.The bonding substrate of adhesive.Active actuation switch activated in response to acceleration.In certain embodiments, active actuation switch activated in response to magnetic field.In another embodiment, active actuation switch activated in response to moisture.In yet another embodiment, active actuation switch activated in response to wireless signal.In going back an embodiment, active actuation switch activated in response to pressure.In another embodiment, active actuation switch activated in response to light.This system also comprises the electronic equipment that is connected with second lead-in wire with first lead-in wire.Electronic equipment also is connected with substrate.In certain embodiments, electronic equipment is connected on the substrate, and hull cell is connected on the electronic equipment.In another embodiment, hull cell is connected on the substrate, and the part of electronic equipment is connected on the hull cell at least.Active actuation switch uses microelectronic manufacturing technology and forms.
Some embodiment comprise a kind of method, are used to start active actuation switch so that hull cell communicates with one group of electronic equipment; The electronic equipment that use is powered instructs ammunition (ordinance).Another kind method comprises: start active actuation switch so that hull cell communicates with one group of electronic equipment; The zero-time of the electronic equipment storage guarantee that use is powered.In certain embodiments, start active actuation switch and be included in the active actuation switch of acceleration startup on the selected level.In another embodiment, this method also comprises the execution self check, and in response to starting active actuation switch storage self-detection result.In other embodiments, store other acceleration.Also write down and surpass the relevant time of other acceleration of selected threshold value.To other accelerating time of this time can with other cycle, as the time that the owner of cargo occupies this active actuation switch, compare.
Advantage is, comprise one or more batteries and start or activate battery or battery pack equipment, and the system of circuit can be formed on the film, and can be placed in compact package or the product.In addition, battery pack, actuation gear and circuit can be formed on the film that has adhesive above it, so that this encapsulation comes down to a kind ofly can be placed on outer package, perhaps place with the packing of product, perhaps are placed on the Sign Board on product or the equipment.A kind of complete system can also be combined in product or equipment with profile that can control appliance or write down the information of relevant product or equipment.Start or actuating device can time response after a while in the incident starting switch.This system needn't carry out manual activation.On the contrary, this system responses can automatically be activated in incident.
In certain embodiments, the price of this whole system is not expensive.The result is, manufacturer, whole seller and or even the retailer so a kind of system can both be provided, it can either be installed on the equipment, again can be as the part of the packing relevant with many equipment or product.In addition, these system bulk are little, in light weight, and enough energy storage can be provided and can realize at least a function.This system is made by non-toxic material, thereby can not produce harm when using with product or equipment.
Some embodiment comprise a kind of system, and described system comprises: substrate; The circuit that is connected with substrate; The hull cell that is connected and is connected with substrate with circuit, this hull cell is given circuit supply; With the acceleration starting switch, be connected with this circuit of energy electric actuation with substrate.
In some embodiment of this system, this acceleration starting switch is a MEMS equipment.
In certain embodiments, this acceleration starting switch comprises a cantilever beam at least.
In certain embodiments, this acceleration starting switch comprises at least one cantilever beam and an electric contact, and described at least one cantilever beam contacts this electric contact in response to acceleration.
In certain embodiments, this acceleration starting switch comprises: the first cantilever beam Closing Switch; With the second cantilever beam Closing Switch.
In certain embodiments, the first cantilever beam Closing Switch is quickened to form in response to first and is electrically contacted, and the second cantilever beam Closing Switch electrically contacts in response to the second acceleration formation, and first acceleration and second is quickened different.
In certain embodiments, this acceleration starting switch quickens to form in response to first and electrically contacts, and quickens to form second in response to second and electrically contacts, and first acceleration and second is quickened different.
In certain embodiments, wherein first quicken starting switch differently in response to any acceleration start-up circuit in two Different Plane.
In certain embodiments, the first cantilever beam Closing Switch is quickened to form in response to first in first plane and is electrically contacted, and the second cantilever beam Closing Switch quickens to form electric contact in response to second in second plane.
In certain embodiments, this circuit also comprises: memory; And timer, wherein timer writes down one of them first cantilever beam Closing Switch in response to first time that quicken to form when electrically contacting, and perhaps the second cantilever beam Closing Switch is in response to second time of quickening to form when electrically contacting, and this time is stored in the memory.
Time when the time when in certain embodiments, another first cantilever beam Closing Switch electrically contacts in response to the first acceleration formation or the second cantilever beam Closing Switch electrically contact in response to the second acceleration formation is stored in the memory.
In certain embodiments, the battery splash is on substrate.
In certain embodiments, wherein circuit is formed on the battery.
In certain embodiments, the circuit splash is on substrate.
In certain embodiments, the battery splash is on circuit.
In certain embodiments, this system is installed in the equipment.
In certain embodiments, this equipment is a kind of packing.
In certain embodiments, this equipment is ammunition.
In certain embodiments, also comprise the adhesive that is fixed on the substrate, wherein this system is adhered to this equipment.
In certain embodiments, also comprise the adhesive that is fixed on the substrate.
Other embodiments of the invention comprise that a kind of system comprises: substrate; Be positioned at the hull cell on this substrate, this hull cell also comprises: first lead-in wire; Carry out first electric contact of electric connection with first lead-in wire; Second lead-in wire; Carry out second electric contact of electric connection with second lead-in wire; With with substrate on first lead-in wire and second one of them active actuation switch that is connected that goes between, be used for this hull cell is electrically connected with first electric contact and second electric contact.
Some such embodiment also comprise: with the adhesive of substrate binding.
In certain embodiments, active actuation switch activated in response to acceleration.
In certain embodiments, active actuation switch activated in response to magnetic field.
In certain embodiments, active actuation switch activated in response to moisture.
In certain embodiments, active actuation switch activated in response to wireless signal.
In certain embodiments, active actuation switch activated in response to pressure.
In certain embodiments, active actuation switch activated in response to light.
Some embodiment also comprise the electronic equipment that is connected with second lead-in wire with first lead-in wire, and wherein electronic equipment also is connected with substrate.
In certain embodiments, electronic equipment is fixed on the substrate, and hull cell is fixed on the electronic equipment.
In certain embodiments, hull cell is fixed on the substrate, and the part of electronic equipment is fixed on the hull cell at least.
In certain embodiments, active actuation switch uses microelectronic manufacturing technology and forms.
Additional embodiments of the present invention comprises a kind of method, comprising: start active actuation switch so that hull cell communicates with one group of electronic equipment; The electronic equipment guiding ammunition that use is powered.
Additional embodiments of the present invention comprises a kind of method, comprising: start active actuation switch so that hull cell communicates with one group of electronic equipment; The zero-time of the electronic equipment storage guarantee that use is powered.
In some embodiment of this method, start active actuation switch and be included in the active actuation switch of acceleration on the selected level.
Some embodiment also comprise: carry out self check; With in response to starting active actuation switch storage self-detection result.
Some embodiment also comprise other acceleration of storage.
Some embodiment also comprise storage and the relevant time of other acceleration that surpasses selected threshold value.
Some embodiment also comprise and the owner of cargo are occupied the time of this active actuation switch and the time of other acceleration compares.
Other other embodiment of the present invention comprises a kind of system, comprising: vacuum chamber; Many to source and machine reel in the vacuum chamber, wherein source and machine reel comprise article one that backing material is provided and first source tray of first machine reel, and provide first mask strip with many different masks and second source tray of second machine reel; First deposition station, it is arranged to material is deposited on article one of the substrate that moves between first source tray and first machine reel, as limiting by first mask strip that moves between second source tray and second machine reel; And controller, be used for operationally coupling with can be between first source tray and first machine reel with first independently speed and tension force move article one of substrate, and can be between second source tray and second machine reel mobile mask strip.
Some embodiment also comprise the 3rd source tray that substrate second backing material and the 3rd machine reel are provided, and its middle controller is coupled is used between the 3rd source tray and the 3rd machine reel that independently speed and tension force move the second substrate with second.
Further other embodiment of the present invention comprises a kind of method, comprising: provide article one backing material by deposition station; Move first mask strip by deposition station; The form of the pattern that the ground floor of the material of deposition station is limited with the first area by first mask strip is deposited on first deposition materials; Be deposited on second backing material with the form of the pattern that the second layer of the material of deposition station is limited with the second area by first mask strip.
Some embodiment of this method also comprise: the second that backing material is provided by deposition station; Move second mask strip by deposition station; The form of the pattern that the ground floor of the material of deposition station is limited with the first area by second mask strip is deposited on second deposition materials; Be deposited on first backing material with the form of the pattern that the second layer of the material of deposition station is limited with the second area by second mask strip.
Other other embodiment of the present invention comprises a kind of method of forming device, and this method comprises: flexible substrate is provided; The deposition battery pack comprises anode, negative electrode and being used to of being limited by different mask regions is isolated the electrolyte deposition of anode and negative electrode in mask strip; The deposition wiring layer; Electronic circuit is arranged on the sedimentary deposit, and wherein electronic circuit operationally is connected with battery pack by wiring layer; The deposition contact adhesive is to allow the application of release adhesive; And overlay device.
In certain embodiments, the layer order of the element of RFID equipment distributes and comprises: (i) protective layer; (ii) electronic circuit, (iii) wiring layer, (iv) battery, (v) substrate and (vi) contact adhesive.
Some other embodiment of this invention comprise a kind of flexible release adhesive battery-operated equipment, comprising: many layers, and wherein these layers keep forming individual packaging mutually, and wherein these layers comprise: flexible substrate; Electronic circuit; Be used for coupling so that the hull cell group of power supply can be provided with electronic circuit; Be used to couple radio frequency (RF) antenna of electronic circuit; And adhesive phase.
In some embodiment of this equipment, electronic circuit comprises that electricity starts the RF actuation switch of electronic circuit.
Other other embodiment of the present invention comprises a kind of system of the RFID of manufacturing equipment, and this system comprises: one or more feed reels of presenting one or more sources substrate; One or more feed reels of presenting one or more electronic circuits and RF antenna; One or more deposition stations that will be deposited upon on one or more substrates; Wherein these layers comprise: (i) form the layer of solid-state lithium-base battery, battery layers comprises: (a) cathode layer; (b) dielectric substrate; (c) anode layer; The wiring layer that (ii) makes battery pack and electronic circuit layer couple and make RF antenna and electronic circuit to couple; The activity mask strip has the many different masked areas that are used for different electroless copper deposition operation; Present the feed reel of peel strip adhesive phase; With the vacuum chamber that comprises feed reel and deposition station.
Other embodiments of the invention comprise a kind of system, comprising: the settling chamber, and it comprises: many to source and machine reel in the vacuum chamber, wherein source and machine reel comprise first source tray, first machine reel, second source tray and second machine reel; Deposition station, it is arranged to material is deposited on article one of the substrate that moves between first source tray and first machine reel, and material can be deposited on the second of the substrate that moves between second source tray and second machine reel; And controller, be used for operationally coupling with can be between first source tray and first machine reel with first independently speed and tension force move article one of substrate, and can be between second source tray and second machine reel independently speed and tension force move the second of substrate with second.
Some embodiment of this system also comprise: one in the many removable mask strip, each mask strip and many sources and machine reel is connected, and each mask strip comprises many mask regions, and each mask regions limits the pattern that is deposited on corresponding of the substrate.
Other embodiments of the invention comprise a kind of method, comprise by deposition station moving many substrate strip with rate travel independently; With the material in the layer is deposited on each substrate strip.
Some embodiment of this method also comprise: move many removable mask strip by deposition station, one in each mask strip and the many substrate strip is connected, and each mask strip comprises many mask regions, and each mask regions defines the pattern of control deposition station.
Other embodiment of this invention comprises a kind of system, comprising: the settling chamber, and it comprises: the device that moves many substrate strip by deposition station with rate travel independently; With the deposition station that the material in the layer is deposited on each substrate strip.
Some embodiment of this system also comprise: one in the many removable mask strip, each mask strip and many sources and machine reel is connected, and each mask strip comprises many mask regions, and each mask regions defines the pattern that is deposited on corresponding of the substrate.
Other embodiment more of the present invention comprises a kind of system, comprising: radio frequency identifiers (RFID) equipment, be used for communicating with remote radio frequency (RF) reflector and/or receiver apparatus, and wherein: RFID equipment comprises: flexible substrate; Be used for contact adhesive that RFID equipment is connected with a surface; Be deposited on the hull cell group that flexibility sinks to the bottom; Be positioned on the battery pack and couple the electronic circuit of battery pack, wherein battery pack is used for operationally coupling electronic circuit powering; With the radio frequency that is connected with electronic circuit (RF) antenna.
In certain embodiments, battery pack is a rechargeable battery pack, and can be recharged in energy battery pack when remote equipment transmits by RF antenna and electronic circuit.
Other other embodiment of the present invention comprises a kind of method, comprising: flexible release adhesive RFID equipment is set, and this equipment comprises multidigit identifier value and the hull cell group that is deposited on the flexible substrate; With RFID equipment pressure binding on article; On RFID equipment, receive the RF energy; With according to the RF energy that receives, battery supply is coupled to RFID equipment with can start-up circuit, and uses the power of battery pack in RFID equipment, to start a task, wherein this task comprises multidigit identifier transmission identifier (ID) value according to RFID equipment.
In some embodiment of this method, task comprises the movable time started in the storage RFID equipment.
Other embodiments of the invention comprise a kind of method of the RFID of formation equipment, and this method comprises: flexible substrate is provided; Deposition comprises anode, negative electrode and separates anode and the electrolytical battery pack of negative electrode; The deposition wiring layer; Electronic circuit is placed on the sedimentary deposit, and wherein electronic circuit is used for operationally being connected with battery pack by wiring layer; The deposition contact adhesive is used to allow release adhesive; With covering RFID equipment.
In some embodiment of this method, the layer order of the element of RFID equipment distributes and comprises: protective layer, electronic circuit, wiring layer, battery pack, substrate, and contact adhesive.
Other embodiment more of the present invention comprises a kind of flexible release adhesive battery-operated equipment, comprising: many layers, and wherein these layers keep forming individual packaging mutually, and wherein these layers comprise: flexible substrate; Electronic circuit; Be used for coupling so that the hull cell group of power supply can be provided with electronic circuit; Be used to couple radio frequency (RF) antenna of electronic circuit; And adhesive phase.
In certain embodiments, electronic circuit comprises that electricity starts the RF actuation switch of electronic circuit.
Other other embodiment of the present invention comprises a kind of system of the RFID of manufacturing equipment, and this system comprises: one or more feed reels of presenting one or more sources substrate; One or more feed reels of presenting one or more electronic circuits and RF antenna; One or more deposition stations that will be deposited upon on one or more substrates; Wherein these layers comprise: (i) form the layer of solid-state lithium-base battery, battery layers comprises: a) cathode layer; B) dielectric substrate; C) anode layer; The wiring layer that (ii) makes battery pack and electronic circuit layer couple and make RF antenna and electronic circuit to couple; With the feed reel of presenting the peel strip adhesive phase; With the vacuum chamber that comprises feed reel and deposition station.
Should be understood that: top description has been intended that interpretation usefulness, rather than plays restriction and use.Though propose in the details description in front of the many features of different embodiment as described herein and effect together with its 26S Proteasome Structure and Function, but for a person skilled in the art, during description on look back, the variation of other many embodiment and details will be conspicuous.Therefore, protection scope of the present invention should be determined with reference to appended claim and with the four corner of the claim equivalent of these mandates.

Claims (45)

1. system comprises:
Substrate;
The circuit that is connected with substrate, described circuit keep not being powered in fact when non operating state;
Hull cell, its form the series of thin rete and with the substrate mechanical connection, this hull cell is given circuit supply; With
Quicken starting switch,, and be used for operationally coupling so that in case when switch activated, this switch can make battery form with circuit and be electrically connected, thereby makes battery subsequently to circuit supply with the substrate mechanical connection.
2. the system as claimed in claim 1, wherein this acceleration starting switch is a kind of MEMS equipment.
3. system as claimed in claim 2, wherein this acceleration starting switch comprises at least one cantilever beam.
4. system as claimed in claim 2, wherein this acceleration starting switch comprises at least one cantilever beam and an electric contact, described at least one cantilever beam contacts this electric contact in response to acceleration.
5. system as claimed in claim 2, wherein this acceleration starting switch comprises:
The first cantilever beam Closing Switch; With
The second cantilever beam Closing Switch.
6. system as claimed in claim 5, wherein the first cantilever beam Closing Switch is quickened to form in response to first according to first mechanical property and is electrically contacted, and the second cantilever beam Closing Switch electrically contacts in response to the second acceleration formation according to second mechanical property, and first acceleration and second is quickened different.
7. system as claimed in claim 2, wherein this acceleration starting switch quickens to form in response to first according to first mechanical property and electrically contacts, and electrically contacts in response to the second acceleration formation according to second mechanical property, and first acceleration and second is quickened different.
8. system comprises:
Substrate;
The circuit that is connected with substrate;
Hull cell, it is connected with circuit with substrate, and described hull cell is used for to circuit supply; With
Quicken starting switch, be connected with substrate, be used for electric start-up circuit, wherein quickening starting switch is a kind of MEMS equipment, and
Wherein said acceleration starting switch is in response to any the acceleration start-up circuit differently in two Different Plane.
9. system as claimed in claim 8, wherein said acceleration starting switch comprises the first cantilever beam Closing Switch, the described first cantilever beam Closing Switch is quickened to form in response to first in first plane and is electrically contacted, the second cantilever beam Closing Switch is quickened to form in response to second in second plane and is electrically contacted, and wherein said second plane is different from first plane.
10. the system as claimed in claim 1, wherein: quickening starting switch is MEMS equipment, and described MEMS equipment comprises:
The first cantilever beam Closing Switch; With
The second cantilever beam Closing Switch, wherein the first cantilever beam Closing Switch is quickened to form according to first mechanical property in response to first of the first estate and is electrically contacted, and the second cantilever beam Closing Switch is quickened to form electric contact according to second mechanical property in response to second of second grade different with the first estate.
11. system as claimed in claim 10, wherein: the first cantilever beam Closing Switch has first length, and the second cantilever beam Closing Switch has second length different with first length.
12. system as claimed in claim 10, wherein: the first cantilever beam Closing Switch has first quality, and the second cantilever beam Closing Switch has second quality different with first quality.
13. system as claimed in claim 10, wherein: the first cantilever beam Closing Switch has first cross-sectional width, and the second cantilever beam Closing Switch has second cross-sectional width different with first cross-sectional width.
14. the system as claimed in claim 1, wherein: quickening starting switch is MEMS equipment, and described MEMS equipment comprises:
The first cantilever beam Closing Switch;
The second cantilever beam Closing Switch; With
The 3rd cantilever beam Closing Switch, wherein the first cantilever beam Closing Switch is quickened to form in response to first and is electrically contacted, the second cantilever beam Closing Switch is quickened to form in response to second and is electrically contacted, quickening formation with the 3rd cantilever beam Closing Switch in response to the 3rd electrically contacts, wherein first quicken to be on the first direction, second quickens to be on the direction different with first direction, with the 3rd quicken to be in different with first direction also with second direction on the different third direction.
15. the system as claimed in claim 1, wherein: quickening starting switch is MEMS equipment, and described MEMS equipment is included on each direction in a plurality of different directions a plurality of cantilever beam Closing Switch in response to a plurality of different levels of acceleration.
16. the system as claimed in claim 1, wherein: quickening starting switch is MEMS equipment, and described MEMS equipment is included on the direction of three quadratures a plurality of cantilever beam Closing Switch in response to a plurality of different levels of acceleration.
17. the system as claimed in claim 1 comprises also being applicable to system being fixed in adhesive-backed on the product that this adhesive-backed layer that is released covers.
18. the system as claimed in claim 1, wherein the battery splash is on substrate.
19. system as claimed in claim 18, wherein circuit is formed on the battery.
20. the system as claimed in claim 1, wherein the circuit splash is on substrate.
21. system as claimed in claim 20, wherein the battery splash is on circuit.
22. the system as claimed in claim 1, wherein this system is installed in the equipment.
23. the system as claimed in claim 22, wherein this equipment is a kind of packing.
24. the system as claimed in claim 22, wherein this equipment is ammunition (ordinance).
25. system as claimed in claim 2 also comprises the adhesive that is fixed on the substrate, wherein this system is fixed in this equipment bondingly.
26. system as claimed in claim 20 also comprises the adhesive that is fixed on the substrate.
27. the system as claimed in claim 1 also comprises timer, wherein circuit is stored in one or more incidents of special time according to timer.
28. the system as claimed in claim 1 also comprises timer, wherein circuit is by using the beginning of timer mark guarantee period.
29. the system as claimed in claim 1 also comprises timer, wherein timer picks up counting according to the startup of switch.
30. the system as claimed in claim 1 also comprises timer, the wherein holding time of circuit tracing device, and timer be used for determining specific impact load whether the process in the holding time take place.
31. the system as claimed in claim 1 also comprises the clauses and subclauses with burglary-resisting installation, wherein switch starts by the mechanism that is generally used for not starting burglary-resisting installation.
32. the system as claimed in claim 1 also comprises the clauses and subclauses with burglary-resisting installation, wherein switch starts by the mechanism that is generally used for not starting burglary-resisting installation, and wherein circuit is carried out the diagnosis self check according to the startup of switch.
33. the system as claimed in claim 1 also comprises timer, wherein circuit just carries out and stores the result of self check when switch activated, and by using the beginning of timer mark guarantee period.
34. the system as claimed in claim 1 also comprises ammunition, wherein circuit is operationally controlled the function of ammunition when switch activated.
35. the system as claimed in claim 1 also comprises ammunition, wherein circuit is operationally controlled the function of ammunition when switch activated, and wherein ammunition is a sub warhead.
36. the system as claimed in claim 1 also comprises the ammunition with direction controller, wherein circuit service orientation controller guiding ammunition when switch activated operationally.
37. the system as claimed in claim 1, wherein hull cell forms by the series thin film layer of successive sedimentation on substrate surface.
38. the system as claimed in claim 1, wherein: quickening starting switch is MEMS equipment, and described MEMS equipment comprises:
The first cantilever beam Closing Switch; With
The second cantilever beam Closing Switch, wherein the first cantilever beam Closing Switch is quickened to form in response to first on the first direction and is electrically contacted, and quickens to form in response to second on the second direction different with first direction with the second cantilever beam Closing Switch to electrically contact.
39. a system comprises:
Substrate;
The circuit that is connected with substrate;
The hull cell that is connected with substrate, also is connected with circuit, described hull cell is used for to circuit supply; With
The acceleration starting switch that is connected with substrate, be used for electric start-up circuit, wherein quickening starting switch is MEMS equipment, wherein quicken starting switch and comprise the first cantilever beam Closing Switch, wherein the first cantilever beam Closing Switch is quickened to form in response to first and is electrically contacted, wherein circuit also comprises timer, and wherein the time when one of them first cantilever beam Closing Switch formation electrically contacts is stored.
40. a system comprises:
Substrate;
The circuit that is connected with substrate;
The hull cell that is connected with substrate, also is connected with circuit, hull cell are used for to circuit supply; With
The acceleration starting switch that is connected with substrate is used for electric start-up circuit, and wherein quickening starting switch is MEMS equipment, wherein quickens starting switch and comprises:
The first cantilever beam Closing Switch; With
The second cantilever beam Closing Switch, wherein the first cantilever beam Closing Switch quicken to form in response to first and electrically contacts, and the second cantilever beam Closing Switch quickens to form in response to second and electrically contact, first quicken different with second acceleration;
Wherein this circuit also comprises:
Memory; With
Timer, the time when wherein the time when one of them first cantilever beam Closing Switch electrically contacts in response to the first acceleration formation or the second cantilever beam Closing Switch are quickened to form electric contact in response to second is stored in the memory.
41. system as claimed in claim 40, the time the when time when wherein another first cantilever beam Closing Switch is quickened to form electric contact in response to first or the second cantilever beam Closing Switch are quickened to form electric contact in response to second is stored in the memory.
42. system as claimed in claim 40 comprises also being applicable to system being fixed in adhesive-backed on the product that this adhesive-backed layer that is released covers.
43. system as claimed in claim 40, wherein: the guarantee time cycle quickens to begin to calculate according to first.
44. system as claimed in claim 43, wherein the time of impact event is according to the second acceleration record.
45. system as claimed in claim 40 also comprises being applicable to system being fixed in adhesive-backed on the product.
CNB2003801100863A 2003-01-02 2003-12-31 Solid-state battery-powered devices and manufacturing methods Expired - Fee Related CN100403477C (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US10/336,621 US7294209B2 (en) 2003-01-02 2003-01-02 Apparatus and method for depositing material onto a substrate using a roll-to-roll mask
US10/336,619 2003-01-02
US10/336,620 2003-01-02
US10/336,620 US6906436B2 (en) 2003-01-02 2003-01-02 Solid state activity-activated battery device and method
US10/336,662 US7603144B2 (en) 2003-01-02 2003-01-02 Active wireless tagging system on peel and stick substrate
US10/336,662 2003-01-02
US10/336,619 US20040131760A1 (en) 2003-01-02 2003-01-02 Apparatus and method for depositing material onto multiple independently moving substrates in a chamber
US10/336,621 2003-01-02
PCT/US2003/041739 WO2004061887A1 (en) 2003-01-02 2003-12-31 Solid-state battery-powered devices and manufacturing methods

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CN100403477C true CN100403477C (en) 2008-07-16

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JP (1) JP2006515952A (en)
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WO2004061887A1 (en) 2004-07-22
KR20050092384A (en) 2005-09-21
WO2004061887A9 (en) 2004-08-26
AU2003300153A1 (en) 2004-07-29
EP1590823A1 (en) 2005-11-02
EP1590823A4 (en) 2007-05-30

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