CA2719249A1 - Light-emitting element lamp and lighting equipment - Google Patents
Light-emitting element lamp and lighting equipment Download PDFInfo
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- CA2719249A1 CA2719249A1 CA2719249A CA2719249A CA2719249A1 CA 2719249 A1 CA2719249 A1 CA 2719249A1 CA 2719249 A CA2719249 A CA 2719249A CA 2719249 A CA2719249 A CA 2719249A CA 2719249 A1 CA2719249 A1 CA 2719249A1
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- Prior art keywords
- light
- thermally conductive
- substrate
- emitting element
- cover
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0083—Array of reflectors for a cluster of light sources, e.g. arrangement of multiple light sources in one plane
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/14—Adjustable mountings
- F21V21/30—Pivoted housings or frames
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/357—Driver circuits specially adapted for retrofit LED light sources
- H05B45/3574—Emulating the electrical or functional characteristics of incandescent lamps
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
Abstract
Provided is a light-emitting lamp (1) that uses a heat conductive case (2) and a heat conductive cover (5) to effectively suppress increased temperature for a substrate (9) on which a light-emitting element (4) is mounted. The light-emitting element lamp (1) is equipped with the heat conductive case (2), a light source part (3), the heat conductive cover (5), and an insulating cover (6). The heat conductive case (2) has an irradiation opening (2b), and is formed to flare out toward the irradiation opening part (2b), while its outer peripheral surface is exposed outward and a substrate installation part (2c) is provided on the inner peripheral surface. The light source part (3) has a substrate (9) on which the light-emitting element (4) is mounted, and the substrate (9) is installed thermally bonded to the substrate installation part (2c) of the heat conductive case (2). The heat conductive cover (5) is connected thermally bonded to the outer peripheral surface of the heat conductive case (2) with the surfaces thereof in contact. One end of the insulating cover (6) is connected to the heat conductive cover (5) and a base (7) is connected to the other end. A lighting circuit (12) controls lighting of the light-emitting element (4) housed in the insulating cover (6).
Description
DESCRIPTION
LIGHT-EMITTING ELEMENT LAMP AND LIGHTING EQUIPMENT
Technical Field [0001]
The present invention relates to a light-emitting element lamp to which light-emitting elements such as LEDs are applied as a light source, and lighting equipment using the light-emitting element lamp.
Background Art
LIGHT-EMITTING ELEMENT LAMP AND LIGHTING EQUIPMENT
Technical Field [0001]
The present invention relates to a light-emitting element lamp to which light-emitting elements such as LEDs are applied as a light source, and lighting equipment using the light-emitting element lamp.
Background Art
[0002]
In regard to the light-emitting element such as an LED, an increase in temperature thereof results in a lowering in optical output and adversely influences the service life.
Therefore, in a lamp in which a solid-state light-emitting element such as an LED and EL element are used as its light source, it is necessary to prevent the temperature of the light-emitting element from rising in order to improve various characteristics such as service life and efficiency.
Conventionally, in this type of LED lamp, such a type of LED
lamp has been known which is provided with a columnar radiator between a substrate having LEDs disposed thereon and a cap and the substrate is attached to the peripheral edge at the end face of the radiator (For example, refer to Patent Document 1).
Patent Citation
In regard to the light-emitting element such as an LED, an increase in temperature thereof results in a lowering in optical output and adversely influences the service life.
Therefore, in a lamp in which a solid-state light-emitting element such as an LED and EL element are used as its light source, it is necessary to prevent the temperature of the light-emitting element from rising in order to improve various characteristics such as service life and efficiency.
Conventionally, in this type of LED lamp, such a type of LED
lamp has been known which is provided with a columnar radiator between a substrate having LEDs disposed thereon and a cap and the substrate is attached to the peripheral edge at the end face of the radiator (For example, refer to Patent Document 1).
Patent Citation
[0003]
Patent Citation l:Japanese Laid-Open Patent Publication No.2005-286267 Summary of Invention Technical Problem
Patent Citation l:Japanese Laid-Open Patent Publication No.2005-286267 Summary of Invention Technical Problem
[0004]
However, the type shown in Patent Document 1 is such that a radiator is specially provided as a countermeasure for heat radiation, and further is shaped so that the substrate is brought into contact with only the peripheral edge of the end face of the radiator. In other words, the radiator is brought into only linear contact with the substrate, whereinitisdifficult that a sufficient radiation effect is obtained.
However, the type shown in Patent Document 1 is such that a radiator is specially provided as a countermeasure for heat radiation, and further is shaped so that the substrate is brought into contact with only the peripheral edge of the end face of the radiator. In other words, the radiator is brought into only linear contact with the substrate, whereinitisdifficult that a sufficient radiation effect is obtained.
[0005]
The present invention was developed in view of the above-described problems and it is an object of the present invention to provide a light-emitting element lamp and lighting equipment in which a temperature rise of the substrate having light-emitting elements mounted thereon can be effectively prevented by using a thermally conductive casing and cover.
Technical Solution
The present invention was developed in view of the above-described problems and it is an object of the present invention to provide a light-emitting element lamp and lighting equipment in which a temperature rise of the substrate having light-emitting elements mounted thereon can be effectively prevented by using a thermally conductive casing and cover.
Technical Solution
[0006]
A light-emitting element lamp according to Claim 1 of the present invention includes a thermally conductive casing having an irradiation opening, which is formed so as to be widened toward the irradiation opening, having an outer circumferential surface exposed outwardly, and having a substrate mounting part equipped on the inner circumferential surface; a light source part having a substrate having light-emitting elements mounted thereon, in which the substrate is attached so as to be thermally coupled to the substrate mounting part; a thermally conductive cover which is thermally coupled to and connected to the outer circumferential surface of the thermally conductive casing in a surface-contacted state; an insulative cover one end side of which is connected to the thermally conductive cover and the other end side of which has a cap connected thereto; and a lighting circuit which is accommodated in the insulative cover and controls lighting of the light-emitting elements.
A light-emitting element lamp according to Claim 1 of the present invention includes a thermally conductive casing having an irradiation opening, which is formed so as to be widened toward the irradiation opening, having an outer circumferential surface exposed outwardly, and having a substrate mounting part equipped on the inner circumferential surface; a light source part having a substrate having light-emitting elements mounted thereon, in which the substrate is attached so as to be thermally coupled to the substrate mounting part; a thermally conductive cover which is thermally coupled to and connected to the outer circumferential surface of the thermally conductive casing in a surface-contacted state; an insulative cover one end side of which is connected to the thermally conductive cover and the other end side of which has a cap connected thereto; and a lighting circuit which is accommodated in the insulative cover and controls lighting of the light-emitting elements.
[0007]
The light-emitting element is a solid-state light-emitting element such as an LED (light-emitting diode) and an organic EL (electro-luminescence). It is preferable that the light-emitting element is mounted by a chip-on-board system and a surface-mounting system. However, the mounting system is not specially restricted in consideration of the features of the present invention. For example, a bullet type LED may be used and mounted on a substrate. Also, there is no special restriction on the number of light-emitting elements to be disposed. The thermally conductive casing may be widened toward the irradiation opening continuously or stepwise. In other words, the casing may be widened with a non-continuous shape.
The light-emitting element is a solid-state light-emitting element such as an LED (light-emitting diode) and an organic EL (electro-luminescence). It is preferable that the light-emitting element is mounted by a chip-on-board system and a surface-mounting system. However, the mounting system is not specially restricted in consideration of the features of the present invention. For example, a bullet type LED may be used and mounted on a substrate. Also, there is no special restriction on the number of light-emitting elements to be disposed. The thermally conductive casing may be widened toward the irradiation opening continuously or stepwise. In other words, the casing may be widened with a non-continuous shape.
[0008]
A light-emitting element lamp according to Claim 2 of the present invention is featured, in addition to the light-emitting element lamp described in Claim 1 of the present invention, in that the thermally conductive casing and the thermally conductive cover are connected to each other with an 0-ring intervening therebetween, and power is fed from the lighting circuit to the light source part inside the 0-ring.
A light-emitting element lamp according to Claim 2 of the present invention is featured, in addition to the light-emitting element lamp described in Claim 1 of the present invention, in that the thermally conductive casing and the thermally conductive cover are connected to each other with an 0-ring intervening therebetween, and power is fed from the lighting circuit to the light source part inside the 0-ring.
[0009]
A light-emitting element lamp according to Claim 3 of the present invention is featured, in addition to the light-emitting element lamp described in Claim 1 or 2 of the present invention, in that a plurality of light-emitting elements are mounted on the substrate, and a reflector is provided opposite to the substrate, and the reflector includes a plurality of incidence openings corresponding to the plurality of light-emitting elements and a reflection surface which sections the incidence openings and is widened from the incidence openings toward the irradiation direction.
A light-emitting element lamp according to Claim 3 of the present invention is featured, in addition to the light-emitting element lamp described in Claim 1 or 2 of the present invention, in that a plurality of light-emitting elements are mounted on the substrate, and a reflector is provided opposite to the substrate, and the reflector includes a plurality of incidence openings corresponding to the plurality of light-emitting elements and a reflection surface which sections the incidence openings and is widened from the incidence openings toward the irradiation direction.
[0010]
Lighting equipment according to Claim 4 of the present invention includes an equipment main body having a socket, and a light-emitting element lamp described in Claim 1 or 2 of the present invention, which is mounted in the socket of the equipment main body.
Advantageous Effects
Lighting equipment according to Claim 4 of the present invention includes an equipment main body having a socket, and a light-emitting element lamp described in Claim 1 or 2 of the present invention, which is mounted in the socket of the equipment main body.
Advantageous Effects
[0011]
According to Claim 1 of the present invention, a temperature rise of the substrate having light-emitting elements mounted thereon can be effectively prevented by using the thermally conductive casing and the thermally conductive cover. Further, since the thermally conductive casing is widened toward the irradiation opening, and the area of the outer circumferential surface which brings about a heat radiation effect is large, the casing is effective in the heat radiation effect. Furthermore, since the thermally conductive casing and the thermally conductive cover are brought into surface contact with each other, the thermal conduction is improved.
According to Claim 1 of the present invention, a temperature rise of the substrate having light-emitting elements mounted thereon can be effectively prevented by using the thermally conductive casing and the thermally conductive cover. Further, since the thermally conductive casing is widened toward the irradiation opening, and the area of the outer circumferential surface which brings about a heat radiation effect is large, the casing is effective in the heat radiation effect. Furthermore, since the thermally conductive casing and the thermally conductive cover are brought into surface contact with each other, the thermal conduction is improved.
[0012]
According to Claim 2 of the present invention, a waterproof feature is maintained with a simple structure, and a power feeding channel to the light source part can be secured, in addition to the effects of the present invention, which are described in Claim 1 of the present invention.
According to Claim 2 of the present invention, a waterproof feature is maintained with a simple structure, and a power feeding channel to the light source part can be secured, in addition to the effects of the present invention, which are described in Claim 1 of the present invention.
[0013]
According to Claim 3 of the present invention, in addition to the effects of Claim 1 or 2 of the present invention, light distribution control is enabled by the reflection surface of the reflector per light-emitting element, wherein desired optical treatment can be carried out without any other light control means provided.
According to Claim 3 of the present invention, in addition to the effects of Claim 1 or 2 of the present invention, light distribution control is enabled by the reflection surface of the reflector per light-emitting element, wherein desired optical treatment can be carried out without any other light control means provided.
[0014]
According to Claim 4 of the invention, in addition to the effects which are brought about by the light-emitting element lamp, it is possible to provide lighting equipment capable of effectively radiating heat by transmitting heat from the cap to the socket.
Brief Description of Drawings
According to Claim 4 of the invention, in addition to the effects which are brought about by the light-emitting element lamp, it is possible to provide lighting equipment capable of effectively radiating heat by transmitting heat from the cap to the socket.
Brief Description of Drawings
[0015]
Fig. 1 is a sectional view showing a light-emitting element lamp according to an embodiment of the present invention;
Fig. 2 is a plan view showing the same light-emitting element lamp with the thermally conductive casing removed;
Fig. 3 is a perspective view showing a reflector of the same light-emitting element lamp;
Fig. 4 is a sectional view showing a reflector of the same light-emitting element lamp; and Fig. 5 is a perspective view showing lighting equipment according to the embodiment of the present invention.
Description of Embodiments
Fig. 1 is a sectional view showing a light-emitting element lamp according to an embodiment of the present invention;
Fig. 2 is a plan view showing the same light-emitting element lamp with the thermally conductive casing removed;
Fig. 3 is a perspective view showing a reflector of the same light-emitting element lamp;
Fig. 4 is a sectional view showing a reflector of the same light-emitting element lamp; and Fig. 5 is a perspective view showing lighting equipment according to the embodiment of the present invention.
Description of Embodiments
[0016]
Hereinafter, a description is given of a light-emitting element lamp according to the embodiment of the present invention with reference to Fig. 1 through Fig. 4. Fig. 1 is a sectional view showing the light-emitting element lamp, Fig.
2 is a plan view showing the same light-emitting element lamp with the thermally conductive casing removed, Fig. 3 is a perspective view showing a reflector of the same light-emitting element lamp, and Fig. 4 is a sectional view showing a reflector of the same light-emitting element lamp. The light-emitting element lamp according to the present embodiment can replace the existing reflection type incandescent lamp or a so called beam lamp and has a structure roughly equivalent to the beam lamp in respect to the appearance dimension. The beam lamp is suitable as a store spot light, projection illumination of buildings and advertisement sign boards, and illumination of construction sites, etc.
Hereinafter, a description is given of a light-emitting element lamp according to the embodiment of the present invention with reference to Fig. 1 through Fig. 4. Fig. 1 is a sectional view showing the light-emitting element lamp, Fig.
2 is a plan view showing the same light-emitting element lamp with the thermally conductive casing removed, Fig. 3 is a perspective view showing a reflector of the same light-emitting element lamp, and Fig. 4 is a sectional view showing a reflector of the same light-emitting element lamp. The light-emitting element lamp according to the present embodiment can replace the existing reflection type incandescent lamp or a so called beam lamp and has a structure roughly equivalent to the beam lamp in respect to the appearance dimension. The beam lamp is suitable as a store spot light, projection illumination of buildings and advertisement sign boards, and illumination of construction sites, etc.
[0017]
In Fig. 1, the light-emitting element lamp 1 has an appearance profile similar to the existing beam lamp, and has a waterproof feature by which the light-emitting element lamp 1 can be used outdoors. The light-emitting element lamp 1 is provided with a thermally conductive casing 2, a light source part 3, a reflector 3a, light-emitting elements 4, a thermally conductive cover 5, an insulative cover 6, a cap 7, and a front side lens 8 serving as a transparent cover.
In Fig. 1, the light-emitting element lamp 1 has an appearance profile similar to the existing beam lamp, and has a waterproof feature by which the light-emitting element lamp 1 can be used outdoors. The light-emitting element lamp 1 is provided with a thermally conductive casing 2, a light source part 3, a reflector 3a, light-emitting elements 4, a thermally conductive cover 5, an insulative cover 6, a cap 7, and a front side lens 8 serving as a transparent cover.
[0018]
The thermally conductive casing 2 is composed of, for example, an integrally molded article of aluminum, and the surf ace thereof isbaking-finished with white acryl. The casing 2 is widened from the base end part 2a toward the irradiation opening 2b, and is formed to be like a bowl having a bottom so that the outer circumferential surface is exposed outwardly.
The bottom wall of the inner circumferential surface of the thermally conductive casing 2 is formed to be flat, where the substrate mounting part 2c is formed. On the other hand, the bottom wall peripheral edge of the outer circumferential surface forms an annular connection part 2d which is connected to the thermally conductive cover 5. In addition, screw through-holes are formed at three points with a gap of approximately 120 degrees in the circumferential direction in the bottomwall of the thermally conductive casing 2. Further, the substrate mounting part 2c is formed to be separate from the thermally conductive casing 2, and the substrate mounting part 2c which is formed separately from the casing 2 may be attached so as to be thermally coupled to the thermally conductive casing 2. Still further, the material of the thermally conductive casing 2 is not limited to aluminum, wherein a metallic material or a resin material which has favorable thermal conductivity may be used. In addition, it is preferable that the inner circumferential surface of the thermally conductive casing 2 may be alumite-treated. By executing alumite treatment, it becomes possible to increase the heat radiation effect of the thermally conductive casing 2. If alumite treatment is executed, the inner circumferential surface of the thermally conductive casing 2 lowers in the reflection effect. However, since the reflector 3a is separately provided, a lowering in the reflection effect does not hinder the performance. On the other hand, where the inner circumferential surface of the thermally conductive casing 2 is used as the reflection surface, a reflection surface may be formed by mirror-like finishing, etc.
The thermally conductive casing 2 is composed of, for example, an integrally molded article of aluminum, and the surf ace thereof isbaking-finished with white acryl. The casing 2 is widened from the base end part 2a toward the irradiation opening 2b, and is formed to be like a bowl having a bottom so that the outer circumferential surface is exposed outwardly.
The bottom wall of the inner circumferential surface of the thermally conductive casing 2 is formed to be flat, where the substrate mounting part 2c is formed. On the other hand, the bottom wall peripheral edge of the outer circumferential surface forms an annular connection part 2d which is connected to the thermally conductive cover 5. In addition, screw through-holes are formed at three points with a gap of approximately 120 degrees in the circumferential direction in the bottomwall of the thermally conductive casing 2. Further, the substrate mounting part 2c is formed to be separate from the thermally conductive casing 2, and the substrate mounting part 2c which is formed separately from the casing 2 may be attached so as to be thermally coupled to the thermally conductive casing 2. Still further, the material of the thermally conductive casing 2 is not limited to aluminum, wherein a metallic material or a resin material which has favorable thermal conductivity may be used. In addition, it is preferable that the inner circumferential surface of the thermally conductive casing 2 may be alumite-treated. By executing alumite treatment, it becomes possible to increase the heat radiation effect of the thermally conductive casing 2. If alumite treatment is executed, the inner circumferential surface of the thermally conductive casing 2 lowers in the reflection effect. However, since the reflector 3a is separately provided, a lowering in the reflection effect does not hinder the performance. On the other hand, where the inner circumferential surface of the thermally conductive casing 2 is used as the reflection surface, a reflection surface may be formed by mirror-like finishing, etc.
[0019]
The light source part 3 is provided on the bottom wall of the thermally conductive casing 2. The light source part 3 is provided with a substrate 9 and light-emitting elements 4 mounted on the substrate 9. The light-emitting elements 4 are LED chips. The LED chips are mounted on the substrate 9 by the chip-on-board system. That is, the LED chips are disposed in the form of a plurality of matrices on the surface of the substrate 9 and are structured so that the surface thereof is coated with a coating material. The substrate 9 is composed of a roughly circular flat plate formed of metal, for example, a material which is good in thermal conductivity and excellent in heat radiation properties, such as aluminum. Where the substrate 9 is an insulative material, a ceramic material or a synthetic resin material which is comparatively good in heat radiation properties and excellent in durability maybe applied.
Where a synthetic resin material is used, for example, the substrate 9 may be formed of, for example, a glass epoxy resin.
The light source part 3 is provided on the bottom wall of the thermally conductive casing 2. The light source part 3 is provided with a substrate 9 and light-emitting elements 4 mounted on the substrate 9. The light-emitting elements 4 are LED chips. The LED chips are mounted on the substrate 9 by the chip-on-board system. That is, the LED chips are disposed in the form of a plurality of matrices on the surface of the substrate 9 and are structured so that the surface thereof is coated with a coating material. The substrate 9 is composed of a roughly circular flat plate formed of metal, for example, a material which is good in thermal conductivity and excellent in heat radiation properties, such as aluminum. Where the substrate 9 is an insulative material, a ceramic material or a synthetic resin material which is comparatively good in heat radiation properties and excellent in durability maybe applied.
Where a synthetic resin material is used, for example, the substrate 9 may be formed of, for example, a glass epoxy resin.
[0020]
And, the substrate 9 is attached so as to be brought into surface contact with and be adhered to the substrate mounting part 2c formed on the bottom wall of the thermally conductive casing 2. When attaching the substrate 9, an adhesive glue may be used. Where an adhesive glue is used, it is preferable that a material having favorable thermal conductivity, inwhich a metallic oxide substance, etc., is mixed in a silicone resin-based adhesive glue is used. Also, the surface contact between the substrate 9 and the base mounting part 2c does not have to be an entire surface contact but may be a partial surface contact.
And, the substrate 9 is attached so as to be brought into surface contact with and be adhered to the substrate mounting part 2c formed on the bottom wall of the thermally conductive casing 2. When attaching the substrate 9, an adhesive glue may be used. Where an adhesive glue is used, it is preferable that a material having favorable thermal conductivity, inwhich a metallic oxide substance, etc., is mixed in a silicone resin-based adhesive glue is used. Also, the surface contact between the substrate 9 and the base mounting part 2c does not have to be an entire surface contact but may be a partial surface contact.
[0021]
A reflector 3a formed of white polycarbonate or ASA resin, etc., is disposed on the surface side of the substrate 9. The reflector 3a functions to control the distribution of light emitted from the LED chips and to efficiently irradiate the light. The reflector 3a is formed to be disk-shaped, and is sectioned by ridge line parts to form a plurality of incidence openings 3b. The incidence openings 3b of the reflector 3a are disposed so as to be opposed to respective LED chips of the substrate 9. Therefore, a roughly bowl-shaped reflection surface 3c widened in the irradiation direction, that is, toward the ridge line part from the incidence openings 3b is formed per incidence opening 3b. Also, a notched part 3d in which a screw is inserted and locked is formed at three points with a gap of approximately 120 degrees in the circumferential direction on the outer circumferential part of the reflector 3a.
A reflector 3a formed of white polycarbonate or ASA resin, etc., is disposed on the surface side of the substrate 9. The reflector 3a functions to control the distribution of light emitted from the LED chips and to efficiently irradiate the light. The reflector 3a is formed to be disk-shaped, and is sectioned by ridge line parts to form a plurality of incidence openings 3b. The incidence openings 3b of the reflector 3a are disposed so as to be opposed to respective LED chips of the substrate 9. Therefore, a roughly bowl-shaped reflection surface 3c widened in the irradiation direction, that is, toward the ridge line part from the incidence openings 3b is formed per incidence opening 3b. Also, a notched part 3d in which a screw is inserted and locked is formed at three points with a gap of approximately 120 degrees in the circumferential direction on the outer circumferential part of the reflector 3a.
[0022]
Next, the thermally conductive cover 5 is made of aluminum die-casting. The surf ace thereof isbaking-finished with white acryl, and is made roughly cylindrical so that the cover 5 is tapered continuously with the outer circumferential surface of the thermally conductive casing 2. Further, the length and thickness dimensions of the thermally conductive cover 5 may be appropriately determined with the heat radiation effect, etc., taken into consideration. The connection part 5a of the thermally conductive cover 5 with the thermally conductive casing 2 is formed to be annular with a predetermined width (Refer to Fig. 2) . Accordingly, the connection part 2d of the thermally conductive casing 2 is formed to be opposed to the corresponding connection part 5a, and they are thermally coupled and connected to each other in a surface-contacted state. An annular groove is formed in the connection part Sa.
An 0-ring 10 made of synthetic rubber, etc., is fitted in the groove. Three screw holes 11 are formed with a gap of approximately 120 degrees in the circumferential direction inside the 0-ring 10.
Next, the thermally conductive cover 5 is made of aluminum die-casting. The surf ace thereof isbaking-finished with white acryl, and is made roughly cylindrical so that the cover 5 is tapered continuously with the outer circumferential surface of the thermally conductive casing 2. Further, the length and thickness dimensions of the thermally conductive cover 5 may be appropriately determined with the heat radiation effect, etc., taken into consideration. The connection part 5a of the thermally conductive cover 5 with the thermally conductive casing 2 is formed to be annular with a predetermined width (Refer to Fig. 2) . Accordingly, the connection part 2d of the thermally conductive casing 2 is formed to be opposed to the corresponding connection part 5a, and they are thermally coupled and connected to each other in a surface-contacted state. An annular groove is formed in the connection part Sa.
An 0-ring 10 made of synthetic rubber, etc., is fitted in the groove. Three screw holes 11 are formed with a gap of approximately 120 degrees in the circumferential direction inside the 0-ring 10.
[0023]
An insulative cover 6 molded by PBT resin is provided along the shape of the thermally conductive cover 5 inside the thermally conductive cover 5. Therefore, the insulative cover 6 has one end side thereof connected to the thermally conductive cover 5 and the other end side thereof protruded from the thermally conductive cover 5. A cap 7 is fixed at a protrusion part 6a of the insulative cover 6, which protrudes from the thermally conductive cover 5. The cap 7 is an E26 cap according to the cap standard, and is a portion which is screwed in a socket of lighting equipment when mounting the light-emitting element lamp 1 in the lighting equipment. Also, an air hole 6b is formed in the protrusion part 6a. The air hole 6b is a small hole which functions to reduce the inside pressure when the inside pressure in the insulative cover 6 is increased.
An insulative cover 6 molded by PBT resin is provided along the shape of the thermally conductive cover 5 inside the thermally conductive cover 5. Therefore, the insulative cover 6 has one end side thereof connected to the thermally conductive cover 5 and the other end side thereof protruded from the thermally conductive cover 5. A cap 7 is fixed at a protrusion part 6a of the insulative cover 6, which protrudes from the thermally conductive cover 5. The cap 7 is an E26 cap according to the cap standard, and is a portion which is screwed in a socket of lighting equipment when mounting the light-emitting element lamp 1 in the lighting equipment. Also, an air hole 6b is formed in the protrusion part 6a. The air hole 6b is a small hole which functions to reduce the inside pressure when the inside pressure in the insulative cover 6 is increased.
[0024] Next, a lighting circuit 12 is accommodated in the insulative cover 6. The lighting circuit 12 controls lighting of the LED chips and is composed of components such as capacitors and transistors as switching elements. The lighting circuit 12 is mounted on the circuit substrate 12c, and the circuit substrate 12c is roughly T-shaped and is accommodated in the longitudinal direction in the insulative cover 6. Accordingly, this makes it possible that the circuit substrate 12c is effectively disposed utilizing a narrow space. In addition, a lead wire 12a is led from the lighting circuit 12, and the lead wire 12a is electrically connected to the substrate 9 of the light source part 3 via a lead wire insertion hole 12b formed in the substrate mounting part 2c. Further, the lighting circuit 12 is electrically connected to the cap 7 (illustration thereof omitted) . Also, the entirety of the lighting circuit 12 may be accommodated in the insulative cover 6, or may be partially accommodated therein, and the remaining part thereof may be accommodated in the cap 7.
[0025]
A filling material 13 is filled up in the insulative cover 6 so as to include and cover the lighting circuit 12. The filling material 13 is made of silicone resin and has resiliency, insulation properties and thermal conductivity. When filling up the filling material 13, a liquid filling material 13 is first poured into the insulative cover 6 fromupward. The filling material 13 is poured to the upper end part level of the insulative cover 6 and is hardened and stabilized in a high temperature atmosphere.
A filling material 13 is filled up in the insulative cover 6 so as to include and cover the lighting circuit 12. The filling material 13 is made of silicone resin and has resiliency, insulation properties and thermal conductivity. When filling up the filling material 13, a liquid filling material 13 is first poured into the insulative cover 6 fromupward. The filling material 13 is poured to the upper end part level of the insulative cover 6 and is hardened and stabilized in a high temperature atmosphere.
[0026]
Next, the front lens 8 is attached so that it encloses the irradiation opening 2b of the thermally conductive casing 2 in an airtight state via a packing (not illustrated) made of silicone resin. Further, there is a light condensing type and a light scattering type for the front lens 8, which may be appropriately selected for use.
Next, the front lens 8 is attached so that it encloses the irradiation opening 2b of the thermally conductive casing 2 in an airtight state via a packing (not illustrated) made of silicone resin. Further, there is a light condensing type and a light scattering type for the front lens 8, which may be appropriately selected for use.
[0027]
Next, a description is given of a connection state between the thermally conductive casing 2 and the thermally conductive cover 5. A connection part 2d of the thermally conductive casing 2 is disposed so as to be opposed to the connection part 5a of the thermally conductive cover S. And, the substrate 9 is disposed at the substrate mounting part 2c of the thermally conductive casing 2, and the reflector 3a is caused to overlap thereon. Then, the screw 14 is screwed in the screw hole 11 of the thermally conductive cover 5 via the notched part 3d of the reflector 3a and the screw through-hole of the thermally conductive casing 2, wherein the thermally conductive casing 2 is fixed at the thermally conductive cover 5, and the lower end of the reflector 3a presses the surface side of the substrate 9, and both the reflector 3a and the substrate 9 are fixed at the bottom wall of the thermally conductive casing 2. In such a state, the 0-ring 10 is resiliently deformed between the connection part 5a and the connection part 2d and makes the gap therebetween airtight. That is, the inside of the 0-ring is kept airtight. Therefore, wiring such as electrical connections by means of lead wires 12a between the lighting circuit 12 and the substrate 9 having the LED chips mounted thereon is carried out inside the 0-ring 10.
Next, a description is given of a connection state between the thermally conductive casing 2 and the thermally conductive cover 5. A connection part 2d of the thermally conductive casing 2 is disposed so as to be opposed to the connection part 5a of the thermally conductive cover S. And, the substrate 9 is disposed at the substrate mounting part 2c of the thermally conductive casing 2, and the reflector 3a is caused to overlap thereon. Then, the screw 14 is screwed in the screw hole 11 of the thermally conductive cover 5 via the notched part 3d of the reflector 3a and the screw through-hole of the thermally conductive casing 2, wherein the thermally conductive casing 2 is fixed at the thermally conductive cover 5, and the lower end of the reflector 3a presses the surface side of the substrate 9, and both the reflector 3a and the substrate 9 are fixed at the bottom wall of the thermally conductive casing 2. In such a state, the 0-ring 10 is resiliently deformed between the connection part 5a and the connection part 2d and makes the gap therebetween airtight. That is, the inside of the 0-ring is kept airtight. Therefore, wiring such as electrical connections by means of lead wires 12a between the lighting circuit 12 and the substrate 9 having the LED chips mounted thereon is carried out inside the 0-ring 10.
[0028]
In Fig. 4, a connector 15 is provided at the outer circumferential edge of the substrate 9 having the LED chips mounted thereon. The connector 15 is composed of a power receiving terminal 15a connected to the wiring pattern of the substrate 9 and a power feeding terminal 15b connected from the wiring pattern of the lighting circuit 12 via the lead wire 12a and forms a socket shape. In this case, the wiring is carried out inside the 0-ring 10, wherein sealing properties of the electrically connected portion can be maintained. In addition, since the connector 15 is disposed in the horizontal direction and is connected from the horizontal direction, the height dimension thereof is made lower than the reflector 3a, and there is no case where the connector 15 blocks light irradiated from the reflector 3a.
In Fig. 4, a connector 15 is provided at the outer circumferential edge of the substrate 9 having the LED chips mounted thereon. The connector 15 is composed of a power receiving terminal 15a connected to the wiring pattern of the substrate 9 and a power feeding terminal 15b connected from the wiring pattern of the lighting circuit 12 via the lead wire 12a and forms a socket shape. In this case, the wiring is carried out inside the 0-ring 10, wherein sealing properties of the electrically connected portion can be maintained. In addition, since the connector 15 is disposed in the horizontal direction and is connected from the horizontal direction, the height dimension thereof is made lower than the reflector 3a, and there is no case where the connector 15 blocks light irradiated from the reflector 3a.
[0029]
A description is given of actions of the light-emitting element lamp 1 thus composed. When the cap 7 is mounted in the socket of lighting equipment and power is supplied thereto, the lighting circuit 12 operates to feed power to the substrate 9. Then, the LED chips emit light. Light emitted from the LED
chips is controlled by the reflection surface 3c of the reflector 3a mainly per LED chip with respect to the distribution of light, and is irradiated forward, passing through the front lens 8. Heat generated from the LED chips in line therewith is transmitted from roughly the entire surface of the rear surface of the substrate 9 to the substrate mounting part 2c, and is further transmitted to the thermally conductive casing 2 having a larger heat radiation area. Still further, the heat is transmitted from the connection part 2d of the thermally conductive casing 2 to the connection part 5a of the thermally conductive cover 5, and is further transmitted to the entirety of the thermally conductive cover 5. Thus, the respective members are thermally coupled to each other, wherein it is possible to prevent the temperature rise of the substrate 9 by the above-described thermal transmission channel and radiation. On the other hand, heat generated from the light circuit 12 is transmitted to the thermally conductive casing 2 via the filling material 13 and is radiated therefrom, and is further transmitted to the cap 7 and still further transmitted from the cap 7 to the socket, etc., of the lighting equipment and is radiated therefrom.
A description is given of actions of the light-emitting element lamp 1 thus composed. When the cap 7 is mounted in the socket of lighting equipment and power is supplied thereto, the lighting circuit 12 operates to feed power to the substrate 9. Then, the LED chips emit light. Light emitted from the LED
chips is controlled by the reflection surface 3c of the reflector 3a mainly per LED chip with respect to the distribution of light, and is irradiated forward, passing through the front lens 8. Heat generated from the LED chips in line therewith is transmitted from roughly the entire surface of the rear surface of the substrate 9 to the substrate mounting part 2c, and is further transmitted to the thermally conductive casing 2 having a larger heat radiation area. Still further, the heat is transmitted from the connection part 2d of the thermally conductive casing 2 to the connection part 5a of the thermally conductive cover 5, and is further transmitted to the entirety of the thermally conductive cover 5. Thus, the respective members are thermally coupled to each other, wherein it is possible to prevent the temperature rise of the substrate 9 by the above-described thermal transmission channel and radiation. On the other hand, heat generated from the light circuit 12 is transmitted to the thermally conductive casing 2 via the filling material 13 and is radiated therefrom, and is further transmitted to the cap 7 and still further transmitted from the cap 7 to the socket, etc., of the lighting equipment and is radiated therefrom.
[0030]
Further, in the light-emitting element lamp 1 according to the present embodiment, the front lens 8 is attached to the irradiation opening 2b of the thermally conductive casing 2 via packing, and the 0-ring 10 is provided between the connection part 2d of the thermally conductive casing 2 and the connection part 5a of the thermally conductive cover 5.
In addition, the lighting circuit 12 is enclosed by the filling material 13. Accordingly, since the light-emitting element lamp 1 has electric insulation properties and has weather resistance and rainproof features, the light-emitting element lamp 1 is structured so as to be suitable for outdoor use.
Further, such a sealing structure is adopted for this reason.
However, if any one of the lighting circuit components becomes abnormal, and temporarily the capacitor becomes damaged or broken, and the inside pressure of the insulative cover 6 is increased, there is a possibility for secondary damage to be brought about. However, it is possible to discharge increased pressure in the insulative cover 6 through the air hole 6b.
Further, in the light-emitting element lamp 1 according to the present embodiment, the front lens 8 is attached to the irradiation opening 2b of the thermally conductive casing 2 via packing, and the 0-ring 10 is provided between the connection part 2d of the thermally conductive casing 2 and the connection part 5a of the thermally conductive cover 5.
In addition, the lighting circuit 12 is enclosed by the filling material 13. Accordingly, since the light-emitting element lamp 1 has electric insulation properties and has weather resistance and rainproof features, the light-emitting element lamp 1 is structured so as to be suitable for outdoor use.
Further, such a sealing structure is adopted for this reason.
However, if any one of the lighting circuit components becomes abnormal, and temporarily the capacitor becomes damaged or broken, and the inside pressure of the insulative cover 6 is increased, there is a possibility for secondary damage to be brought about. However, it is possible to discharge increased pressure in the insulative cover 6 through the air hole 6b.
[0031]
According to the present embodiment described above, the light distribution is controlled by the reflection surface 3c of the reflector 3a per LED chip, wherein desired optical treatment can be carried out without using other light control means. In addition, it is possible to effectively prevent the temperature rise of the substrate 9 having the light-emitting elements 4 mounted thereon by utilizing the thermally conductive casing 2 and the thermally conductive cover 5.
Further, since the thermally conductive casing 2 is widened toward the irradiation opening 2b, the area of the outer circumferential surface which brings about heat radiation effect, and the casing 2 is effective for the heat radiation effect. Still further, since the thermally conductive casing 2 and the thermally conductive cover 5 are brought into surface contact with each other, the thermal conduction becomes favorable. Also, since the 0-ring 10 is provided between the connection part 2d of the thermally conductive casing 2 and the connection part 5a of the thermally conductive cover 5 to keep sealing properties, it is possible to secure a power feeding channel to the light source part 3 with the waterproof features maintained by a simple structure. In addition, since components of the existing so-called beam light can be used, the components can be commonly utilized, and it is possible to provide an inexpensive light-emitting element lamp 1.
According to the present embodiment described above, the light distribution is controlled by the reflection surface 3c of the reflector 3a per LED chip, wherein desired optical treatment can be carried out without using other light control means. In addition, it is possible to effectively prevent the temperature rise of the substrate 9 having the light-emitting elements 4 mounted thereon by utilizing the thermally conductive casing 2 and the thermally conductive cover 5.
Further, since the thermally conductive casing 2 is widened toward the irradiation opening 2b, the area of the outer circumferential surface which brings about heat radiation effect, and the casing 2 is effective for the heat radiation effect. Still further, since the thermally conductive casing 2 and the thermally conductive cover 5 are brought into surface contact with each other, the thermal conduction becomes favorable. Also, since the 0-ring 10 is provided between the connection part 2d of the thermally conductive casing 2 and the connection part 5a of the thermally conductive cover 5 to keep sealing properties, it is possible to secure a power feeding channel to the light source part 3 with the waterproof features maintained by a simple structure. In addition, since components of the existing so-called beam light can be used, the components can be commonly utilized, and it is possible to provide an inexpensive light-emitting element lamp 1.
[0032]
Next, a description is given of an embodiment of lighting equipment in which the light-emitting element lamp 1 is used as a light source, with reference to a perspective view of Fig. S. The lighting equipment 20 is a spot light for outdoor use. The lighting equipment 20 is provided with an equipment main body 21 and a base 22 on which the equipment main body 21 is mounted. A socket 23 is provided in the equipment main body 21. The cap 7 of the light-emitting element lamp 1 is screwed in and mounted in the socket 23. In addition, the lighting equipment 20 is fixed with the base 22 thereof fixed on the ground, etc., and the direction of the equipment main body 21 is variable with respect to the base 22, and the irradiation direction of light can be optionally changed.
According to such lighting equipment 20, temperature rise of the substrate 9 of the light-emitting element lamp 1 can be effectively prevented by utilizing the thermally conductive casing 2 and the thermally conductive cover 5, and heat generated from the lighting circuit 12 is mainly transmitted to the cap 7, transmitted from the cap 7 to the socket 23, etc., of the lighting equipment 20 and is radiated therefrom, wherein it is possible to provide lighting equipment 20 capable of further effectively preventing a temperature rise of the substrate 9.
Next, a description is given of an embodiment of lighting equipment in which the light-emitting element lamp 1 is used as a light source, with reference to a perspective view of Fig. S. The lighting equipment 20 is a spot light for outdoor use. The lighting equipment 20 is provided with an equipment main body 21 and a base 22 on which the equipment main body 21 is mounted. A socket 23 is provided in the equipment main body 21. The cap 7 of the light-emitting element lamp 1 is screwed in and mounted in the socket 23. In addition, the lighting equipment 20 is fixed with the base 22 thereof fixed on the ground, etc., and the direction of the equipment main body 21 is variable with respect to the base 22, and the irradiation direction of light can be optionally changed.
According to such lighting equipment 20, temperature rise of the substrate 9 of the light-emitting element lamp 1 can be effectively prevented by utilizing the thermally conductive casing 2 and the thermally conductive cover 5, and heat generated from the lighting circuit 12 is mainly transmitted to the cap 7, transmitted from the cap 7 to the socket 23, etc., of the lighting equipment 20 and is radiated therefrom, wherein it is possible to provide lighting equipment 20 capable of further effectively preventing a temperature rise of the substrate 9.
[0033]
Also, in the present invention, it is not requisite that components of the existing beam light are used.
Industrial Applicability
Also, in the present invention, it is not requisite that components of the existing beam light are used.
Industrial Applicability
[0034]
The present invention is applicable to a light-emitting element lamp, in which light-emitting elements such as LEDs are used as a light source, and lighting equipment in which the light-emitting element lamp is used.
Explanation of Reference
The present invention is applicable to a light-emitting element lamp, in which light-emitting elements such as LEDs are used as a light source, and lighting equipment in which the light-emitting element lamp is used.
Explanation of Reference
[0035]
1 Light-emitting element lamp 2 Thermally conductive casing 2b Irradiation opening 2c Substrate mounting part 3 Light source part 3a Reflector 3b Incidence opening 3c Reflection surface 4 Light-emitting element Thermally conductive cover 6 Insulative cover 7 Cap 9 Substrate 0-ring 12 Lighting circuit Lighting equipment 21 Equipment main body 23 Socket
1 Light-emitting element lamp 2 Thermally conductive casing 2b Irradiation opening 2c Substrate mounting part 3 Light source part 3a Reflector 3b Incidence opening 3c Reflection surface 4 Light-emitting element Thermally conductive cover 6 Insulative cover 7 Cap 9 Substrate 0-ring 12 Lighting circuit Lighting equipment 21 Equipment main body 23 Socket
Claims (4)
1. A light-emitting element lamp including:
a thermally conductive casing having an irradiation opening, which is formed so as to be widened toward the irradiation opening, having an outer circumferential surface exposed outwardly, and having a substrate mounting part equipped on the inner circumferential surface;
a light source part having a substrate having light-emitting elements mounted thereon, in which the substrate is attached so as to be thermally coupled to the substrate mounting part;
a thermally conductive cover which is thermally coupled to and connected to the outer circumferential surface of the thermally conductive casing in a surface-contacted state;
an insulative cover one end side of which is connected to the thermally conductive cover and the other end side of which has a cap connected thereto; and a lighting circuit which is accommodated in the insulative cover and controls lighting of the light-emitting elements.
a thermally conductive casing having an irradiation opening, which is formed so as to be widened toward the irradiation opening, having an outer circumferential surface exposed outwardly, and having a substrate mounting part equipped on the inner circumferential surface;
a light source part having a substrate having light-emitting elements mounted thereon, in which the substrate is attached so as to be thermally coupled to the substrate mounting part;
a thermally conductive cover which is thermally coupled to and connected to the outer circumferential surface of the thermally conductive casing in a surface-contacted state;
an insulative cover one end side of which is connected to the thermally conductive cover and the other end side of which has a cap connected thereto; and a lighting circuit which is accommodated in the insulative cover and controls lighting of the light-emitting elements.
2. The light-emitting element lamp according to Claim 1, wherein the thermally conductive casing and the thermally conductive cover are connected to each other with an O-ring intervening therebetween, and power is fed from the lighting circuit to the light source part inside the O-ring.
3. The light-emitting element lamp according to Claim 1 or 2, wherein a plurality of light-emitting elements are mounted on the substrate, and a reflector is provided opposite to the substrate, and the reflector includes a plurality of incidence openings corresponding to the plurality of light-emitting elements and a reflection surface which sections the incidence openings and is widened from the incidence openings toward the irradiation direction.
4. Lighting equipment including:
an equipment main body having a socket;
a light-emitting element lamp according to Claim 1 or 2, which is mounted in the socket of the equipment main body.
an equipment main body having a socket;
a light-emitting element lamp according to Claim 1 or 2, which is mounted in the socket of the equipment main body.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-168897 | 2008-06-27 | ||
| JP2008168897 | 2008-06-27 | ||
| PCT/JP2009/060256 WO2009157285A1 (en) | 2008-06-27 | 2009-06-04 | Light-emitting element lamp and lighting fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2719249A1 true CA2719249A1 (en) | 2009-12-30 |
| CA2719249C CA2719249C (en) | 2013-04-16 |
Family
ID=41444354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2719249A Expired - Fee Related CA2719249C (en) | 2008-06-27 | 2009-06-04 | Light-emitting element lamp and lighting equipment |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8294356B2 (en) |
| EP (1) | EP2256402A4 (en) |
| JP (3) | JP5287547B2 (en) |
| CN (3) | CN103470983A (en) |
| CA (1) | CA2719249C (en) |
| MX (1) | MX2010014517A (en) |
| WO (1) | WO2009157285A1 (en) |
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- 2009-06-04 EP EP09769995A patent/EP2256402A4/en not_active Withdrawn
- 2009-06-04 CN CN2013104167150A patent/CN103470983A/en active Pending
- 2009-06-04 CA CA2719249A patent/CA2719249C/en not_active Expired - Fee Related
- 2009-06-04 CN CN2013104168115A patent/CN103470984A/en active Pending
- 2009-06-04 CN CN2009801093180A patent/CN101978209A/en active Pending
- 2009-06-04 MX MX2010014517A patent/MX2010014517A/en active IP Right Grant
- 2009-06-29 JP JP2009154058A patent/JP5287547B2/en not_active Expired - Fee Related
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| WO2011101257A1 (en) * | 2010-02-16 | 2011-08-25 | Osram Gesellschaft mit beschränkter Haftung | Light-emitting means and method for producing same |
| CN105135325A (en) * | 2015-09-28 | 2015-12-09 | 成都易明半导体有限公司 | Hook type industrial and mining lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| US8294356B2 (en) | 2012-10-23 |
| JP5320555B2 (en) | 2013-10-23 |
| US20110089806A1 (en) | 2011-04-21 |
| EP2256402A1 (en) | 2010-12-01 |
| JP2010034546A (en) | 2010-02-12 |
| JP2010034545A (en) | 2010-02-12 |
| EP2256402A4 (en) | 2012-08-15 |
| CN103470983A (en) | 2013-12-25 |
| MX2010014517A (en) | 2011-02-22 |
| CA2719249C (en) | 2013-04-16 |
| WO2009157285A1 (en) | 2009-12-30 |
| CN101978209A (en) | 2011-02-16 |
| JP5282990B1 (en) | 2013-09-04 |
| CN103470984A (en) | 2013-12-25 |
| JP2013175465A (en) | 2013-09-05 |
| JP5287547B2 (en) | 2013-09-11 |
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