CA2538304A1 - System and method for monitoring defects in structures - Google Patents

System and method for monitoring defects in structures Download PDF

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Publication number
CA2538304A1
CA2538304A1 CA002538304A CA2538304A CA2538304A1 CA 2538304 A1 CA2538304 A1 CA 2538304A1 CA 002538304 A CA002538304 A CA 002538304A CA 2538304 A CA2538304 A CA 2538304A CA 2538304 A1 CA2538304 A1 CA 2538304A1
Authority
CA
Canada
Prior art keywords
potential drop
monitoring area
contact points
measuring
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002538304A
Other languages
French (fr)
Other versions
CA2538304C (en
Inventor
Thomas Batzinger
Andrew May
Peter Allison
Carl Lester
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Company
Thomas Batzinger
Andrew May
Peter Allison
Carl Lester
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Company, Thomas Batzinger, Andrew May, Peter Allison, Carl Lester filed Critical General Electric Company
Publication of CA2538304A1 publication Critical patent/CA2538304A1/en
Application granted granted Critical
Publication of CA2538304C publication Critical patent/CA2538304C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/28Measuring arrangements characterised by the use of electric or magnetic techniques for measuring contours or curvatures
    • G01B7/281Measuring arrangements characterised by the use of electric or magnetic techniques for measuring contours or curvatures for measuring contour or curvature along an axis, e.g. axial curvature of a pipeline or along a series of feeder rollers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20Investigating the presence of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness

Abstract

A system and method for monitoring defects in a structure are provided. The system (I 10) includes a power supply (112) for supplying an electric current to a monitoring area (118) of the structure (114) and a reference (116); a measurement circuit for measuring a potential drop across at least two contact points (126, 128) of the monitoring area (118) and at least two contact points (122, 124) of the reference (116); and a processor (112) adapted to determine a ratio of the monitoring area potential drop to the reference potential drop indicative of a percentage change in a thickness of the structure (114). The method includes the steps of supplying the current to the monitoring area (118) and the reference (116); measuring a first potential drop across the monitoring area (118) and the reference (116); and determining the ratio indicative of the percentage change in the thickness of the structure (114).

Claims (10)

1. A system (110) for monitoring defects in a structure (114), the system (110) comprising:
a power supply (202) for supplying an electric current to a monitoring area (118) of the structure (114) and a reference (116);
a measurement circuit (206) for measuring a potential drop across at least two contact points (126, 128) of the monitoring area (118) and at least two contact points (122, 124) of the reference (116); and a processor (212) adapted to determine a ratio of the monitoring area potential drop to the reference potential drop indicative of a percentage change in a thickness of the structure (114).
2. The system as in claim 1, wherein the reference (116) is electrically coupled to the structure (114).
3. The system as in claim 2, wherein the reference (116) includes a first current injection port (120) for coupling. the power supply (202) to the reference (116) and the structure (114) includes a second current injection port (130) for coupling the power supply (202) to the structure (114), wherein current will flow from the first current injection port (120) to the second current injection port (130).
4. The system as in claim 3, wherein the reference (116) includes a plurality of current injection ports (120) for coupling the power supply (202) to the reference (116) and the structure (114) includes a plurality of current injection ports (130) for coupling the power supply (202) to the structure (114), wherein a plurality of currents may be applied in different directions across the reference (116) and structure (114).
5. The system as in claim 1, wherein the monitoring area (118) includes a plurality of contact points arranged in a matrix for measuring a potential drop across any pair of contact points and the measuring circuit (206) measures the plurality of contact points simultaneously.
6. A method for monitoring defects in a structure, the method comprising the steps of:
supplying an electric current to a monitoring area of the structure and a reference (302);
measuring a first potential drop across at least two contact points of the monitoring area (306) and a first potential drop across at least two contact points of the reference (304); and determining a ratio of the monitoring area potential drop to the reference potential drop indicative of a percentage change in a thickness of the structure (318).
7. The method of claim 6, wherein the measuring step includes measuring a second potential drop across the at least two contact points of the monitoring area (312) and a second potential drop across the at least two points of the reference with no current supplied (310).
8. The method of claim 7, wherein the measuring step includes the steps of:
calculating the monitoring area potential drop by subtracting the first monitoring area potential drop with the second monitoring area potential drop (316); and calculating the reference potential drop by subtracting the first reference potential drop with the second reference potential drop (314).
9. The method as in claim 6, wherein the monitoring area of the structure includes a plurality of contact points and the measuring step includes measuring a potential drops across the plurality of contact points simultaneously.
10. The method as in claim 6, further comprising the steps of:
supplying the current in a plurality of paths sequentially; and measuring the potential drops across the at least two contact points of the monitoring area for each current path supplied.
CA2538304A 2003-09-17 2004-08-10 System and method for monitoring defects in structures Expired - Fee Related CA2538304C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/664,196 2003-09-17
US10/664,196 US6922641B2 (en) 2003-09-17 2003-09-17 System and method for monitoring defects in structures
PCT/US2004/025880 WO2005036152A1 (en) 2003-09-17 2004-08-10 System and method for monitoring defects in structures

Publications (2)

Publication Number Publication Date
CA2538304A1 true CA2538304A1 (en) 2005-04-21
CA2538304C CA2538304C (en) 2010-12-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CA2538304A Expired - Fee Related CA2538304C (en) 2003-09-17 2004-08-10 System and method for monitoring defects in structures

Country Status (7)

Country Link
US (1) US6922641B2 (en)
EP (1) EP1678487A1 (en)
JP (1) JP4740855B2 (en)
KR (1) KR101143730B1 (en)
CN (1) CN100504368C (en)
CA (1) CA2538304C (en)
WO (1) WO2005036152A1 (en)

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Also Published As

Publication number Publication date
KR101143730B1 (en) 2012-05-10
EP1678487A1 (en) 2006-07-12
CA2538304C (en) 2010-12-14
JP2007506096A (en) 2007-03-15
CN1879015A (en) 2006-12-13
CN100504368C (en) 2009-06-24
JP4740855B2 (en) 2011-08-03
US6922641B2 (en) 2005-07-26
WO2005036152A1 (en) 2005-04-21
US20050075800A1 (en) 2005-04-07
KR20060080204A (en) 2006-07-07

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Effective date: 20140812