CA2471693A1 - Arrays of microparticles and methods of preparation thereof - Google Patents
Arrays of microparticles and methods of preparation thereof Download PDFInfo
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- CA2471693A1 CA2471693A1 CA002471693A CA2471693A CA2471693A1 CA 2471693 A1 CA2471693 A1 CA 2471693A1 CA 002471693 A CA002471693 A CA 002471693A CA 2471693 A CA2471693 A CA 2471693A CA 2471693 A1 CA2471693 A1 CA 2471693A1
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- biochips
- beads
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- wafer substrate
- chip
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- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12Q—MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
- C12Q1/00—Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
- C12Q1/68—Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions involving nucleic acids
- C12Q1/6813—Hybridisation assays
- C12Q1/6834—Enzymatic or biochemical coupling of nucleic acids to a solid phase
- C12Q1/6837—Enzymatic or biochemical coupling of nucleic acids to a solid phase using probe arrays or probe chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/0046—Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
- G01N33/50—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
- G01N33/53—Immunoassay; Biospecific binding assay; Materials therefor
- G01N33/5302—Apparatus specially adapted for immunological test procedures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
- G01N33/50—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
- G01N33/53—Immunoassay; Biospecific binding assay; Materials therefor
- G01N33/543—Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals
- G01N33/54306—Solid-phase reaction mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00277—Apparatus
- B01J2219/00279—Features relating to reactor vessels
- B01J2219/00306—Reactor vessels in a multiple arrangement
- B01J2219/00313—Reactor vessels in a multiple arrangement the reactor vessels being formed by arrays of wells in blocks
- B01J2219/00315—Microtiter plates
- B01J2219/00317—Microwell devices, i.e. having large numbers of wells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00277—Apparatus
- B01J2219/00457—Dispensing or evacuation of the solid phase support
- B01J2219/00459—Beads
- B01J2219/00466—Beads in a slurry
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00277—Apparatus
- B01J2219/00457—Dispensing or evacuation of the solid phase support
- B01J2219/00459—Beads
- B01J2219/00468—Beads by manipulation of individual beads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00277—Apparatus
- B01J2219/00497—Features relating to the solid phase supports
- B01J2219/005—Beads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00277—Apparatus
- B01J2219/0054—Means for coding or tagging the apparatus or the reagents
- B01J2219/00545—Colours
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00583—Features relative to the processes being carried out
- B01J2219/00603—Making arrays on substantially continuous surfaces
- B01J2219/00646—Making arrays on substantially continuous surfaces the compounds being bound to beads immobilised on the solid supports
- B01J2219/00648—Making arrays on substantially continuous surfaces the compounds being bound to beads immobilised on the solid supports by the use of solid beads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00583—Features relative to the processes being carried out
- B01J2219/00603—Making arrays on substantially continuous surfaces
- B01J2219/00659—Two-dimensional arrays
- B01J2219/00662—Two-dimensional arrays within two-dimensional arrays
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- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12Q—MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
- C12Q2563/00—Nucleic acid detection characterized by the use of physical, structural and functional properties
- C12Q2563/149—Particles, e.g. beads
Abstract
This invention provides high unit density arrays of microparticles and methods of assembling such arrays. The microparticles in the arrays may be functionalized with chemical or biological entities specific to a given target analyte. The high unit density arrays of this invention are formed on chips which may be combined to form multichip arrays acccording to the methods described herein. The chip and/or multichip arrays of this invention are useful for chemical and biological assays.
Claims (44)
1. A method for producing biochips comprising patterning a wafer substrate to form a plurality of chip regions;
assembling at least one bead array comprising functionalized, encoded beads on a surface of the wafer substrate in at least one chip region; and singulating the wafer to form a plurality of individual biochips.
assembling at least one bead array comprising functionalized, encoded beads on a surface of the wafer substrate in at least one chip region; and singulating the wafer to form a plurality of individual biochips.
2. The method according to claim 1, wherein said method further comprises scribing said wafer substrate in accordance with delineated chip regions.
3. The method according to claim 1 further comprising the step of cutting trenches into said patterned wafer along boundaries between said chip regions.
4. The method according to claim 3 wherein cutting is accomplished by using wet chemicals.
5. The method according to claim 3 wherein cutting is accomplished by using dry etching.
6. The method according to claim 1 wherein said bead array is protected by a removable protective coating prior to singulation.
7. The method of producing biochips according to claim 1 further comprising fabricating bead confining structures in said chip regions, the bead confining structures comprising recesses to confine the movement of beads.
8. The method according to claim 7 wherein said recesses are defined by photolithography and formed by reactive ion etching.
9. The method according to claim 7 wherein each said recess has straight sidewalls and a predetermined depth.
10. The method according to claim 9 wherein said recesses have reentrant sidewall profiles, said profiles being formed by modifying recesses having straight sidewalk by subsequently depositing a layer of material that adheres to the sidewalls so as to produce the desired re-entrant sidewall profiles.
11. The method according to claim 10 wherein said material is silicon dioxide.
12. The method according to claim 1, further comprising a step for evaluating and controlling biochip quality by optically imaging the beads to ensure that recesses formed in said chip regions are substantially occupied by beads.
13. A method for packaging biochips produced according to the method of claim comprising selecting biochips originating from a multiplicity of wafer substrates and assembling them on a planar surface to form pooled biochip sets.
14. A method for packaging biochips produced according to the method of claim 1, wherein said pooled biochip sets form an assay device.
15. The method according to claim 13 wherein said biochips are assembled in an assembly area by sliding said biochips from a multiplicity of wafer substrates present on a common substrate.
16. The method according to claim 15 wherein said biochips are tagged to identify the wafer substrate of origin.
17. The method according to claim 16 wherein said biochips are assembled randomly.
18. The method according to claim 16 wherein biochips from a multiplicity of wafer substrates are present in a suspension and wherein said suspension is deposited on a planar substrate.
19. The method according to claim 13 wherein biochips from a multiplicity of wafer substrates are picked and placed on a common planar surface.
20. A method for packaging biochips produced according to the method of claim comprising selecting at least one biochip from at least one wafer substrate and placing said at least one biochip into a liquid confining region on a carrier substrate.
21. The method according to claim 20 wherein said carrier substrate comprises a hydrophilic major surface and a patterned hydrophobic layer.
22. The method according to claim 21 wherein said patterned hydrophobic layer on said carrier substrate defines liquid confining regions.
23. A plurality of biochips prepared by the method comprising:
patterning a wafer substrate to form a plurality of chip regions;
assembling at least one bead array comprising functionalized, encoded beads on a surface the wafer substrate in at least one chip region; and singulating the wafer to form said plurality of individual biochips.
patterning a wafer substrate to form a plurality of chip regions;
assembling at least one bead array comprising functionalized, encoded beads on a surface the wafer substrate in at least one chip region; and singulating the wafer to form said plurality of individual biochips.
24. The plurality of biochips according to claim 23, wherein said wafer substrate also comprises scribing in accordance with delineated chip regions.
25. The plurality of biochips according to claim 23 wherein said wafer substrate also comprises trenches cut into said patterned wafer along boundaries between said chip regions.
26. A pool biochips obtained from a multiplicity of wafer substrates and wherein said biochips are prepared according to the method of claim 1.
27. An assay device comprising a mobile chip carrier and a functional device for containing liquid, said mobile chip carrier comprising a plurality of biochips bonded to a common substrate; and wherein said biochips attached to said mobile chip carrier may be positioned to contact liquid contained by said functional device during an assay.
28. A mobile chip carrier comprising at least one chamber containing at least one biochip, said mobile chip carrier further comprising means for changing thermodynamic properties of said at least one chamber.
29. An assay comprising:
contacting a mobile chip carrier comprising a plurality biochips bonded to a carrier substrate with a solution comprising at least one target analyte, said solution contained in a functional device for containing liquid; and detecting whether the target analyte reacts with the biochips.
contacting a mobile chip carrier comprising a plurality biochips bonded to a carrier substrate with a solution comprising at least one target analyte, said solution contained in a functional device for containing liquid; and detecting whether the target analyte reacts with the biochips.
30. The assay according to claim 29, comprising multiple processing steps of contacting said mobile chip carrier with different reaction media contained in a plurality of functional devices.
31. The method according to either one of claims 29 or 30, wherein said functional device is selected from the group consisting of a reaction chamber, a washing chamber, or a signal reading stage.
32. A bead array comprising a removable coating for protecting said bead array on a biochip, said bead array comprising a plurality of functionalized encoded beads with surfaces to which molecular probes are attached, and said coating having the property of being non-reactive towards the molecular probes on the surfaces of the beads.
33. A process for depositing beads on a surface of a patterned wafer substrate to form a bead array, wherein said surface of said wafer substrate comprises a patterned layer, said patterned layer having an area with surface structures for confining beads, said process comprising placing an aliquot of a suspension of beads on a surface of said wafer substrate and mechanically agitating the suspension of beads to induce beads to settle in said area with surface structures for confining beads to form said bead array.
34. The process according to claim 33, wherein the step of mechanically agitating the suspension of beads comprises stirring said suspension with a damp cotton applicator to increase the occupancy of beads in said area for confining beads.
35. A semiconductor wafer substrate comprising at least one chip region, said chip region comprising:
a recess array for confining movement of beads on the substrate;
an optional patterned insulating dielectric layer for modifying impedance of an electrolyte-insulator semiconductor structure when the substrate is in contact with a bead solution wherein said patterned dielectric layer is positioned such that when an alternating electric field is applied beads in said bead solution are driven to accumulate at said recess array; and an optional protective passivation layer covering a surface of the substrate.
a recess array for confining movement of beads on the substrate;
an optional patterned insulating dielectric layer for modifying impedance of an electrolyte-insulator semiconductor structure when the substrate is in contact with a bead solution wherein said patterned dielectric layer is positioned such that when an alternating electric field is applied beads in said bead solution are driven to accumulate at said recess array; and an optional protective passivation layer covering a surface of the substrate.
36. The semiconductor wafer substrate according to claim 35, further comprising a plurality of chip regions.
37. The semiconductor wafer substrate according to claim 35, wherein said patterned insulating dielectric layer defines a region having a star-shaped perimeter.
38. The semiconductor wafer substrate according to claim 37, wherein said recess array comprises recesses having shapes selected from the group consisting of triangles, pentagons, hexagons and circles.
39. A method of assembling an array of beads, said method comprising:
providing a semiconductor wafer substrate according to claim 35, wherein said patterned dielectric layer defines regions on said substrate with and without dielectric, and wherein said recess array is located in a region without dielectric;
applying a solution of beads to a surface of the substrate, said surface comprising said patterned dielectric layer; and assembling an array of beads using LEAPS, wherein an electric field with a first frequency is applied to induce movement of beads towards said regions with dielectric and a second frequency electric field is applied to arrange beads in said recess array.
providing a semiconductor wafer substrate according to claim 35, wherein said patterned dielectric layer defines regions on said substrate with and without dielectric, and wherein said recess array is located in a region without dielectric;
applying a solution of beads to a surface of the substrate, said surface comprising said patterned dielectric layer; and assembling an array of beads using LEAPS, wherein an electric field with a first frequency is applied to induce movement of beads towards said regions with dielectric and a second frequency electric field is applied to arrange beads in said recess array.
40. A wafer substrate comprising a plurality of chip regions defined by patterning and optionally scribing said wafer substrate, wherein said chip regions comprise at least one bead restraining region and wherein said scribing enables breaking of said chip regions to form biochips comprising one or more chip regions.
41. The wafer substrate according to claim 40 further comprising at least one bead subpopulation affixed to a surface of at least one chip region of said substrate and wherein said bead subpopulation is formed of at least one biofunctionalized molecular probe selected from a probe library and affixed to a plurality of beads.
42. A plurality of biochips wherein said biochips are produced by breaking at least one wafer substrate according to claim 41 to separate said chip regions to form said plurality of biochips.
43. The plurality of biochips according to claim 42 wherein said biochips are obtained by breaking two or more wafer substrates comprising different bead subpopulations.
44. A method of retaining a population of charged beads in designated positions on a surface of a semiconductor wafer substrate comprising depositing a first charged polymer on the surface of the semiconductor wafer substrate, said first charged polymer having a charge of opposite sign to the charged beads, depositing the beads onto the surface of the semiconductor wafer substrate, and depositing a second charged polymer on the surface of the semiconductor wafer substrate, said second charged polymer having a charge of opposite sign to the first charged polymer.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34362101P | 2001-12-28 | 2001-12-28 | |
US60/343,621 | 2001-12-28 | ||
US10/192,352 | 2002-07-09 | ||
US10/192,352 US7335153B2 (en) | 2001-12-28 | 2002-07-09 | Arrays of microparticles and methods of preparation thereof |
PCT/US2002/041623 WO2003058199A2 (en) | 2001-12-28 | 2002-12-27 | Arrays of microparticles and methods of preparation thereof |
Publications (2)
Publication Number | Publication Date |
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CA2471693A1 true CA2471693A1 (en) | 2003-07-17 |
CA2471693C CA2471693C (en) | 2011-05-03 |
Family
ID=26888007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2471693A Expired - Lifetime CA2471693C (en) | 2001-12-28 | 2002-12-27 | Arrays of microparticles and methods of preparation thereof |
Country Status (13)
Country | Link |
---|---|
US (7) | US7335153B2 (en) |
EP (3) | EP2565648B1 (en) |
JP (2) | JP2005535868A (en) |
KR (1) | KR100966683B1 (en) |
CN (1) | CN1299117C (en) |
AU (1) | AU2002364034B2 (en) |
CA (1) | CA2471693C (en) |
ES (2) | ES2398194T3 (en) |
HK (1) | HK1074881A1 (en) |
IL (2) | IL162737A0 (en) |
NZ (1) | NZ533752A (en) |
PT (1) | PT1488236E (en) |
WO (1) | WO2003058199A2 (en) |
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