CA2457791A1 - Coatings with low permeation of gases and vapors - Google Patents

Coatings with low permeation of gases and vapors Download PDF

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Publication number
CA2457791A1
CA2457791A1 CA002457791A CA2457791A CA2457791A1 CA 2457791 A1 CA2457791 A1 CA 2457791A1 CA 002457791 A CA002457791 A CA 002457791A CA 2457791 A CA2457791 A CA 2457791A CA 2457791 A1 CA2457791 A1 CA 2457791A1
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CA
Canada
Prior art keywords
coating
organic
barrier
inorganic
permeation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002457791A
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French (fr)
Other versions
CA2457791C (en
Inventor
Grzegorz Czeremuszkin
Mohamed Latreche
Michael Robert Wertheimer
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Beijing Xiaomi Mobile Software Co Ltd
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Individual
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Publication of CA2457791A1 publication Critical patent/CA2457791A1/en
Application granted granted Critical
Publication of CA2457791C publication Critical patent/CA2457791C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • C23C16/0272Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/042Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/043Improving the adhesiveness of the coatings per se, e.g. forming primers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/046Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/048Forming gas barrier coatings
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/401Oxides containing silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/401Oxides containing silicon
    • C23C16/402Silicon dioxide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/88Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/10Organic photovoltaic [PV] modules; Arrays of single organic PV cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • H10K50/8445Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/20Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising organic-organic junctions, e.g. donor-acceptor junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/30Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/917Electroluminescent

Abstract

A multilayer structure has barrier properties for gases and vapors, for example oxygen and water vapor; the structure comprises: an organic substrate layer, and a multilayer permeation barrier thereon; the barrier comprises: a) a first inorganic coating contacting a surface of the substrate layer, and b) a first organic coating contacting a surface of the inorganic coating; the structure may be employed in a variety of articles where barrier properties are important especially in electronic articles such as organic light emitting diode devices where superior barrier characteristics over the life of the device are required.

Claims (28)

1. An organic light emitting or photovoltaic device in which organic semi-conductors are encased in a barrier envelope, said envelope comprising a multilayer structure comprising:
i) an organic substrate layer, and ii) a multilayer permeation barrier thereon, said barrier comprising:
a) a first inorganic coating contacting a surface of said substrate layer, and b) a first organic coating contacting a surface of said first inorganic coating.
2. A device according to claim 1, wherein the inorganic coating is impermeable to gases, when formed as a continuous coating and exhibits discontinuity-controlled permeability with the occurrence of inadvertent discontinuities in the inorganic coating; and said organic coating exhibits diffusion controlled permeation of water vapor and oxygen.
3. A device according to claim 1 or 2 wherein said coatings a) and b) form a first permeation barrier of said mutilayer permeation barrier, and said multilayer permeation barrier further comprises at least one inorganic coating and at least one organic coating, in alternating relationship with said coatings of said first permeation barrier.
4. A device according to claim 1 or 2 wherein said coatings a) and b) form a first permeation barrier of said mutilayer permeation barrier, and said multilayer permeation barrier further comprises a first plurality of inorganic coatings and a second plurality of organic coatings, in alternating relationship, with an inorganic coating of said first plurality contacting coating b).
5. A device according to claim 1 or 2, wherein said inorganic coating has a thickness of 1 nm to 1 µm.
6. A device according to claim 1, 2 or 5 wherein said inorganic coating has a thickness of 45 nm to 350 nm.
7. A device according to claim 1, 2, 5 or 6 wherein said organic coating has a thickness of 5 nm to 10 µm.
8. A device according to claim 1, 2, 5, 6 or 7 wherein said organic coating has a thickness of 20 to 500 nm.
9. A device according to claim 3 or 4, wherein each inorganic coating has a thickness of 45 to 350 nm.
10. A device according to claim 3, 4 or 9, wherein each organic coating has a thickness of 20 to 500nm.
11. A multilayer structure according to claim 3, 4 or 9, wherein each organic coating has a thickness of 20 to 500nm, and at least one organic coating of said second permeation barrier has a thickness greater than 1 µm up to 10 µm.
12. A device according to any one of claims 1 to 11, wherein said organic substrate has a thickness of 5 to 5000 µm.
13. A device according to any one of claims 1 to 12, wherein the substrate is selected from the group consisting of:
a) single, multi-layer or coextruded plastic films;
b) plastic films having the surface modified by at least one of the following techniques: corona discharge treatment, low or atmospheric pressure glory discharge, flame treatment and heat treatment, and a radiation treatment wherein the radiation is selected from the group consisting of UV, VUV, X-rays, gamma-rays, and particle radiation such as ion bombardment c) plastic films having a surface coated with a functional coating selected from a hard-coating, an anti-scratch coating, an anti-abrasion coating, an anti-reflective coating, an anti-glare coating, a chemically-active coating, an oxygen scavenger coating, a desiccant coating, a UV-protective coating, and a colour-adjustment coating.
14. A device according to any one of claims 1 to 13 wherein the or each inorganic coating is completely or essentially made of an inorganic material which is selected from the group consisting of SiO2, SiO2, SiO x C y, Si3N4, Si x N y C z, SiO x N y, TiO2, TiO x, , ZrO2, ZrO x, Al2O3, SnO2, In2O3, ITO, PbO, PbO2, B2O3, P2O5, tantalum oxide, yttrium oxide, barium oxide, magnesium oxide, amorphous carbon, sulphur, selenium, magnesium fluoride, calcium fluoride, calcium oxide, mixtures thereof, or their alloys or compounds;
wherein x represents an integer ranging from 1 to 3, y represents a number ranging from 0.01 to 5 and z represents a number ranging from 0.01 to 5.
15. A device according to any one of claims 1 to 14, wherein the or each organic coating is completely or essentially made of an organic material which is selected from the group consisting of plasma-deposited coatings obtained from mixtures containing at least one organic substance, gas or vapor at normal pressure, with or without contribution of inert or reactive gases, said organic substance being selected from: hydrocarbons, organic compounds containing one or more heteroatoms, alcohols, ethers, esters, or their combinations, organosilicon compounds, and organometallic compounds.
16. A device according to any one of claims 1 to 15, wherein the substrate is rigid.
17. A device according to any one of claims 1 to 16, wherein the substrate is flexible.
18. A device according to any one of claims 1 to 17, wherein the permeation-barrier-providing coating is transparent.
19. A device according to any one of claims 1 to 18, having an oxygen permeation, measured by ASTM methods F1927 and D3985 which is lower than 2 cm3/m2day.
20. A device according to any one of claims 1 to 18, having an oxygen permeation, measured by ASTM methods F1927 and D3985 which is lower than 0.01 cm3/m2day.
21. A device according to any one of claims 1 to 20, wherein said multilayer barrier has hardness of less than 2GPa.
22. A device according to any one of claims 1 to 21, wherein said substrate has a smooth, flat surface in direct contact with said first inorganic coating.
23. Use of the multilayer structure defined in any one of claims 1 to 22, in manufacturing photovoltaic device or organic light-emitting devices.
24. An organic light emitting device in which light emitting diodes are encased in said barrier envelope, as defined in any one of claims 1 to 22.
25. A process for producing an organic light emitting or photovoltaic device comprising preparing a multilayer permeation barrier structure by:
i) depositing an inorganic material on an organic substrate to form an inorganic coating in contact with a surface of said organic substrate;
ii) depositing an organic coating on said inorganic coating, and iii) enveloping an organic semi-conductor for said device in an envelope which comprises said barrier structure.
26. A process according to claim 25, wherein said depositing in i) is by PECVD, CVD, PVD, evaporation, reactive evaporation, sputtering, reactive sputtering, cathodic or anodic arc evaporation or wet chemical (e.g. sol-gel), in partial vacuum, or at or above atmospheric pressure; and said depositing in ii) is in partial vacuum, or at or above atmospheric pressure, using dip coating, spray coating, cast coating, sputtering, reactive sputtering, evaporation, reactive evaporation, PECVD, pyrolysis/condensation or pyrolysis/polymerization methods.
27. A process according to claim 25 or 26, for producing a device according to any one of claims 1 to 21.
28. A process according to claim 25, wherein the depositing of inorganic material is carried out by using PECVD or PVD, in partial vacuum; and the depositing of organic material is carried out using PECVD or pyrolysis/polymerisation method in partial vacuum.
CA2457791A 2001-08-20 2002-08-20 Coatings with low permeation of gases and vapors Expired - Fee Related CA2457791C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31302501P 2001-08-20 2001-08-20
US60/313,025 2001-08-20
PCT/CA2002/001288 WO2003016589A1 (en) 2001-08-20 2002-08-20 Coatings with low permeation of gases and vapors

Publications (2)

Publication Number Publication Date
CA2457791A1 true CA2457791A1 (en) 2003-02-27
CA2457791C CA2457791C (en) 2010-08-03

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Country Status (7)

Country Link
US (1) US7074501B2 (en)
EP (1) EP1419286A1 (en)
JP (1) JP2004537448A (en)
KR (1) KR20040027940A (en)
CN (1) CN1317421C (en)
CA (1) CA2457791C (en)
WO (1) WO2003016589A1 (en)

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