CA2432438A1 - Flexible microchip devices for ophthalmic and other applications - Google Patents

Flexible microchip devices for ophthalmic and other applications Download PDF

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Publication number
CA2432438A1
CA2432438A1 CA002432438A CA2432438A CA2432438A1 CA 2432438 A1 CA2432438 A1 CA 2432438A1 CA 002432438 A CA002432438 A CA 002432438A CA 2432438 A CA2432438 A CA 2432438A CA 2432438 A1 CA2432438 A1 CA 2432438A1
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Prior art keywords
microchip device
device array
array
microchip
reservoirs
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CA002432438A
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French (fr)
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CA2432438C (en
Inventor
John T. Santini, Jr.
Michael J. Cima
Robert S. Langer
Dennis Ausiello
Norman F. Sheppard, Jr.
Stephen J. Herman
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Dare MB inc
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Individual
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00—Medicinal preparations characterised by special physical form
    • A61K9/0012—Galenical forms characterised by the site of application
    • A61K9/0048—Eye, e.g. artificial tears
    • A61K9/0051—Ocular inserts, ocular implants
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F9/00—Methods or devices for treatment of the eyes; Devices for putting-in contact lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
    • A61F9/0008—Introducing ophthalmic products into the ocular cavity or retaining products therein
    • A61F9/0017—Introducing ophthalmic products into the ocular cavity or retaining products therein implantable in, or in contact with, the eye, e.g. ocular inserts
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00—Medicinal preparations characterised by special physical form
    • A61K9/0002—Galenical forms characterised by the drug release technique; Application systems commanded by energy
    • A61K9/0009—Galenical forms characterised by the drug release technique; Application systems commanded by energy involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00—Medicinal preparations characterised by special physical form
    • A61K9/0012—Galenical forms characterised by the site of application
    • A61K9/0048—Eye, e.g. artificial tears
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00—Medicinal preparations characterised by special physical form
    • A61K9/0087—Galenical forms not covered by A61K9/02 - A61K9/7023
    • A61K9/0097—Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61P—SPECIFIC THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS
    • A61P9/00—Drugs for disorders of the cardiovascular system
    • A61P9/10—Drugs for disorders of the cardiovascular system for treating ischaemic or atherosclerotic diseases, e.g. antianginal drugs, coronary vasodilators, drugs for myocardial infarction, retinopathy, cerebrovascula insufficiency, renal arteriosclerosis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

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  • Health & Medical Sciences (AREA)
  • Veterinary Medicine (AREA)
  • Public Health (AREA)
  • General Health & Medical Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Epidemiology (AREA)
  • Engineering & Computer Science (AREA)
  • Ophthalmology & Optometry (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Vascular Medicine (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Biomedical Technology (AREA)
  • Dermatology (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Urology & Nephrology (AREA)
  • Organic Chemistry (AREA)
  • Cardiology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Prostheses (AREA)
  • Medicinal Preparation (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Medicines Containing Antibodies Or Antigens For Use As Internal Diagnostic Agents (AREA)

Abstract

Microchip device arrays that can conform to a curved surface are provided for the controlled release or exposure of reservoir contents. The arrays comprise two or more microchip device elements, each of which includes a plurality of reservoirs that contain molecules for controlled release or components for selective exposure, and a means for flexibly connecting the device elements.
The reservoirs can contain one or more drugs and/or one or more secondary devices, such as a sensor or a component thereof. Preferably, the microchip devices contain and controllably release therapeutic, prophylactic, and diagnostic molecules to and into the eye of a patient in need thereof.

Claims (40)

1. ~A microchip device array for the controlled release or exposure of reservoir contents comprising:
two or more microchip device elements, each of which includes a plurality of reservoirs which contain molecules for controlled release or components for selective exposure; and a means for flexibly connecting said device elements, so as to form a flexible array which can conform to a curved surface.
2. ~The microchip device array of claim 1, wherein the means for flexibly connecting comprises a flexible supporting layer attached to a surface of the device elements.
3. ~The microchip device array of claim 2, wherein the flexible supporting layer comprises a polymer.
4. ~The microchip device array of claim 3, wherein the polymer is selected from the group consisting of polyimides, polyesters, parylenes, and hydrogels.
5. ~The microchip device array of claim 1, wherein the flexible supporting layer is porous or permeable to molecules releasable from the reservoirs or provided with one or more apertures through said flexible supporting layer.
6. ~The microchip device array of claim 1, wherein the means for flexibly connecting comprises one or more hinges or flexible tethers connecting two or more of the device elements.
7. ~The microchip device array of claim 1 for implantation onto or into a patient, wherein the array can conform to the curvature of a tissue surface.
8. ~The microchip device array of claim 7 for implantation into or onto the eye of the patient, wherein the tissue surface comprises ophthalinic tissue.
9. ~The microchip device array of claim 7, wherein the tissue surface is selected from the group consisting of the stratum corneum, mucosal membranes, blood vessels, bone, brain, and bladder.
10. ~The microchip device array of claim 1, wherein the microchip device elements comprise reservoir caps over the reservoirs.
11. ~The microchip device array of claim 1 further comprising a means for wirelessly communicating with the microchip device elements.
12. ~The microchip device array of claim 11, wherein the communicating means comprises a photocell to receive incident light energy.
13. ~The microchip device array of claim 1 further comprising an energy storage means.
14. ~The microchip device array of claim 13, wherein the energy storage means comprises a capacitor, a battery, or both.
15. ~The microchip device. array of claim 1 further comprising electrical connections between two or more of the microchip device elements, such that the microchip device elements can be powered or controlled by a common energy source or control source, respectively.
16. ~The microchip device array of claim 1, wherein the reservoirs contain drug molecules.
17. ~The microchip device array of claim 1, wherein the reservoirs contains one or more secondary devices for exposure.
18. ~The microchip device array of claim 17, wherein the secondary device comprises a sensor.
19. ~The microchip device array of claim 18, wherein the sensor is a pressure sensor or a chemical sensor.
20. The microchip device array of claim 1, wherein the microchip device elements comprise reservoirs which contain drug molecules and at least one reservoir which contains a sensor.
21. The microchip device array of claim 1, wherein the reservoirs contain molecules selected from the group consisting of diagnostic reagents, catalysts, combinatorial chemistry precursors, and fragrance molecules.
22. The microchip device array of claim 1, wherein the electrical traces are built into the means for flexibly connecting said device elements.
23. The microchip device array of claim 1, which comprises flexible, passive release device elements.
24. The microchip device array of claim 7, which enhances the patency of a tissue lumen or other organ structure in the patient.
25. A method for delivering drug molecules to a patient, the method comprising:
implanting into or onto a tissue surface of the patient the microchip device array of claim 16; and selectively releasing from one or more of the reservoirs an effective amount of the drug molecules.
26. The method of claim 25, wherein the microchip device is implanted onto or into the sclera or another surface of the eye of the patient.
27. The method of claim 25, wherein the release of drug is activated wirelessly.
28. The method of claim 27, wherein the activation is by application of light to the microchip device array.
29. The method of claim 28, wherein the light is from a laser source.
30. The method of claim 29, wherein the laser light removes or permeates one or more reservoir caps which cover the reservoirs.
31. ~The method of claim 25, wherein the tissue surface is selected from the group consisting of the stratum corneum, mucosal membranes, blood vessels, bone, brain, and bladder.
32. ~A method for sensing a molecule or physical property at a site, the method comprising:
implanting at a site the microchip device array of claim 18; and selectively exposing at least one sensor of the sensors to molecules or a property at said site, thereby permitting said at least one sensor to sense said molecules or property.
33. ~A method for sensing a molecule or physical property on or in the eye of a patient, the method comprising:
providing a microchip device having a plurality of reservoirs containing sensors;
implanting the microchip device at a site in or on the eye of the patient; and selectively exposing one or more of the sensors to molecules or a property at said site.
34. ~The method of claim 33, wherein the sensor comprises a pressure sensor and wherein the condition is intraocular pressure.
35. ~The method of claim 33, wherein the sensor comprises a chemical sensor.
36. ~The method of claim 33, wherein the selective exposure of the sensor is activated wirelessly.
37. ~The method of claim 36, wherein the activation is by application of light to the microchip device.
38. ~The method of claim 37, wherein the light is from a laser source.
39. ~The method of claim 38, wherein the laser light removes or permeates one or more reservoir caps which cover the reservoirs.
40. The method of claim 33, wherein the microchip device comprises a microchip device array comprising two or more microchip device elements, each of which includes a plurality of reservoirs which contain molecules for controlled release or components for selective exposure, and a means for flexibly connecting said device elements, so as to a flexible array which can conform to a curved surface of the eye.
CA2432438A 2001-01-09 2002-01-09 Flexible microchip devices for ophthalmic and other applications Expired - Fee Related CA2432438C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26072501P 2001-01-09 2001-01-09
US60/260,725 2001-01-09
PCT/US2002/000581 WO2002055058A2 (en) 2001-01-09 2002-01-09 Flexible microchip devices for ophthalmic and other applications

Publications (2)

Publication Number Publication Date
CA2432438A1 true CA2432438A1 (en) 2002-07-18
CA2432438C CA2432438C (en) 2011-04-26

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CA2432438A Expired - Fee Related CA2432438C (en) 2001-01-09 2002-01-09 Flexible microchip devices for ophthalmic and other applications

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US (5) US6976982B2 (en)
EP (1) EP1372602B1 (en)
JP (3) JP4657577B2 (en)
AT (1) ATE359762T1 (en)
AU (1) AU2002241834B2 (en)
CA (1) CA2432438C (en)
DE (1) DE60219607T2 (en)
WO (1) WO2002055058A2 (en)

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US8308707B2 (en) 2012-11-13
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US20080221557A1 (en) 2008-09-11
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US7879019B2 (en) 2011-02-01
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US20060178655A1 (en) 2006-08-10
US20020099359A1 (en) 2002-07-25
US7776024B2 (en) 2010-08-17
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US20110172587A1 (en) 2011-07-14
US20080071252A1 (en) 2008-03-20
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US6976982B2 (en) 2005-12-20
JP4657577B2 (en) 2011-03-23
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JP4354521B2 (en) 2009-10-28
US7582080B2 (en) 2009-09-01

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