CA2167074A1 - Procede de metalisation de substrats non-conducteurs - Google Patents
Procede de metalisation de substrats non-conducteursInfo
- Publication number
- CA2167074A1 CA2167074A1 CA002167074A CA2167074A CA2167074A1 CA 2167074 A1 CA2167074 A1 CA 2167074A1 CA 002167074 A CA002167074 A CA 002167074A CA 2167074 A CA2167074 A CA 2167074A CA 2167074 A1 CA2167074 A1 CA 2167074A1
- Authority
- CA
- Canada
- Prior art keywords
- pct
- film
- metallising
- conductive substrates
- sec
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/70—Carriers or collectors characterised by shape or form
- H01M4/80—Porous plates, e.g. sintered carriers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Laminated Bodies (AREA)
- Chemical Treatment Of Metals (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Liquid Crystal (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Le procédé comprend les étapes suivantes: a) on prépare une dispersion (4) d'un oxyde de cuivre à l'état divisé comprenant un solvant et un liant sélectionné, b) on applique ladite dispersion sur ledit substrat non-conducteur (1), pour former une couche (5), c) on forme une couche avec Cu (9), par action d'un réactif adapté, d) on dépose sur ladite couche (9) au moins une couche métallique (11) par dépôt électrolytique.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9308986A FR2707673B1 (fr) | 1993-07-16 | 1993-07-16 | Procédé de métallisation de substrats non-conducteurs. |
FR93/08986 | 1993-07-16 | ||
PCT/FR1994/000860 WO1995002715A1 (fr) | 1993-07-16 | 1994-07-11 | Procede de metalisation de substrats non-conducteurs |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2167074A1 true CA2167074A1 (fr) | 1995-01-26 |
CA2167074C CA2167074C (fr) | 2004-09-14 |
Family
ID=9449480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002167074A Expired - Fee Related CA2167074C (fr) | 1993-07-16 | 1994-07-11 | Procede de metalisation de substrats non-conducteurs |
Country Status (14)
Country | Link |
---|---|
US (1) | US5674373A (fr) |
EP (1) | EP0708847B1 (fr) |
JP (1) | JPH09500174A (fr) |
KR (1) | KR100309196B1 (fr) |
AT (1) | ATE150805T1 (fr) |
CA (1) | CA2167074C (fr) |
DE (1) | DE69402319T2 (fr) |
ES (1) | ES2099625T3 (fr) |
FI (1) | FI103994B (fr) |
FR (1) | FR2707673B1 (fr) |
GR (1) | GR3022955T3 (fr) |
NO (1) | NO315279B1 (fr) |
PL (1) | PL312570A1 (fr) |
WO (1) | WO1995002715A1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2320728A (en) * | 1996-12-30 | 1998-07-01 | Coates Brothers Plc | Depositing a metallic film involving pretreatment |
US6547934B2 (en) | 1998-05-18 | 2003-04-15 | Applied Materials, Inc. | Reduction of metal oxide in a dual frequency etch chamber |
US6297147B1 (en) | 1998-06-05 | 2001-10-02 | Applied Materials, Inc. | Plasma treatment for ex-situ contact fill |
US7053002B2 (en) | 1998-12-04 | 2006-05-30 | Applied Materials, Inc | Plasma preclean with argon, helium, and hydrogen gases |
US6372301B1 (en) * | 1998-12-22 | 2002-04-16 | Applied Materials, Inc. | Method of improving adhesion of diffusion layers on fluorinated silicon dioxide |
US6821571B2 (en) | 1999-06-18 | 2004-11-23 | Applied Materials Inc. | Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers |
FR2799475B1 (fr) * | 1999-10-11 | 2002-02-01 | Centre Nat Rech Scient | Procede de metallisation d'un substrat isolant par voie electrochimique |
US6632344B1 (en) * | 2000-03-24 | 2003-10-14 | Robert L. Goldberg | Conductive oxide coating process |
US6794311B2 (en) | 2000-07-14 | 2004-09-21 | Applied Materials Inc. | Method and apparatus for treating low k dielectric layers to reduce diffusion |
JP3761892B1 (ja) * | 2004-10-19 | 2006-03-29 | シャープ株式会社 | 繊維構造体に制電性を付与する方法およびその方法によって制電性が付与された繊維構造体 |
JP4803549B2 (ja) * | 2006-03-03 | 2011-10-26 | 地方独立行政法人 大阪市立工業研究所 | 亜酸化銅膜に金属銅層を形成する方法 |
JP6177065B2 (ja) * | 2013-09-11 | 2017-08-09 | 株式会社クラレ | 金属レプリカ及びスタンパの製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2893930A (en) * | 1956-10-03 | 1959-07-07 | Gen Lab Associates Inc | Process of making a ceramic element usable in surface-gap igniters |
GB927205A (en) * | 1959-08-26 | 1963-05-29 | Nat Res Dev | Methods of applying metal deposits to resistive oxide films |
US3146125A (en) * | 1960-05-31 | 1964-08-25 | Day Company | Method of making printed circuits |
US3226256A (en) * | 1963-01-02 | 1965-12-28 | Jr Frederick W Schneble | Method of making printed circuits |
FR2518126B1 (fr) * | 1981-12-14 | 1986-01-17 | Rhone Poulenc Spec Chim | Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede |
US5389270A (en) * | 1993-05-17 | 1995-02-14 | Electrochemicals, Inc. | Composition and process for preparing a non-conductive substrate for electroplating |
-
1993
- 1993-07-16 FR FR9308986A patent/FR2707673B1/fr not_active Expired - Fee Related
-
1994
- 1994-07-11 AT AT94922898T patent/ATE150805T1/de active
- 1994-07-11 EP EP94922898A patent/EP0708847B1/fr not_active Expired - Lifetime
- 1994-07-11 CA CA002167074A patent/CA2167074C/fr not_active Expired - Fee Related
- 1994-07-11 KR KR1019960700178A patent/KR100309196B1/ko not_active IP Right Cessation
- 1994-07-11 JP JP7504371A patent/JPH09500174A/ja active Pending
- 1994-07-11 PL PL94312570A patent/PL312570A1/xx unknown
- 1994-07-11 ES ES94922898T patent/ES2099625T3/es not_active Expired - Lifetime
- 1994-07-11 WO PCT/FR1994/000860 patent/WO1995002715A1/fr active IP Right Grant
- 1994-07-11 US US08/571,977 patent/US5674373A/en not_active Expired - Lifetime
- 1994-07-11 DE DE69402319T patent/DE69402319T2/de not_active Expired - Lifetime
-
1996
- 1996-01-15 NO NO19960178A patent/NO315279B1/no not_active IP Right Cessation
- 1996-01-15 FI FI960171A patent/FI103994B/fi not_active IP Right Cessation
-
1997
- 1997-03-27 GR GR970400555T patent/GR3022955T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
EP0708847B1 (fr) | 1997-03-26 |
FR2707673B1 (fr) | 1995-08-18 |
FI103994B1 (fi) | 1999-10-29 |
ATE150805T1 (de) | 1997-04-15 |
CA2167074C (fr) | 2004-09-14 |
DE69402319T2 (de) | 1997-08-07 |
FR2707673A1 (fr) | 1995-01-20 |
WO1995002715A1 (fr) | 1995-01-26 |
PL312570A1 (en) | 1996-04-29 |
FI960171A0 (fi) | 1996-01-15 |
US5674373A (en) | 1997-10-07 |
FI103994B (fi) | 1999-10-29 |
KR100309196B1 (ko) | 2002-07-02 |
GR3022955T3 (en) | 1997-06-30 |
NO315279B1 (no) | 2003-08-11 |
JPH09500174A (ja) | 1997-01-07 |
NO960178D0 (no) | 1996-01-15 |
ES2099625T3 (es) | 1997-05-16 |
NO960178L (no) | 1996-01-15 |
FI960171A (fi) | 1996-03-15 |
EP0708847A1 (fr) | 1996-05-01 |
DE69402319D1 (de) | 1997-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20140711 |