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Publication numberCA2144323 A1
Publication typeApplication
Application numberCA 2144323
PCT numberPCT/EP1992/002134
Publication date31 Mar 1994
Filing date14 Sep 1992
Priority date14 Sep 1992
Also published asCA2144323C, DE69231785D1, DE69231785T2, EP0660967A1, EP0660967B1, US5455455, US5547906, WO1994007267A1
Publication numberCA 2144323, CA 2144323 A1, CA 2144323A1, CA-A1-2144323, CA2144323 A1, CA2144323A1, PCT/1992/2134, PCT/EP/1992/002134, PCT/EP/1992/02134, PCT/EP/92/002134, PCT/EP/92/02134, PCT/EP1992/002134, PCT/EP1992/02134, PCT/EP1992002134, PCT/EP199202134, PCT/EP92/002134, PCT/EP92/02134, PCT/EP92002134, PCT/EP9202134
InventorsPierre Badehi
ApplicantPierre Badehi, Shellcase Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: CIPO, Espacenet
Methods and apparatus for producing integrated circuit devices
CA 2144323 A1
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads (19) and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads.
Apparatus for carrying out the method and integrated circuit devices are also described and claimed.
Description  available in
Claims  available in
International ClassificationH01L25/18, H01L21/98, H01L25/07, H01L21/301, H01L25/065, H01L21/78
Cooperative ClassificationH01L2924/14, H01L2924/12042, H01L24/96, H01L25/0657, H01L25/0652, H01L2225/06579, H01L25/50, H01L2225/06589, H01L21/78, H01L2225/06551, H01L2924/00013, H01L2924/10253
European ClassificationH01L25/50, H01L21/78, H01L25/065M, H01L25/065S
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