CA2114110A1 - Cleaning agent for electronic and electrical assemblies - Google Patents
Cleaning agent for electronic and electrical assembliesInfo
- Publication number
- CA2114110A1 CA2114110A1 CA002114110A CA2114110A CA2114110A1 CA 2114110 A1 CA2114110 A1 CA 2114110A1 CA 002114110 A CA002114110 A CA 002114110A CA 2114110 A CA2114110 A CA 2114110A CA 2114110 A1 CA2114110 A1 CA 2114110A1
- Authority
- CA
- Canada
- Prior art keywords
- weight
- cleaning
- cleaning agents
- quantities
- cleaning agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/264—Aldehydes; Ketones; Acetals or ketals
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2072—Aldehydes-ketones
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/267—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
Abstract Cleaning agents for electronic and electrical assemblies The invention relates to the use of diacetone alcohol in water-miscible cleaningagents free from halogenated hydrocarbons for cleaning electronic and electrical as-semblies.
Diacetone alcohol can be used to particularly good effect in the removal of fluxes because, in addition to rosin residues, the so-called "white residues" are also removed.
Diacetone alcohol can be used to particularly good effect in the removal of fluxes because, in addition to rosin residues, the so-called "white residues" are also removed.
Description
2l ~11D
~;
~, CLEAN~G AGENT FOR ELlE:iCTRONIC AND ELECTRICAL
ASSEMlBLIES
~, This invention relates to water-miscible cleaning agents free from halogenated hydrocarbons for cleaning electronic and electrical assemblies and to the use of the cleaning agent for the removal of flux from circuit boards afler soldering.
~iBasically, fluxes based on rosin are made up of products belonging to two dif-5 ferent chemical groups, namely relatively apolar resin-like compounds, for example rosin, and polar compounds, so-called activators. In accordance with the laws of¦chemistry, ~he chemical compounds dissolve best in solvents of the same type, i.e. in apolar or polar cleaning agents. Particular problems arise in the prior art when the carboxylic acids used as activators are present in the rosin in concentrations of up to `.
~C~
35 % and, in some cases, are insoluble in fluorinated hydrocarbons or chlorinated hy-drocarbons and only sparingly soluble in alcohols. This often leads to dissolution of the rosin and to exposure of white residues of the activators which, freed from the in-sulating effect of the rosin, can become conductive and corrosive under the effect of s atmospheric moisture.
Until very recently, fluorinated hydrocarbons were mainly used for cleaning electronic and electrical assemblies, more particularly for removing rosin-con~aining fluxes from circuit boards after soldering. In view of the problem of destruction of the ozone layer by chloronuorocarbons~ atternpts have recently been made to develop o alternative cleaning agents.
DE-A 23 16 720 describes a cleaning agent for removing rosin-containing res-idues from electrical equipment which is said largely to eliminate rosin residues and activators, if any, but which on the other hand does not affect the insulating materials and metals norrnally used in electrical circuits~ The cleaning solution contains in par-, 15 ticular a polar, higher alcohol, more particularly butyl glycol or N-butanol, a polar , lower alcohol, more particularly methanol or isopropanol, in addition to an apolar hy-drocarbon, more particularly trichlorotrifluoroethane or hexane, optionally in the prcs-ence of a nonionic wetting agent. Firs~ly, a water-immiscible cleaning agent is ob-tained through the use of the polar hydrocarbon. Secondly, the chlorofluorocarbon ¦ 20 used should be avoided on account of its ozone-destroying effect. In addition, clean-ing agents of the type in question have extremely low flash points without the chloro-fluorocarbons so that their practical application requires appropriate explosion-proof equipment.
A cleaning agent containing non-halogenated hydrocarbons, a fluorinated al-~¦ 25 cohol and, optionally, other polar organic solvents in addition to halogenated hydrocar-bons is known from EP-A-0 120 319. In view of the presence of halogenated hydro-i carbons, this cleaning agent does not satisfy present-day requirements.
EP-A-0 416 763 describes the cleaning of electronic circuit boards with prepa-rations containing terpenes or other non-halogenated solvents. Unfortunately, these 30 cleaning agents have an extremely low flash point so that appropriate anti-explosion ` measures have to be taken for their practical application.
EP-A-0 419 089 describes a cleaning agent containing dimethyl cyclooctadiene.
.
The use of diacetone alcohol for dissolving rosin and many natural and syn-~hetic resins is known from Ro~lpps Chemie-Lexikon [Title in English: Rompps Chemical Dictionary], 9th Edition, Vol. 2 (1990), page 923, keyword "diacetone alco-hol".
s Water-free solvent mixtures consisting of chlorofluorocarbons and ketones are known from Chemical Absfracts, Voh 114 (1991), page 139, Abstract 114:84372 g from JP-A90/202998. In addition lo the chlorofluorocarbons mentioned, diacetone al-cohol inter alia is used for removing fluxes.
By contrast, the problem addressed by the present invention was to provide a water-miscible preparaiion free from halogenated hydrocarbons for cleaning electronic and electrical assemblies which would be capable of safely removing the polar and apolar substances present in the fluxes, particularly those based on rosin, without the use of chlorofluorocarbons or chlorinaled hydrocarbons. In addition, the preparation would have a flash point above 60 C which could be further increased by addidonof water, depending on the particular application. A further requirement to be satis-fied was universal useability in immersion/flood systems, ultrasonic balhs and spray systems.
The cleaning agent according to the invention would also have to be com-¦ pletely removable by rinsing with watcr after cleaning.
It has now been found that water-miscible cleaning agents free from halo-genated hydrocarbons based on diacetone alcohol are capable of satisfying all the re-quirements mentioned above. In a first embodiment, therefore, the present invention relates to water-miscible preparations free from halogenated hydrocarbons and contain-ing diacetone alcohol for cleaning electronic and electrical assemblies. According to 25 the invention, the cleaning agents contain 30 to 90 ~o by weight of diacetone alcohol, based on the cleaning agent. It has also been found that, in addition to the good dissolving effect of diacetone alcohol on rosin known per se, the so-called "white residues" emanating from the activators could also be removed substantially com-pletely with diacetone alcohol.
It has also been found that diacetone alcohol need not necessarily be used in an anhydrous medium for the purposes of the invention. Instead, the diacetone alco-hol may also be used in the form of an aqueous solution. Aqueous solutions preferab-ly contain at least 30 % by weight of diacetone alcohol, based on the cleaning agent.
A diacetone alcohol content, based on ~he cleaning agent, of 30 ~o 80% by weight is - particularly preferred, a content of 50 to 70% by weight being most particularly pre-ferred.
s In addition, cleaning agents accordillg to the invention may contain other addi-tives. For example, surfactants may be added to reduce the surface tension. Surfact-ants suitable for this purpose are, for example, known nonionic and anionic surfact-ants. Examples of suitable nonionic surfactimts are adducts of ethylene oxide and/or propylene oxide with fatty alcohols, fatty amines, fatty acids or aL~cyl phenols.
Examples of suitable anionic surfactants are aL~;yl ben~enesulfonates, alkanesulfates, , aL~canesulfonates, fatty alkyl ether sulfates or ~-sulfofatty acid esters. The cleaning agent may contain up to 10 % by weight and, more particularly, from 1 to 5 % by weight of these surfactants used for the stated purpose.
, Corrosion inhibitors for inhibiting corrosion on the metallic surface of the arti-15 cle to be cleaned are known in the prior art and, as such, may also be used for ~he , purposes of the present invention. For example, copper corrosion inhibitors, such as benzotriazole and/or tolyl triazole, may be used. A suitable concentration range for these corrosion inhibitor additives is from 0.01 to 5 % by weight and, more particular-.1 ly, from 0.01 to 1 % by weight.
¦ 20 In another embodiment, preferred cleaning agents according to the invention contain water-soluble organic nitrogen bases, more particularly triethanolamine, for the accelerated separation of acidic constituents from the flux resin and, more particularly, the activators used. The nitrogen bases are preferably used in a quantity of 1 to 10 % by weight and, more preferably, in a quantity of 2 to 5% by weight, based on the 25 cleaning agent.
`¦ The cleaning agents according to the invention may also contain water-soluble organic solvents containing one or more polar groups, more particularly those contain-~, ing an alcohol group and having a boiling point below 300 C, i.e. linear alcohols, ~1 such as butanol, hexyl alcohol, decanol, etc. and branched isomers thereof, those con-30 taining an alicyclic alcohol group, for example embodied in cyclohexanol, ~hose con-i taining several alcohol groups, more particularly glycols, fGr example embodied in he:cylene glycol, those containing rn ether group, glycol etùers, for exnmple embodied :~ - ,. , k ~3 .3~ a in ethylene glycol monobu~yl e~her, elhylene glycol dibutyl e~her, etc., and those con-taining an ester group, such as glycolic acid ester or glycol ester, for example ethyl glycol acetate. In addition, lactones or lactams, more par~icularly N-methyl-2-pyrroli-done, may be present in the cleaning a~ents according to the invention. A key criteri-on in the choice of these so-called cleaning boosters is ~he llash point of the cleaning -. agent obtained which should not be lowerecl to values below 60 C through the addi-tion of these cleaning boos~ers. These water-soluble solvent cleaning boosters are preferably present in the cleaning agents according to the invention in a quantity of . up to 30 % by weight and, more preferably, in a quantity of 5 to 20 % by weight, 10 based on the cleaning agent.
In another embodimen~ of the present invention, the cleanirlg agents may con-tain up to S ~ by weight and, more particularly, 1 to 2 % by weight alkali metal' phosphates, based on the cleaning agen~s, as builders. In the context of the invention, aL~ali metal phosphates are understood to be aL~cali metal orthophosphates, pyrophos-' 15 phates and ~riphosphates (also referred to as "~ripolyphosphates"). Of these, however, ~he ~riphospha~es are preferred for the purposes of the invention, potassium triphos-phate or sodium triphosphate being particularly preferred.
, The percentages by weight mentioned above for the individual components should always be understood to add to 100 ~o by weight.
In the cleaning of printed circuit boards using the cleaning agent according lo the invention, the circuit boards are immersed in the cleaning agent which is kept at a temperature between room temperature and about 100 C and, more particularly, at a temperature of 30 to 70 C. If desired, immersion may be accompanied by ultra-sonication, stirring, vibration, blowing through of air, liquid circulation. Alternatively, . ~ 25 cleaning may be carried out by spraying, immersion, brushing, flooding and combina-'! tions thereof.
,, After cleaning as described above, the circuit boards may either be removed (from the cleaning bath) and simply dried or, alterna~ively, may be cleaned once more with the same cleaner (bath) or with conventional halogen-containing solvents, such 30 as chlorofluorocarbons or chlorine-containing cleaners or cleaners of the alcohol type.
The quantities of halogen-containing cleaners used for this purpose are distinctly smaller than the quantities in which the halogen-containing cleaners are used in the S
;Z ~ 3 9 , firsl cleaning step.
.- After cleaning, the circuit boards are preferably rinsed with water. IL is of par-ticular advantage to use water when either a considerable quantity of water-soluble substanccs remains behind on the circuit boards or when fine dust-like residues are ' 5 present thereon in relatively large quantities. The water used for rinsing is not con-3 taminated with halogenated hydrocarbons, as is the case with corresponding cleaning , agents of l~he prior art, but instead conlains only biodegradable substances.
., In addition, the printed circuit boards may be dried after the treatrnent de-, scribed above, for example at elevated temperature in a drying cabinet or in a suitable 'j 10 dryer, by a stream of hot air or by washing with a readily volatile solvent, such as eth-l anol and/or isopropanol, which forms an azeotrope with water.
.¦ Accordingly, the present invention also relates to a process for cleaning elec-tronic and electrical assemblies using water-miscible cleaning agents free from halo-genated hydrocarbons of the type defined above. More particularly, the inventionrelates to a process for the removal of fluxes after soldering.
~¦ The invention is illustrated by the following Examples.
! Exarnple I
A rosin-based flux is applied to a circuit board and dried at 150 to 200 C.
The circuits are then soldered by hand using a commercially available solder.
The board thus treated was ultrasonicated for 2 minutes at 55 C in an aqueous solution containing 60 % by weight of diacetone alcohol, 12 % by weigh~ N-methyl-2-pyrrolidone, 2 ~o by weight of a nonionic surfactant (C13 alkyl polyethylene glycol ether containing S ethylene oxide units) and 1 % by weight of an anionic surfactant (C13.,7 alkylsulfonic acid, Na salt). The circuit board was then rinsed with water and dried in a drying cabinet.
After this treatment, the surface was microscopically clean and no coatings $ (white deposits) were in evidence, even on the circuits.
Example 2 Another circuit board was pretreated as described in Example 1 and then . 30 cleaned by spraying for 3 minutes by spraying at 55 C (spraying pressure 4 bar) with an aqueous solutioIl of 60 % by weight of diacetone alcohol, 12 % by weight of N-methyi-2-pyrrolidone, 2 % by weight of triethanolamine, 2 % by we;ght of a nonionic .
surfactant (C~3 alkyl polyethylene glycol ether containing 5 ethylene oxide units) and 1 ~ by weight of an anionic surfactant (C~3 ~7 aL~cylsulfonic acid, Na salt).
:, After rinsing with water and drying, the surfaces showed no residues of rosin under a microscope and even the circuits were bright and free from any deposits.5 Example 3 After reflow soldering, a circuit board provided with solder paste and equipped , wi~h SMD units was ultrasonicated for 3 minutes at 45 C in a solvent mixture con-', taining 86 % by weight of diacetone alcohol, 9 % by weight of N-methyl-2-pyrroli-done, 2 % by weight of triethanolamine, 2 % by weight of C,3 allcyl polyethylenelo glycol ether containing 5 ethylene oxide units and 1 ~o by weight of Cl3 ~7 alkylsulfon-i ic acid Na salt.
, The circuit board was then rinsed with water and dried in a drying cabinet.
~ After this ~reatment, the surface of the circuit board was completely clean and did not :! show any residues of the solder paste, even in the vicinity of the contact feet and in `~ 15 the narrow gaps beneath the SMD units.
.~13
~;
~, CLEAN~G AGENT FOR ELlE:iCTRONIC AND ELECTRICAL
ASSEMlBLIES
~, This invention relates to water-miscible cleaning agents free from halogenated hydrocarbons for cleaning electronic and electrical assemblies and to the use of the cleaning agent for the removal of flux from circuit boards afler soldering.
~iBasically, fluxes based on rosin are made up of products belonging to two dif-5 ferent chemical groups, namely relatively apolar resin-like compounds, for example rosin, and polar compounds, so-called activators. In accordance with the laws of¦chemistry, ~he chemical compounds dissolve best in solvents of the same type, i.e. in apolar or polar cleaning agents. Particular problems arise in the prior art when the carboxylic acids used as activators are present in the rosin in concentrations of up to `.
~C~
35 % and, in some cases, are insoluble in fluorinated hydrocarbons or chlorinated hy-drocarbons and only sparingly soluble in alcohols. This often leads to dissolution of the rosin and to exposure of white residues of the activators which, freed from the in-sulating effect of the rosin, can become conductive and corrosive under the effect of s atmospheric moisture.
Until very recently, fluorinated hydrocarbons were mainly used for cleaning electronic and electrical assemblies, more particularly for removing rosin-con~aining fluxes from circuit boards after soldering. In view of the problem of destruction of the ozone layer by chloronuorocarbons~ atternpts have recently been made to develop o alternative cleaning agents.
DE-A 23 16 720 describes a cleaning agent for removing rosin-containing res-idues from electrical equipment which is said largely to eliminate rosin residues and activators, if any, but which on the other hand does not affect the insulating materials and metals norrnally used in electrical circuits~ The cleaning solution contains in par-, 15 ticular a polar, higher alcohol, more particularly butyl glycol or N-butanol, a polar , lower alcohol, more particularly methanol or isopropanol, in addition to an apolar hy-drocarbon, more particularly trichlorotrifluoroethane or hexane, optionally in the prcs-ence of a nonionic wetting agent. Firs~ly, a water-immiscible cleaning agent is ob-tained through the use of the polar hydrocarbon. Secondly, the chlorofluorocarbon ¦ 20 used should be avoided on account of its ozone-destroying effect. In addition, clean-ing agents of the type in question have extremely low flash points without the chloro-fluorocarbons so that their practical application requires appropriate explosion-proof equipment.
A cleaning agent containing non-halogenated hydrocarbons, a fluorinated al-~¦ 25 cohol and, optionally, other polar organic solvents in addition to halogenated hydrocar-bons is known from EP-A-0 120 319. In view of the presence of halogenated hydro-i carbons, this cleaning agent does not satisfy present-day requirements.
EP-A-0 416 763 describes the cleaning of electronic circuit boards with prepa-rations containing terpenes or other non-halogenated solvents. Unfortunately, these 30 cleaning agents have an extremely low flash point so that appropriate anti-explosion ` measures have to be taken for their practical application.
EP-A-0 419 089 describes a cleaning agent containing dimethyl cyclooctadiene.
.
The use of diacetone alcohol for dissolving rosin and many natural and syn-~hetic resins is known from Ro~lpps Chemie-Lexikon [Title in English: Rompps Chemical Dictionary], 9th Edition, Vol. 2 (1990), page 923, keyword "diacetone alco-hol".
s Water-free solvent mixtures consisting of chlorofluorocarbons and ketones are known from Chemical Absfracts, Voh 114 (1991), page 139, Abstract 114:84372 g from JP-A90/202998. In addition lo the chlorofluorocarbons mentioned, diacetone al-cohol inter alia is used for removing fluxes.
By contrast, the problem addressed by the present invention was to provide a water-miscible preparaiion free from halogenated hydrocarbons for cleaning electronic and electrical assemblies which would be capable of safely removing the polar and apolar substances present in the fluxes, particularly those based on rosin, without the use of chlorofluorocarbons or chlorinaled hydrocarbons. In addition, the preparation would have a flash point above 60 C which could be further increased by addidonof water, depending on the particular application. A further requirement to be satis-fied was universal useability in immersion/flood systems, ultrasonic balhs and spray systems.
The cleaning agent according to the invention would also have to be com-¦ pletely removable by rinsing with watcr after cleaning.
It has now been found that water-miscible cleaning agents free from halo-genated hydrocarbons based on diacetone alcohol are capable of satisfying all the re-quirements mentioned above. In a first embodiment, therefore, the present invention relates to water-miscible preparations free from halogenated hydrocarbons and contain-ing diacetone alcohol for cleaning electronic and electrical assemblies. According to 25 the invention, the cleaning agents contain 30 to 90 ~o by weight of diacetone alcohol, based on the cleaning agent. It has also been found that, in addition to the good dissolving effect of diacetone alcohol on rosin known per se, the so-called "white residues" emanating from the activators could also be removed substantially com-pletely with diacetone alcohol.
It has also been found that diacetone alcohol need not necessarily be used in an anhydrous medium for the purposes of the invention. Instead, the diacetone alco-hol may also be used in the form of an aqueous solution. Aqueous solutions preferab-ly contain at least 30 % by weight of diacetone alcohol, based on the cleaning agent.
A diacetone alcohol content, based on ~he cleaning agent, of 30 ~o 80% by weight is - particularly preferred, a content of 50 to 70% by weight being most particularly pre-ferred.
s In addition, cleaning agents accordillg to the invention may contain other addi-tives. For example, surfactants may be added to reduce the surface tension. Surfact-ants suitable for this purpose are, for example, known nonionic and anionic surfact-ants. Examples of suitable nonionic surfactimts are adducts of ethylene oxide and/or propylene oxide with fatty alcohols, fatty amines, fatty acids or aL~cyl phenols.
Examples of suitable anionic surfactants are aL~;yl ben~enesulfonates, alkanesulfates, , aL~canesulfonates, fatty alkyl ether sulfates or ~-sulfofatty acid esters. The cleaning agent may contain up to 10 % by weight and, more particularly, from 1 to 5 % by weight of these surfactants used for the stated purpose.
, Corrosion inhibitors for inhibiting corrosion on the metallic surface of the arti-15 cle to be cleaned are known in the prior art and, as such, may also be used for ~he , purposes of the present invention. For example, copper corrosion inhibitors, such as benzotriazole and/or tolyl triazole, may be used. A suitable concentration range for these corrosion inhibitor additives is from 0.01 to 5 % by weight and, more particular-.1 ly, from 0.01 to 1 % by weight.
¦ 20 In another embodiment, preferred cleaning agents according to the invention contain water-soluble organic nitrogen bases, more particularly triethanolamine, for the accelerated separation of acidic constituents from the flux resin and, more particularly, the activators used. The nitrogen bases are preferably used in a quantity of 1 to 10 % by weight and, more preferably, in a quantity of 2 to 5% by weight, based on the 25 cleaning agent.
`¦ The cleaning agents according to the invention may also contain water-soluble organic solvents containing one or more polar groups, more particularly those contain-~, ing an alcohol group and having a boiling point below 300 C, i.e. linear alcohols, ~1 such as butanol, hexyl alcohol, decanol, etc. and branched isomers thereof, those con-30 taining an alicyclic alcohol group, for example embodied in cyclohexanol, ~hose con-i taining several alcohol groups, more particularly glycols, fGr example embodied in he:cylene glycol, those containing rn ether group, glycol etùers, for exnmple embodied :~ - ,. , k ~3 .3~ a in ethylene glycol monobu~yl e~her, elhylene glycol dibutyl e~her, etc., and those con-taining an ester group, such as glycolic acid ester or glycol ester, for example ethyl glycol acetate. In addition, lactones or lactams, more par~icularly N-methyl-2-pyrroli-done, may be present in the cleaning a~ents according to the invention. A key criteri-on in the choice of these so-called cleaning boosters is ~he llash point of the cleaning -. agent obtained which should not be lowerecl to values below 60 C through the addi-tion of these cleaning boos~ers. These water-soluble solvent cleaning boosters are preferably present in the cleaning agents according to the invention in a quantity of . up to 30 % by weight and, more preferably, in a quantity of 5 to 20 % by weight, 10 based on the cleaning agent.
In another embodimen~ of the present invention, the cleanirlg agents may con-tain up to S ~ by weight and, more particularly, 1 to 2 % by weight alkali metal' phosphates, based on the cleaning agen~s, as builders. In the context of the invention, aL~ali metal phosphates are understood to be aL~cali metal orthophosphates, pyrophos-' 15 phates and ~riphosphates (also referred to as "~ripolyphosphates"). Of these, however, ~he ~riphospha~es are preferred for the purposes of the invention, potassium triphos-phate or sodium triphosphate being particularly preferred.
, The percentages by weight mentioned above for the individual components should always be understood to add to 100 ~o by weight.
In the cleaning of printed circuit boards using the cleaning agent according lo the invention, the circuit boards are immersed in the cleaning agent which is kept at a temperature between room temperature and about 100 C and, more particularly, at a temperature of 30 to 70 C. If desired, immersion may be accompanied by ultra-sonication, stirring, vibration, blowing through of air, liquid circulation. Alternatively, . ~ 25 cleaning may be carried out by spraying, immersion, brushing, flooding and combina-'! tions thereof.
,, After cleaning as described above, the circuit boards may either be removed (from the cleaning bath) and simply dried or, alterna~ively, may be cleaned once more with the same cleaner (bath) or with conventional halogen-containing solvents, such 30 as chlorofluorocarbons or chlorine-containing cleaners or cleaners of the alcohol type.
The quantities of halogen-containing cleaners used for this purpose are distinctly smaller than the quantities in which the halogen-containing cleaners are used in the S
;Z ~ 3 9 , firsl cleaning step.
.- After cleaning, the circuit boards are preferably rinsed with water. IL is of par-ticular advantage to use water when either a considerable quantity of water-soluble substanccs remains behind on the circuit boards or when fine dust-like residues are ' 5 present thereon in relatively large quantities. The water used for rinsing is not con-3 taminated with halogenated hydrocarbons, as is the case with corresponding cleaning , agents of l~he prior art, but instead conlains only biodegradable substances.
., In addition, the printed circuit boards may be dried after the treatrnent de-, scribed above, for example at elevated temperature in a drying cabinet or in a suitable 'j 10 dryer, by a stream of hot air or by washing with a readily volatile solvent, such as eth-l anol and/or isopropanol, which forms an azeotrope with water.
.¦ Accordingly, the present invention also relates to a process for cleaning elec-tronic and electrical assemblies using water-miscible cleaning agents free from halo-genated hydrocarbons of the type defined above. More particularly, the inventionrelates to a process for the removal of fluxes after soldering.
~¦ The invention is illustrated by the following Examples.
! Exarnple I
A rosin-based flux is applied to a circuit board and dried at 150 to 200 C.
The circuits are then soldered by hand using a commercially available solder.
The board thus treated was ultrasonicated for 2 minutes at 55 C in an aqueous solution containing 60 % by weight of diacetone alcohol, 12 % by weigh~ N-methyl-2-pyrrolidone, 2 ~o by weight of a nonionic surfactant (C13 alkyl polyethylene glycol ether containing S ethylene oxide units) and 1 % by weight of an anionic surfactant (C13.,7 alkylsulfonic acid, Na salt). The circuit board was then rinsed with water and dried in a drying cabinet.
After this treatment, the surface was microscopically clean and no coatings $ (white deposits) were in evidence, even on the circuits.
Example 2 Another circuit board was pretreated as described in Example 1 and then . 30 cleaned by spraying for 3 minutes by spraying at 55 C (spraying pressure 4 bar) with an aqueous solutioIl of 60 % by weight of diacetone alcohol, 12 % by weight of N-methyi-2-pyrrolidone, 2 % by weight of triethanolamine, 2 % by we;ght of a nonionic .
surfactant (C~3 alkyl polyethylene glycol ether containing 5 ethylene oxide units) and 1 ~ by weight of an anionic surfactant (C~3 ~7 aL~cylsulfonic acid, Na salt).
:, After rinsing with water and drying, the surfaces showed no residues of rosin under a microscope and even the circuits were bright and free from any deposits.5 Example 3 After reflow soldering, a circuit board provided with solder paste and equipped , wi~h SMD units was ultrasonicated for 3 minutes at 45 C in a solvent mixture con-', taining 86 % by weight of diacetone alcohol, 9 % by weight of N-methyl-2-pyrroli-done, 2 % by weight of triethanolamine, 2 % by weight of C,3 allcyl polyethylenelo glycol ether containing 5 ethylene oxide units and 1 ~o by weight of Cl3 ~7 alkylsulfon-i ic acid Na salt.
, The circuit board was then rinsed with water and dried in a drying cabinet.
~ After this ~reatment, the surface of the circuit board was completely clean and did not :! show any residues of the solder paste, even in the vicinity of the contact feet and in `~ 15 the narrow gaps beneath the SMD units.
.~13
Claims (15)
1. The use of diacetone alcohol for cleaning electronic and electrical assemblies in water-miscible cleaning agents free from halogenated hydrocarbons, characterized in that the cleaning agents contain diacetone alcohol in quantities of 30 to 90 % by weight, based on the cleaning agent.
2. The use claimed in claim 1, characterized in that the cleaning agents containdiacetone alcohol in quantities of 30 to 80 % by weight, based on the cleaning agent, in an aqueous solution.
3. The use claimed in claim 2, characterized in that the cleaning agents containdiacetone alcohol in quantities of 50 to 70 % by weight in an aqueous solution.
4. The use claimed in one or more of claims 1 to 3, characterized in that the cleaning agents contain anionic and/or nonionic surfactants in a quantity of up to 10 % by weight, based on the cleaning agent.
5. The use claimed in claim 4, characterized in that the cleaning agents containanionic and/or nonionic surfactants in quantities of 1 to 5 % by weight.
6. The use claimed in one or more of claims 1 to 5, characterized in that the cleaning agents contain water-soluble organic nitrogen bases in quantities of 1 to 10 % by weight, based on the cleaning agent.
7. The use claimed in claim 6, characterized in that the cleaning agents containtriethanolamine in quantities of 2 to 5 % by weight.
8. The use claimed in or more of claims 1 to 7, characterized in that the cleaning agents contain water-soluble solvents selected from alcohols, glycols, glycol ethers, glycol esters, glycolic acid esters, lactones and lactams in a quantity of up to 30 % by weight, based on the cleaning agent.
9. The use claimed in claim 8, characterized in that the cleaning agents containN-methyl-2- pyrrolidone in quantities of 5 to 20 % by weight.
10. The use claimed in one or more of claims 1 to 9, characterized in that the cleaning agents contain inorganic builders from the group of alkali metal phosphates in a quantity of at most 5 % by weight, based on the cleaning agent.
11. The use claimed in claim 10, characterized in that the cleaning agents contain inorganic builders in quantities of 1 to 2 % by weight.
12. The use claimed in one or more of claims 1 to 11, characterized in that the cleaning agents contain corrosion inhibitors in quantitites of 0.01 to 5 % by weight, based on the cleaning agent.
13. The use claimed in claim 12, characterized in that the cleaning agents contain corrosion inhibitors in quantities of 0.01 to 1 % by weight.
14. The use claimed in one or more of claims 1 to 13, characterized in that the cleaning agents are used to remove fluxes after soldering.
15. The use claimed in claim 14, characterized in that the cleaning process is assisted by ultrasonication, stirring, vibration, blowing through of air, liquid circulation of the cleaning agent or by spraying, immersion, brushing, flooding or combinations thereof.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4124246A DE4124246A1 (en) | 1991-07-22 | 1991-07-22 | CLEANING AGENT FOR ELECTRONIC AND ELECTRICAL ASSEMBLIES |
| DEP4124246.7 | 1991-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2114110A1 true CA2114110A1 (en) | 1993-02-04 |
Family
ID=6436731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002114110A Abandoned CA2114110A1 (en) | 1991-07-22 | 1992-07-13 | Cleaning agent for electronic and electrical assemblies |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5456760A (en) |
| EP (1) | EP0595881B1 (en) |
| JP (1) | JP3086254B2 (en) |
| KR (1) | KR100204548B1 (en) |
| AT (1) | ATE151105T1 (en) |
| CA (1) | CA2114110A1 (en) |
| DE (2) | DE4124246A1 (en) |
| DK (1) | DK0595881T3 (en) |
| WO (1) | WO1993002173A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5674827A (en) * | 1994-01-11 | 1997-10-07 | Mitsubishi Chemical Corporation | Degreasing cleaner and method for cleaning oil-deposited material |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9321067D0 (en) * | 1993-10-13 | 1993-12-01 | Croftshaw Solvents Limited | Cleaning method and apparatus |
| US5932021A (en) * | 1996-06-26 | 1999-08-03 | Cala; Francis R. | Aqueous cleaning composition for removing flux and method of use |
| KR100207982B1 (en) * | 1996-07-19 | 1999-07-15 | 윤종용 | Cleaner & cleaning method of metalmask for improving continuance of printing in surface mounting process |
| US5958144A (en) * | 1997-05-20 | 1999-09-28 | Church & Dwight | Flux-removing aqueous cleaning composition and method of use |
| EP1083219B1 (en) * | 1998-05-26 | 2006-08-30 | Tokyo Electron Limited | Cleaning fluid and cleaning method for component of semiconductor-treating apparatus |
| US6319884B2 (en) * | 1998-06-16 | 2001-11-20 | International Business Machines Corporation | Method for removal of cured polyimide and other polymers |
| TWI243204B (en) * | 2000-02-04 | 2005-11-11 | Sumitomo Chemical Co | Electronic parts cleaning solution |
| DE10005599A1 (en) * | 2000-02-09 | 2001-08-16 | Bayer Ag | cleaning supplies |
| DE10221335B4 (en) * | 2002-05-10 | 2006-05-24 | Braun Gmbh | Use of a cleaning liquid for electric razors |
| US6716290B1 (en) | 2002-12-04 | 2004-04-06 | The United States Of America As Represented By The Secretary Of The Navy | Method for removing soldering flux residue from a substrate |
| JP2006016438A (en) * | 2004-06-30 | 2006-01-19 | Dongwoo Fine-Chem Co Ltd | Electronic part-washing liquid |
| AU2006235230B8 (en) * | 2005-04-07 | 2010-08-26 | Chata Biosystems, Inc. | Flow path conditioner system |
| DE102005041533B3 (en) * | 2005-08-31 | 2007-02-08 | Atotech Deutschland Gmbh | Aqueous cleaning solution for workpiece with solder stopping mask and final surface layer, contains ethanolamine, alcohol and guanidine compounds, effectively removing ionic contaminants |
| US8119688B2 (en) * | 2007-09-19 | 2012-02-21 | Xy, Llc | Differential evaporation potentiated disinfectant system |
| US20100249166A1 (en) * | 2007-09-19 | 2010-09-30 | Xy, Inc. | Differential evaporation potentiated disinfectant system |
| KR20230036466A (en) | 2021-09-07 | 2023-03-14 | 이호열 | Semi-aqueous cleaning composition for pcb |
| CN114149866A (en) * | 2021-12-08 | 2022-03-08 | 安美科技股份有限公司 | Hydrocarbon paraffin removal agent and preparation process thereof |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2545149C3 (en) * | 1975-10-08 | 1981-06-19 | Siemens AG, 1000 Berlin und 8000 München | Solvent for the production of adhesive films containing epoxy resin for dissolving a hardener which is present in dicyandiamide |
| DE2843764C3 (en) * | 1978-10-06 | 1982-01-14 | Georg Scheidel Jr. Gmbh, 8606 Hirschaid | cleaning supplies |
| US4276186A (en) * | 1979-06-26 | 1981-06-30 | International Business Machines Corporation | Cleaning composition and use thereof |
| FR2486535A1 (en) * | 1980-07-09 | 1982-01-15 | Gottschalk Meinhardt | Compsns. for un-gluing fabric coverings - contg. chlorinated solvent, alcohol(s) and surfactant |
| DE3106181A1 (en) * | 1981-02-19 | 1982-09-02 | Videocolor GmbH, 7900 Ulm | Process for removing films and film residues from face plates for cathode ray tubes |
| JPS59157196A (en) * | 1983-02-28 | 1984-09-06 | ダイキン工業株式会社 | Solvent composition |
| US5302313A (en) * | 1988-06-22 | 1994-04-12 | Asahi Glass Company Ltd. | Halogenated hydrocarbon solvents |
| US5271775A (en) * | 1988-06-22 | 1993-12-21 | Asahi Glass Company Ltd. | Methods for treating substrates by applying a halogenated hydrocarbon thereto |
| CZ279988B6 (en) * | 1988-06-22 | 1995-09-13 | Asahi Glass Company Ltd. | Cleansing agent and use thereof |
| US4968447A (en) * | 1988-08-11 | 1990-11-06 | Gage Products Company | Cleaning composition and method |
| US4983224A (en) * | 1988-10-28 | 1991-01-08 | Rd Chemical Company | Cleaning compositions and methods for removing soldering flux |
| GB8918504D0 (en) * | 1989-08-14 | 1989-09-20 | Bush Boake Allen Ltd | Methods and compositions for cleaning articles |
| CA2024589A1 (en) * | 1989-09-05 | 1991-03-06 | Masaru Sugita | Cleaning compositions and applications thereof |
| US5128057A (en) * | 1989-09-29 | 1992-07-07 | Kyzen Corporation | Furfuryl alcohol mixtures for use as cleaning agents |
| DE4031563A1 (en) * | 1990-10-05 | 1992-04-09 | Zeiss Carl Fa | Cleaning optical components using non-halogenated solvents - by passing through successive baths contg. organic solvent, water contg. surfactant, and organic solvent for drying |
| US5183514A (en) * | 1991-04-01 | 1993-02-02 | Texaco Chemical Company | Process for dissolving or removing rigid polyurethane foam by contacting with 1,2-dimethyl imidazole |
| US5238504A (en) * | 1991-09-27 | 1993-08-24 | Advanced Research Technologies | Use of terpene hydrocarbons and ketone blends for electrical contact cleaning |
-
1991
- 1991-07-22 DE DE4124246A patent/DE4124246A1/en not_active Withdrawn
-
1992
- 1992-07-13 US US08/182,012 patent/US5456760A/en not_active Expired - Fee Related
- 1992-07-13 EP EP92915419A patent/EP0595881B1/en not_active Expired - Lifetime
- 1992-07-13 CA CA002114110A patent/CA2114110A1/en not_active Abandoned
- 1992-07-13 DE DE59208300T patent/DE59208300D1/en not_active Expired - Fee Related
- 1992-07-13 WO PCT/EP1992/001588 patent/WO1993002173A1/en active IP Right Grant
- 1992-07-13 AT AT92915419T patent/ATE151105T1/en not_active IP Right Cessation
- 1992-07-13 KR KR1019940700176A patent/KR100204548B1/en not_active IP Right Cessation
- 1992-07-13 DK DK92915419.3T patent/DK0595881T3/en active
- 1992-07-13 JP JP05502570A patent/JP3086254B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5674827A (en) * | 1994-01-11 | 1997-10-07 | Mitsubishi Chemical Corporation | Degreasing cleaner and method for cleaning oil-deposited material |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100204548B1 (en) | 1999-06-15 |
| EP0595881A1 (en) | 1994-05-11 |
| ATE151105T1 (en) | 1997-04-15 |
| US5456760A (en) | 1995-10-10 |
| WO1993002173A1 (en) | 1993-02-04 |
| DK0595881T3 (en) | 1997-08-04 |
| DE4124246A1 (en) | 1993-01-28 |
| JPH06509134A (en) | 1994-10-13 |
| EP0595881B1 (en) | 1997-04-02 |
| JP3086254B2 (en) | 2000-09-11 |
| DE59208300D1 (en) | 1997-05-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Discontinued |