CA2102138A1 - Structural adhesive composition having high temperature resistance - Google Patents

Structural adhesive composition having high temperature resistance

Info

Publication number
CA2102138A1
CA2102138A1 CA002102138A CA2102138A CA2102138A1 CA 2102138 A1 CA2102138 A1 CA 2102138A1 CA 002102138 A CA002102138 A CA 002102138A CA 2102138 A CA2102138 A CA 2102138A CA 2102138 A1 CA2102138 A1 CA 2102138A1
Authority
CA
Canada
Prior art keywords
adhesive composition
high temperature
structural adhesive
temperature resistance
hydroxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002102138A
Other languages
French (fr)
Other versions
CA2102138C (en
Inventor
Kirk J. Abbey
Stephen E. Howe
Beth C. Munoz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lord Corp
Original Assignee
Kirk J. Abbey
Stephen E. Howe
Beth C. Munoz
Lord Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kirk J. Abbey, Stephen E. Howe, Beth C. Munoz, Lord Corporation filed Critical Kirk J. Abbey
Publication of CA2102138A1 publication Critical patent/CA2102138A1/en
Application granted granted Critical
Publication of CA2102138C publication Critical patent/CA2102138C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols

Abstract

A structural adhesive composition containing an epoxy compound, an amine hardener and a hydroxy-substituted aromatic compound having a pKa ranging from about 5 to 9.7 and a boiling point greater than about 210°C. The utilization of a hydroxy-substituted aromatic compound having a pKa and a boiling point within the stated ranges provides for an adhesive composition which develops significant green strength, undergoes minimal sinkage during the bonding and curing process, and is capable of withstanding high temperature a conditions.
CA002102138A 1992-11-02 1993-11-01 Structural adhesive composition having high temperature resistance Expired - Lifetime CA2102138C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/970,322 1992-11-02
US07/970,322 US5385990A (en) 1992-11-02 1992-11-02 Structural adhesive composition having high temperature resistance

Publications (2)

Publication Number Publication Date
CA2102138A1 true CA2102138A1 (en) 1994-05-03
CA2102138C CA2102138C (en) 2003-07-08

Family

ID=25516760

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002102138A Expired - Lifetime CA2102138C (en) 1992-11-02 1993-11-01 Structural adhesive composition having high temperature resistance

Country Status (5)

Country Link
US (1) US5385990A (en)
EP (1) EP0596622A3 (en)
JP (1) JP3625848B2 (en)
CN (1) CN1067096C (en)
CA (1) CA2102138C (en)

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US6749938B2 (en) 2001-11-13 2004-06-15 Lord Corporation Low read-through epoxy-bonded SMC
US6645341B1 (en) * 2002-08-06 2003-11-11 National Starch And Chemical Investment Holding Corporation Two part epoxide adhesive with improved strength
US7094843B2 (en) * 2002-08-19 2006-08-22 3M Innovative Properties Company Epoxy compositions having improved shelf life and articles containing the same
AU2002951868A0 (en) * 2002-10-04 2002-10-24 Prana Biotechnology Limited Compound i
US7071263B2 (en) * 2003-05-19 2006-07-04 3M Innovative Properties Company Epoxy adhesives and bonded substrates
US7244793B2 (en) * 2003-09-26 2007-07-17 Illinois Tool Works Inc. Adhesive compositions
US7745006B2 (en) * 2006-12-15 2010-06-29 Ashland Licensing And Intellectual Property, Llc Low odor, fast cure, toughened epoxy adhesive
WO2008140906A1 (en) * 2007-05-09 2008-11-20 Dow Global Technologies Inc. Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof
WO2009018193A1 (en) * 2007-08-02 2009-02-05 Dow Global Technologies Inc. Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
BRPI0813210A2 (en) * 2007-08-02 2014-12-23 Dow Global Technologies Inc "PROCESS FOR SHOCKING VIBRATIONS IN AN ARTICLE, COMPOSING HAVING IMPROVED DAMPING PROPERTIES AT HIGH TEMPERATURES AND THERMOSTABLE COMPOSITION HAVING IMPROVED DAMPING PROPERTIES"
JP2011505461A (en) * 2007-11-29 2011-02-24 ダウ グローバル テクノロジーズ インコーポレイティド Dimethylformamide-free formulation using dicyandiamide as a curing agent for thermosetting epoxy resins
US8742018B2 (en) * 2008-01-08 2014-06-03 Dow Global Technologies Llc High Tg epoxy systems for composite applications
US8362120B2 (en) 2009-02-02 2013-01-29 Lord Corporation Structural adhesives containing maleimide terminated polyimides
US20110319564A1 (en) 2010-06-24 2011-12-29 Larry Steven Corley Epoxy systems for composites
US8586653B2 (en) * 2011-09-19 2013-11-19 Basf Se Curing of epoxy resin compositions comprising cyclic carbonates using mixtures of amino hardeners
US8877837B2 (en) * 2011-09-21 2014-11-04 Basf Se Curing of epoxy resin compositions comprising cyclic carbonates using mixtures of amino hardeners and catalysts
DE102013012206A1 (en) 2013-07-16 2015-01-22 Lohmann Gmbh & Co. Kg Process for the production of molded parts by means of adhesive strips
JP2016033208A (en) * 2014-07-28 2016-03-10 日東電工株式会社 Primer composition and composite article
US10711128B2 (en) 2015-09-30 2020-07-14 Sekisui Chemical Co., Ltd. Modified polyvinyl acetal resin composition
CN105331320B (en) * 2015-12-01 2018-01-23 苏州圣杰特种树脂有限公司 A kind of epoxyn of low viscosity high activity
KR102450608B1 (en) 2016-09-30 2022-10-04 세키스이가가쿠 고교가부시키가이샤 Epoxy Adhesive Composition
JP6983046B2 (en) * 2017-01-25 2021-12-17 日東シンコー株式会社 How to use reaction-curing adhesive, adhesive kit, and reaction-curing adhesive
KR102627557B1 (en) 2017-08-15 2024-01-24 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 Two-component room temperature curing epoxy adhesive
WO2019082828A1 (en) * 2017-10-27 2019-05-02 積水ポリマテック株式会社 Sealing material composition, sealing material, and electronic substrate
CN111533564A (en) * 2017-11-27 2020-08-14 湖南辰砾新材料有限公司 High-strength anti-cracking ceramic
JP7402048B2 (en) 2018-09-26 2023-12-20 積水化学工業株式会社 epoxy resin composition
TW202334355A (en) * 2021-11-12 2023-09-01 美商阿散德性能材料營運公司 Bhm in adhesive compositions

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Also Published As

Publication number Publication date
US5385990A (en) 1995-01-31
EP0596622A2 (en) 1994-05-11
CA2102138C (en) 2003-07-08
JPH06212138A (en) 1994-08-02
JP3625848B2 (en) 2005-03-02
CN1067096C (en) 2001-06-13
CN1087367A (en) 1994-06-01
EP0596622A3 (en) 1995-05-10

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Legal Events

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EEER Examination request
MKEX Expiry

Effective date: 20131101