CA2072247A1 - Optical integrated circuitry - Google Patents

Optical integrated circuitry

Info

Publication number
CA2072247A1
CA2072247A1 CA2072247A CA2072247A CA2072247A1 CA 2072247 A1 CA2072247 A1 CA 2072247A1 CA 2072247 A CA2072247 A CA 2072247A CA 2072247 A CA2072247 A CA 2072247A CA 2072247 A1 CA2072247 A1 CA 2072247A1
Authority
CA
Canada
Prior art keywords
integrated circuitry
fabrication
guides
optical integrated
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2072247A
Other languages
French (fr)
Other versions
CA2072247C (en
Inventor
Anthony Fredric John Levi
Samuel Leverte Mccall
Richart Elliott Slusher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of CA2072247A1 publication Critical patent/CA2072247A1/en
Application granted granted Critical
Publication of CA2072247C publication Critical patent/CA2072247C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/262—Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1042—Optical microcavities, e.g. cavity dimensions comparable to the wavelength
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/125—Distributed Bragg reflector [DBR] lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Abstract

Optical integrated circuitry, performing various of the functions associated with electronic integrated circuitry, is described. Fabrication, importantly to achieve high circuit chip density - typically in the range of 106 as including both devices and interconnecting guides - is dependent upon device/spacing dimension miniaturization resulting from fabrication in very thin layers. Typical layer thickness as retained in fabricated devices and guides, of a maximum of the order of a 1/2 wavelength for relevant photon flux, results in limitation in cross-talk to permit device design rules of one or a few wavelengths.
CA002072247A 1991-10-16 1992-06-24 Optical integrated circuitry Expired - Fee Related CA2072247C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/777,888 US5148504A (en) 1991-10-16 1991-10-16 Optical integrated circuit designed to operate by use of photons
US777,888 1991-10-16

Publications (2)

Publication Number Publication Date
CA2072247A1 true CA2072247A1 (en) 1993-04-17
CA2072247C CA2072247C (en) 1997-03-25

Family

ID=25111610

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002072247A Expired - Fee Related CA2072247C (en) 1991-10-16 1992-06-24 Optical integrated circuitry

Country Status (7)

Country Link
US (1) US5148504A (en)
EP (1) EP0541247A1 (en)
JP (1) JPH05218386A (en)
CA (1) CA2072247C (en)
NO (1) NO923989L (en)
PT (1) PT100954A (en)
TW (1) TW246748B (en)

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US5497140A (en) * 1992-08-12 1996-03-05 Micron Technology, Inc. Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
US5779839A (en) * 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US6045652A (en) * 1992-06-17 2000-04-04 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
DE4345610B4 (en) * 1992-06-17 2013-01-03 Micron Technology Inc. Method for producing a radio-frequency identification device (HFID)
USRE42773E1 (en) 1992-06-17 2011-10-04 Round Rock Research, Llc Method of manufacturing an enclosed transceiver
US5776278A (en) 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
DE4312881C1 (en) * 1993-04-20 1994-03-17 Fraunhofer Ges Forschung Semi finished substrate for opto electrical hybrid circuit - has bonded optically transparent substrate and ceramic substrate segments
US5751466A (en) * 1996-01-11 1998-05-12 University Of Alabama At Huntsville Photonic bandgap apparatus and method for delaying photonic signals
US5988510A (en) * 1997-02-13 1999-11-23 Micron Communications, Inc. Tamper resistant smart card and method of protecting data in a smart card
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
US6262830B1 (en) 1997-09-16 2001-07-17 Michael Scalora Transparent metallo-dielectric photonic band gap structure
US5907427A (en) 1997-10-24 1999-05-25 Time Domain Corporation Photonic band gap device and method using a periodicity defect region to increase photonic signal delay
US6028693A (en) * 1998-01-14 2000-02-22 University Of Alabama In Huntsville Microresonator and associated method for producing and controlling photonic signals with a photonic bandgap delay apparatus
US6744552B2 (en) * 1998-04-02 2004-06-01 Michael Scalora Photonic signal frequency up and down-conversion using a photonic band gap structure
US6304366B1 (en) 1998-04-02 2001-10-16 Michael Scalora Photonic signal frequency conversion using a photonic band gap structure
US6396617B1 (en) 1999-05-17 2002-05-28 Michael Scalora Photonic band gap device and method using a periodicity defect region doped with a gain medium to increase photonic signal delay
US6273339B1 (en) 1999-08-30 2001-08-14 Micron Technology, Inc. Tamper resistant smart card and method of protecting data in a smart card
AU7734900A (en) 1999-09-30 2001-04-30 Mark J. Bloemer Efficient non-linear phase shifting using a photonic band gap structure
US6339493B1 (en) 1999-12-23 2002-01-15 Michael Scalora Apparatus and method for controlling optics propagation based on a transparent metal stack
US6414780B1 (en) 1999-12-23 2002-07-02 D'aguanno Giuseppe Photonic signal reflectivity and transmissivity control using a photonic band gap structure
US6693033B2 (en) * 2000-02-10 2004-02-17 Motorola, Inc. Method of removing an amorphous oxide from a monocrystalline surface
WO2001061387A2 (en) * 2000-02-17 2001-08-23 Nanovation Technologies, Inc. Strongly confined polarization-independent single-mode optical ridge waveguide
JP4638005B2 (en) * 2000-08-28 2011-02-23 ルネサスエレクトロニクス株式会社 Semiconductor device
US20020096683A1 (en) * 2001-01-19 2002-07-25 Motorola, Inc. Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
JP2003015175A (en) 2001-04-27 2003-01-15 Mitsubishi Electric Corp Solid-state light source apparatus
US6709989B2 (en) 2001-06-21 2004-03-23 Motorola, Inc. Method for fabricating a semiconductor structure including a metal oxide interface with silicon
US6693298B2 (en) 2001-07-20 2004-02-17 Motorola, Inc. Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
US7019332B2 (en) * 2001-07-20 2006-03-28 Freescale Semiconductor, Inc. Fabrication of a wavelength locker within a semiconductor structure
US6639249B2 (en) * 2001-08-06 2003-10-28 Motorola, Inc. Structure and method for fabrication for a solid-state lighting device
US20030026310A1 (en) * 2001-08-06 2003-02-06 Motorola, Inc. Structure and method for fabrication for a lighting device
WO2003017372A1 (en) * 2001-08-14 2003-02-27 Infineon Technologies Ag Photodiode arrangement with two photodiodes
US6673667B2 (en) * 2001-08-15 2004-01-06 Motorola, Inc. Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
US7169619B2 (en) * 2002-11-19 2007-01-30 Freescale Semiconductor, Inc. Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process
US6806202B2 (en) 2002-12-03 2004-10-19 Motorola, Inc. Method of removing silicon oxide from a surface of a substrate
US6963090B2 (en) 2003-01-09 2005-11-08 Freescale Semiconductor, Inc. Enhancement mode metal-oxide-semiconductor field effect transistor
US7286770B2 (en) * 2003-07-18 2007-10-23 International Business Machines Corporation Fiber optic transmission lines on an SOC
US7570849B2 (en) * 2005-06-21 2009-08-04 Hewlett-Packard Development Company, L.P. Integrated circuit device having optically coupled layers
US7352602B2 (en) * 2005-12-30 2008-04-01 Micron Technology, Inc. Configurable inputs and outputs for memory stacking system and method
EP2111529B1 (en) 2006-10-23 2015-08-26 J.A. Woollam Co. Inc. Directing a Beam of Electromagnetic Radiation into the end of an Optical Fibre Using Output from a Multiple Element Detector
US7469085B1 (en) * 2007-07-12 2008-12-23 International Business Machines Corporation Method and apparatus for minimizing propagation losses in wavelength selective filters
US20090317033A1 (en) * 2008-06-20 2009-12-24 Industrial Technology Research Institute Integrated circuit and photonic board thereof
KR20100067487A (en) * 2008-12-11 2010-06-21 삼성전자주식회사 Test interface device, test system and optical interface memory device

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FR2152464B1 (en) * 1971-09-16 1974-05-31 Thomson Csf
FR2613826B1 (en) * 1987-04-07 1990-10-26 Commissariat Energie Atomique MOTION SENSOR IN INTEGRATED OPTICS
US4762382A (en) * 1987-06-29 1988-08-09 Honeywell Inc. Optical interconnect circuit for GaAs optoelectronics and Si VLSI/VHSIC
DE3815293A1 (en) * 1988-05-05 1989-11-16 Licentia Gmbh Three-dimensionally arranged waveguide

Also Published As

Publication number Publication date
NO923989D0 (en) 1992-10-14
CA2072247C (en) 1997-03-25
JPH05218386A (en) 1993-08-27
PT100954A (en) 1994-05-31
TW246748B (en) 1995-05-01
NO923989L (en) 1993-04-19
EP0541247A1 (en) 1993-05-12
US5148504A (en) 1992-09-15

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