CA1285427C

CA1285427C - Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture

Info

Publication number: CA1285427C
Application number: CA000554061A
Authority: CA
Inventors: David E. Hackleman; James G. Bearss; Eldurkar V. Bhaskar
Original assignee: Hewlett Packard Co
Current assignee: HP Inc
Priority date: 1986-12-12
Filing date: 1987-12-10
Publication date: 1991-07-02
Anticipated expiration: 2008-07-02
Also published as: HK151795A; EP0271257A2; DE3788110T2; JP2820406B2; DE3788110D1; EP0271257A3; JPS63158268A; EP0271257B1; US4695853A

Abstract

Abstract The specification describes thermal ink jet (TIJ) processes and device structures produced thereby wherein either heater resistors or heater resistor-diode combinations are constructed vertically upward from a common supporting substrate.
A lower or first metal level conductor pattern provides one part of an X-Y matrix multiplex connection to the resistor/diode components, and a second, upper metal level conductor pattern forms the second part of the X-Y matrix multiplex connection. In this manner, the multiplex drive circuitry for the TIJ printhead resistors/diodes may be fabricated (integrated) directly on the thin film resistor (TFR) printhead substrate. Additionally, the second level metal conductors which overlie the resistive heater and diode elements also serve as a barrier shield to ink corrosion and cavitation wear.

Description

12~ 7 THIN FILM VERTICAL RESISTOR DEVICES FOR A THERMAL
INX JET PRINTHEAD AND METHODS OF MANUFACTURE

Technical Fiçld The present invention relates generally to thermal ink jet (TIJ) printing and more particularly to new and improved thermal ink jet printhead device structures employing vertical resistors and a metal ink barrier having improved resistance to ink corrosion and cavitation wear.

Background Art In the field of thermal ink jet printing, it has become a common practice to provide heater resistors on a common sub-strate and align these heater resistors with individual ink reservoirs and corresponding ink ejection orifices in an outer nozzle plate. These heater resistors are physically defined and electrically driven by conductive traces which are photolitho-graphically formed on the surface of a suitable resistor layer material, such as tantalum-aluminum. These heater resistors have been traditionally isolated from the overlying ink reservoirs by highly inert dielectric materials such as silicon carbide and silicon nitride. This type of thermal ink jet printhead is des-cribod,, for example, in the Hewlett Pack~d Journal, Vol. 36, No.
5, May 1985.
ThuQ, th- current flowing in this type of printhead flows laterally in the conductive traco material and then down and again laterally through the resistive tantalum aluminum layer where no trace material appears and then back up and again laterally through the conductive trace material.
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1.2854Z7 Disclosure of Invention In significant contrast to the above lateral resistor and inert dielectric barrier construction of the prior art, the present invention provides new and improved printhead construc-tion featuring the use of vertical heater resistors in combina-tion with a metal, rat~er than a dielectric, barrier layer. These vertical heater resistors provide conductive paths from electri-cally conductive leads on an underlying substrate and through openings in an insulating pattern and then to either a single conductive bus member or to an upper set of leads for the resis-tors. The upper conductor also serves as the ink barrier layer between the vertical heater resistors and the ink reservoirs.
When used as a bus bar, this metal barrier layer may be grounded and thus made nonreactive to the ink which it shields against, and thus offers an improved resistance to ink corrosion and cavitation wear during an ink jet printing operation.
In an alternative embodiment of our invention, the vertical resistors may be appropriately doped to form PN junc-tions (diodes) in the resistive material and may then be selec-tively connected to certain onos of the electrical leads on both the underside and the topside of these PN junctions so as to form an X-Y matrix type of diode multiplexing circuit which may be integrated on the surfacQ of a singlQ printhead substrate member.
Thus, the present invention not only improves the barrier-to-corrosion/cavitation wear, but it simultaneously pro-vides a novel vertical rQsistor/diode integrated driving multi-plex circuit which may be fabricated on the surface of a single substrate.

~.2854'~:7 Various aspects of the invention are as follows:
A thin film resistor device suitable for use in a thermal ink jet printhead comprising:
a. a substrate member, b. a conductive pattern disposed atop an upper surface of said substrate member, c. an insulating layer disposed on said conductive pattern and having openings therein aligned with preselected areas on said conductive pattern, d. a resistive layer of a selected resistivity formed on said preselected areas on said conductive pattern, and e. a metal barrier layer disposed atop said resistive layer and thereby providing an electrical path for current flowing through said resistive layer and also a shield against ink corrosion and cavitation wear.
In a thermal ink jet heater device wherein an insulating pattern is formed on a substrate, the improvement comprising a heater resistor disposed in an opening in said insulating pattern, and conductive leads disposed on the top and bottom surfaces of said heater resistor to provide current vertically through said heater re6istor during an ink jet printing operation.
A process for manufacturing a thermal ink jet thin film resistor device which includes the steps of:
a. forming a conduGtive lead pattern on one surface of a selected substrate, b. forming an insulating pattern having openings therein aligned with certain areas on said conductive lead pattern, c. forming a resistive layer in contact with said conductive lead pattern, and d. depositing a top metal barrier layer on the surface of said resistive layer which may then be usçd as an electrical connection for said resistive layer as well as an ink barrier , , .

~.285427 layer between ink reservoirs and said resistive layer to shield against ink corrosion and cavitation wear.
An integrated X-Y matrix diode multiplex circuit and resistive heater printhead structure which includes:
~a) an X conductive pattern formed on the surface of a printhead substrate, (b) a resistive heater element disposed on said X
conductive pattern and including a rectifying junction therein, and (c) a Y conductive pattern connected to the top surface of said resistive heater element and insulated from said X conductive pattern by an insulating layer, whereby said X and Y
conductive patterns may be fabricated integrally on said printhead structure and there connected to receive diode multiplex signals and provide diode multiplexing of said signals directly on said printhead structure, and said Y conductive pattern may also serve as a metal barrier shield against ink corrosion and cavitation wear during thermal ink jet printing.
A process for fabricating a vertical resistor printhead structure which includes:
a. forming a conductive pattern on the surface of an insulating or semiconducting substrate, b. forming an insulating mask on said conductive pattern, c. forming a resistive lay~r atop the surface of said insulating mask and atop a selected area of said conductive pattern, d. forming a conductive layer atop said resistive layer, and e. defining said conductive layer to form another conductive pattern and thereby provide an XY
interconnect matrix by said first and second conductive patterns to said resistive layer.

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, ~.285427 The above advantages and novel features of this inven-tion will become more readily apparent in the following descrip-tion of the accompanyinq drawing ~rief Description of the Drawinos Figures lA - lH are ~chematic croQs section views of a first process used to fabricate one type of printhead device structure and multiplex circuit according to the present inven-tion Figure lI i8 a plan view of the resistor/diode multi-plex circuit fabricated by the process of Figures lA - 1~
Figures 2A - 2G are 6chematic cross 6~ction views illustrating a sQcond proc-s~ mbodiment of the invention Figure 2H iB a plan vi-w illustrating the multiplex circuit connection for a plurality of resi6tors or diodes formed in accordance with Figur-~ 2A - 2G
Figur~s 3A-3G illu~trate in schematic cross section a third proce~s mbodim nt of the invention Figure 3H ~s a pl~n view illustrating the multiplex circuit conn-ction for ~tructure~ fabricated using the process sequence of Figures 3A - 3G
Figur-s 4A - 4G illustrate in sch-matic cross section a fourth proc-~s embodiment according to the invention Figure 5 i~ a schematic diagram for a nine (9) diode and nine (9) re~istor XY matrix type multiplex circuit which may be constructed using the vertical resistor/diode construction technigues of the invention 1~54;~ ~
Best Mode for ~arrvina out the Invention Referring now to Figure 1, the legend ~or the insulating substrate (S), the first level metal layer or conduc-tor number 1 (Cl), the insulating layer (I), the resistive layer (R), and the second level conductor or conductor number 2 (C2) apply to all of the four process embodiments described herein as will be indicated in more detail below Additionally, a table of values for materials, layer thicknesses, resistivities and other significant electrical properties is given below for the various layers formed in the different embodiments of the invention Accordingly, these various device properties will not be further recited throughout the specification In a first mbodiment of the invention, an insulating substrat- 10 is adapted to rocieve a first level metal layer 12 which i8 sputtered or evaporated on the surface of the substrate using conventional metal deposition techniques ~hen, as indicated in Figure lB, the metal layer 12 is patterned to form a first level metal conductor 14 Next, an insulating layer 16 is provided as shown in Figure lC and then patterned as indicated in Figure lD to provide an opening 18 thor-in Th-n, a resistive layer 20 is deposited on the surface of Figuro lD to form the structure of Figure lE
which is sub~oqu-ntly masked and etched to leave the vertical resi~tor pad 22 as ~hown in Figure lF When the resistor pad 22 is to be formed as a combination resistor/diode component for use in diode matrix multipl-x circuits, then the resistive layer formation step of Figure lE must include appropriate PN junction processing such solid state diffusion, ion-implantation, or .
' . . -~as4;~7 netal-semiconductor rectifying junction forming processes known in the art One suitable process for ~orming a PN junction in the resistor pad 22 would be to first form the pad 22 o~ polycrystal-line silicon using, for example, low-pressure chemical vapor deposition, LPCVD Then, phosphorous ions can be implanted into the polysilicon pad 22 in a concentration between 1ol9 and 1o21 ions per cubic centimeter and then annealed in a nitrogen atmosphere from between 3-4 hours Alternatively, this PN junction could be replaced by a Shottky barrier junction which is created by first forming a P-type polysilicon resistor pad and then depositing a gold conduc-tor on this resistor pad to establish a Shottky barrier junction at the poly~ilicon-gold interface, as i5 well known in the art Next, as shown in Figure lG, a top surface layer or second level metal layer 24 is depo~ited on the surface of the structure whereafter the conductive pattern 24 is furtber defined such as by selective etching to leave the second level metal conductor 26 with the geometry shown in Figure lH
U~ing photolithoqraphic exposure, masking and etching technigue~ known to those skilled in thè art, one may topographically d-~in- the multiplex circuit shown in Figure lI
In this figur-, th- sub~trate 10, the first level metal conductor 14, the in-ulating layer 16, the heater resistor 22 and the s-eond lev-l m-tal conductor 26 are designated with reference numeral~ corre~ponding to like referencQ numeral indicating the ~ same materials in previous Figures lA - lH

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The foll~wing TABLE is applicable to all of th~

fabrication sequences described herein:

TABLE
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SUITABLE I DEPOSITI0~ I THICKNESS I RESISTJVITY
LAYER I UATERI~L I PROCESS I ~ICRO~S~ I ohm.cm ...
Insuloting I Oxidi~ed S~licon ~ ¦ Therm~
I Subætr~te I Glozcd Ceramic Glass ~ ¦ Oxid3tion I (S) I SilicDn Oxyni~:rida J

I First Lcvel ¦ Aluminium _ ¦ Conductor ¦ Alu~ninium-Ccffer Alloy ~ ¦ Sputterin~ ¦ 0.5 to ¦ 2 to 3 (C1~ ¦ Aluminium 3ilicorl ~lloy ~ I ¦ 2.0 Gold J

Insuloting ¦ Silicon Dioxide ~ ¦ PECYD ~ 1 1.0 to I Loyer I Si'icon Ni~ride ~ ¦ LPCVD ~ I ~.0 ¦ ~13 1 ~ilioon Oxynitrid~ J
1---~ - - 1--- -- - - -- - 1 - - - 1 - ----1-- 1 ¦ Resistor/Diode ¦ Polysilicon ¦ PECVD/LPCYO
¦ Layer ¦ C~rbvn ¦ PCVD ¦ 1.0 to ¦ 0.5 to ¦ (R~ ¦ Silicon Cnrbide I PECVD/Sputter ¦ 2.0 ¦ 3.0 Indium Tin Oxl~s I sputeor Zinc 0xi~Je I Sputter I I C~dm;Um SUIPhj~! I Ev~poration/Sputter Second Level I Tontnl~Jm Gold Conductor I Gold ~ I Spu~t~r ¦ 1.0 ¦ 2 to 3 ¦ (C2~ ¦ T mtr~lum S~lici~k J
I_ .... _ ~ I I I . _ I
~ECVo ~ = Plasma Enhanc~2d Chemical Vapor Deposition LPCVD ~ = Low Pressure Chemical Vap~or Deposition In F.igure lI, there is shown a multiplex conneotion of lower electri.cal leads; 1 and 2 used in combination upper el~ctrical leads I and II and connected to fire the resistor/diodes indicated as A, B and C. Thus, a multiplexed combination of leads 1 and I fires resistor/diode A and a multiplexed combination of leads 1 and II fires resistor/diode C.
Alternatively, a multi.plexed combination of leads 2 and I will fire resistor/diode B, Referriny now to Figures 2A - 2G, an insulating sub-:: . : . , . :. .
. . . .

~ ,': ~ ' '; '' ' - ~285427 ~:rate 28 is disposed to recieve a first level metal layer 30 o~
Figure 2A which i8 then patterned a~ shown in Figure 2B to pro-vide a first level metal conductor 32 Then, an intermediate insulating layer 34 is deposited as shown in Figure 2C and defined as shown in Figuro 2D to leave an opening 36 therein and identical thus far to the process of Fiqure 1 Now ver, at this point the resisti~e layer 38 i8 depo ited over the entire top surface of the structure as shown in Figure 2E and is there left intact Next, an upper, second level metal layer 40 is deposited over the ent~re surface of the rosistive layer 38 as indicated in ftqure 2F, and therQafter the second le~el metal conductor pattern is defined as shown in F~gur~ 2G
Referrinq now to Figure 2H, the multiplex circuit connection shGwn therein is the same for both the above process of Figure 2A - 26 and the proce-~ of Fiqure~ 4A - 4G to be described below In Figure 2H, multiplex siqnals applied to l-ads 1 and I will fir~-th- re-istor/diod- A, whereas multiplex signals applied to l-ads 1 and II will fire re~istor/diode C
Signals applied ~imultan-ously to l-ads 2 and I will fire the resistorJdiode B
R ferring now to Figure 3a, in this process embodiment a r ~lstlv- cov-r lay r 46 is applied as shown to ehe upper surface of a fir~t level metal layer 48 which in turn was previou~ly form d on the upper surfac- of an insulating substrate Then, using conventional ma~kinq and etching processes, a :
; resistive island 52 is develop~d as shown in Figure 3B to define ~ .

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~ ~ , ,' ' ', ~.2854~7 he heater resistor. Then, as shown in Figure 3C, the resistive island 52 is used as an etch mask to form the first level metal conductor 54.
Next, an intermediate insulating layer 56 is deposited as shown in Figure 3D, and then this layer 56 is masked and etched to form the opening 58 therein as shown in Figure 3E.
Then, an upper, second level metal layer 60 is formed atop the entire surface of the structure as shown in Figure 3F and there-after defined using photolithographic metal etch processes known in the art to form the upper or second level metal conductor pattern 62 as shown in Figure 3G.
Referring now to Figure 3H, the firing schedule for the multiplex circuit shown in this figure is identical to the firing schedule of the multiplex circuits shown in Figures lI and 2H
previously described.
Referring now to Figure 4, there is shown a forth process embodiment according to the invention. In this embodi-ment the substrate 64 and first level metal layer 66 of Figure 4A
are masked and etched to define a first level metal conductor 68 as shown in Figuro 4B. Then, a resistive layer 70 is deposited over the entire surfac- of the structure of Figure 4B to thereby provide the layered structure as shown in Figure 4C.
N-xt, the structure of Figure 4C is provided with an intermediate insulating layer ~2 as shown in Figure 4D which is then ma~ked and etched to provide an oponing 74 therein as shown in Figuro 4E. Then, an upper second level conductive layer 76 is deposited across the entire surface of the structure as shown in Figure 4F, and finally this conductive layer 76 is photolitho-~285427 graphically defined as a second metal level or upper conductor 78on the top surface of Figure 4G.
As previously mentioned, the multiplex circuit of Figure 2H iS applicable to the present process of Figure 4, and device structure produced thereby and is not described in further detail herein Referring now to Figure 5, there is shown in Figure 5A
a nine resistor-diode (RD) multiplex circuit which illustrates how the previously described 3-diode (A,B,C) networks of Figures 1-4 can be expanded into a larger X-Y multiplex matrix In this matrix of Figure 5A, there is no specific relation between the resistor-diode combinations shown therein and the A, B and C
diodes of Figures 1-4 which ar- primarily intended to show a general plan view layout for the ad;acent resistor-diodes In Figure SA, each resistor-diode (RD) combination fires when a positive-going pul~e is applied to the anode of the diode and simultaneou~ly a negative-going pulse is applied to the cathode of the diode Hence, the timing schedule no 1 in Figure 5C represents the firing of resistor-diodes RDl, RD2 and RD3 at times t=2, t~3 and t-4 for the six pul~e waveforms applied to the X-Y matrix terminals 1, 2 and 3 and I, II and III, respectively However, when th- puls- waveform in Figure 5B i8 applied to terminal no 1 in Figure 5A, both r-sistor-diodes RD3 and RD4 will fire at tim- t-4 Thus, it will b- appreciated by thos- skilled in the art that using th- proper s-lection of pulse waveforms at the X-Y
matrix input terminals, any resistor-diode combination in Figure ~285427 .~ can be fired. This feature greatly enhances the packing density and integration of resistors, diodes and conductive trace patterns on the ink ejection surface area of a printhead substrate.

Industr$al A~licability This invention is useful in the production of thermal ink jet printheads and printhead in~egrated circuits which in turn are used in disposable ink jet heads in TIJ printers.

Claims

THE EMBODIMENTS OF THE INVENTION IN WHICH AN EXCLUSIVE
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:

1. A thin film resistor device suitable for use in a thermal ink jet printhead comprising:
a. a substrate member, b. a conductive pattern disposed atop an upper surface of said substrate member, c. an insulating layer disposed on said conductive pattern and having openings therein aligned with preselected areas on said conductive pattern, d. a resistive layer of a selected resistivity formed on said preselected areas on said conductive pattern, and e. a metal barrier layer disposed atop said resistive layer and thereby providing an electrical path for current flowing through said resistive layer and also a shield against ink corrosion and cavitation wear.

2. The structure defined in Claim 1 wherein said resistive layer is doped with impurities to form a PN
junction, whereby said device may be used as a diode multiplex circuit.

3. In a thermal ink jet heater device wherein an insulating pattern is formed on a substrate, the improvement comprising a heater resistor disposed in an opening in said insulating pattern, and conductive leads disposed on the top and bottom surfaces of said heater resistor to provide current vertically through said heater resistor during an ink jet printing operation.

4. The device defined in Claim 3 wherein said heater resistor is treated to form a rectifying junction diode therein, whereby said device may be used in a diode multiplex circuit for driving an ink jet printhead.

5. A process for manufacturing a thermal ink jet thin film resistor device which includes the steps of:
a. forming a conductive lead pattern on one surface of a selected substrate, b. forming an insulating pattern having openings therein aligned with certain areas on said conductive lead pattern, c. forming a resistive layer in contact with said conductive lead pattern, and d. depositing a top metal barrier layer on the surface of said resistive layer which may then be used as an electrical connection for said resistive layer as well as an ink barrier layer between ink reservoirs and said resistive layer to shield against ink corrosion and cavitation wear.

6. The process defined in Claim 5 which includes the intermediate step of forming a PN or other rectifying junction in said resistive layer whereby said device may be used as a diode matrix multiplex circuit.

7. An integrated X-Y matrix diode multiplex circuit and resistive heater printhead structure which includes:
(a) an X conductive pattern formed on the surface of a printhead substrate, (b) a resistive heater element disposed on said X
conductive pattern and including a rectifying junction therein, and (c) a Y conductive pattern connected to the top surface of said resistive heater element and insulated from said X conductive pattern by an insulating layer, whereby said X and Y

conductive patterns may be fabricated integrally on said printhead structure and there connected to receive diode multiplex signals and provide diode multiplexing of said signals directly on said printhead structure, and said Y conductive pattern may also serve as a metal barrier shield against ink corrosion and cavitation wear during thermal ink jet printing.

8. A process for fabricating a vertical resistor printhead structure which includes:
a. forming a conductive pattern on the surface of an insulating or semiconducting substrate, b. forming an insulating mask on said conductive pattern, c. forming a resistive layer atop the surface of said insulating mask and atop a selected area of said conductive pattern, d. forming a conductive layer atop said resistive layer, and e. defining said conductive layer to form another conductive pattern and thereby provide an XY
interconnect matrix by said first and second conductive patterns to said resistive layer.

9. The process defined in Claim 8 which further includes treating selected areas of said resistive layer to form a rectifying junction diode therein, whereby said matrix is operable as a diode multiplex circuit and capable of integration on the surface of said printhead structure.