CA1217647A - Fluid pressure transmitter assembly - Google Patents

Fluid pressure transmitter assembly

Info

Publication number
CA1217647A
CA1217647A CA000447551A CA447551A CA1217647A CA 1217647 A CA1217647 A CA 1217647A CA 000447551 A CA000447551 A CA 000447551A CA 447551 A CA447551 A CA 447551A CA 1217647 A CA1217647 A CA 1217647A
Authority
CA
Canada
Prior art keywords
spacer
housing
fluid
sensor
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000447551A
Other languages
French (fr)
Inventor
David B. Wamstad
Douglas W. Wilda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23952952&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA1217647(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Honeywell Inc filed Critical Honeywell Inc
Application granted granted Critical
Publication of CA1217647A publication Critical patent/CA1217647A/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/147Details about the mounting of the sensor to support or covering means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007Fluidic connecting means
    • G01L19/0038Fluidic connecting means being part of the housing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061Electrical connection means
    • G01L19/0084Electrical connection means to the outside of the housing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/142Multiple part housings
    • G01L19/143Two part housings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

APPLICATION OF

DAVID B. WAMSTAD AND DOUGLAS W. WILDA
FLUID PRESSURE TRANSMITTER ASSEMBLY
ABSTRACT
A fluid differential pressure transmitter assembly includes a presure sensor housing having a spacer within the housing to minimize the internal fill fluid used to conduct fluid pressure from a fluid inlet port to a pressure sensor located within the housing in the form of a pressure responsive diaphragm. Input pressures are applied to respective sides of the diaphragm to produce an electrical signal output representative of the differential pressure from piezoresistive elements deposited on the diaphragm. The sensor is electrically connected by flexible wires to electrically conductive paths supported on an end surface of the spacer. The conductive paths are, in turn, electrically connected to electrode wires at electrically conductive support junctions between the spacer and the electrode wires.
However, the spacer is supported on the electrode wires at the support junctions in a free floating arrangement without any other physical contact to either adjacent elements within the housing or the interior wall of the housing. Thus, physical changes to the spacer such as those occasioned by temperature changes are not transmitted to the fluid seals. The electrode wires are arranged to pass through fluid-tight seals in the transmitter housing to provide external electrical connections to the sensor while supporting the spacer within the housing.

Description

6~7 NOTION
' The present invention is directed owe fluid pressure transmitters. More specifically, the present invention is directed to a fluid pressure transmitter assembly on object of the present invention is Jo provide an improved fluid pressure transmitter assembly In accomplishing this and other objects there has been provided in accordance with the present invention, a fluid pressure transmitter assembly having a pressure sensor, a sensor housing for the pressure sensor a spacer : lo . located within the housing and support means for supporting the sensor as a free floating body within the housing with a support connection to one end of the spacer.
Jo A better understanding of the present invention may be had when the following detailed description is read in connection with the accompanying drawing, in which the single figure is a cross section illustration of a -fluid pressure transmitter assembly embodying an example of the present invention.

Referring to the single figure drawing in more detail, there is shown a fluid pressure transmitter assembly embodying an example ox the present invention in the form of a differential pressure transmitter and having an outer cup shaped housing 2. A first fluid inlet port 4 is provided in an end wall 6 of the housing 2 to enable a first input pressure to be admitted into an interior I

Lo volume or cavity 8 defined by the housing 2. A cover 10 for an open end 12 of the housing 2 is attached thereto by any suitable means providing a fluid-tight seal, e.g., an elPc~ron beam weld 14. A second fluid inlet port 16 is provided in the cover 10 to allow the admission of a second input fluid pressure into the housing 2. The cover 10 is provided with a circular recess 18 coaxial with the second fluid inlet port 16~ A hollow support tube 20 has - a first end coccal mounted within the recess 18 and is bonded to the adjacent side wall of the recess 18 by any suitable means e.g. an adhesive, to provide a fluid-tight seal thereto A fluid conduit 22 within the tube 20 is aligned with the second fluid port 16 to conduct a fluid admitted my the second port 16.
A second end 24 of the tube 20 is used to support a pressure sensor in the form of a diaphragm 26 which is secured at its peripheral edge 28 to the second end 24 of the tube 20. The attachment of the diaphragm 26 to the tube 20 is arranged to provide a fluid-tight seal between the diaphragm 26 and the tube 20. The diaphragm 26 has a pressure sensitive coating thereon which may be in the form of piezo-resistive elements, in a manner well-known in the art. These diaphragm elements are attached to one end of respective ones of a plurality of flexible wires 30 which provide electrical connections thereto. The other ends of the wires 30 are connected to resp~otive ones of electrically conductive paths supported on a first end surface 32 of a spacer 34 located within the interior volume 8 defined by the housing. The spacer 34 is preferably in the form of 2 cylindrical element coaxial with the tube 20 and having an axial aperture 36 spaced ~t7~7 from the tube 20.
A plurality of electrically conductive and relatively rigid electrode wires 38 are arranged two pass through holes 40 in the cover 10. Hermetic seals 42 are located between the wires 38 and the surfaces of the cover 10 surrounding the holes 38 to provide fluidity connections thereto. The wires 38 extend into the housing cavity 8 and pass through respective ones of a plurality of bores 44 in the spacer 34 which coccal surround each of the corresponding ones of the electrode wires 38 while being spaced wherefrom. The free ends 46 of the electrode wires 38 within the housing 2 are rigidly attached to the first end surface 32 of the spacer 34 by any suitable means to provide mechanical and electrical connections 48 thereto, e.g. 9 or soldering. The connections I are arranged to provide a support junction for the spacer 34 and to provide a current path between the electrode wires 38 and the aforesaid electrically conducting paths on the end surface 32 of the spacer 34 which, in turn, as previously described, are connected to the wires 30 leading to the diaphragm pressure sensor 26.
The spacer 34 is arranged to be a free floating element within the cavity 8 of the housing 2 and is, accordingly, spaced from the interior walls of the housing 6, the cover 10~ the electrode wires 38, the support tube e 20 and the diaphragm 26. Thus, the spacer 34 is suspended from the connections 48 to the electrode wires 38 whereby temperature changes in the environment of the pressure transmitter which can produce physical changes in the spacer 34 based on the coefficient of temperature expansion of the spacer 34 do not affect the hermetic I

seals 40, i.e., the hermetic seals 40 are not stressed by temperature induced expansions and contractions of the spacer 34. The spacer 34 is used to reduce the volume within the housing 2 Jo minimize the amount of a fill S fluid (not shown) needed for transmitting the first input pressure to one side of the sensor diaphragm 26. A first fill fluid would be arrange to fill the cavity 8 within the housing 2 while a second fill fluid (not shown) would be arranged to fill the fluid conduit 22 within the tube 20 to transmit a second input pressure to the other side of the sensor diaphragm 26. Concurrently, the spacer 34 provides a support for the electrical connections between the flexible wires 30 and the electrode wires 38. The illustrated size relative and shape of the spacer 34 is only intended to provide an example of the present invention since the size and shape thereof may be modified to conform the spacer 34 to the operating requirements of the transmitter. For example in a transmitter to be used to withstand accelerating and decelerating forces, i.e., "g" forces, the spacer may be made thinner to provide less inertial mass. However, the free-floating relationship described above would be maintained.
Accordingly, it may be seen that there has been provided, in accordance with the present invention an improved fluid pressure transmitter assembly.

Claims (5)

THE EMBODIMENTS OF THE INVENTION IN WHICH AN EXCLUSIVE
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A pressure transmitter comprising a housing means a pressure sensor means mounted within said housing means, a spacer within said housing means said spacer includ-ing a first end, and support means for supporting said spacer as a free floating body within said housing means with a support connection to said spacer at said first end of said spacer.
2. A transmitter as set forth in Claim 1 wherein said support means includes electrically conductive wires and said housing means includes hermetic seals for allowing one end of said wires to extend out of said housing means while the other end of said wires is attached to said first end of said spacer.
3. A transmitter as set forth in Claim 2 wherein sensor means includes electrical connection means supported on said first end of said spacer and electrically connected to said wires.
4. A transmitter as set forth in Claim 3 wherein said connection means includes at least one electrical conductor mounted on said first end of said spacer and an electrical junction connecting said conductor to a respective one of said wires.
5. A transmitter as set forth in Claim 4 wherein said sensor means further includes a pressure sensor and at least one flexible wire connecting said sensor to said electrical conductor.
CA000447551A 1983-05-04 1984-02-15 Fluid pressure transmitter assembly Expired CA1217647A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/491,613 US4502335A (en) 1983-05-04 1983-05-04 Fluid pressure transmitter assembly
US491,613 1983-05-04

Publications (1)

Publication Number Publication Date
CA1217647A true CA1217647A (en) 1987-02-10

Family

ID=23952952

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000447551A Expired CA1217647A (en) 1983-05-04 1984-02-15 Fluid pressure transmitter assembly

Country Status (5)

Country Link
US (1) US4502335A (en)
EP (1) EP0126989B2 (en)
JP (1) JPS59210338A (en)
CA (1) CA1217647A (en)
DE (1) DE3465517D1 (en)

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JPS6073325A (en) * 1983-09-30 1985-04-25 Toshiba Corp Semiconductor pressure sensor
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ATE42637T1 (en) * 1985-09-11 1989-05-15 Kunz Manfred PRESSURE SENSOR.
US4888992A (en) * 1988-04-15 1989-12-26 Honeywell Inc. Absolute pressure transducer and method for making same
JPH01301134A (en) * 1988-05-30 1989-12-05 Nippon Beeles- Kk Pressure transmitter
US4939497A (en) * 1989-04-18 1990-07-03 Nippon Soken, Inc. Pressure sensor
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US5174156A (en) * 1990-07-27 1992-12-29 Honeywell Inc. Pressure transducer with reduced offset signal
JP2719448B2 (en) * 1991-01-24 1998-02-25 三菱電機株式会社 Semiconductor pressure detector
JPH04258176A (en) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp Semiconductor pressure sensor
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DE4244459C1 (en) * 1992-12-23 1994-05-11 Siemens Ag Pressure transmitter
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WO1996034264A1 (en) * 1995-04-28 1996-10-31 Rosemount Inc. Pressure transmitter with high pressure isolator mounting assembly
US5596147A (en) 1995-11-17 1997-01-21 Wilda; Douglas W. Coplanar pressure sensor mounting for remote sensor
US20020003274A1 (en) * 1998-08-27 2002-01-10 Janusz Bryzek Piezoresistive sensor with epi-pocket isolation
US6006607A (en) * 1998-08-31 1999-12-28 Maxim Integrated Products, Inc. Piezoresistive pressure sensor with sculpted diaphragm
US6346742B1 (en) 1998-11-12 2002-02-12 Maxim Integrated Products, Inc. Chip-scale packaged pressure sensor
US6351996B1 (en) 1998-11-12 2002-03-05 Maxim Integrated Products, Inc. Hermetic packaging for semiconductor pressure sensors
US6229190B1 (en) 1998-12-18 2001-05-08 Maxim Integrated Products, Inc. Compensated semiconductor pressure sensor
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US20060272405A1 (en) * 2005-06-07 2006-12-07 Lajos Feher Casing for in-tank hall effect sensor used for fuel level sensing
JP4919024B2 (en) * 2006-11-16 2012-04-18 横河電機株式会社 Pressure sensor
JP2009098062A (en) * 2007-10-18 2009-05-07 Denso Corp Pressure sensor
NZ588818A (en) * 2008-04-17 2012-10-26 Allergan Inc Body implantable access port device activated by a cable mechanism
US9023063B2 (en) * 2008-04-17 2015-05-05 Apollo Endosurgery, Inc. Implantable access port device having a safety cap
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Also Published As

Publication number Publication date
JPH0374937B2 (en) 1991-11-28
JPS59210338A (en) 1984-11-29
US4502335A (en) 1985-03-05
EP0126989A1 (en) 1984-12-05
EP0126989B1 (en) 1987-08-19
DE3465517D1 (en) 1987-09-24
EP0126989B2 (en) 1992-02-12

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