They don't toss the chips around at FlipChip International. The company specializes in advanced packaging technology for semiconductors. Its services include silicon wafer bumping, where tiny bumps of solder paste are attached to a silicon wafer to accommodate the packaging process for fine-pitch devices. FlipChip also offers wafer-level packaging services for high-reliability devices used by the military and other customers. FlipChip was established in 1996 as a joint venture between Delco Electronics Systems and Kulicke and Soffa; K&S bought out Delco's equity interest in 2001 and sold the FlipChip assets to RoseStreet Labs, a Phoenix-based biotech and energy research firm, in 2004.